CN208796983U - A kind of package structure of semiconductor device - Google Patents
A kind of package structure of semiconductor device Download PDFInfo
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- CN208796983U CN208796983U CN201821038994.6U CN201821038994U CN208796983U CN 208796983 U CN208796983 U CN 208796983U CN 201821038994 U CN201821038994 U CN 201821038994U CN 208796983 U CN208796983 U CN 208796983U
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- electrode sheet
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- elastic component
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Abstract
The utility model provides a kind of package structure of semiconductor device, the package structure of semiconductor device, comprising: first electrode sheet；Second electrode sheet is oppositely arranged with the first electrode sheet；Semiconductor device chip is arranged between the first electrode sheet and second electrode sheet；And conductive elastic component, it is arranged between the semiconductor device chip and the first electrode sheet and/or between the semiconductor device chip and the second electrode sheet.The encapsulating structure between semiconductor device chip and electrode slice by being arranged conductive elastic component; it is buffered by the conductive elastic component and discharges the stress being applied on the power semiconductor chips when encapsulation; effective protection power semiconductor chips are not damaged because local pressure is excessive; the reliability for effectively improving device encapsulation, obtains good packages and devices performance.
Description
Technical field
The utility model relates to semiconductor packages fields, and in particular to a kind of package structure of semiconductor device.
Background technique
In recent years, rigidity crimping is packaged into the predominant package mode for high-power semiconductor device chip, and rigidity crimps
Encapsulation reduces metal molybdenum sheet and core by applying external force mainly by the front and the back side of the direct contact chip of upper and lower two metal molybdenum sheets
Contact resistance between plate electrode piece.Rigidity crimping encapsulation includes between device surface area and package surface area with good
The compact design that contacts well, device can be realized two-sided cooling and connect without lead, caused by can be avoided lead connection
Heat fatigue and short circuit occurs the problem of cause desoldering to fail, when component failure, it is succinct convenient for series redundancy design, installation, it is parasitic
The advantages that parameter is small.
Since semiconductor chip itself easily damages under mechanical force, meanwhile, the film in semiconductor processes
Deformation occurs under stress will lead to electrology characteristic and change for material, such as under stress ruler occurs for a capacitor
Very little variation will lead to capacitance and change, and therefore, when semiconductor chip packaging should avoid excessive stresses from being applied to core as far as possible
On piece.Therefore, although rigidity crimping encapsulation has the above advantages, rigidity is crimped in encapsulation process to chip, electrode slice piece
Equal materials requirement on machining accuracy is high, and rigid material inevitably introduces machining tolerance, the difference strained in encapsulation process
It is different to will lead to stress distribution non-uniform phenomenon, so as to cause current unevenness, so that individual chip excessively collects because of current or voltage
In and damage.
In addition, especially vertical-type power semiconductor device chip, encapsulation are tied for power semiconductor chips
It is also to influence a key factor of the device performance and service life that whether structure, which has high heat-sinking capability,.
Summary of the invention
Technical problem to be solved in the utility model is sealed for above-mentioned power semiconductor chips in the prior art
The phenomenon that rigid material machining tolerance bring power, electricity are unevenly distributed during dress and the not high phenomenon of heat-sinking capability, provide
A kind of encapsulating structure of power semiconductor part, to improve package reliability.
In order to solve the above technical problems, the utility model provides a kind of package structure of semiconductor device, comprising:
First electrode sheet；Second electrode sheet is oppositely arranged with the first electrode sheet；Semiconductor device chip, setting exist
Between the first electrode sheet and second electrode sheet；And conductive elastic component, it is arranged in the semiconductor device chip and institute
It states between first electrode sheet and/or between the semiconductor device chip and the second electrode sheet.
Optionally, the conductive elastic component includes conducting liquid.
Optionally, the conductive elastic component further includes compliant conductive shell, and the conducting liquid is set to the flexibility
In conductive shell.
It optionally, further include support member, the side wall of the semiconductor device chip is arranged in the support member, described
Confined space and/or the support portion are formed between support member, the semiconductor device chip and the first electrode sheet
Confined space is formed between part, the semiconductor device chip and the second electrode sheet, the conductive elastic component setting exists
In the sealing space.
Optionally, side of the support member covering towards the outer surface of the first electrode sheet and/or second electrode sheet
Edge point.
The encapsulating structure of power semiconductor part of the utility model, in semiconductor device chip and first electrode sheet and/or
Conductive elastic component is set between second electrode sheet, buffered by the conductive elastic component and is applied to the function when discharging encapsulation
Stress on rate semiconductor device chip, effective protection power semiconductor chips do not damage because local pressure is excessive, have
Effect improves the reliability of device encapsulation, obtains good packages and devices performance.
Detailed description of the invention
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the utility model embodiment package structure of semiconductor device cross-sectional view；
Fig. 2 is another embodiment of the utility model package structure of semiconductor device cross-sectional view；
Fig. 3 is another embodiment of the utility model package structure of semiconductor device cross-sectional view；
Fig. 4 is another embodiment of the utility model package structure of semiconductor device cross-sectional view.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, originally
Field those of ordinary skill every other embodiment obtained without making creative work belongs to practical
Novel protected range.
It is in the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In addition, as long as technical characteristic involved in the utility model different embodiments disclosed below is each other
Not constituting conflict can be combined with each other.
The utility model embodiment provides a kind of package structure of semiconductor device, and Fig. 1 illustrates the embodiment semiconductor device
Part encapsulating structure cross-sectional view, as shown in Figure 1, the package structure of semiconductor device includes first electrode sheet 1, electrically conductive elastic
Component 2, power semiconductor chips 3 and second electrode sheet 4.
Wherein, the first electrode sheet and second electrode sheet are oppositely arranged, which is located at the first electrode
Between piece and second electrode sheet, which can be vertical-type power semiconductor device chip, as IGBT,
MOSFET, thyristor etc..
The conductive elastic component is set to as shown in Figure 1 between the semiconductor device chip and the second electrode sheet, this is led
Electric elastomeric element includes conducting liquid, or is also possible to be wrapped in the intracorporal conducting liquid of compliant conductive shell.Specifically, this is led
Electro-hydraulic body can be the common conducting liquid such as water, liquid metals, which can be located at the semiconductor device for disk
Fluid pipe structure on part chip 3, the shell are contacted with the second electrode sheet.
Optionally, which can be a segment pipe structure, be also possible to multistage fluid line, the pipeline knot
Structure can be the fluid line for bending to arbitrary shape, be also possible to linear type fluid line, carry out with specific reference to actual needs
Selection.
The embodiment by will be coated with outside conducting liquid conductive material preparation shell, enhance the conducting liquid with
Good electric connection between the first electrode sheet 1 and/or second electrode sheet 5 and the chip 3, improves the electrical property of device
Energy.
When concrete application, seal member can also be set in the semiconductor device structure side, be not shown in the figure, the sealing
The side of the coated upper/lower electrode of component, the semiconductor chip and the conductive elastic component, to the semiconductor device structure
Play good seal protection.
The structure of the embodiment is led to by the way that conductive elastic component is arranged between semiconductor device chip and second electrode sheet
It crosses the conductive elastic component and buffers and discharge the stress being applied on the semiconductor device chip when encapsulation, effective protection semiconductor
Device chip is not damaged because local pressure is excessive, is effectively improved the reliability of device encapsulation, is obtained good packages and devices
Performance；And conducting liquid is used to be uniformly distributed spy for rough interfaces power using conducting liquid as conductive elastic component
Property, can buffer and discharge and be applied to the external carbuncle of first electrode on piece when encapsulation and answer the power semiconductor chips
Power effect realizes that mechanics uniformly encapsulates；The heat generated when power semiconductor chip work simultaneously can be transmitted to the conduction
Liquid has good heat spreading function to the power semiconductor chips；The encapsulating structure also has good self-protection function,
Once liquid leakage, first electrode sheet is opened a way with chip automatically.
As the further embodiment of the embodiment, which can also be arranged in the semiconductor device chip
Between the first electrode sheet.
Another embodiment of the utility model provides a kind of package structure of semiconductor device, as shown in Fig. 2, the semiconductor devices
The difference of encapsulating structure and previous embodiment encapsulating structure is only that conductive elastic component setting is in the semiconductor chip and is somebody's turn to do
Between first electrode sheet, the semiconductor chip and the second electrode sheet, i.e., in the semiconductor chip relative to first electrode and
The two sides of two electrodes are provided with conductive elastic component.The structure of the embodiment is due to the power semiconductor chips and first
It is provided with conducting liquid between electrode slice and second electrode sheet, can buffer and is applied to the power semiconductor when discharging encapsulation
The stress of device chip upper and lower surface realizes that mechanics uniformly encapsulates, and improves package reliability, while the presence of conducting liquid, energy
The enough heat generated to the semiconductor chip plays the role of good two-side radiation, which also has good self-shield function
Can, once liquid leakage, first electrode sheet is opened a way with chip automatically.
Another embodiment of the utility model provides a kind of package structure of semiconductor device, as shown in figure 3, the structure with it is aforementioned
The difference of the encapsulating structure of embodiment is, further includes support member 5, which is arranged in the semiconductor device chip 2
Side wall, form confined space between the support member 5, the semiconductor device chip and the second electrode sheet, the electrically conductive elastic
Component 3 is arranged in the sealing space.Specifically, which may include insulating materials.
As shown in figure 3, the support member can be close to semiconductor chip side wall setting, and the height of the seal member is big
In the height of the power semiconductor chips, which also covers outer surface of the chip towards the second electrode sheet
Marginal portion.That is the terminal part of the upper surface of the semiconductor chip improves the chip to protect the semiconductor device chip
Pressure resistance.The support member passes through the marginal portion realization pair of the side and upper surface that cover the power semiconductor chips
Fixation, electrical isolation and the sealing function of the chip, while playing a supportive role between first electrode sheet and second electrode sheet.
Specifically, which, which also can choose, does not cover appearance of the semiconductor device chip towards second electrode sheet
The marginal portion in face, but only it is close to semiconductor device chip side wall setting, the end of the upper surface of the semiconductor device chip
End part realizes protection by the way that the material of O-shaped sealed insulation rubber etc is arranged in the semiconductor device chip upper surface, should
Structure also can be improved the pressure resistance of the chip, protect terminal.Or electrically conductive elastic shell is wrapped in when the conductive elastic component
When interior conducting liquid, since the conducting liquid is wrapped in the electrically conductive elastic shell, the support portion also can choose at this time
Part does not cover the semiconductor device chip towards the marginal portion of the outer surface of second electrode sheet.
As the further embodiment of the embodiment, which can be with the semiconductor device chip, first electricity
Confined space is formed between pole piece, which is arranged in the confined space.Specifically, which can cover
Cover the outer edge part at the back side of the semiconductor chip, i.e. outer surface edge portion of the semiconductor chip relative to the first electrode
Point, to play the role of protecting terminal.Due to chip the back side do not have conductive pattern, the chip towards this second electricity
The marginal portion of the outer surface of pole piece also can choose to be covered without using seal member.
And cover marginal portion of the semiconductor chip towards the outer surface of second electrode sheet, as the embodiment into one
Walk embodiment, as shown in figure 4, the support member can also simultaneously between the semiconductor device chip and the first electrode sheet,
Two confined spaces are respectively formed between the semiconductor device chip and the second electrode sheet, in two confined spaces respectively
It is provided with conductive elastic component.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes among the protection scope created still in the utility model.
Claims (5)
1. a kind of package structure of semiconductor device characterized by comprising
First electrode sheet；
Second electrode sheet is oppositely arranged with the first electrode sheet；
Semiconductor device chip is arranged between the first electrode sheet and second electrode sheet；And
Conductive elastic component is arranged between the semiconductor device chip and the first electrode sheet and/or the semiconductor
Between device chip and the second electrode sheet.
2. encapsulating structure according to claim 1, which is characterized in that the conductive elastic component includes conducting liquid.
3. encapsulating structure according to claim 2, which is characterized in that the conductive elastic component further includes compliant conductive shell
Body, the conducting liquid are set in the compliant conductive shell.
4. encapsulating structure according to claim 1, which is characterized in that it further include support member, the support member setting
In the side wall of the semiconductor device chip, the support member, the semiconductor device chip and the first electrode sheet it
Between formed between confined space and/or the support member, the semiconductor device chip and the second electrode sheet formed it is close
Space is closed, the conductive elastic component is arranged in the confined space.
5. encapsulating structure according to claim 4, which is characterized in that the support member is covered towards the first electrode
The marginal portion of the outer surface of piece and/or second electrode sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821038994.6U CN208796983U (en) | 2018-06-29 | 2018-06-29 | A kind of package structure of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821038994.6U CN208796983U (en) | 2018-06-29 | 2018-06-29 | A kind of package structure of semiconductor device |
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| Publication Number | Publication Date |
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| CN208796983U true CN208796983U (en) | 2019-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821038994.6U Active CN208796983U (en) | 2018-06-29 | 2018-06-29 | A kind of package structure of semiconductor device |
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| CN (1) | CN208796983U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108630649A (en) * | 2018-06-29 | 2018-10-09 | 全球能源互联网研究院有限公司 | A kind of package structure of semiconductor device and packaging method |
-
2018
- 2018-06-29 CN CN201821038994.6U patent/CN208796983U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108630649A (en) * | 2018-06-29 | 2018-10-09 | 全球能源互联网研究院有限公司 | A kind of package structure of semiconductor device and packaging method |
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