CN208734423U - A kind of semiconductor refrigerating car radiator device - Google Patents

A kind of semiconductor refrigerating car radiator device Download PDF

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Publication number
CN208734423U
CN208734423U CN201821302892.0U CN201821302892U CN208734423U CN 208734423 U CN208734423 U CN 208734423U CN 201821302892 U CN201821302892 U CN 201821302892U CN 208734423 U CN208734423 U CN 208734423U
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CN
China
Prior art keywords
chilling plate
semiconductor chilling
semiconductor
temperature control
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201821302892.0U
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Chinese (zh)
Inventor
常爱军
薛勇
连二超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEBEI HUIZHIDA AUTOMOBILE RADIATOR Co Ltd
Original Assignee
HEBEI HUIZHIDA AUTOMOBILE RADIATOR Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEBEI HUIZHIDA AUTOMOBILE RADIATOR Co Ltd filed Critical HEBEI HUIZHIDA AUTOMOBILE RADIATOR Co Ltd
Priority to CN201821302892.0U priority Critical patent/CN208734423U/en
Application granted granted Critical
Publication of CN208734423U publication Critical patent/CN208734423U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

A kind of semiconductor refrigerating car radiator device, including semiconductor chilling plate, temperature sensor, power supply and electronic temperature control switch, the cold end of semiconductor chilling plate is attached on the water inlet pipe of automobile radiators, hot end exposure is in air, it is radiated by windage, the pole N of semiconductor chilling plate is connected with one end of temperature detect switch (TDS), the pole P of semiconductor chilling plate is connect with power cathode, the anode of power supply is connect with the temperature detect switch (TDS) other end, temperature sensor is arranged on the upper water chamber of the radiator, temperature detect switch (TDS) is connected with the temperature sensor, the temperature value that temperature detect switch (TDS) is acquired according to temperature sensor is compared with temperature detect switch (TDS) preset value, control the working condition of semiconductor chilling plate.Car radiator device provided by the utility model, increase semiconductor chilling plate on a heat sink, additional cooler cooling, while according to the quantity of the difference of power of vehicle and the different semiconductor chilling plates for selecting corresponding powers and corresponding semiconductor cooling piece that require heat-sinking capability.

Description

A kind of semiconductor refrigerating car radiator device
Technical field
The utility model relates to automobile radiators fields, more particularly to a kind of semiconductor refrigerating car radiator device.
Background technique
It is the critical component of car engine cooling system along with new cars radiator, the quality of radiator performance is directly Influence dynamic property, the economical and reliability of automobile.It is simple from dissipating for the hot environment and complex landform for adapting to partial region The radiating requirements of automobile engine cannot be fully met in the material of hot device, the method mainly used at present is dissipated in original It is increased on the basis of hot device, is thickeied to meet heat dissipation, but is influenced by space, not all radiator can Increase, thicken, meanwhile, increase, thicken the weight for not only increasing radiator, does not meet the requirement of automotive light weight technology, increase simultaneously The manufacturing cost of radiator is added.And said from heat dissipation performance, heat dissipation performance is not to be scaled up, and is counted through research It calculates, can only generally improve the radiating efficiency of 15%-20%.
Currently, semiconductor chilling plate is widely used in the heat dissipation of electronic component, and answered not yet in other field With, the emergence of new-energy automobile, the requirement to radiator has a stringenter cooling requirements again, and domestic heat dissipation Device is difficult to meet cooling requirements.
Summary of the invention
The utility model provides a kind of semiconductor refrigerating car radiator device, increases semiconductor refrigerating on a heat sink Piece cools down for additional cooler, while according to the difference of power of vehicle and the different selection phases required heat-sinking capability Answer the semiconductor chilling plate of power and the quantity of corresponding semiconductor cooling piece.
To achieve the above object, the utility model provides following scheme:
A kind of semiconductor refrigerating car radiator device, which is characterized in that including semiconductor chilling plate, temperature sensor, Power supply and electronic temperature control switch, the cold end of the semiconductor chilling plate are attached on the water inlet pipe of automobile radiators, and described half The hot end of conductor cooling piece exposes in air, one end phase that the pole N of the semiconductor chilling plate is switched with the electronic temperature control Connection, the pole P of the semiconductor chilling plate is connected with the cathode of the power supply, the power supply it is positive with it is described The other end of electronic temperature control switch is connected, and the temperature sensor is arranged on the upper water chamber of the radiator, the temperature Sensor is used to detect the temperature of engine coolant, and the engine coolant enters radiator by the water inlet pipe, institute Electronic temperature control switch is stated to be connected with the temperature sensor, what the electronic temperature control switch was acquired according to the temperature sensor Temperature value controls the working condition of semiconductor chilling plate compared with the preset value in electronic temperature control switch.
Optionally, the electronic temperature control switch is provided with relay, and the electronic temperature control is switched the temperature sensor The temperature value of acquisition is compared with preset value, controls the relay coil electrification or off-position according to comparison result.
Optionally, it is provided with relay contact on the relay, when relay coil electrification, relay contact is closed It closes, semiconductor chilling plate work;When relay coil power-off, relay contact is opened, and semiconductor chilling plate stops working.
Optionally, the semiconductor refrigerating car radiator device further includes automobile radiators, the electronic temperature control switch It is fixed by screws on the upper water chamber of the automobile radiators.
Optionally, the power supply is automobile storage battery, and provided voltage is 24V voltage.
Optionally, when the quantity of the semiconductor chilling plate is one or more, the connection side of the semiconductor chilling plate Formula is to be connected in parallel.
Optionally, the contact surface of the cold end of the semiconductor chilling plate and the radiator inleting pipe is coated with heat-conducting silicone grease.
The technology compared with prior art, has the following beneficial effects:
A kind of semiconductor refrigerating car radiator device provided by the utility model, installs additional at radiator inleting pipe and partly leads Body cooling piece, temperature sensor and electronic temperature control switch, the cold end of the semiconductor chilling plate are attached to the water inlet of automobile radiators Guan Shang, the hot end exposure of the semiconductor chilling plate in air, are radiated, temperature sensor is arranged described by windage On the upper water chamber of radiator, the temperature sensor is used to detect the temperature of engine coolant, and the engine coolant is logical It crosses the water inlet pipe and enters radiator, the pole N of the semiconductor chilling plate is connected with one end that the electronic temperature control switchs, institute The pole P for stating semiconductor chilling plate is connected with the cathode of automobile storage battery, and the anode of the automobile storage battery is opened with the electronic temperature control The other end of pass is connected.When the collected engine coolant temperature of temperature sensor and electronic temperature control switch preset value into Row compares, and controls the working condition of semiconductor chilling plate.When collected temperature >=83 DEG C of temperature sensor, electronic temperature control is opened It closes and opens, semiconductor chilling plate energization starts to cool down;When 83 DEG C of the collected temperature < of temperature sensor, electronic temperature control switch It closes, semiconductor chilling plate stops working.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model Some embodiments for those of ordinary skill in the art without any creative labor, can also basis These attached drawings obtain other attached drawings.
Fig. 1 is the utility model embodiment semiconductor chilling plate working circuit diagram;
Fig. 2 is the scheme of installation of the utility model embodiment cooling piece on a heat sink;
Fig. 3 is the connection schematic diagram of the multiple semiconductor chilling plates of the utility model embodiment.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of semiconductor refrigerating car radiator device, increases semiconductor refrigerating on a heat sink Piece cools down for additional cooler, while according to the difference of power of vehicle and the different selection phases required heat-sinking capability Answer the semiconductor chilling plate of power and the quantity of corresponding semiconductor cooling piece.
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing and have The present invention is described in further detail for body embodiment.
Fig. 1 is the utility model embodiment semiconductor waste-heat power generation energy recycle device system diagram, as shown in Figure 1, a kind of Semiconductor refrigerating car radiator device, which is characterized in that including semiconductor chilling plate 4, temperature sensor, 1 and of power supply The cold end of electronic temperature control switch 2, the semiconductor chilling plate 4 is attached on automobile radiators water inlet pipe 8, the semiconductor chilling plate In air, the pole N of the semiconductor chilling plate 4 is connected with one end of the electronic temperature control switch 2, institute for 4 hot end exposure The pole P for stating semiconductor chilling plate 4 is connected with the cathode of the power supply 1, anode and the electronics of the power supply 1 The other end of temperature detect switch (TDS) 2 is connected, and the temperature sensor is arranged on the upper water chamber 9 of the radiator, and the temperature passes Sensor is used to detect the temperature of engine coolant, and the engine coolant enters radiator 7, institute by the water inlet pipe 8 It states electronic temperature control switch 2 to be connected with the temperature sensor, the electronic temperature control switch 2 is acquired according to the temperature sensor Temperature value compared with the preset value in the electronic temperature control switch 2, control semiconductor chilling plate 4 working condition.It is described Electronic temperature control switch 2 is provided with relay, the temperature value and preset that the electronic temperature control switch acquires the temperature sensor Value is compared, and controls the relay coil electrification or off-position according to comparison result.It is provided on the relay Relay contact 3, when relay coil electrification, relay contact 3 is closed, and semiconductor chilling plate 4 works;Work as relay coil When power-off, relay contact 3 is opened, and semiconductor chilling plate 4 stops working.The semiconductor refrigerating car radiator device also wraps Automobile radiators 7 are included, the electronic temperature control switch 2 is fixed by screws on the upper water chamber 9 of the automobile radiators.The confession Power supply 1 is automobile storage battery, and provided voltage is 24V voltage.The quantity of the semiconductor chilling plate 4 is one or more When, the connection type of the semiconductor chilling plate 4 is to be connected in parallel.
Fig. 2 is the scheme of installation of the utility model embodiment cooling piece on a heat sink, as shown in Fig. 2, described partly lead The cold end of body cooling piece 4 is attached on automobile radiators water inlet pipe 8, and the hot end of the semiconductor chilling plate 4 exposes in air, institute The contact surface of the cold end and the radiator inleting pipe 8 of stating semiconductor chilling plate 4 is coated with heat-conducting silicone grease.
Fig. 3 is the connection schematic diagram of the multiple semiconductor chilling plates of the utility model embodiment, as shown in figure 3, described partly lead The quantity of body cooling piece 4 is four, and the connection type of the semiconductor chilling plate 4 is to be connected in parallel, four semiconductor chilling plates 4 The pole N be connected in parallel, the pole P of four conductor cooling pieces 4 is connected in parallel, the pole N of four semiconductor chilling plates 4 and electronics temperature One end of control switch 2 is connected, and the other end of electronic temperature control switch 2 is connected with automobile storage battery anode 5, four semiconductor refrigeratings The pole P of piece 4 is connected with automobile storage battery cathode 6.
A kind of semiconductor refrigerating car radiator device provided by the utility model, installs additional at radiator inleting pipe and partly leads Body cooling piece, temperature sensor and electronic temperature control switch, the cold end of the semiconductor chilling plate are attached to the water inlet of automobile radiators Guan Shang, the hot end exposure of the semiconductor chilling plate in air, are radiated, temperature sensor is arranged described by windage On the upper water chamber of radiator, the temperature sensor is used to detect the temperature of engine coolant, and the engine coolant is logical It crosses the water inlet pipe and enters radiator, the pole N of the semiconductor chilling plate is connected with one end that the electronic temperature control switchs, institute The pole P for stating semiconductor chilling plate is connected with the cathode of automobile storage battery, and the anode of the automobile storage battery is opened with the electronic temperature control The other end of pass is connected.When the collected engine coolant temperature of temperature sensor and electronic temperature control switch preset value into Row compares, and controls the working condition of semiconductor chilling plate.When collected temperature >=83 DEG C of temperature sensor, electronic temperature control is opened It closes and opens, semiconductor chilling plate energization starts to cool down;When 83 DEG C of the collected temperature < of temperature sensor, electronic temperature control switch It closes, semiconductor chilling plate stops working.The utility model provides a kind of semiconductor refrigerating car radiator device, in radiator Upper increase semiconductor chilling plate, cools down for additional cooler, while according to the difference of power of vehicle and to heat-sinking capability It is required that different selection corresponding powers semiconductor chilling plates and corresponding semiconductor cooling piece quantity.
The type selecting of semiconductor chilling plate power and the piece number depends on the horsepower of automobile, and the difference of the automobile horsepower is described Power selection and the quantity selection of semiconductor chilling plate are also different.It is learnt by experience, be can reduce using the cooling piece of 6 50W Radiator coolant temperature once.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
Specific case used herein is expounded the principles of the present invention and embodiment, above embodiments Explanation be merely used to help understand the method and its core concept of the utility model;Meanwhile for the general technology of this field Personnel, according to the thought of the present invention, there will be changes in the specific implementation manner and application range.In conclusion this theory Bright book content should not be construed as limiting the invention.

Claims (7)

1. a kind of semiconductor refrigerating car radiator device, which is characterized in that including semiconductor chilling plate, temperature sensor, confession Power supply and electronic temperature control switch, the cold end of the semiconductor chilling plate is attached on the water inlet pipe of automobile radiators, described partly to lead In air, the pole N of the semiconductor chilling plate is connected with one end that the electronic temperature control switchs for the hot end exposure of body cooling piece It connects, the pole P of the semiconductor chilling plate is connected with the cathode of the power supply, anode and the electricity of the power supply The other end of sub- temperature detect switch (TDS) is connected, and the temperature sensor is arranged on the upper water chamber of the radiator, and the temperature passes Sensor is used to detect the temperature of engine coolant, and the engine coolant enters radiator by the water inlet pipe, described Electronic temperature control switch is connected with the temperature sensor, and the electronic temperature control switchs the temperature acquired according to the temperature sensor Angle value controls the working condition of semiconductor chilling plate compared with the preset value in electronic temperature control switch.
2. semiconductor refrigerating car radiator device according to claim 1, which is characterized in that the electronic temperature control switch It is provided with relay, the temperature value that the temperature sensor acquires is compared by the electronic temperature control switch with preset value, root The relay coil electrification or off-position are controlled according to comparison result.
3. semiconductor refrigerating car radiator device according to claim 2, which is characterized in that be arranged on the relay There is relay contact, when relay coil electrification, relay contact closure, semiconductor chilling plate work;Work as relay coil When power-off, relay contact is opened, and semiconductor chilling plate stops working.
4. semiconductor refrigerating car radiator device according to claim 1, which is characterized in that the semiconductor refrigerating vapour Vehicle heat sink arrangement further includes automobile radiators, and the electronic temperature control switch is fixed by screws in the upper of the automobile radiators On water chamber.
5. semiconductor refrigerating car radiator device according to claim 1, which is characterized in that the power supply is vapour Automobile battery, provided voltage are 24V voltage.
6. semiconductor refrigerating car radiator device according to claim 1, which is characterized in that the semiconductor chilling plate Quantity when being one or more, the connection type of the semiconductor chilling plate is to be connected in parallel.
7. semiconductor refrigerating car radiator device according to claim 1, which is characterized in that the semiconductor chilling plate Cold end and the contact surface of the radiator inleting pipe be coated with heat-conducting silicone grease.
CN201821302892.0U 2018-08-14 2018-08-14 A kind of semiconductor refrigerating car radiator device Expired - Fee Related CN208734423U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821302892.0U CN208734423U (en) 2018-08-14 2018-08-14 A kind of semiconductor refrigerating car radiator device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821302892.0U CN208734423U (en) 2018-08-14 2018-08-14 A kind of semiconductor refrigerating car radiator device

Publications (1)

Publication Number Publication Date
CN208734423U true CN208734423U (en) 2019-04-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821302892.0U Expired - Fee Related CN208734423U (en) 2018-08-14 2018-08-14 A kind of semiconductor refrigerating car radiator device

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111473544A (en) * 2020-04-20 2020-07-31 珠海格力电器股份有限公司 Semiconductor heat exchanger, monitoring method thereof and air conditioning unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111473544A (en) * 2020-04-20 2020-07-31 珠海格力电器股份有限公司 Semiconductor heat exchanger, monitoring method thereof and air conditioning unit

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190412

Termination date: 20210814