CN111538387A - Computer with heat dissipation auxiliary constant temperature circuit - Google Patents
Computer with heat dissipation auxiliary constant temperature circuit Download PDFInfo
- Publication number
- CN111538387A CN111538387A CN202010406622.XA CN202010406622A CN111538387A CN 111538387 A CN111538387 A CN 111538387A CN 202010406622 A CN202010406622 A CN 202010406622A CN 111538387 A CN111538387 A CN 111538387A
- Authority
- CN
- China
- Prior art keywords
- water
- frame
- heat
- computer
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a computer with a heat dissipation auxiliary constant temperature circuit, which structurally comprises a case, a frame, a cover plate, a keyboard groove and a display screen, wherein the frame is horizontally arranged at the upper end of the case and clamped, the cover plate is arranged at the side end of the frame, the keyboard groove is sunken in the inner side of the cover plate, the display screen is embedded and arranged at the inner side of the frame, the case comprises a case body, a water cooling structure, an inner frame, a fan, a heat dissipation port and an air port, the water cooling structure is embedded and arranged at the bottom of the inner side of the case body, the inner frame is embedded in the inner side of the case body, and the fan is mechanically connected to two sides of the case body; the inner frame is arranged on the inner side of the box body, so that heat is sent out nearby, meanwhile, hot air is gathered, the electronic elements are prevented from being contacted again when being sent out, the mutual influence of the temperature among the electronic elements is reduced, and the heat dissipation effect is guaranteed.
Description
Technical Field
The invention belongs to the field of computers, and particularly relates to a computer with a heat dissipation auxiliary constant temperature circuit.
Background
The computer is a computer which is commonly known by people, mainly an electronic computing machine for high-speed computing in modern society, and intelligent electronic equipment for operating according to programs and automatically processing data at high speed, plays a powerful role in production and life, is rapidly developed in industry, utilizes the cooperation of the intelligent electronic equipment and the intelligent electronic equipment to control the intelligent automatic operation work of the equipment, accelerates the efficiency of industrial production, generates heat in the operation of the computer, generates more heat when the computer performs higher-speed computing, and needs to use a computer with a heat dissipation auxiliary constant temperature circuit to help the equipment to perform constant temperature and prevent overheating damage, but the prior art has the following defects:
because the circuit in the computer is concentrated on the circuit board and is in an integral type, and the fan is positioned in the center of the circuit board, wherein the electronic elements in the circuit play different roles during operation, the generated heat is different, and when the fan works, the heat on the circuit board is gathered towards the middle along with the flowing of air, so that the temperature among the electronic elements on the circuit is influenced mutually, and the heat dissipation effect is influenced.
Therefore, the computer with the heat dissipation auxiliary constant temperature circuit is provided, and the defects are improved.
Disclosure of Invention
The invention aims to provide a computer with a heat dissipation auxiliary constant temperature circuit, aiming at solving the problems that in the prior art, because the circuits in the computer are concentrated on a circuit board and are integrated, and a fan is positioned in the center of the circuit board, electronic elements in the circuits play different roles during operation, the generated heat is different, and when the fan works, the heat on the circuit board is gathered towards the middle along with the flowing of air, so that the temperatures among the electronic elements on the circuits are influenced mutually, and the heat dissipation effect is influenced.
In order to achieve the purpose, the invention is realized by the following technical scheme: a computer with a heat dissipation auxiliary constant temperature circuit structurally comprises a case, a frame, a cover plate, a keyboard groove and a display screen, wherein the frame is horizontally arranged at the upper end of the case and clamped, the cover plate is arranged at the side end of the frame and connected by a hinge, the keyboard groove is sunken in the inner side of the cover plate and is of an integrated structure, and the display screen is embedded in the inner side of the frame and connected by a machine; the machine case comprises a case body, a water cooling structure, an inner frame, a fan, a heat dissipation opening and an air opening, wherein the water cooling structure is embedded in the bottom of the inner side of the case body and is mechanically connected, the inner frame is embedded in the inner side of the case body and is fixedly connected with the inner side of the case body, the fan is mechanically connected to two sides of the case body and is located in the air opening, and the heat dissipation opening penetrates through the upper end of the case body.
The invention is further improved, the water cooling structure comprises a water tank, a water pumping structure, water pumping pipes, a pipe network and connecting pipes, the water pumping structure is embedded and installed on the inner side of the water tank and is mechanically connected, the water pumping pipes penetrate through the water tank and are connected with the water pumping structure, the right side of the pipe network is connected with the water pumping pipes, the connecting pipes are connected between the pipe network, the pipe network is provided with two pairs of pipes and distributed on the inner sides of the two fans, and the lower end of the pipe network is communicated with the water.
The invention is further improved, the water pumping structure comprises a power supply module, a switch module, a thermistor and a water pump, the power supply module is used for providing working voltage for the thermistor and the water pump, the switch module controls the power supply module to be started, and the thermistor provides corresponding working current for the water pump according to the received temperature.
The invention is further improved, the inner frame comprises a lower groove, a circuit mounting plate, a heat dissipation structure and notches, the lower groove is arranged at the lower end of the circuit mounting plate and is of an integrated structure, the heat dissipation structure is embedded and mounted on the inner side of the circuit mounting plate and is uniformly distributed, and the notches penetrate through the upper left end of the inner side of the circuit mounting plate.
The invention is further improved, the heat dissipation structure comprises an outer frame, a diversion trench and an air outlet, the diversion trench is arranged on the inner side of the outer frame and welded with the outer frame, and the air outlet penetrates through the diversion trench and is communicated with the diversion trench.
The invention is further improved, the inner side of the diversion trench is provided with an auxiliary structure, the auxiliary structure comprises a movable structure, a rotating shaft and diversion plates, the rotating shaft penetrates through the inner side of the movable structure and is clamped, and the diversion plates are arranged on the outer side of the movable structure and are uniformly distributed.
The invention is further improved, the movable structure comprises a movable disc, movable rods, an outer ring and sliding grooves, the movable rods are arranged on the outer side of the movable disc and are uniformly distributed, the outer ring is sleeved on the outer side of the movable disc and is movably connected, the sliding grooves are recessed in the inner side of the outer ring and are of an integrated structure, the movable rods abut against the inner side of the sliding grooves, and a plurality of guide plates are uniformly arranged on the outer side of the outer ring.
The invention is further improved, the upper end of the guide plate is provided with an inner groove, the inner groove extends from the inner side to the outer side and gradually inclines upwards, the inner side of the guide plate is provided with a partition plate, and the partition plate partitions the inner groove and inclines from top to bottom.
According to the technical scheme, the computer with the heat dissipation auxiliary constant temperature circuit has the following beneficial effects:
according to the invention, the water cooling structure is arranged on the inner side of the box body, the power module supplies power to the thermistor, the thermistor adjusts the size of the resistor according to the temperature in the case, and then the electric energy is supplied to the water suction pump, so that the cooling water on the inner side of the water tank can be extracted to enter the water suction pipe and enter a pipe network, at the moment, the cooling water on the inner side cools the air blown out by the fan and blows the air inwards to blow the circuit mounting plate to cool the electronic element on the upper end, at the moment, the air on the inner side is brought into the heat dissipation structure nearby, the heat on the upper end is sent out nearby while the electronic element is further cooled, the contact with the electronic element is reduced, and the constant temperature of the circuit on the inner side is ensured.
The inner frame is arranged on the inner side of the box body, heat enters the air outlet along with the flow guide groove, the heat acts on the auxiliary structure at the upper end, the flow guide plate is blown by hot air, the movable structure rotates around the rotating shaft, the outer ring also rotates on the outer side of the movable rod, the movable rod abuts against the inner side of the sliding groove, the heat on the inner side is quickly closed when the box body is opened and sent out, the hot air is sufficiently gathered, the hot air is also gathered to the inner side along the inner groove when the box body is sent out, the hot air is gathered to the middle when the box body is sent out, the hot air is prevented from contacting the electronic elements again when the box body is sent out, the mutual influence of the temperature among the electronic elements is reduced, and the heat dissipation effect is guaranteed.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic diagram of a computer with a heat dissipation auxiliary thermostat circuit according to the present invention;
FIG. 2 is a schematic structural diagram of a chassis according to the present invention;
FIG. 3 is a schematic structural diagram of a water-cooling structure according to the present invention;
FIG. 4 is a schematic view of the water pumping structure of the present invention;
FIG. 5 is a schematic diagram of a circuit configuration of the water pumping structure of the present invention;
FIG. 6 is a schematic front view of the inner frame of the present invention;
FIG. 7 is a side view of the inner frame of the present invention;
FIG. 8 is a schematic structural diagram of a heat dissipation structure according to the present invention;
fig. 9 is a schematic structural view of a guiding gutter according to the present invention;
FIG. 10 is a schematic structural diagram of an auxiliary structure according to the present invention;
FIG. 11 is a schematic structural view of the mobile structure of the present invention;
fig. 12 is a schematic view of a baffle of the present invention.
In the figure: case-1, frame-2, cover plate-3, keyboard groove-4, display screen-5, case-11, water cooling structure-12, inner frame-13, fan-14, heat dissipation port-15, air port-16, water tank-121, water pumping structure-122, water pumping pipe-123, pipe network-124, connecting pipe-125, power module-22 a, switch module-22 b, thermistor-22 c, water pumping pump-22 d, lower groove-131, circuit mounting plate-132, heat dissipation structure-133, notch-134, outer frame-33 a, diversion groove-33 b, air outlet-33 c, auxiliary structure-b 1, movable structure-b 11, rotating shaft-b 12, diversion plate-d 13, movable plate-z 1, movable rod-z 2, outer ring-z 3, sliding groove-z 4, inner groove-x 1, partition-x 2.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
The first embodiment is as follows: referring to fig. 1-7, the embodiments of the present invention are as follows:
the structure of the keyboard comprises a case 1, a frame 2, a cover plate 3, a keyboard groove 4 and a display screen 5, wherein the frame 2 is horizontally arranged at the upper end of the case 1 and clamped, the cover plate 3 is arranged at the side end of the frame 2 and connected by a hinge, the keyboard groove 4 is sunken at the inner side of the cover plate 3 and is of an integrated structure, and the display screen 5 is embedded and arranged at the inner side of the frame 2 and is mechanically connected; the case 1 comprises a case body 11, a water cooling structure 12, an inner frame 13, a fan 14, a heat dissipation port 15 and an air port 16, wherein the water cooling structure 12 is embedded in the bottom of the inner side of the case body 11 and is mechanically connected, the inner frame 13 is embedded in the inner side of the case body 11 and is fixedly connected with the inner side of the case body, the fan 14 is mechanically connected to two sides of the case body 11 and is positioned in the air port 16, and the heat dissipation port 15 penetrates through the upper end of the case body 11 and is.
Referring to fig. 3, the water cooling structure 12 includes a water tank 121, a water pumping structure 122, water pumping pipes 123, a pipe network 124, and a connecting pipe 125, the water pumping structure 122 is embedded in the water tank 121 and mechanically connected, the water pumping pipes 123 penetrate through the water tank 121 and are connected to the water pumping structure 122, the right side of the pipe network 124 is connected to the water pumping pipes 123, the connecting pipe 125 is connected between the pipe networks 124, two pairs of the pipe networks 124 are arranged and distributed inside two fans 14, the lower end of the pipe network 124 is communicated with the water tank 121, the blown air is cooled down better by the inside circuit according to the flow of the cooling water in the water tank 121 in the pipe network 124, and the cooling water on the pipe network 124 outside is taken away heat by the fans 14 and then circulates.
Referring to fig. 4 to 5, the water pumping structure 122 includes a power module 22a, a switch module 22b, a thermistor 22c, and a water pump 22d, where the power module 22a is configured to provide a working voltage to the thermistor 22c and the water pump 22d, the switch module 22b controls the power module 22a to start, the thermistor 22c provides a corresponding working current to the water pump 22d according to the received temperature, the thermistor 22c is a negative temperature coefficient thermistor, and the resistance is smaller when the temperature is higher, and the current provided to the water pump 22d is larger, so as to accelerate the operation of the water pump 22d, and accelerate the cooling speed.
Referring to fig. 6 to 7, the inner frame 13 includes a lower groove 131, a circuit mounting plate 132, a heat dissipation structure 133, and notches 134, the lower groove 131 is disposed at a lower end of the circuit mounting plate 132 and is an integrated structure, the heat dissipation structure 133 is embedded and mounted inside the circuit mounting plate 132 and is uniformly distributed, and the notches 134 penetrate through an upper left end inside the circuit mounting plate 132, so that wind takes heat away from the heat dissipation structure 133 at both sides through the circuit mounting plate 132, and the heat is reduced from contacting again with electronic components on the circuit mounting plate 132.
Based on the above embodiment, the specific working principle is as follows:
when the machine works, heat is generated in the machine case 1, at this time, the fan 14 and the water cooling structure 12 start to work, the switch module 22b starts the power module 22a, so that the power module 22a supplies power to the thermistor 22c, at this time, the thermistor 22c adjusts the resistance according to the temperature in the machine case 1, and further supplies electric energy to the water pump 22d, so that the cooling water inside the water tank 121 can be extracted and enters the water pumping pipe 123 and enters the pipe network 124, at this time, the inside cooling water cools the air blown out by the fan 14 and blows the air inwards to the circuit mounting plate 132, the electronic components at the upper end are cooled, at this time, the inside air is brought into the heat dissipation structure 133 and is sent to the next inner frame 13, the hot air is taken away continuously, then the left side fan 14 is taken away, and the heated cooling water in the pipe network 124 is also taken away by heat, the cooling water then enters the water cooling structure 12, and the circulating work is performed.
Example two: referring to fig. 6-12, the embodiment of the present invention is as follows:
the inner frame 13 includes a lower groove 131, a circuit mounting plate 132, a heat dissipation structure 133, and notches 134, the lower groove 131 is disposed at the lower end of the circuit mounting plate 132 and is an integrated structure, the heat dissipation structure 133 is embedded inside the circuit mounting plate 132 and is uniformly distributed, and the notches 134 penetrate through the upper left end inside the circuit mounting plate 132.
Referring to fig. 8, the heat dissipation structure 133 includes an outer frame 33a, a flow guide groove 33b, and an air outlet 33c, where the flow guide groove 33b is installed inside the outer frame 33a and welded to the outer frame, and the air outlet 33c penetrates through the flow guide groove 33b and is communicated with the flow guide groove 33b, so that heat is gathered to the inside to prevent diffusion.
Referring to fig. 9-10, an auxiliary structure b1 is disposed on the inner side of the diversion trench 33b, the auxiliary structure b1 includes a movable structure b11, a rotating shaft b12, and a diversion plate d13, the rotating shaft b12 penetrates through the inner side of the movable structure b11 and is clamped, the diversion plates d13 are mounted on the outer side of the movable structure b11 and are uniformly distributed, heat is diverted, the diversion speed is adjusted according to the flow speed of hot air, and contact with cold air is guaranteed.
Referring to fig. 11, the movable structure b11 includes a movable disk z1, movable rods z2, an outer ring z3, and a sliding groove z4, the movable rods z2 are mounted outside the movable disk z1 and are uniformly distributed, the outer ring z3 is sleeved outside the movable disk z1 and movably connected, the sliding groove z4 is recessed inside the outer ring z3 and is an integrated structure, the movable rods z2 abut against the inside of the sliding groove z4, a plurality of guide plates d13 are uniformly mounted outside the outer ring z3, and the position change of the guide plates d13 outside the outer ring z3 is maintained, so that better wind guiding is performed.
Referring to fig. 12, the upper end of the flow guide plate d13 is provided with an inner groove x1, the inner groove x1 extends from the inner side to the outer side and gradually inclines upwards, the inner side of the flow guide plate d13 is provided with a partition plate x2, and the partition plate x2 partitions the inner groove x1 and inclines upwards, so that hot air is gathered in the middle and prevented from diffusing outwards to contact with other electronic components.
Based on the above embodiment, the specific working principle is as follows:
the heat dissipation structure 133 brings the heat at the upper end of the circuit mounting board 132 to the outside, at this time, the heat enters the air outlet 33c along with the diversion trench 33b, the heat will act on the auxiliary structure b1 at the upper end, the hot air will blow the diversion plate d13, the movable structure b11 will rotate around the rotation axis b12, the outer ring z3 will also rotate outside the movable rod z2, and the movable rod z2 abuts against the inside of the sliding trench z4, so that the heat at the inside will be quickly closed when being opened and sent out, the hot air will be sufficiently gathered, and when being sent out, the hot air will be gathered to the inside along the inner trench x1, and further gathered to the middle, thereby preventing the electronic components on the circuit mounting board 132 from being contacted when being sent out, and the heat on the circuit mounting board 132 is taken away by the circulating work.
The invention solves the problems that in the prior art, because the circuits in the computer are concentrated on the circuit board and are in an integral type, the fan is positioned in the center of the circuit board, and the electronic elements in the circuits play different roles in operation, the generated heat is different, when the fan works, the heat on the circuit board is gathered towards the middle along with the flow of air, so that the temperatures of the electronic elements on the circuits are mutually influenced, and the heat dissipation effect is influenced, through the mutual combination of the components, the inner side of the box body is provided with a water cooling structure, the power module provides power for the thermistor, the thermistor adjusts the size of the resistor according to the temperature in the box body, so as to provide electric energy for the water pump, namely, the cooling water in the water tank can be extracted to enter the water pumping pipe and then enter the pipe network, and the cooling water on the inner side cools the air blown out by the fan, the air is blown inwards to blow the circuit mounting plate to cool the electronic element at the upper end, and at the moment, the air at the inner side is brought into the heat dissipation structure nearby, so that the heat at the upper end is sent out nearby while the electronic element is further cooled, the contact with the electronic element is reduced, and the constant temperature of the circuit at the inner side is ensured; the internal frame has been set up at the box inboard, the heat enters into the air outlet along with the guiding gutter, the auxiliary structure that will act on the upper end, hot-blast guide plate that will blow, the revolution mechanic will rotate round the axis of rotation thereupon, the outer loop will also rotate in the movable rod outside, and the movable rod supports in the sliding tray inboard, will make inboard heat open the closure that send out time is quick again, carry out abundant the assembling to hot-blast, and when sending out, hot-blast also will concentrate to the inboard along the inside groove, and then assemble the sending out to the centre, when sending out the heat nearby, assemble hot-blast, prevent to contact electronic component once more when sending out, the temperature that has reduced between electronic component influences each other, the radiating effect has been guaranteed.
While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. A computer with a heat dissipation auxiliary constant temperature circuit structurally comprises a case (1), a frame (2), a cover plate (3), a keyboard groove (4) and a display screen (5), wherein the frame (2) is horizontally arranged at the upper end of the case (1), the cover plate (3) is arranged at the side end of the frame (2), the keyboard groove (4) is sunken in the inner side of the cover plate (3), and the display screen (5) is embedded in the inner side of the frame (2); the method is characterized in that:
case (1) includes box (11), water-cooling structure (12), inner frame (13), fan (14), thermovent (15), wind gap (16), water-cooling structure (12) embedding is installed in box (11) inboard bottom, inner frame (13) inlay in box (11) inboard, fan (14) mechanical connection is in box (11) both sides, thermovent (15) run through in box (11) upper end.
2. A computer having a heat-dissipating auxiliary thermostatic circuit according to claim 1, characterized in that: water-cooling structure (12) include water tank (121), draw water structure (122), drinking-water pipe (123), pipe network (124), connecting pipe (125), it installs in water tank (121) inboardly to draw water structure (122), drinking-water pipe (123) run through in water tank (121) and are connected with pumping-water structure (122), pipe network (124) right side is connected with drinking-water pipe (123), connecting pipe (125) are connected between pipe network (124), pipe network (124) are equipped with two pairs, pipe network (124) lower extreme is linked together with water tank (121).
3. A computer having a heat-dissipating auxiliary thermostatic circuit according to claim 2, characterized in that: the water pumping structure (122) comprises a power supply module (22 a), a switch module (22 b), a thermistor (22 c) and a water pump (22 d), wherein the power supply module (22 a) is used for providing working voltage for the thermistor (22 c) and the water pump (22 d), the switch module (22 b) controls the power supply module (22 a) to be started, and the thermistor (22 c) provides corresponding working current for the water pump (22 d) according to the received temperature.
4. A computer having a heat-dissipating auxiliary thermostatic circuit according to claim 1, characterized in that: the inner frame (13) comprises a lower groove (131), a circuit mounting plate (132), a heat dissipation structure (133) and a notch (134), the lower end of the circuit mounting plate (132) is arranged in the lower groove (131), the heat dissipation structure (133) is embedded in the inner side of the circuit mounting plate (132), and the notch (134) penetrates through the left upper end of the inner side of the circuit mounting plate (132).
5. The computer with the auxiliary thermostatic circuit for dissipating heat according to claim 4, wherein: the heat dissipation structure (133) comprises an outer frame (33 a), a diversion trench (33 b) and an air outlet (33 c), the diversion trench (33 b) is installed on the inner side of the outer frame (33 a), and the air outlet (33 c) penetrates through the diversion trench (33 b) and is communicated with the diversion trench (33 b).
6. A computer with a heat-dissipating auxiliary thermostatic circuit according to claim 5, characterized in that: the guiding gutter (33 b) inboard is equipped with auxiliary structure (b 1), auxiliary structure (b 1) are including activity structure (b 11), axis of rotation (b 12), guide plate (d 13), axis of rotation (b 12) run through in activity structure (b 11) inboard, guide plate (d 13) are installed in the activity structure (b 11) outside.
7. The computer with the auxiliary thermostatic circuit for dissipating heat according to claim 6, wherein: the movable structure (b 11) comprises a movable disc (z 1), a movable rod (z 2), an outer ring (z 3) and a sliding groove (z 4), wherein the movable rod (z 2) is installed on the outer side of the movable disc (z 1), the outer ring (z 3) is sleeved on the outer side of the movable disc (z 1), the sliding groove (z 4) is sunken on the inner side of the outer ring (z 3), the movable rod (z 2) is supported on the inner side of the sliding groove (z 4), and a plurality of guide plates (d 13) are uniformly installed on the outer side of the outer ring (z 3).
8. A computer with a heat-dissipating auxiliary thermostatic circuit according to claim 6 or 7, characterized in that: an inner groove (x 1) is formed in the upper end of the flow guide plate (d 13), the inner groove (x 1) extends from the inner side to the outer side, a partition plate (x 2) is arranged on the inner side of the flow guide plate (d 13), and the partition plate (x 2) partitions the inner groove (x 1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010406622.XA CN111538387B (en) | 2020-05-14 | 2020-05-14 | Computer with heat dissipation auxiliary constant temperature circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010406622.XA CN111538387B (en) | 2020-05-14 | 2020-05-14 | Computer with heat dissipation auxiliary constant temperature circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111538387A true CN111538387A (en) | 2020-08-14 |
| CN111538387B CN111538387B (en) | 2023-04-07 |
Family
ID=71967986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010406622.XA Active CN111538387B (en) | 2020-05-14 | 2020-05-14 | Computer with heat dissipation auxiliary constant temperature circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111538387B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112671037A (en) * | 2020-12-24 | 2021-04-16 | 广东理工学院 | Micro-grid power droop control device and control method thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2585305Y (en) * | 2002-11-19 | 2003-11-05 | 曲树立 | Circulating liquid/air cooling type heat sink for desk computer CPU |
| JP2014053504A (en) * | 2012-09-07 | 2014-03-20 | Fujitsu Ltd | Electronic apparatus and cooling module mounted in electronic apparatus |
| CN104460907A (en) * | 2014-12-11 | 2015-03-25 | 湖南机电职业技术学院 | Computer water-cooling radiating system |
| CN204496399U (en) * | 2015-04-14 | 2015-07-22 | 周调彪 | Heat radiation computer cabinet capable of circulation |
| CN107092323A (en) * | 2017-06-16 | 2017-08-25 | 合肥海腾软件科技有限公司 | A kind of pair of cooling system mating type computer housing |
| CN107329548A (en) * | 2017-07-26 | 2017-11-07 | 张家港市九华科技有限公司 | A kind of computer automatic dust removing radiator fan |
| CN207571684U (en) * | 2017-11-14 | 2018-07-03 | 石家庄市睿兴科技有限公司 | A kind of auxiliary temperature-reducing device of desk computer host case |
| CN208061080U (en) * | 2018-01-05 | 2018-11-06 | 广东理工学院 | A kind of dustproof computer cabinet |
| CN208805758U (en) * | 2018-05-31 | 2019-04-30 | 东莞肯博尔电子科技有限公司 | A kind of electronic computer micro server automatically adjusting temperature |
| CN110137826A (en) * | 2019-05-29 | 2019-08-16 | 吕美连 | A kind of high temperature resistant power distributing cabinet |
| CN209356979U (en) * | 2019-03-21 | 2019-09-06 | 刘爱民 | Cooling cabinet is used in a kind of installation of computer |
-
2020
- 2020-05-14 CN CN202010406622.XA patent/CN111538387B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2585305Y (en) * | 2002-11-19 | 2003-11-05 | 曲树立 | Circulating liquid/air cooling type heat sink for desk computer CPU |
| JP2014053504A (en) * | 2012-09-07 | 2014-03-20 | Fujitsu Ltd | Electronic apparatus and cooling module mounted in electronic apparatus |
| CN104460907A (en) * | 2014-12-11 | 2015-03-25 | 湖南机电职业技术学院 | Computer water-cooling radiating system |
| CN204496399U (en) * | 2015-04-14 | 2015-07-22 | 周调彪 | Heat radiation computer cabinet capable of circulation |
| CN107092323A (en) * | 2017-06-16 | 2017-08-25 | 合肥海腾软件科技有限公司 | A kind of pair of cooling system mating type computer housing |
| CN107329548A (en) * | 2017-07-26 | 2017-11-07 | 张家港市九华科技有限公司 | A kind of computer automatic dust removing radiator fan |
| CN207571684U (en) * | 2017-11-14 | 2018-07-03 | 石家庄市睿兴科技有限公司 | A kind of auxiliary temperature-reducing device of desk computer host case |
| CN208061080U (en) * | 2018-01-05 | 2018-11-06 | 广东理工学院 | A kind of dustproof computer cabinet |
| CN208805758U (en) * | 2018-05-31 | 2019-04-30 | 东莞肯博尔电子科技有限公司 | A kind of electronic computer micro server automatically adjusting temperature |
| CN209356979U (en) * | 2019-03-21 | 2019-09-06 | 刘爱民 | Cooling cabinet is used in a kind of installation of computer |
| CN110137826A (en) * | 2019-05-29 | 2019-08-16 | 吕美连 | A kind of high temperature resistant power distributing cabinet |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112671037A (en) * | 2020-12-24 | 2021-04-16 | 广东理工学院 | Micro-grid power droop control device and control method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111538387B (en) | 2023-04-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8164897B2 (en) | Airflow recirculation and cooling apparatus and method for an electronics rack | |
| US9441640B2 (en) | Pump for water cooler | |
| CN211061984U (en) | Computer heat abstractor | |
| CN111538387B (en) | Computer with heat dissipation auxiliary constant temperature circuit | |
| CN211531601U (en) | Server cabinet with heat dissipation function for electric power information communication machine room | |
| CN204731715U (en) | A kind of New cold type radiating frame for notebook computer | |
| CN217115322U (en) | High-efficient radiating block terminal structure | |
| CN216872631U (en) | Power cabinet cooling device for electric power | |
| CN216056620U (en) | Efficient heat dissipation device for linear motor | |
| CN114390870A (en) | Heat dissipation cabinet | |
| CN201388355Y (en) | Heat dissipating device and electronic part module box and machine room with heat dissipating devices | |
| CN112384036B (en) | High-efficient heat abstractor of electric automatization liquid cooling | |
| CN112616297A (en) | Heat dissipation device, control method and server equipment | |
| CN112294351A (en) | Internal temperature adjusting method of CT (computed tomography) machine | |
| CN207252129U (en) | A kind of automatic temperature reduction device | |
| CN110306330B (en) | Laundry treating apparatus and control panel cooling method thereof | |
| CN216772327U (en) | Block chain server | |
| CN220545374U (en) | Cooling device for communication cabinet | |
| CN219978785U (en) | Server | |
| CN211128791U (en) | Intelligent instrument convenient to heat dissipation | |
| CN217957589U (en) | Network information transmission safety analysis device | |
| CN213693935U (en) | Monitoring equipment box | |
| CN220651211U (en) | Computer hardware cooling box | |
| CN216218312U (en) | High-efficient heat sink | |
| CN212204955U (en) | Liquid cooling heat abstractor and air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A computer with heat dissipation assisted constant temperature circuit Effective date of registration: 20230913 Granted publication date: 20230407 Pledgee: Industrial and Commercial Bank of China Limited Zhaoqing Duanzhou Branch Pledgor: GUANGDONG POLYTECHNIC College Registration number: Y2023980056473 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |