CN208889637U - 基板处理装置 - Google Patents
基板处理装置 Download PDFInfo
- Publication number
- CN208889637U CN208889637U CN201821423838.1U CN201821423838U CN208889637U CN 208889637 U CN208889637 U CN 208889637U CN 201821423838 U CN201821423838 U CN 201821423838U CN 208889637 U CN208889637 U CN 208889637U
- Authority
- CN
- China
- Prior art keywords
- substrate
- snap ring
- board treatment
- placing component
- lifting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 244
- 238000011282 treatment Methods 0.000 title claims abstract description 42
- 230000000694 effects Effects 0.000 abstract description 17
- 238000000034 method Methods 0.000 description 16
- 239000000126 substance Substances 0.000 description 8
- 238000000227 grinding Methods 0.000 description 6
- 230000000630 rising effect Effects 0.000 description 6
- 238000003701 mechanical milling Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0034262 | 2018-03-26 | ||
KR1020180034262A KR102038508B1 (ko) | 2018-03-26 | 2018-03-26 | 기판 처리 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208889637U true CN208889637U (zh) | 2019-05-21 |
Family
ID=66510695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821423838.1U Active CN208889637U (zh) | 2018-03-26 | 2018-08-31 | 基板处理装置 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR102038508B1 (ko) |
CN (1) | CN208889637U (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113547437A (zh) * | 2021-08-09 | 2021-10-26 | 河南科技学院 | 一种实验室用多功能研抛机 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4524084B2 (ja) * | 2003-08-05 | 2010-08-11 | Sumco Techxiv株式会社 | 半導体ウェーハのローディング装置およびローディング方 |
KR101036605B1 (ko) * | 2008-06-30 | 2011-05-24 | 세메스 주식회사 | 기판 지지 유닛 및 이를 이용한 매엽식 기판 연마 장치 |
KR102412773B1 (ko) * | 2015-11-27 | 2022-06-24 | 주식회사 케이씨텍 | 화학 기계적 연마 시스템의 웨이퍼 로딩 장치 |
KR102461598B1 (ko) * | 2015-12-18 | 2022-11-01 | 주식회사 케이씨텍 | 화학 기계적 연마 시스템의 기판 로딩 장치 |
-
2018
- 2018-03-26 KR KR1020180034262A patent/KR102038508B1/ko active IP Right Grant
- 2018-08-31 CN CN201821423838.1U patent/CN208889637U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113547437A (zh) * | 2021-08-09 | 2021-10-26 | 河南科技学院 | 一种实验室用多功能研抛机 |
CN113547437B (zh) * | 2021-08-09 | 2022-05-27 | 河南科技学院 | 一种实验室用多功能研抛机 |
Also Published As
Publication number | Publication date |
---|---|
KR20190112369A (ko) | 2019-10-07 |
KR102038508B1 (ko) | 2019-10-30 |
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Legal Events
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---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |