CN208889637U - 基板处理装置 - Google Patents

基板处理装置 Download PDF

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Publication number
CN208889637U
CN208889637U CN201821423838.1U CN201821423838U CN208889637U CN 208889637 U CN208889637 U CN 208889637U CN 201821423838 U CN201821423838 U CN 201821423838U CN 208889637 U CN208889637 U CN 208889637U
Authority
CN
China
Prior art keywords
substrate
snap ring
board treatment
placing component
lifting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201821423838.1U
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English (en)
Chinese (zh)
Inventor
金海率
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Case Polytron Technologies Inc
KC Tech Co Ltd
Original Assignee
Case Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Case Polytron Technologies Inc filed Critical Case Polytron Technologies Inc
Application granted granted Critical
Publication of CN208889637U publication Critical patent/CN208889637U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201821423838.1U 2018-03-26 2018-08-31 基板处理装置 Active CN208889637U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0034262 2018-03-26
KR1020180034262A KR102038508B1 (ko) 2018-03-26 2018-03-26 기판 처리 장치

Publications (1)

Publication Number Publication Date
CN208889637U true CN208889637U (zh) 2019-05-21

Family

ID=66510695

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821423838.1U Active CN208889637U (zh) 2018-03-26 2018-08-31 基板处理装置

Country Status (2)

Country Link
KR (1) KR102038508B1 (ko)
CN (1) CN208889637U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113547437A (zh) * 2021-08-09 2021-10-26 河南科技学院 一种实验室用多功能研抛机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4524084B2 (ja) 2003-08-05 2010-08-11 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハのローディング装置およびローディング方
KR101036605B1 (ko) * 2008-06-30 2011-05-24 세메스 주식회사 기판 지지 유닛 및 이를 이용한 매엽식 기판 연마 장치
KR102412773B1 (ko) * 2015-11-27 2022-06-24 주식회사 케이씨텍 화학 기계적 연마 시스템의 웨이퍼 로딩 장치
KR102461598B1 (ko) * 2015-12-18 2022-11-01 주식회사 케이씨텍 화학 기계적 연마 시스템의 기판 로딩 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113547437A (zh) * 2021-08-09 2021-10-26 河南科技学院 一种实验室用多功能研抛机
CN113547437B (zh) * 2021-08-09 2022-05-27 河南科技学院 一种实验室用多功能研抛机

Also Published As

Publication number Publication date
KR20190112369A (ko) 2019-10-07
KR102038508B1 (ko) 2019-10-30

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