CN208805758U - A kind of electronic computer micro server automatically adjusting temperature - Google Patents
A kind of electronic computer micro server automatically adjusting temperature Download PDFInfo
- Publication number
- CN208805758U CN208805758U CN201820841080.7U CN201820841080U CN208805758U CN 208805758 U CN208805758 U CN 208805758U CN 201820841080 U CN201820841080 U CN 201820841080U CN 208805758 U CN208805758 U CN 208805758U
- Authority
- CN
- China
- Prior art keywords
- micro server
- heat dissipation
- heat
- dissipation box
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of electronic computer micro servers for automatically adjusting temperature, including micro server shell, mainboard and CPU, the inner bottom wall of the micro server shell to be fixedly connected with mainboard, and the slot activity on the CPU and mainboard is clamped.Metal mesh and L-type baffle make server have certain dirt exclusion capabilities.In underrun, cooled down by flabellum and coolant liquid.When heavy-duty service, motor speed is changed by thermistor, accelerates water velocity, increases air quantity, increased heat dissipation bore, realize fast cooling.
Description
Technical field
The utility model relates to server correlative technology field more particularly to a kind of electronic computers for automatically adjusting temperature
Micro server.
Background technique
Server, also referred to as servomechanism are to provide the equipment of the service of calculating.The composition of server includes processor, hard disk, interior
It deposits, the micro server small volume similar with general computer architecture such as system bus, and cpu calorific value is big, to guarantee
Dustproof and waterproof, usual heat dissipation effect is bad, causes temperature excessively high, and then influences machine performance.
Utility model content
Purpose of the utility model is to solve disadvantages existing in the prior art, and a kind of automatic adjustment temperature proposed
The electronic computer micro server of degree.
To achieve the goals above, the utility model adopts the technical scheme that
A kind of electronic computer micro server automatically adjusting temperature, including micro server shell, mainboard and CPU,
The inner bottom wall of the micro server shell is fixedly connected with mainboard, and the slot activity on the CPU and mainboard is clamped;
The side wall of the micro server shell offers air inlet, and the upper surface of the micro server shell offers
Air outlet, the inner wall of the air inlet are fixedly connected with metal mesh, and the metal mesh is fixed to be plugged with motor, and the motor turns
Axis fixing sleeve is connected to flabellum, and the shaft rotation of the motor is plugged in the first connecting tube, and the shaft of the motor is fixedly connected
There is water pump vane, the water pump vane is located at the inside of the first connecting tube, and the lower end perforation of first connecting tube, which is connected with, to be led
Hot plate, the heat-conducting plate and CPU are inconsistent, and the side wall of the heat-conducting plate is fixedly connected with thermistor, during the heat-conducting plate is
Hollow structure, the upper surface perforation of the heat-conducting plate are connected with the second connecting tube, the upper end of first connecting tube and the second connection
The upper end of pipe both passes through the inner roof wall of micro server shell and perforation is connected with the same heat dissipation box.
Preferably, the inner wall of the heat dissipation box slidably connects push plate, and the push plate passes through the inside of spring and heat dissipation box
Wall connection, the push plate are fixedly connected with one end of connecting rod, and the side wall that the other end of the connecting rod passes through heat dissipation box reaches
The outside of heat dissipation box is simultaneously fixedly connected with L-type baffle, and one section of the L-type baffle horizontal direction offers stomata, the L-type gear
The upper surface of plate and micro server shell is inconsistent.
Preferably, the upper surface fixation of the heat dissipation box is plugged with heat dissipation fin keel.
Preferably, the area of L-type baffle lower end surface is greater than the area of air outlet port.
Preferably, the thickness of the heat dissipation box is greater than the thickness of heat-conducting plate.
Compared with prior art, the utility model has the beneficial effects that
1. metal mesh and L-type baffle make server have certain dirt exclusion capabilities.
2. being cooled down in underrun by flabellum and coolant liquid.
3. when heavy-duty service, changing motor speed by thermistor, accelerating water velocity, increase air quantity, increase and dissipate
Hot bore realizes fast cooling.
Detailed description of the invention
Fig. 1 be the utility model proposes structural schematic diagram.
In figure: micro server shell 1, metal mesh 2, motor 3, flabellum 4, water pump vane 5, the first connecting tube 6, heat-conducting plate
7, thermistor 8, the second connecting tube 9, heat dissipation box 10, push plate 11, connecting rod 12, L-type baffle 13, mainboard 14, CPU15.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
Referring to Fig.1, a kind of electronic computer micro server automatically adjusting temperature, including micro server shell 1, master
The inner bottom wall of plate 14 and CPU15, micro server shell 1 are fixedly connected with mainboard 14, the slot activity on CPU15 and mainboard 14
Clamping.
The side wall of micro server shell 1 offers air inlet, and the upper surface of micro server shell 1 offers outlet air
Mouthful, the inner wall of air inlet is fixedly connected with metal mesh 2, and the aperture of metal mesh 2 is not more than 5mm, and the fixation of metal mesh 2 is plugged with motor
3, the shaft fixing sleeve of motor 3 is connected to flabellum 4, and the shaft rotation of motor 3 is plugged in the first connecting tube 6, and the shaft of motor 3 is solid
Surely it is connected with water pump vane 5, water pump vane 5 is located at the inside of the first connecting tube 6, and the lower end perforation of the first connecting tube 6 is connected with
Heat-conducting plate 7, heat-conducting plate 7 and CPU15 is inconsistent, and gap location is also added with silicone grease, and the side wall of heat-conducting plate 7 is fixedly connected with temperature-sensitive
Resistance 8, and be negative tempperature coefficient thermistor, heat-conducting plate 7 is hollow structure, and the upper surface perforation of heat-conducting plate 7 is connected with second
The upper end of connecting tube 9, the upper end of the first connecting tube 6 and the second connecting tube 9 both passes through the inner roof wall of micro server shell 1 and passes through
Lead to and is connected to the same heat dissipation box 10.
The inner wall of heat dissipation box 10 slidably connects push plate 11, and push plate 11 is connect by spring with the inner sidewall of heat dissipation box 10,
Push plate 11 is fixedly connected with one end of connecting rod 12, and the side wall that the other end of connecting rod 12 passes through heat dissipation box 10 reaches heat dissipation box 10
Outside and be fixedly connected with L-type baffle 13, one section of 13 horizontal direction of L-type baffle offers stomata, L-type baffle 13 with it is miniature
The upper surface of server enclosure 1 is inconsistent.
The upper surface fixation of heat dissipation box 10 is plugged with heat dissipation fin keel, is iron plate or copper sheet.The area of 13 lower end surface of L-type baffle
Greater than the area of air outlet port, dust-proof effect is improved.The thickness of heat dissipation box 10 is greater than the thickness of heat-conducting plate 7.
In this case, when CPU15 underrun, CPU15 generates heat, and the rotation of motor 3 is slower, and hydraulic pressure is smaller, L-type baffle
13 cover air outlet, drive flabellum 4 and water pump vane 5 to rotate, flow into air from air inlet, then flow out from stomata, will be micro-
Heat in type server enclosure 1 is taken away, and metal mesh 2 and L-type baffle 13 can play dust-proof work to micro server shell 1
With, while water is pumped into heat dissipation box 10 by water pump vane 5, is made water in the first connecting tube 6, heat dissipation box 10, the second connecting tube 9, is led
Clockwise flow in hot plate 7, heat dissipation box 10 and heat dissipation fin keel cool down.
If CPU15 heavy-duty service, the heat generated in the unit time is more, causes the temperature of CPU15 to increase, makes heat
The resistance value of quick resistance 8 reduces, and then increases the revolving speed of motor 3, accelerates the air circulation in micro server shell 1, simultaneously
Accelerate the flow velocity of water, hydraulic pressure increases, and pushes push plate 11 to move right, separates L-type baffle 13 with air outlet, further speed up scattered
Temperature is adjusted in heat.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not
It is confined to this, anyone skilled in the art is within the technical scope disclosed by the utility model, practical according to this
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (5)
1. it is a kind of automatically adjust temperature electronic computer micro server, including micro server shell (1), mainboard (14) and
CPU (15), which is characterized in that the inner bottom wall of the micro server shell (1) is fixedly connected with mainboard (14), the CPU
(15) it is clamped with the slot activity on mainboard (14);
The side wall of the micro server shell (1) offers air inlet, and the upper surface of the micro server shell (1) opens up
There is air outlet, the inner wall of the air inlet is fixedly connected with metal mesh (2), and metal mesh (2) fixation is plugged with motor (3),
The shaft fixing sleeve of the motor (3) is connected to flabellum (4), and the shaft rotation of the motor (3) is plugged on the first connecting tube (6)
In, the shaft of the motor (3) is fixedly connected with water pump vane (5), and the water pump vane (5) is located at the first connecting tube (6)
The lower end perforation of inside, first connecting tube (6) is connected with heat-conducting plate (7), and the heat-conducting plate (7) and CPU (15) are inconsistent
The side wall of the heat-conducting plate (7) is fixedly connected with thermistor (8), and the heat-conducting plate (7) is hollow structure, the heat-conducting plate
(7) upper surface perforation is connected with the second connecting tube (9), the upper end of first connecting tube (6) and the second connecting tube (9) it is upper
It holds the inner roof wall for both passing through micro server shell (1) and perforation is connected with the same heat dissipation box (10).
2. a kind of electronic computer micro server for automatically adjusting temperature according to claim 1, which is characterized in that institute
The inner wall for stating heat dissipation box (10) slidably connects push plate (11), and the push plate (11) passes through the inner sidewall of spring and heat dissipation box (10)
Connection, the push plate (11) are fixedly connected with one end of connecting rod (12), and the other end of the connecting rod (12) passes through heat dissipation box
(10) side wall reaches the outside of heat dissipation box (10) and is fixedly connected with L-type baffle (13), L-type baffle (13) horizontal direction
One section offer stomata, the L-type baffle (13) and the upper surface of micro server shell (1) are inconsistent.
3. a kind of electronic computer micro server for automatically adjusting temperature according to claim 1, which is characterized in that institute
The upper surface fixation for stating heat dissipation box (10) is plugged with heat dissipation fin keel.
4. a kind of electronic computer micro server for automatically adjusting temperature according to claim 2, which is characterized in that institute
The area for stating L-type baffle (13) lower end surface is greater than the area of air outlet port.
5. a kind of electronic computer micro server for automatically adjusting temperature according to claim 1, which is characterized in that institute
The thickness for stating heat dissipation box (10) is greater than the thickness of heat-conducting plate (7).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820841080.7U CN208805758U (en) | 2018-05-31 | 2018-05-31 | A kind of electronic computer micro server automatically adjusting temperature |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820841080.7U CN208805758U (en) | 2018-05-31 | 2018-05-31 | A kind of electronic computer micro server automatically adjusting temperature |
Publications (1)
Publication Number | Publication Date |
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CN208805758U true CN208805758U (en) | 2019-04-30 |
Family
ID=66224531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201820841080.7U Expired - Fee Related CN208805758U (en) | 2018-05-31 | 2018-05-31 | A kind of electronic computer micro server automatically adjusting temperature |
Country Status (1)
Country | Link |
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CN (1) | CN208805758U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111103956A (en) * | 2020-01-19 | 2020-05-05 | 张瑞雯 | Big data server with intelligent regulation heat dissipation function |
CN111538387A (en) * | 2020-05-14 | 2020-08-14 | 广东理工学院 | Computer with heat dissipation auxiliary constant temperature circuit |
-
2018
- 2018-05-31 CN CN201820841080.7U patent/CN208805758U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111103956A (en) * | 2020-01-19 | 2020-05-05 | 张瑞雯 | Big data server with intelligent regulation heat dissipation function |
CN111538387A (en) * | 2020-05-14 | 2020-08-14 | 广东理工学院 | Computer with heat dissipation auxiliary constant temperature circuit |
CN111538387B (en) * | 2020-05-14 | 2023-04-07 | 广东理工学院 | Computer with heat dissipation auxiliary constant temperature circuit |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190430 Termination date: 20210531 |