CN208903981U - Rotate wet-method etching equipment - Google Patents

Abstract

The utility model provides a kind of rotation wet-method etching equipment, and the rotation wet-method etching equipment includes: etching groove, for accommodating etching liquid and the cassette equipped with wafer to be etched；Rotating device, for driving wafer to be etched to rotate in cassette；Rotating device includes live-roller, and live-roller is rotated around central shaft, and live-roller contacts wafer side to be etched and wafer to be etched is driven to rotate with live-roller perpendicular to crystal column surface to be etched, the roll surface of live-roller.The utility model drives the wafer in cassette to rotate by being introduced into live-roller during wet etching, avoids because of the bad problem of etching homogeneity in wafer face caused by concentration or the temperature difference of etching liquid everywhere in etching groove, to improve product yield.In addition, the rotation by live-roller and wafer also further increases the convection velocity of etching liquid in etching groove, the distributing homogeneity of etching liquid in etching groove is improved.

Description

Rotate wet-method etching equipment

Technical field

The utility model relates to semiconductor integrated circuit manufacturing fields, more particularly to a kind of rotation wet-method etching equipment.

Background technique

Currently, can will generally be equipped with more pieces of wafers during the slot type wet etching of semiconductor integrated circuit manufacture Cassette is immersed in etching groove, is performed etching by the etching liquid in etching groove to wafer.However, the etching liquid in etching groove is normal It is commonly present the phenomenon that being unevenly distributed, for example, the etching liquid concentration or temperature in etching groove upper and lower level different zones can have differences. Above-mentioned difference will lead to the etching for being disposed vertically the wafer in etching groove between the different location corresponding to etching groove upper and lower level Rate and etching selection ratio difference, it is abnormal that this can be such that the etching homogeneity in wafer face occurs, and then influences product yield.

Therefore, it is necessary to propose a kind of new rotation wet-method etching equipment, solve the above problems.

Utility model content

In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of rotation wet etchings to set Standby, the wafer inner evenness for solving the problems, such as wet etching in the prior art is bad.

To achieve the above object and other related purposes, the utility model provide a kind of rotation wet-method etching equipment, It is characterized in that, comprising:

For accommodating the etching groove of etching liquid and the cassette equipped with wafer to be etched；

Rotating device for driving the wafer to be etched to rotate in the cassette；

The rotating device includes live-roller, and the live-roller is rotated around central shaft, and the live-roller is perpendicular to described Crystal column surface to be etched, the roll surface of the live-roller contact the wafer side to be etched and drive the wafer to be etched with institute State live-roller rotation.

As a kind of optinal plan of the utility model, the rotating device further include: drive module and the connection drive The transmission module of dynamic model block and the live-roller, the drive module drive the live-roller rotation by the transmission module.

As a kind of optinal plan of the utility model, the drive module includes servo motor.

As a kind of optinal plan of the utility model, the transmission module includes shaft coupling, and the shaft coupling connects institute Drive module and the live-roller are stated, the drive module drives the live-roller rotation by the shaft coupling.

As a kind of optinal plan of the utility model, the both ends of the live-roller are movably installed on the etching groove two sides On opposite side wall, at least one end of the live-roller passes through the side wall of the etching groove and connects the transmission module.

As a kind of optinal plan of the utility model, the installation site of the live-roller in the etching groove sidewall Place is equipped with sealing bearing, and the sealing bearing movably connects the live-roller and the live-roller is supported to rotate.

As a kind of optinal plan of the utility model, the surface of the sealing bearing and the live-roller is coated with corrosion resistant Corrosion material layer.

As a kind of optinal plan of the utility model, the roll surface of the live-roller includes rough surface.

As a kind of optinal plan of the utility model, the rotation wet-method etching equipment further includes loading/unloading unit, institute The top that loading/unloading unit is set to the etching groove is stated, the loading/unloading unit includes for grabbing the cassette and making described The mechanical arm of cassette loading or unloading in the etching groove.

As a kind of optinal plan of the utility model, the rotation wet-method etching equipment further includes control module, described Control module includes:

For controlling the switch of the rotating device and the rotation control unit of rotation speed, the rotating device is connected；

The loading and unloading control unit that the cassette is loaded and is unloaded for controlling the loading/unloading unit connects institute State loading/unloading unit.

As described above, the utility model provides a kind of rotation wet-method etching equipment, carved by introducing live-roller in wet process The wafer rotation in cassette is driven during erosion, avoid because in etching groove everywhere the concentration or temperature of etching liquid it is different due to cause Wafer face in the bad problem of etching homogeneity, to improve product yield.In addition, passing through the rotation of live-roller and wafer The convection velocity of etching liquid in etching groove is also further increased, the distributing homogeneity of etching liquid in etching groove is improved.

Detailed description of the invention

Fig. 1 is shown as the stereoscopic schematic diagram of the rotation wet-method etching equipment provided in the utility model embodiment one.

Fig. 2 is shown as the side view of the rotation wet-method etching equipment provided in the utility model embodiment one.

Fig. 3 is shown as the structural schematic diagram of the live-roller provided in the utility model embodiment one.

It is carved in wafer face after wet etching when Fig. 4 is shown as the wafer provided in the utility model embodiment two without spin Lose rate distribution schematic diagram.

Fig. 5 is shown as in the wafer face obtained using rotation wet etching method provided in the utility model embodiment two Etch rate distribution schematic diagram

Component label instructions

100 etching grooves

101 etching liquids

102 wafers to be etched

102a wafer unfilled corner

103 cassettes

104 live-rollers

104a roll surface

105 servo motors

106 shaft couplings

107 sealing bearings

108 connection locking levels

109 mechanical arms

110 control modules

110a rotation control unit

110b loading and unloading control unit

111 etch rates measure region

The first area 111a

111b second area

111c third region

111d does not measure region

The 5th region 111e

The 6th region 111f

Specific embodiment

Illustrate the embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this theory Content disclosed by bright book understands the further advantage and effect of the utility model easily.The utility model can also be by addition Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints and answer With carrying out various modifications or alterations under the spirit without departing from the utility model.

Fig. 1 is please referred to Fig. 5.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way The basic conception of utility model, though it is only shown with related component in the utility model rather than when according to actual implementation in diagram Component count, shape and size are drawn, when actual implementation form, quantity and the ratio of each component can arbitrarily change for one kind Become, and its assembly layout form may also be increasingly complex.

Embodiment one

It please refers to Fig.1 to Fig.3, the utility model provides a kind of rotation wet-method etching equipment, comprising:

Etching groove 100, for accommodating etching liquid 101 and the cassette 103 equipped with wafer 102 to be etched；

Rotating device, for driving the wafer to be etched 102 to rotate in the cassette 103；

The rotating device includes live-roller 104, and the live-roller 104 is rotated around central shaft, and the live-roller 104 hangs down Directly in 102 surface of wafer to be etched, the roll surface 104a of the live-roller 104 contacts 102 side of wafer to be etched simultaneously The wafer to be etched 102 is driven to rotate with the live-roller 104.

As shown in Figure 1, being the stereoscopic schematic diagram of the rotation wet-method etching equipment provided by the present embodiment, Fig. 2 is it Side view.The all parts of the present embodiment in order to clearly demonstrate, Fig. 1 and Fig. 2 have made partially transparentization processing.In the present embodiment Provided rotation wet-method etching equipment is collectively formed by etching groove 100 and rotating device.Wherein, the etching groove 100 has Enough spaces can fill etching liquid 101 wherein, and the etching liquid 101 is made to submerge the top of wafer 102 to be etched. The wafer to be etched 102 is vertically inserted in cassette 103, and is loaded from the etching groove 100 together with the cassette 103 Or unloading.The rotating device includes live-roller 104, and the live-roller 104 can be rotated around central shaft, and the transmission The roll surface of roller 104 contacts the lateral side regions of the wafer to be etched 102, by the rotation of the live-roller 104, drive it is described to Etching wafer 102 rotates together.As shown in Fig. 2, the wafer 102 to be etched is in the cassette 103 in the present embodiment When, the part wafer of bottom is exposed to except the cassette 103, and is in contact with the roll surface of the live-roller 104, the transmission Roller 104 passes through and the frictional force of 102 side of wafer to be etched drives the wafer 102 to be etched to rotate.As shown in figure 3, It is the structural schematic diagram of the live-roller 104 employed in the present embodiment.102 institute of wafer to be etched is driven in order to increase The frictional force needed, processing of the roll surface 104a of the live-roller 104 by increase roughness, drives the crystalline substance to be etched to improve The frictional force of circle 102.The diameter of the live-roller 104 needs to consider that the cassette 103 is placed in the etching groove 100 When, the remaining space reserved between 100 bottom of the wafer 102 to be etched and the etching groove, so that the live-roller 104 exists While driving the wafer to be etched 102 to rotate, normal wet-etching technology will not be influenced.It should be pointed out that this In embodiment, the quantity of the live-roller 104 is only one, and in other embodiments of the utility model, the transmission The quantity of roller 104 can also be not limited to one, and be perpendicular to the more live-rollers on 102 surface of wafer to be etched 104.For example, the live-roller 104 is respectively arranged in monosymmetric position below wafer, to increase the frictional force of roll surface simultaneously Improve the stability when wafer to be etched 102 rotation.

As an example, the rotating device further include: drive module and the connection drive module and the live-roller 104 Transmission module, the drive module drives live-roller rotation by the transmission module.Specifically, as shown in Figure 1, institute Stating drive module includes servo motor 105, and the transmission module includes shaft coupling 106, and the shaft coupling 106 connects the servo Motor 105 and the live-roller 104, the servo motor 105 drive the live-roller 104 to rotate by the shaft coupling 106. The servo motor 105 can accurately and quickly control itself revolving speed by the control signal received, and the present embodiment passes through The servo motor 105 is introduced into the drive module, accurately to control rotation and the revolving speed of the live-roller 104.It is described Shaft coupling 106 can by different components driving shaft and driven shaft be firmly coupled, and realize synchronous rotation.In this reality It applies in example, by the way that the shaft coupling 106 to be introduced into the transmission module, so that the power of the servo motor 105 accurately passes It is delivered on the live-roller 104.

As an example, it is opposite that the both ends of the live-roller 104 are movably installed on 100 two sides of etching groove in Fig. 1 On side wall, at least one end of the live-roller 104 passes through the side wall of the etching groove 100 and is connected to outside the etching groove 100 The transmission module.Specifically, the installed position of the live-roller 104 on 100 side wall of etching groove is equipped with close Bearing 107 is sealed, the sealing bearing 107 movably connects the live-roller 104 and the live-roller 104 is supported to rotate.Such as Fig. 1 institute Show, the sealing bearing 107 is set on the opposite side wall in 100 two sides of etching groove, and the both ends of the live-roller 104 plug In the sealing bearing 107, the sealing bearing 107 and the live-roller 104 are combined closely, to prevent the etching groove The etching liquid 101 in 100 leaks.Optionally, one end that the live-roller 104 connects the shaft coupling 106 is equipped with connection Locking level 108 is fixed in the sealing bearing 107 by the connection locking level 108.The connection locking level 108 plugs In the live-roller 104, and run through the sealing bearing 107, the live-roller 104 is solid by the connection locking level 108 It is scheduled on the sealing bearing 107, and the shaft coupling 106 is connected by the connection locking level 108.Dismantling the transmission When roller 104, only need the connection locking level 108 is first removed from the live-roller 104, so that it may by the live-roller 104 from It is removed on the sealing bearing 107.Similarly, the combination of the connection locking level 108 and the sealing bearing 107 must be tight It is close, to prevent the etching liquid 101 in the etching groove 100 from revealing.

As an example, the surface of the sealing bearing 107 and the live-roller 104 is coated with etch resistant material layer.Due to The sealing bearing 107 and the live-roller 104 require directly to contact the institute in the etching groove 100 with chemical corrosivity State etching liquid 101, therefore its surface needs to have corrosion resistant characteristic, at least can to avoid the corrosion of the etching liquid 101, with Prevent structural failure and the etching liquid 101 from revealing, optionally, the sealing bearing 107 and the live-roller 104 can be Teflon.

As an example, the roll surface 104a of the live-roller 104 includes rough surface.In the introduced biography of the utility model Dynamic 104 one side of roller has the function of that the drive as described above wafer 102 to be etched rotates；It on the other hand, can also be with By the rotation of the live-roller 104 itself, increase the liquid convection inside the etching groove 100, to improve the etching liquid 101 distributing homogeneity.Therefore, rough surface described in the present embodiment is on the one hand to increase the roll surface 104a and institute State frictional force when contacting between wafer 102 to be etched；It on the other hand, can also be thick by increasing the surface of the roll surface 104a Rugosity improves the ability that liquid flows in 104 agitator bath of live-roller.Optionally, the roll surface 104a increases rough surface The measure of degree further includes that blade knot is added at the position not contacted directly with the wafer 102 to be etched on the live-roller 104 Structure or other possible surface relief structures drive the energy of tank liquid convection current to improve the live-roller 104 in rotation Power.

As an example, as depicted in figs. 1 and 2, the rotation wet-method etching equipment further includes loading/unloading unit, the handling The top for installing and being placed in the etching groove 100 is carried, the loading/unloading unit includes mechanical arm 109, the mechanical arm 109 For grabbing the cassette 103, and make the cassette 103 loading or unloading in the etching groove 100.Specifically, such as Fig. 2 institute Show, the top of the cassette 103 is equipped with to two sides protruding portion structure outstanding, and the mechanical arm 109 is described prominent by buckling The fixed cassette 103 of portion's structural clamp out, and by the up and down motion of the mechanical arm 109, drive the cassette 103 into Enter or remove the etching groove 100, to complete loading and the unloading of the cassette 103.In the present embodiment, the mechanical arm 109 clamp the cassette 103 always during entire wet etching, and need to drive the cassette 103 according to loading and unloading It moves up and down.In other embodiments of the utility model, it can also be equipped in the etching groove 100 and place the cassette 103 fixed pedestal, when the cassette 103 loads, the cassette 103 is put into the fixed base by the mechanical arm 109 After in seat, the cassette 103 is unclamped, and rises to standby above liquid level position, after the completion of etching, is dropped in slot again, The cassette 103 is grabbed to be unloaded.Loading and unloading in the present embodiment refer to being put into or remove the quarter for the cassette 103 Lose slot 100, optionally, the rotation wet-method etching equipment can also include be used for before loading with the cassette is placed after unloading 103 transition platform, for after wet etching the deionized water rinse bath of cleaning wafer surface raffinate, for after to cleaning The drying device that wafer is dried and the transmission device for transmitting wafer between the cassette 103 and film magazine.

As an example, as shown in Figure 1, the rotation wet-method etching equipment further includes control module 110, the control module 110 include:

Rotation control unit 110a connects the rotating device, for controlling the switch and rotation speed of the rotating device Degree；

Loading and unloading control unit 110b, connects the loading/unloading unit, for controlling the loading/unloading unit to the crystalline substance Boat 103 is loaded and unloads.

As described in Figure 1, in this embodiment, the rotation wet-method etching equipment is by the control module 110 to entire wet Method etching process is controlled.The control module 110 includes rotation control unit 110a and loading and unloading control unit 110b.

The rotation control unit 110a connection servo motor 105, control the servo motor 105 switch and Revolving speed.The revolving speed of the servo motor 105 affects described to be etched in 104 revolving speed of live-roller and the cassette 103 Lose the stability that wafer 102 rotates.Optionally, in the present embodiment, by adjusting the revolving speed of the servo motor 105, make described 104 revolving speed of live-roller maintains 20-80 revolutions per seconds.By setting above-mentioned live-roller revolving speed to obtain corresponding wafer revolving speed.When So, the important adjustable parameter of live-roller revolving speed and wafer revolving speed as rotation wet-method etching equipment provided by the utility model, It is not limited to above-mentioned revolving speed, can be adjusted flexibly according to different wet-etching technology specific requirements.In the utility model Other embodiments in, wafer speed-changing rotation can also be set.For example, setting wafer revolving speed is first fast in entire etching process Afterwards slowly or first slow rear fast, with wet-etching technologies different in satisfaction for etching homogeneity requirement.

The loading and unloading control unit 110b is used to control loading and the unloading of the cassette 103.In the present embodiment, institute It states loading and unloading control unit 110b and clamps the cassette 103 by controlling the mechanical arm 109, and pass through the mechanical arm 109 up and down motion makes the cassette 103 be put into or remove the etching groove 100.

Embodiment two

The utility model additionally provides a kind of rotation wet etching method, includes the following steps:

Etching liquid 101 is passed through in etching groove 100, the liquid level of the etching liquid 101 did not had wafer 102 to be etched to put Height when being placed in the etching groove 100；

The cassette 103 for being placed with wafer 102 to be etched is loaded into the etching groove 100, and is started to described to be etched Wafer 102 carries out wet etching；

During wet etching, the cassette 103 is driven by the live-roller 104 being set in the etching groove 100 Interior wafer to be etched 102 rotates；

After the completion of wet etching, the live-roller 104 stops operating, and by the cassette 103 from the etching groove 100 Middle unloading.

As depicted in figs. 1 and 2, rotation wet etching method described in the present embodiment can be using provided in embodiment one Rotation wet-method etching equipment.Etching liquid 101 is passed through in etching groove 100, the etching liquid 101 needs at least to make its liquid level high Degree is higher than height when wafer 102 to be etched is placed in the etching groove 100, i.e., the described etching liquid 101 will be totally submerged crystalline substance The top of the wafer 102 to be etched in boat 103, to prevent wafer upper position not to be etched into etching process.It can Selection of land clamps the cassette 103 by the loading and unloading control unit 110b control mechanical arm 109 and is put into the etching In slot 100.

After the cassette 103 is put into the etching groove 100, the wafer to be etched 102 in the cassette 103 is in bottom It is in contact with the live-roller 104, and is rotated in the cassette 103 under the drive of the live-roller 104.Optionally, by The rotation control unit 110a controls the switch and revolving speed of the live-roller 104.Institute is determined by the revolving speed of the live-roller 104 The revolving speed of the wafer 102 to be etched in cassette 103 is stated, and the revolving speed of the live-roller 104 is by 105 essence of servo motor Really control.

After the completion of wet etching, i.e., residence time of the described wafer to be etched 102 in the etching groove 100 reaches work When skill setting time, the cassette 103 is clamped by the loading and unloading control unit 110b control mechanical arm 109 and is moved The etching groove 100 is out to complete to etch.

It is equal can to promote distribution of the wet etching in wafer face for the rotation wet etching method through this embodiment Even property.As an example, wafer has etch rate profiles versus without spin when below by way of wet etching, to show the rotation The technical effect of wet etching method.

As shown in figure 4, be wafer without spin when wet etching after etch rate distribution schematic diagram in wafer face, it is every in figure One grid represents etch rate and measures region 111, and has been carried out point according to different size of etch rate distributed area Class mark, be successively labeled as first area 111a, second area 111b, third region 111c and crystal round fringes does not measure region 111d, wafer unfilled corner 102a (wafer notch) are located at the lower section of distribution map, and when wet etching wafer unfilled corner towards slot bottom. As an example, the wet etching in the present embodiment is using hot phosphoric acid etch nitride silicon fiml, etch rate is single by calculating The silicon nitride Thickness Variation of etching front and back obtains in the time of position.Wherein, the distribution model of the etch rate in the 111a of first area Enclose forThe distribution of etch rate in second area 111b isIn the 111c of third region The distribution of etch rate beAccording to above data it is found that wafer without spin when face in etching it is uniform Property it is poor, etching inhomogeneities be even greater than 10%, seriously affected product yield.Analysis chart 4 is as can be seen that in wafer face Etch rate distribution mainly in the trend that is distributed up and down, i.e. third region 111c is greater than second area 111b, second area 111b is greater than first area 111a.This is because the temperature and concentration of the etching liquid of upper and lower level have differences in etching groove, for example, The benchmark set temperature of hot phosphoric acid in the present embodiment be 160 DEG C, concentration 86%, but in etching groove the upper and lower etching Liquid is likely due to be unevenly distributed and deviate setting value, for example, the etching liquid temperature on upper layer is likely to be breached 163 in etching groove DEG C, concentration 85.5%, this just makes the etch rate of top area be greater than lower region.In addition, can also be observed that from Fig. 4 Uneven distribution of the etch rate on crystal circle center region and fringe region, this is because more wafers be placed in simultaneously it is described When in cassette 103, the convection action of adjacent wafers dense arrangement in cassette, the etching liquid in crystal circle center region is not so good as wafer side Edge region, this also makes the etch rate in crystal circle center region that can be slower than fringe region.

As shown in figure 5, being that etch rate distribution is shown in the wafer face obtained in this implementation using rotation wet etching method It is intended to, wherein the distribution of the etch rate in the 5th region 111e isEtching in 6th region 111f The distribution of rate isOther than introducing the wafer rotating condition that the wafer speed of rotation is 3rpm, other quarters Erosion condition is all identical with the wet etching condition of above wafer without spin.From figure 5 it can be seen that etch rate is in wafer face Interior distribution essentially eliminated wafer etch without spin in the distribution up and down that occurs and center edge distribution, and etching face in Uniformity gets a promotion, and inhomogeneities is controlled less than 5%.This is because counteracting etching groove by introducing wafer rotation Interior upper and lower level etching liquid influence unevenly distributed.In addition, passing through the rotation of wafer and live-roller, etching is also further enhanced Etching liquid convection current in slot, improves etching liquid distributing homogeneity.Crystal circle center region is also enhanced by the rotation of wafer Etching liquid convection current reduces the center edge Distribution Effect of etch rate.

In conclusion the utility model provides a kind of rotation wet-method etching equipment, the rotation wet-method etching equipment packet It includes: etching groove, for accommodating etching liquid and the cassette equipped with wafer to be etched；Rotating device, for driving the crystalline substance to be etched Circle rotates in the cassette；The rotating device includes live-roller, and the live-roller is rotated around central shaft, the live-roller Perpendicular to the crystal column surface to be etched, the roll surface of the live-roller contacts the wafer side to be etched and drives described to be etched Erosion wafer is rotated with the live-roller.The utility model, which passes through, to be introduced into live-roller and drives crystalline substance in cassette during wet etching Circle rotation is avoided because etching homogeneity is not in wafer face caused by the concentration or temperature of etching liquid are different everywhere in etching groove Good problem, to improve product yield.In addition, the rotation by live-roller and wafer also further increases in etching groove The convection velocity of etching liquid improves the distributing homogeneity of etching liquid in etching groove.

The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.

Claims (10)

1. a kind of rotation wet-method etching equipment characterized by comprising

For accommodating the etching groove of etching liquid and the cassette equipped with wafer to be etched；

Rotating device for driving the wafer to be etched to rotate in the cassette；

The rotating device includes live-roller, and the live-roller is rotated around central shaft, and the live-roller is perpendicular to described to be etched Crystal column surface is lost, the roll surface of the live-roller contacts the wafer side to be etched and drives the wafer to be etched with the biography Dynamic roller rotation.

2. a kind of rotation wet-method etching equipment according to claim 1, which is characterized in that the rotating device further include: Drive module and the transmission module for connecting the drive module and the live-roller, the drive module pass through the transmission module The live-roller is driven to rotate.

3. a kind of rotation wet-method etching equipment according to claim 2, which is characterized in that the drive module includes servo Motor.

4. a kind of rotation wet-method etching equipment according to claim 2, which is characterized in that the transmission module includes shaft coupling Device, the shaft coupling connect the drive module and the live-roller, and the drive module passes through described in shaft coupling drive Live-roller rotation.

5. a kind of rotation wet-method etching equipment according to claim 2, which is characterized in that the both ends of the live-roller are movable It is installed on the opposite side wall in the etching groove two sides, at least one end of the live-roller passes through side wall and the company of the etching groove Connect the transmission module.

6. a kind of rotation wet-method etching equipment according to claim 5, which is characterized in that in the etching groove sidewall The installed position of the live-roller is equipped with sealing bearing, and the sealing bearing movably connects the live-roller and supports the biography Dynamic roller rotation.

7. a kind of rotation wet-method etching equipment according to claim 6, which is characterized in that the sealing bearing and the biography The surface of dynamic roller is coated with etch resistant material layer.

8. a kind of rotation wet-method etching equipment according to claim 2, which is characterized in that the roll surface of the live-roller includes Rough surface.

9. a kind of rotation wet-method etching equipment according to claim 1, which is characterized in that the rotation wet-method etching equipment It further include loading/unloading unit, the loading/unloading unit is set to the top of the etching groove, and the loading/unloading unit includes being used for It grabs the cassette and makes the mechanical arm of cassette loading or unloading in the etching groove.

10. a kind of rotation wet-method etching equipment according to claim 9, which is characterized in that the rotation wet etching is set Standby further includes control module, and the control module includes:

For controlling the switch of the rotating device and the rotation control unit of rotation speed, the rotating device is connected；

The loading and unloading control unit that the cassette is loaded and is unloaded for controlling the loading/unloading unit, connects the dress Discharge mechanism.