CN208666479U - Silicon wafer automatic supplier - Google Patents
Silicon wafer automatic supplier Download PDFInfo
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- CN208666479U CN208666479U CN201821191391.XU CN201821191391U CN208666479U CN 208666479 U CN208666479 U CN 208666479U CN 201821191391 U CN201821191391 U CN 201821191391U CN 208666479 U CN208666479 U CN 208666479U
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- China
- Prior art keywords
- silicon wafer
- clamping device
- automatic supplier
- positioning mechanism
- clamping
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Abstract
The utility model relates to a kind of silicon wafer automatic suppliers comprising: clamping device, for clamping silicon wafer；Positioning mechanism, to detect silicon wafer position；And driving mechanism, it is connect with the clamping device, drives clamping device operation to receive the detection information of positioning mechanism, and according to the detection information of positioning mechanism.Above-mentioned silicon wafer automatic supplier, driving mechanism based on the received positioning mechanism detection information driving clamping device operation, the silicon wafer in turnover box to be moved into piece folder, to realize automatically supplying for silicon wafer, the operation of manual handling turnover box is reduced or remitted, ensure operation safety problem, and the impaired phenomenon of silicon wafer caused by avoiding turnover box from being fallen.In addition, avoiding the step of operator directly grabs silicon wafer by gripper mechanism grips silicon wafer, that is, avoiding the phenomenon that causing silicon wafer to damage because of human factor.Furthermore relative to manual operation, silicon wafer automatic supplier improves the efficiency of supply of silicon wafer.
Description
Technical field
The utility model relates to photovoltaic arts, more particularly to a kind of silicon wafer automatic supplier.
Background technique
Traditional, the production procedure of silicon wafer wool making are as follows: by the silicon chip extracting in turnover box and be put into piece folder；Feeder is by piece
Silicon wafer in folder is inserted into the gaily decorated basket；Silicon wafer in the gaily decorated basket is through wool-weaving machine making herbs into wool；Cleaning；Plastic packaging；Packaging.It wherein, will be in turnover box
The step of silicon chip extracting is simultaneously put into the step of piece presss from both sides, i.e., silicon wafer supplies, relies primarily on and is accomplished manually.I.e. by manually by turnover box
It is carried to operating table, then is put into piece folder by the artificial silicon wafer for successively taking out unit specification.
Firstly, the turnover box equipped with silicon wafer is very heavy, operator is easy to injury when carrying turnover box, and be easy to cause
Turnover box is fallen, and then causes silicon wafer impaired；Secondly, because being unfamiliar with the human factors such as silicon wafer characteristic or fatigue, operator exists
When directly grabbing silicon wafer, it be easy to cause the damage to silicon wafer；Again, manual operation low efficiency.
Utility model content
Based on this, it is necessary to provide a kind of operation safety, silicon wafer not easy damaged and improve the silicon wafer of the silicon wafer efficiency of supply from
Dynamic feedway.
A kind of silicon wafer automatic supplier, comprising:
Clamping device, for clamping silicon wafer；
Positioning mechanism, to detect silicon wafer position；
And driving mechanism, it is connect with the clamping device, to receive the detection information of the positioning mechanism, and according to
The detection information of positioning mechanism drives the clamping device operation.
Above-mentioned silicon wafer automatic supplier, driving mechanism based on the received positioning mechanism detection information drive clamping device
Silicon wafer in turnover box is moved into piece folder, to realize automatically supplying for silicon wafer, has reduced or remitted manual handling turnover by operation
The operation of case ensures that operation safety problem, and the impaired phenomenon of silicon wafer caused by avoiding turnover box from being fallen.In addition,
By gripper mechanism grips silicon wafer, the step of operator directly grabs silicon wafer is avoided, that is, avoids and is led because of human factor
The phenomenon that causing silicon wafer damage.Furthermore relative to manual operation, silicon wafer automatic supplier improves the efficiency of supply of silicon wafer.
The positioning mechanism includes the industrial camera to detect position of silicon wafer in one of the embodiments,.
The positioning mechanism includes the infrared sensor to detect position of silicon wafer in one of the embodiments,.
It in one of the embodiments, further include torque sensor；The torque sensor is to monitor the clamping machine
The chucking power of structure, and monitoring information is passed into the driving mechanism.
The clamping device is clamping jaw in one of the embodiments,.
The clamping jaw is Pneumatic clamping jaw or electronic clamping jaw in one of the embodiments,.
The clamping device is equipped with cushion to the position contacted with silicon wafer in one of the embodiments,.
The cushion is silicagel pad in one of the embodiments,.
It in one of the embodiments, further include the Distance-sensing for the thickness for detecting the silicon wafer of gripper mechanism grips
Device.
The driving mechanism includes mechanical arm in one of the embodiments, and the clamping device is fixed at the machine
On tool arm.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the silicon wafer automatic supplier that an embodiment of the present invention provides.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
It should be noted that it can directly on the other element when element is referred to as " being set to " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
As shown in Figure 1, the silicon wafer automatic supplier 100 that an embodiment of the present invention provides, including for clamping silicon
It the clamping device 110 of piece 200, positioning mechanism to detect 200 position of silicon wafer and is connect with clamping device 110
Driving mechanism 130.
It is understood that Fig. 1 provided is state signal when silicon wafer automatic supplier 100 is clamped with silicon wafer 200
Figure.
Wherein, detection information of the driving mechanism 130 to receive positioning mechanism, and driven according to the detection information of positioning mechanism
Dynamic clamping device 110 is run, and the silicon wafer 200 in turnover box is moved into piece folder.
Driving mechanism 130 drives clamping device 110 to run according to the detection information of positioning mechanism, by the silicon in turnover box
Piece 200 moves into piece folder, to realize automatically supplying for silicon wafer 200, the operation of manual handling turnover box has been reduced or remitted, to keep away
Operator's phenomenon injured when carrying heavier turnover box is exempted from, it is ensured that operation safety problem.Simultaneously, moreover it is possible to avoid week
Turnning box is fallen and the phenomenon that causes silicon wafer 200 in turnover box impaired.
In addition, clamping silicon wafer 200 by clamping device 110, the step of operator directly grabs silicon wafer 200 is avoided,
Operator is avoided to be unfamiliar with the human factors such as silicon wafer characteristic or fatigue and lead to showing for silicon wafer damage when grabbing silicon wafer
As.
Furthermore relative to manual operation, silicon wafer automatic supplier 100 improves the efficiency of supply of silicon wafer 200.
It is understood that the position of the silicon wafer 200 of positioning mechanism detection herein, refers to the position of silicon wafer 200 in turnover box
It sets, so that driving mechanism 130 is facilitated to drive clamping device 110 to move at turnover box according to the detection information of positioning mechanism, with
Grab silicon wafer 200.
Specifically, in the present embodiment, in the present embodiment, positioning mechanism includes the industrial phase to detect 200 position of silicon wafer
Machine.
Certainly, the mode for detecting the position of silicon wafer 200 is not limited by industrial camera, can also examine otherwise
Survey the position of silicon wafer 200.Such as, in a further embodiment, positioning mechanism includes to the infrared biography to detect position of silicon wafer
Sensor detects the position of silicon wafer 200 by infrared sensor.For another example, in a further embodiment, can also be visited by laser
The modes such as survey to detect the position of silicon wafer 200.
In the present embodiment, silicon wafer automated tool device further includes torque sensor.Torque sensor is to monitor clamping machine
The chucking power of structure 110, and monitoring information is passed into driving mechanism 130.To which driving mechanism 130 can be according to moment sensing
Chucking power of the monitoring information adjustment clamping device 110 of device to silicon wafer 200, on the one hand, prevent chucking power too small and lead to silicon wafer
200 slide；On the other hand, it prevents chucking power excessive and damages silicon wafer 200.It is understood that torque sensor passes through detection
Torque is to extrapolate the chucking power of clamping device 110.It is specific to calculate that mode is conventional technical means in the art, it is no longer superfluous herein
It states.Specifically, torque sensor may be provided in driving mechanism.
Generally, the piece clip-type number in silicon wafer wool making device is consistent, therefore is packed into every time by silicon wafer automatic supplier 100
The quantity of silicon wafer 200 in piece folder is identical, so that the making herbs into wool process of silicon wafer is gone on smoothly.Pass through silicon wafer based on each
The quantity that automatic supplier 100 is fitted into the silicon wafer 200 in piece folder is identical, i.e. the silicon wafer 200 that clamps every time of clamping device 110
Quantity is identical, therefore preferable chucking power can be obtained according to clamping experience, and be set to preset value.In clamping silicon every time
When piece 200, chucking power of the clamping device 110 to silicon wafer 200 is adjusted to preset value, to facilitate the quick supply of silicon wafer 200.
In addition, torque sensor monitors clamping device during silicon wafer 200 is transported to piece folder by clamping device 110
The chucking power of 110 pairs of silicon wafers 200, and monitoring information is passed into driving mechanism 130, driving mechanism 130 passes through torque sensor
Monitoring information compared with preset value, adjusted clamping device 110 to the chucking power of silicon wafer 200.
Certainly, in a further embodiment, the chucking power of clamping device 110 can also be monitored by other means.Such as exist
Force snesor is set on the position to silicon wafer contact of clamping device 110, directly to monitor the chucking power of clamping device.
In the present embodiment, clamping device 110 is clamping jaw.More specifically, clamping jaw is Pneumatic clamping jaw or electronic clamping jaw.
In the present embodiment, the position that clamping device 110 is contacted with silicon wafer 200 is equipped with cushion.On the one hand it can prevent from clamping
The position that mechanism 110 is contacted with silicon wafer 200 is really up to the mark and damages silicon wafer 200；On the other hand, moreover it is possible to effectively increase clamping device 110
With the coefficient of friction between silicon wafer 200, it is better protected from the landing of silicon wafer 200.Specifically, in the present embodiment, cushion is silicagel pad.
In the present embodiment, silicon wafer automatic supplier 100 further includes the silicon wafer 200 for detecting the clamping of clamping device 110
Thickness range sensor.Range sensor, which can be, to be arranged near the retaining part of clamping device 110.In view of silicon wafer
Thickness is identical, therefore the overall thickness that clamping device 110 clamps the silicon wafer 200 of identical quantity every time is identical.Therefore, detection can be passed through
The phenomenon that thickness for the silicon wafer 200 that clamping device 110 clamps judges whether there is scarce piece.
Certainly, in a further embodiment, piece phenomenon can also be lacked to determine whether existing by other means.For example,
Weight sensor is added to detect the weight of the silicon wafer 200 of the clamping of clamping device 110, thus clamped according to clamping device 110
The weight of silicon wafer 200 is to determine whether the phenomenon that lacking piece.For another example, increase scanning means to scan the silicon of the clamping of clamping device 110
Piece 200, the quantity for the silicon wafer 200 that clamping device 110 clamps is judged according to scanning information, and then obtains the conclusion for whether lacking piece.
In the present embodiment, driving mechanism 130 includes mechanical arm 131, and clamping device 110 is fixed on mechanical arm 131.It is logical
It crosses the movement of the mobile drive clamping device 110 of mechanical arm 131, and then clamping device 110 is moved at turnover box with from week
Clipping silicon chip 200 in turnning box, and clamping device 110 is moved at the piece folder of texturing equipment for silicon chip, silicon wafer 200 is put into piece
In folder.
In the present embodiment, two clamping devices 110 are fixed on mechanical arm 131.Certainly in a further embodiment, folder
The number for holding mechanism 110 can be adjusted according to specific needs, such as one or more than two.
Above-mentioned silicon wafer automatic supplier, driving mechanism based on the received positioning mechanism detection information drive clamping device
Silicon wafer in turnover box is moved into piece folder, to realize automatically supplying for silicon wafer, has reduced or remitted manual handling turnover by operation
The operation of case ensures that operation safety problem, and the impaired phenomenon of silicon wafer caused by avoiding turnover box from being fallen.In addition,
By gripper mechanism grips silicon wafer, the step of operator directly grabs silicon wafer is avoided, that is, avoids and is led because of human factor
The phenomenon that causing silicon wafer damage.Furthermore relative to manual operation, silicon wafer automatic supplier improves the efficiency of supply of silicon wafer.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of silicon wafer automatic supplier characterized by comprising
Clamping device, for clamping silicon wafer；
Positioning mechanism, to detect silicon wafer position；
And driving mechanism, it is connect with the clamping device, to receive the detection information of the positioning mechanism, and according to positioning
The detection information of mechanism drives the clamping device operation.
2. silicon wafer automatic supplier according to claim 1, which is characterized in that the positioning mechanism includes to detect
The industrial camera of position of silicon wafer.
3. silicon wafer automatic supplier according to claim 1, which is characterized in that the positioning mechanism includes to detect
The infrared sensor of position of silicon wafer.
4. silicon wafer automatic supplier according to claim 1, which is characterized in that further include torque sensor；The power
Chucking power of the square sensor to monitor the clamping device, and monitoring information is passed into the driving mechanism.
5. silicon wafer automatic supplier according to claim 1, which is characterized in that the clamping device is clamping jaw.
6. silicon wafer automatic supplier according to claim 5, which is characterized in that the clamping jaw is Pneumatic clamping jaw or electronic
Clamping jaw.
7. silicon wafer automatic supplier according to claim 5 or 6, which is characterized in that the clamping device to silicon
The position of piece contact is equipped with cushion.
8. silicon wafer automatic supplier according to claim 7, which is characterized in that the cushion is silicagel pad.
9. silicon wafer automatic supplier according to claim 1, which is characterized in that further include for detecting clamping device folder
The range sensor of the thickness for the silicon wafer held.
10. silicon wafer automatic supplier according to claim 1, which is characterized in that the driving mechanism includes mechanical arm,
The clamping device is fixed on the mechanical arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821191391.XU CN208666479U (en) | 2018-07-25 | 2018-07-25 | Silicon wafer automatic supplier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821191391.XU CN208666479U (en) | 2018-07-25 | 2018-07-25 | Silicon wafer automatic supplier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208666479U true CN208666479U (en) | 2019-03-29 |
Family
ID=65829620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821191391.XU Expired - Fee Related CN208666479U (en) | 2018-07-25 | 2018-07-25 | Silicon wafer automatic supplier |
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| CN (1) | CN208666479U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112830231A (en) * | 2020-12-30 | 2021-05-25 | 深圳市华星光电半导体显示技术有限公司 | Clamping method and device for display panel |
-
2018
- 2018-07-25 CN CN201821191391.XU patent/CN208666479U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112830231A (en) * | 2020-12-30 | 2021-05-25 | 深圳市华星光电半导体显示技术有限公司 | Clamping method and device for display panel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220510 Address after: 212400 east side of the intersection of Wenxi road and Ningli Road, Guozhuang Town, Jurong City, Zhenjiang City, Jiangsu Province Patentee after: Jurong GCL Photovoltaic Technology Co.,Ltd. Address before: No. 129, Jinshan Road, Bali Town, Yangzhou, Jiangsu 225131 Patentee before: YANGZHOU XIEXIN PHOTOVOLTAIC TECHNOLOGY CO.,LTD. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190329 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |