CN208738182U - Bonded wafer tears sheet devices open - Google Patents
Bonded wafer tears sheet devices open Download PDFInfo
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- CN208738182U CN208738182U CN201821314927.2U CN201821314927U CN208738182U CN 208738182 U CN208738182 U CN 208738182U CN 201821314927 U CN201821314927 U CN 201821314927U CN 208738182 U CN208738182 U CN 208738182U
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- wafer
- sheet devices
- vacuum
- bonded wafer
- devices open
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Abstract
The utility model provides a kind of bonded wafer and tears sheet devices open, comprising: bottom vacuum sucker and top vacuum absorption device.The utility model is split two pieces of bonded wafers by vacuum suction, is reduced and tear piece process open to the mechanical stress of crystal round fringes by using the fixed wafer of vacuum suction.The utility model also introduces gas injection apparatus, purges the bonding face at two pieces of bonded wafer edges using gas injection apparatus during tearing piece open, further reduced the risk of wafer sliver.
Description
Technical field
The utility model relates to field of semiconductor manufacture, tear sheet devices open more particularly to a kind of bonded wafer.
Background technique
In semiconductor fabrication process now, alignment exception is likely to occur during wafer bonding, needing will
Two pieces of wafers being bonded in advance, which carry out tearing piece open, to be realigned.It is existing tear piece open during, generally will wherein one piece of wafer lead to
It crosses vacuum absorption device to be fixed, grips another piece of wafer from the edge of wafer using clamper, it is mechanical by applying
Power is from bonding face by two pieces of wafer separates.In above process, the position of clamper and crystal round fringes contact is that stress is concentrated
Region is easy to fragmentation chipping due to stress at this, even results in whole piece of wafer fragmentation.
Therefore, the application demand of piece is torn open for bonded wafer, it is necessary to propose that a kind of new bonded wafer tears sheet devices open, with
It solves the above problems.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of new bonded wafers to tear open
Sheet devices, for solving the problems, such as bonded wafer chipping easy to break during tearing piece open in the prior art.
To achieve the above object and other related purposes, the utility model provides a kind of bonded wafer and tears sheet devices open, is used for
The bottom wafers of bonding and top wafer are split into separation characterized by comprising
The bottom vacuum sucker for supporting bottom wafers described in simultaneously vacuum suction, positioned at the lower section of the bottom wafers；
The top vacuum absorption device of top wafer described in vacuum suction, the bottom wafers and the top wafer are split
When separation, the top vacuum absorption device is located at the top of the top wafer, and adsorbs the top wafer far from described
The surface of bottom wafers.
As a kind of preferred embodiment of the utility model, the top vacuum absorption device includes:
The top vacuum chuck of top wafer described in vacuum suction；
Connect and lift the lifting device of the top vacuum chuck.
As a kind of preferred embodiment of the utility model, it further includes when the top vacuum that the bonded wafer, which tears sheet devices open,
When the vacuum degree of sucker is greater than the set value, the control device that the lifting device lifts the top vacuum chuck is controlled, it is described
Control device is connected with the lifting device.
As a kind of preferred embodiment of the utility model, the control device includes:
Set the setting value, and the setting that the vacuum degree of the top vacuum chuck is compared with the setting value
Comparing unit；
Driven when the vacuum degree of the top vacuum chuck is greater than the set value the movable cantilevered swing and it is described can
Telescopic lever telescopic lifting device lifts the driving unit of the top vacuum chuck, with the setting comparing unit and it is described can
Dynamic cantilever lifting device is connected.
As a kind of preferred embodiment of the utility model, the lifting device includes:
Movable cantilever is movably connected at the top of the top vacuum chuck；
Several telescopic bars, one end are connected with the movable cantilever, the other end and the top vacuum chuck
Fringe region is connected.
As a kind of preferred embodiment of the utility model, the movable cantilever is movably connected on the top via a shaft
The top center region of vacuum chuck.
As a kind of preferred embodiment of the utility model, the bonded wafer tear open sheet devices further include can described in real-time monitoring
The pulling force inductor of the pulling force of telescopic lever is located on the telescopic bar；The control device further includes that can stretch when described
The pulling force of contracting pull rod controls the control unit that the driving unit stops working, described control unit and the pulling force sense when being zero
Device and the driving unit is answered to be connected.
As a kind of preferred embodiment of the utility model, the bonded wafer tears sheet devices open further include: brilliant in the bottom
To the gas of the bottom wafers and the bonding face jet-stream wind of the top wafer when circle is separated with the top wafer
Injection apparatus is located at the bottom wafers and top wafer side.
As a kind of preferred embodiment of the utility model, the gas injection apparatus includes nitrogen jet device or indifferent gas
Body injection apparatus.
As a kind of preferred embodiment of the utility model, the gas injection apparatus includes:
Movable base；
Connecting rod is located in the movable base；
Gas source；
Gas nozzle is articulated in the connecting rod, and the gas nozzle is via a gas piping and the gas source phase
Connection.
As a kind of preferred embodiment of the utility model, the connecting rod is fixed on vertically in the movable base；To institute
When stating bonding face jet-stream wind of the bottom wafers with the top wafer, the gas nozzle and the connecting rod are perpendicular.
As described above, the utility model, which provides a kind of bonded wafer, tears sheet devices open, have the advantages that
The utility model introduces a kind of bonded wafer and tears sheet devices open, using the fixed wafer of vacuum suction, is passing through vacuum
When absorption splits two pieces of bonded wafers, the bonding face at two pieces of bonded wafer edges is purged using gas injection apparatus, reduces and tears open
Piece process reduces the risk of wafer sliver to the mechanical stress of crystal round fringes.
Detailed description of the invention
Fig. 1 to Fig. 3 is shown as tearing piece process schematic open using clamper in the prior art.
The bonded wafer that Fig. 4 is shown as providing in the utility model embodiment tears the structural schematic diagram of sheet devices open.
What the bonded wafer that Fig. 5 is shown as providing in the utility model embodiment tore sheet devices open tears piece schematic diagram open.
Fig. 6 is shown as the connection relationship diagram of the control device provided in the utility model embodiment.
Component label instructions
001 clamper
002 support plate
101 bottom wafers
102 bottom vacuum suckers
103 top wafers
104 top vacuum absorption devices
Vacuum chuck at the top of 104a
The movable cantilever of 104b
104c telescopic bar
104d shaft
104e pulling force inductor
105 gas injection apparatus
105a movable base
105b connecting rod
105c gas source
105d gas nozzle
105e gas piping
106 control devices
106a sets comparing unit
106b driving unit
106c control unit
Specific embodiment
Illustrate the embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this theory
Content disclosed by bright book understands the further advantage and effect of the utility model easily.The utility model can also be by addition
Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints and answer
With carrying out various modifications or alterations under the spirit without departing from the utility model.
Fig. 1 is please referred to Fig. 6.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of utility model, though it is only shown with related component in the utility model rather than when according to actual implementation in diagram
Component count, shape and size are drawn, when actual implementation form, quantity and the ratio of each component can arbitrarily change for one kind
Become, and its assembly layout form may also be increasingly complex.
It as shown in Figure 1 to Figure 3, is the process for tear open using 001 para-linkage wafer of clamper piece in the prior art.Such as figure
1 to shown in Fig. 2, and the bottom wafers 101 of the bonded wafer are fixed on the bottom vacuum sucker 102, the clamper 001
It is set to the surrounding of support plate 002, and is bonded the edge of top wafer 103 after capable of tightening by bascule, with the support
Plate 002 is formed together buckle structure, and the top wafer 103 is fixed on to the downside of the support plate 002.Such as Fig. 2 to Fig. 3 institute
Show, a pulling force applied in the edge side of the top wafer 103 by the clamper 001 along the direction of arrow in the figure,
Separate the top wafer 103 and the bottom wafers 101.In the actual operation process, directly due to the clamper 001
The edge of the wafer is acted on, so that the edge of the wafer is easy to the fragmentation under stress, so as to cause defective products production
It is raw.
Please refer to Fig. 4 to Fig. 5, the utility model provides a kind of bonded wafer and tears sheet devices open, the bottom for will be bonded
Wafer 101 and top wafer 103 split separation, comprising:
The bottom vacuum sucker 102 for supporting bottom wafers 101 described in simultaneously vacuum suction, positioned at the bottom wafers 101
Lower section；
The top vacuum absorption device 104 of top wafer 103 described in vacuum suction, the bottom wafers 101 and the top
When portion's wafer 103 splits separation, the top vacuum absorption device 104 is located at the top of the top wafer 103, and adsorbs institute
State top surface of the wafer 103 far from the bottom wafers 101.
As shown in figure 4, being used in the present embodiment using the fixed bottom wafers 101 of the bottom vacuum sucker 102
The fixed top wafer 103 of the top vacuum absorption device 104, applies tractive force to the top wafer 103 and tears open
Separation.The stress being applied on the top wafer 103 is evenly distributed in whole wafer face, to reduce crystal round fringes
The risk of stress fragmentation.
As an example, the top vacuum absorption device 104 includes:
The top vacuum chuck 104a of top wafer 103 described in vacuum suction；
Connect and lift the lifting device of the top vacuum chuck 104a.
Preferably, the lifting device includes: movable cantilever 104b, is movably connected on the top top vacuum chuck 104a
Portion；Several telescopic bars 104c, one end are connected with the movable cantilever 104b, the other end and the top vacuum chuck
The fringe region of 104a is connected.
As shown in figure 4, in the present embodiment, the top vacuum chuck in the top vacuum absorption device 104
104a is movably connected on the top vacuum chuck by top wafer 103, the movable cantilever 104b described in vacuum suction
At the top of 104a, two telescopic bar 104c are symmetrically arranged in the two sides of the movable cantilever 104b, one end and it is described can
Dynamic cantilever 104b is connected, and the other end is connected with the fringe region of the top vacuum chuck 104a.
As an example, the movable cantilever 104b is movably connected on the top vacuum chuck 104a via a shaft 104d
Top center region.It is inhaled as shown in figure 4, the movable cantilever 104b is movably connected on the top vacuum by shaft 104d
The top of disk 104a, the movable cantilever 104b are movable, the telescopic bar 104c of two sides around the shaft 104d
It stretches with the drive of the movable cantilever 104b.As shown in figure 5, during tearing piece open, it is described in the lifting device
Telescopic bar 104c wafer 103 at the top of described in one side edge pull-up, meanwhile, the movable cantilever 104b can also be synchronized upwards
It is promoted, to drive the top wafer 103 far from the surface of the bottom wafers 101.
It should be pointed out that the implementation of the lifting device is not limited to using the movable cantilever 104b and institute
State the structure of telescopic bar 104c.For example, four shaft mechanicals can also be used in another case study on implementation of the utility model
The four shaft mechanicals arm is connected the top of the top vacuum chuck 104a, is tearing piece process open by arm as lifting device
In, the top vacuum chuck 104a is promoted and rotated by the four shaft mechanicals arm, to drive the top brilliant
103 surfaces far from the bottom wafers 101 of circle.
As an example, it further includes when the vacuum degree of the top vacuum chuck 104a is greater than that the bonded wafer, which tears sheet devices open,
When setting value, the control device 106 that the lifting device lifts the top vacuum chuck 104a, the control device are controlled
106 are connected with the lifting device.Pass through the control device 106, it can be determined that the top vacuum chuck 104a's is true
Whether reciprocal of duty cycle is greater than the set value, i.e., the described bonded wafer tears whether sheet devices can start to tear piece operation open open.In the present embodiment, when
When vacuum degree reaches setting value, the control device 106 controls the movable cantilever 104b and swings, and drives the scalable drawing
Bar 104c is flexible, and the movable cantilever 104b is also lifted up simultaneously.Under the action of pulling force, the side of the bonded wafer by
To pulling force, and full wafer wafer is uniformly diffused to, finally pulls the top wafer 103 separate and remote from the bottom wafers 101
Surface.Preferably, the vacuum degree can be measured by the vacuum meter being mounted on the top vacuum chuck 104a, and in real time
Feed back to the control device 106.
As an example, the control device 106 includes:
The setting value is set, and the vacuum degree of the top vacuum chuck 104a is compared with the setting value
Set comparing unit 106a；
The lifting device is driven to lift the top when the vacuum degree of the top vacuum chuck 104a is greater than the set value
The driving unit 106b of portion vacuum chuck 104a is connected with the setting comparing unit 106a and the lifting device.
As shown in fig. 6, the control device 106 includes the setting comparing unit 106a and driving unit 106b.
The control device 106 needs to read the vacuum degree of the top vacuum chuck 104a, and judges whether the vacuum degree reaches
Setting value.The setting value can be preset by the setting comparing unit 106a, and by the vacuum degree of reading with
The setting value is compared, and judges whether the vacuum degree reaches setting value.When the vacuum degree is greater than the setting value,
The lifting device movement is driven by the driving unit 106b, and starts wafer separate operation.
As an example, the bonded wafer tears the pulling force that sheet devices further include telescopic bar 104c described in real-time monitoring open
Pulling force inductor 104e is located on the telescopic bar 104c；The control device 106 further includes when the telescopic bar
Control the control unit 106c that the driving unit 106b stops working when the pulling force of 104c is zero, described control unit 106c with
The pulling force inductor 104e and the driving unit 106b are connected.Preferably, the pulling force inductor 104e is via described
Telescopic bar 104c and the movable cantilever 104b are connected with the control device 106.
As shown in Figure 4 and Figure 6, the pulling force inductor 104e is located on the telescopic bar 104c, and described in connection
Control unit 106c.The top wafer 103 and institute are detected by the pulling force inductor 104e by described control unit 106c
It states whether bottom wafers 101 have separated, and stops working after isolation.During the separation process due to the driving unit 106b
The movable cantilever 104b is driven, pulling force is applied to the top wafer 103, when the top wafer 103 and the bottom are brilliant
When circle 101 is completely separated, the pulling force inductor 104e monitors that when the pulling force of the telescopic bar 104c be zero, the control
Unit 106c processed controls the driving unit 106b and stops working.
As an example, the bonded wafer tears sheet devices open further include: in the bottom wafers 101 and the top wafer
103 split when separating to the gas injection apparatus of the bottom wafers 101 and the bonding face jet-stream wind of the top wafer 103
105, it is located at the bottom wafers 101 and 103 side of top wafer.Using the gas injection apparatus 105 to the bottom
The edge jet-stream wind of the bonding face of portion's wafer 101 and the top wafer 103, so that the bottom wafers 101 and the top
Portion's wafer 103 is easier to separate.It has been formed with for the wafer with figure of concaveconvex structure preferably for surface, protrusion
Portion is bonded as bonding bonding face with the lug boss of another piece of wafer in bonding, and recessed portion will form two pieces after bonding
Gap between wafer.It, will when the jet-stream wind that the gas injection apparatus 105 generates enters the gap from bonding face edge
The separating pressure for being greater than an atmospheric pressure is generated in the inside of the bonded wafer, to be more conducive to the separation of two pieces of wafers.
Jet-stream wind is added when tearing piece open not only reduces the local stress on the crystal round fringes, also reduces and tears the piece separation bottom open
Pulling force needed for portion's wafer 101 and the top wafer 103 reduces wafer risk damaged due to mechanical force.Such as Fig. 5 institute
Show, the one side edge by the top vacuum absorption device 104 in the bonded wafer applies pulling force, and tension uniform is expanded
It is dissipated to full wafer wafer, while in bonding face jet-stream wind, separates the top wafer 103 and the bottom wafers 101.
As an example, the gas injection apparatus 105 includes nitrogen jet device or inert gas injection apparatus.Due to crystalline substance
Circle bonding process has higher requirements for the flatness and cleanliness of crystal column surface, the dirt that may cause in order to avoid injection gas
Dye, should be using the clean nitrogen or inert gas that will not be reacted with wafer as gas source.
As an example, the gas injection apparatus 105 includes:
Movable base 105a；
Connecting rod 105b is located on the movable base 105a；
Gas source 105c；
Gas nozzle 105d is articulated on the connecting rod 105b, and the gas nozzle 105d is via a gas piping
105e is connected with the gas source 105c.
As shown in figure 4, the gas nozzle 105d is fixed on the movable base 105a by the connecting rod 105b.
The gas nozzle 105d can be adjusted at a distance from the bonded wafer by the movement of the movable base 105a.It is described
Gas nozzle 105d is articulated on the connecting rod 105b, is rotated in hinged place adjustable.Therefore, the gas nozzle 105d for
The gas injection direction of the bonded wafer is adjustable.Preferably, the connecting rod 105b can drive the gas nozzle
105d oscilaltion, to cooperate the rotation of the gas nozzle 105d, so that the connecting rod 105b is directed at the bonded wafer
Bonding face edge.
As an example, the connecting rod 105b is fixed on vertically on the movable base 105a；To the bottom wafers 101
When with the bonding face jet-stream wind of the top wafer 103, the gas nozzle 105d and the connecting rod 105b are perpendicular.?
It is perpendicular in the gas nozzle 105d and the connecting rod 105b in the present embodiment, i.e. key described in jet-stream wind horizontal sheaf
When the bonding face of synthetic circle, jet-stream wind is the most advantageous for the separation of the bonded wafer.In other embodiments, described
Gas nozzle 105d may be set to be and horizontal plane is at an angle is sprayed.For example, the gas nozzle 105d with
The angle of horizontal plane is 0~30 °.In addition, the optional range of bore of the gas nozzle 105d is 0.1~1.0mm, gas pressure
Optional range is 0.1~10MPa.Suitable gas nozzle angle, mouth can be chosen according to the actual conditions of the bonded wafer
Diameter and gas pressure.
As an example, tearing sheet devices open using bonded wafer provided by the utility model carries out the step of bonded wafer tears piece open
Include:
1) bonded wafer is transferred on the bottom vacuum sucker 102, and 102 vacuum of bottom vacuum sucker is inhaled
The attached bottom wafers 101；
2) gas injection apparatus 105 is moved to the operating position of setting by the movable base 105a；
3) the top vacuum absorption device 104 is moved to the top of the bonded wafer, the top vacuum chuck
104a passes through top wafer 103 described in vacuum suction；
4) control device 106 obtains the vacuum degree of the top vacuum chuck 104a in real time, and carries out with setting value
It compares, when the vacuum degree is greater than the setting value, transmission mechanism pulls the top vacuum chuck 104a to be initially separated, together
Bonding face jet-stream wind of the Shi Suoshu gas injection apparatus 105 to the bonded wafer；
5) when transmission mechanism pulls the top vacuum chuck 104a to carry out wafer separate, the pulling force inductor 104e
It monitors the pulling force applied on the telescopic bar 104c in real time, when pulling force is zero, judges the top wafer 103 and described
Bottom wafers 101 have been completely separated；
6) the top vacuum absorption device 104 moves the adsorbed top wafer 103 and reaches a wafer and keeps in
Area, wait it is to be unloaded take piece, entirely tearing piece process open terminates.
In conclusion the utility model, which provides a kind of bonded wafer, tears sheet devices open, comprising: bottom vacuum sucker and top
Vacuum absorption device.The utility model splits two pieces of bonded wafers by vacuum suction by using the fixed wafer of vacuum suction,
Reduce and tears piece process open to the mechanical stress of crystal round fringes.The utility model also introduces gas injection apparatus, is tearing piece process open
The middle bonding face that two pieces of bonded wafer edges are purged using gas injection apparatus, further reduced the risk of wafer sliver.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (11)
1. a kind of bonded wafer tears sheet devices open, the bottom wafers and top wafer for that will be bonded split separation, which is characterized in that
Include:
The bottom vacuum sucker for supporting bottom wafers described in simultaneously vacuum suction, positioned at the lower section of the bottom wafers；
The top vacuum absorption device of top wafer, the bottom wafers described in vacuum suction are separated with the top wafer
When, the top vacuum absorption device is located at the top of the top wafer, and adsorbs the top wafer far from the bottom
The surface of wafer.
2. bonded wafer according to claim 1 tears sheet devices open, which is characterized in that the top vacuum absorption device packet
It includes:
The top vacuum chuck of top wafer described in vacuum suction；
Connect and lift the lifting device of the top vacuum chuck.
3. bonded wafer according to claim 2 tears sheet devices open, which is characterized in that the bonded wafer is torn sheet devices open and also wrapped
It includes when the vacuum degree of the top vacuum chuck is greater than the set value, controls the lifting device and lift the top vacuum chuck
Control device, the control device is connected with the lifting device.
4. bonded wafer according to claim 3 tears sheet devices open, which is characterized in that the control device includes:
The setting value is set, and the setting that the vacuum degree of the top vacuum chuck is compared with the setting value is compared
Unit；
It drives the lifting device to lift the top vacuum when the vacuum degree of the top vacuum chuck is greater than the set value to inhale
The driving unit of disk is connected with the setting comparing unit and the lifting device.
5. bonded wafer according to claim 4 tears sheet devices open, which is characterized in that the lifting device includes:
Movable cantilever is movably connected at the top of the top vacuum chuck；
Several telescopic bars, one end are connected with the movable cantilever, the edge of the other end and the top vacuum chuck
Region is connected.
6. bonded wafer according to claim 5 tears sheet devices open, which is characterized in that the movable cantilever is living via a shaft
The dynamic top center region for being connected to the top vacuum chuck.
7. bonded wafer according to claim 5 tears sheet devices open, which is characterized in that the bonded wafer is torn sheet devices open and also wrapped
The pulling force inductor of the pulling force of telescopic bar described in real-time monitoring is included, is located on the telescopic bar；The control device
It further include the control unit for controlling the driving unit when the pulling force of the telescopic bar is zero and stopping working, the control
Unit is connected with the pulling force inductor and the driving unit.
8. bonded wafer according to claim 1 tears sheet devices open, which is characterized in that the bonded wafer is torn sheet devices open and also wrapped
It includes: when the bottom wafers are separated with the top wafer to the bonding face of the bottom wafers and the top wafer
The gas injection apparatus of jet-stream wind is located at the bottom wafers and top wafer side.
9. bonded wafer according to claim 8 tears sheet devices open, which is characterized in that the gas injection apparatus includes nitrogen
Injection apparatus or inert gas injection apparatus.
10. bonded wafer according to claim 8 tears sheet devices open, which is characterized in that the gas injection apparatus includes:
Movable base；
Connecting rod is located in the movable base；
Gas source；
Gas nozzle is articulated in the connecting rod, and the gas nozzle is connected via a gas piping with the gas source.
11. bonded wafer according to claim 10 tears sheet devices open, which is characterized in that the connecting rod is fixed on institute vertically
It states in movable base；To the bottom wafers and the top wafer bonding face jet-stream wind when, the gas nozzle and institute
It is perpendicular to state connecting rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821314927.2U CN208738182U (en) | 2018-08-15 | 2018-08-15 | Bonded wafer tears sheet devices open |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821314927.2U CN208738182U (en) | 2018-08-15 | 2018-08-15 | Bonded wafer tears sheet devices open |
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| Publication Number | Publication Date |
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| CN208738182U true CN208738182U (en) | 2019-04-12 |
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ID=66029566
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821314927.2U Active CN208738182U (en) | 2018-08-15 | 2018-08-15 | Bonded wafer tears sheet devices open |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111469045A (en) * | 2020-04-22 | 2020-07-31 | 华海清科股份有限公司 | Wafer loading cup |
| CN111469046A (en) * | 2020-04-22 | 2020-07-31 | 华海清科股份有限公司 | Wafer loading cup |
-
2018
- 2018-08-15 CN CN201821314927.2U patent/CN208738182U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111469045A (en) * | 2020-04-22 | 2020-07-31 | 华海清科股份有限公司 | Wafer loading cup |
| CN111469046A (en) * | 2020-04-22 | 2020-07-31 | 华海清科股份有限公司 | Wafer loading cup |
| CN111469046B (en) * | 2020-04-22 | 2020-12-29 | 华海清科股份有限公司 | Wafer loading cup |
| CN111469045B (en) * | 2020-04-22 | 2021-05-11 | 华海清科股份有限公司 | Wafer loading cup |
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