CN208644400U - Etching laser machining - Google Patents
Etching laser machining Download PDFInfo
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- CN208644400U CN208644400U CN201821175171.8U CN201821175171U CN208644400U CN 208644400 U CN208644400 U CN 208644400U CN 201821175171 U CN201821175171 U CN 201821175171U CN 208644400 U CN208644400 U CN 208644400U
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Abstract
The utility model provides a kind of etching laser machining.Etching laser machining, comprising: base；Light path system, the light path system includes laser, camera, coaxial optical path component, galvanometer and field lens, the coaxial optical path component is connect with the laser and the camera, the galvanometer is fixed on the described one end of coaxial optical path component far from the laser, and the field lens is fixedly connected on the bottom of the galvanometer；Swing arm unit, the swing arm unit are mounted on the base to drive the coaxial optical path component to swing；Workbench, the workbench are movably mounted at the bottom on the base and being located at the field lens.The utility model can be avoided the appearance of mechanical damage layer, not by the constraint of materials conductive performance, is able to carry out accurate, efficient leveling and is thinned.
Description
Technical field
The utility model, which is set, is related to hard material processing technique field, in particular to a kind of etching laser machining.
Background technique
Using diamond as the superhard material of representative, due to its high hardness, wearability, so that surface flattening and thickness
Being thinned becomes especially time-consuming, laborious.
Tradition leveling processing technology such as mechanical grinding and novel chemical assistant grinding will be made via in certain pressure
Micro-crack is generated by relative motion, the extruding of abrasive grain on the surface of the material with lower, removes material with falling off through crack propagation generation
Material.Thus the environmental pollution of the loss of bring abrasive material, friction pressure generate mechanical damage layer, grinding fluid processing generation becomes not
Avoidable problem.
Electric spark milling is then that instantaneous high-temperature, high pressure removal surfacing are generated using non-contacting spark discharge principle,
The leveling of material surface is realized by the online compensation of milling campaign and export license, is thinned.On the one hand, non-contacting processing side
Formula avoids stress injury；On the other hand, electric discharge require so that the material of poorly conductive and non-conductive diamond etc. be difficult into
Row processing.
Ultrasonic wave secondary process is added the processing of ultrasonic vibration and mechanical grinding or electrical discharge milling machining are mutually compound
Work mode.Although haveing a certain upgrade to processing efficiency, still the drawback that two kinds of processing methods cannot be avoided intrinsic.
For avoid the above processing method there are the drawbacks of, each producer is badly in need of designing a kind of novel process equipment.
Utility model content
The main purpose of the utility model is to provide a kind of etching laser machinings, can be avoided the appearance of mechanical damage layer,
Not by the constraint of materials conductive performance, it is able to carry out accurate, efficient leveling and is thinned.
To achieve the goals above, one aspect according to the present utility model provides a kind of etching laser machining, comprising:
Base；Light path system, the light path system include laser, camera, coaxial optical path component, galvanometer and field lens, described coaxial
Optical path component is connect with the laser and the camera, and the galvanometer is fixed on the coaxial optical path component and swashs far from described
One end of light device, the field lens are fixedly connected on the bottom of the galvanometer；Swing arm unit, the swing arm unit are mounted on the machine
To drive the coaxial optical path component to swing on seat；Workbench, the workbench is movably mounted on the base and position
In the bottom of the field lens.
Further, the coaxial optical path component includes: lens barrel, and the lens barrel includes laser lens barrel and camera lens barrel,
The laser lens barrel is connect with the laser, and the camera lens barrel is connect with the camera；Beam expander, the beam expander peace
In the laser lens barrel；Light path coaxial device, the light path coaxial device are arranged in the laser lens barrel far from institute
State one end of laser；Imaging system, the imaging system are mounted on the camera lens barrel close to one end of the camera.
Further, the swing arm unit includes: swing arm rotating mechanism, and the swing arm rotating mechanism is installed in rotation on
On the base；Swing arm, the first end of the swing arm are mounted on the swing arm rotating mechanism, the coaxial optical path component installation
In the second end of the swing arm.
Further, the swing arm rotating mechanism further includes rotary shaft and driving motor, and the driving motor is mounted on institute
It states on base and is drivingly connected with the rotary shaft.
Further, the workbench includes: three axis mobile platforms, and the three axis mobile platform is mounted on the base
On；Rotating platform, the rotating platform are mounted on the three axis mobile platform.
Further, the three axis mobile platform includes: X-axis translation stage, and the X-axis translation stage is mounted on the base
On；Y axis translation stage, the Y-axis translation stage are mounted on the X-axis translation stage；Z axis lifting platform, the Z axis lifting platform installation
On the Y-axis translation stage, the rotating platform is mounted on the Z axis lifting platform.
Further, the base includes: marble damping base, and the workbench is mounted on marble damping bottom
On seat；Marble support frame, the marble support frame are mounted in the marble damping base, the light path system and institute
Swing arm unit is stated to be installed on the marble support frame.
Further, the etching laser machining further includes control cabinet and computer, and the control cabinet and the computer are set
It sets in the bottom far from the workbench of the marble support frame.
Using the technical solution of the utility model, superhard material can be able to drive light with working table movement, swing arm unit
Road system is swung, and in swing process, swing arm unit axis is passed through in focal plane always, when surface of ultra-hard material is placed in swing arm unit
When rotation axis height, the galvanometer center Y-direction scan line of surface of ultra-hard material is fallen in swing arm unit swing process always
It is maintained on focal plane, convenient for quickly being positioned, being processed to superhard material.In use, the cutting of etching laser machining can be passed through
Different defocusing amounts is realized in the position that scan line is adjusted in software, and then simplifies the positioning operation in leveling thinning process.
During actual processing, increase working depth with swing arm unit pivot angle and reduce, leveling precision improves.Galvanometer is swept
It retouches while superhard material movement is driven by workbench, machined surface is completed by the relative motion of superhard material and laser scanning line
Task is thinned in leveling, and machining sketch chart is as shown in the figure.To realize that the more preferable rotatable swing arm unit pivot angle of processing effect repeatedly carries out
Processing carries out roughing using the long pulsewidth of high power, and low-power narrow spaces are finished.
As it can be seen that the etching laser machining of the utility model is high using laser energy density, controllability is good, and speed is fast, and precision is high
The characteristics of, surface of ultra-hard material leveling, thinned requirement can be efficiently reached.The design of swing arm unit is so that focal plane is worn always
Swing arm unit rotation axis is crossed, thus greatlys save fixed-focus to the knife time under different pivot angles.The utility model is added using laser
The non-contacting feature of work technology can avoid the generation of mechanical damage layer, without considering the electric conductivity of superhard material, in addition, this reality
Avoid the loss of the assistant chemicals solution such as abrasive material, electrode, grinding fluid with novel laser processing, save the cost while is reduced
Environmental pollution.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide a further understanding of the present invention, this is practical
Novel illustrative embodiments and their description are not constituteed improper limits to the present invention for explaining the utility model.
In the accompanying drawings:
Fig. 1 diagrammatically illustrates the perspective view of the etching laser machining of the utility model；
Fig. 2 diagrammatically illustrates the machining sketch chart of the etching laser machining of the utility model；
Fig. 3 diagrammatically illustrates the superhard material processing method flow chart of the utility model.
Wherein, the above drawings include the following reference numerals:
10, base；11, marble damping base；12, marble support frame；20, light path system；21, laser；22, same
Axial light path component；221, lens barrel；222, beam expander；223, light path coaxial device；224, imaging system；23, galvanometer；24, field
Mirror；30, swing arm unit；31, swing arm rotating mechanism；32, swing arm；40, workbench；41, X-axis translation stage；42, Y-axis translation stage；
43, Z axis lifting platform；44, rotating platform；50, control cabinet；60, superhard material.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The utility model will be described in detail below with reference to the accompanying drawings and embodiments.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so that presently filed embodiment described herein for example can be in addition to herein
Sequence other than those of diagram or description is implemented.In addition, term " includes " and " having " and their any deformation, it is intended that
Be to cover it is non-exclusive include, for example, containing the process, method, system, product or equipment of a series of steps or units not
Those of be necessarily limited to be clearly listed step or unit, but may include be not clearly listed or for these processes, side
The intrinsic other step or units of method, product or equipment.
For ease of description, spatially relative term can be used herein, as " ... on ", " ... top ",
" ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy
The spatial relation of sign.It should be understood that spatially relative term is intended to comprising the orientation in addition to device described in figure
Except different direction in use or operation.For example, being described as if the device in attached drawing is squeezed " in other devices
It will be positioned as " under other devices or construction after part or construction top " or the device of " on other devices or construction "
Side " or " under other devices or construction ".Thus, exemplary term " ... top " may include " ... top " and
" in ... lower section " two kinds of orientation.The device can also be positioned with other different modes and (is rotated by 90 ° or in other orientation), and
And respective explanations are made to the opposite description in space used herein above.
Referring to figure 1 and figure 2, embodiment according to the present utility model provides a kind of etching laser machining, the laser incising
Erosion machine includes base 10, light path system 20, swing arm unit 30 and workbench 40.
Wherein, light path system 20 include laser 21, camera (not shown), coaxial optical path component 22, galvanometer 23 with
And field lens 24, coaxial optical path component 22 are connect with laser 21 and camera, it is separate that galvanometer 23 is fixed on coaxial optical path component 22
One end of laser 21, field lens 24 are fixedly connected on the bottom of galvanometer 23；Swing arm unit 30 is mounted on base 10 same to drive
Axial light path component 22 is swung；Workbench 40 is movably mounted at the bottom on base 10 and being located at field lens 24.
During real work, the etching laser machining in the present embodiment is particularly suitable for the surfacing of super superhard material
China and thickness are thinned, and super superhard material here for example can be the structures such as diamond.When processing, superhard material 60 is placed on
On workbench 40, the cutting path of galvanometer 23 is set on etching laser machining, opens laser 21, what laser 21 emitted
Laser road imports galvanometer 23 through coaxial optical path component 22, through field lens 24 focus on the surface of superhard material 60 to superhard material 60 into
Row processing.
Superhard material 60 can be moved with workbench 40, and swing arm unit 30 is able to drive the swing of light path system 20, be swung
30 axis of swing arm unit is passed through in Cheng Zhong, focal plane always, when the rotation axis that 60 surface of superhard material is placed in swing arm unit 30 is high
When spending, the 23 center Y-direction scan line of galvanometer that 60 surface of superhard material is fallen in 30 swing process of swing arm unit is remained
On focal plane, convenient for carrying out rapid processing to superhard material 60.In use, can be by being adjusted in the cutting software of etching laser machining
Different defocusing amounts is realized in the position of whole scan line, and then simplifies the positioning operation in leveling thinning process.
During actual processing, increase working depth with 30 pivot angle of swing arm unit and reduce, leveling precision improves.Galvanometer
23 scannings drive superhard material 60 to move by workbench 40 simultaneously, pass through the relative motion of superhard material 60 and laser scanning line
It completes the leveling of machined surface, task is thinned, machining sketch chart is as shown in Figure 2.To realize the more preferable rotatable swing arm set of processing effect
30 pivot angle of part is repeatedly processed, and carries out roughing using the long pulsewidth of high power, low-power narrow spaces are finished.
As it can be seen that the etching laser machining of the present embodiment is high using laser energy density, controllability is good, and speed is fast, with high accuracy
Feature is aided with measurement-feedback closed loop processing mode, can efficiently reach surface of ultra-hard material leveling, thinned requirement.Swing arm
Component 30 designs so that focal plane passes through 30 rotation axis of swing arm unit always, thus greatlys save fixed-focus under different pivot angles
To the knife time.The utility model can avoid the generation of mechanical damage layer using the non-contacting feature of laser processing technology, without examining
The electric conductivity for considering superhard material, in addition, the laser processing of the utility model avoids the auxiliary such as abrasive material, electrode, grinding fluid
The loss of solution is learned, save the cost while reduces environmental pollution.
Shown in Figure 1, the coaxial optical path component 22 in the present embodiment includes lens barrel 221, beam expander 222, light path coaxial
Device 223 and imaging system 224.Wherein, lens barrel 221 includes laser lens barrel disposed in parallel and camera lens barrel, laser
Lens barrel is connect with laser 21, and camera lens barrel is connect with camera；Beam expander 222 is mounted in laser lens barrel；Light path coaxial dress
It sets 223 and the one end of laser lens barrel far from laser 21 is set；Imaging system 224 is mounted on camera lens barrel close to camera
One end.The effect of beam expander 222 and light path coaxial device 223 in through this embodiment issues convenient for improving laser 21
Laser efficiency, and then convenient for superhard material 60 carry out rapid processing, improve the etching laser machining of the present embodiment work effect
Rate.When actual installation, the structures such as eyeglass are provided in camera lens barrel, convenient for the form for the element that cameras capture is processed.
Swing arm unit 30 in the present embodiment includes swing arm rotating mechanism 31 and swing arm 32, and swing arm rotating mechanism 31 can be rotated
Ground is mounted on base 10；The first end of swing arm 32 is mounted on swing arm rotating mechanism 31, and coaxial optical path component 22 is mounted on pendulum
The second end of arm 32.When swing arm rotating mechanism 31 works, it is able to drive the rotation of swing arm 32, it is ensured that in 32 swing process of swing arm
The rotation axis of swing arm rotating mechanism 31 is passed through in middle focal plane always.
Swing arm rotating mechanism 31 in the present embodiment further includes rotary shaft and driving motor, and driving motor is mounted on base 10
Above and with rotary shaft it is drivingly connected.When work, driving motor rotation drives rotary shaft rotation, and then swing arm 32 is driven to swing, and makes
It obtains light path system 20 and generates predetermined pivot angle, convenient for being processed to superhard material 60.
Workbench 40 in the present embodiment includes three axis mobile platforms and rotating platform 44, wherein three axis mobile platforms are installed
On base 10；Rotating platform 44 is mounted on three axis mobile platforms.Preferably, three axis mobile platforms include X-axis translation stage
41, Y axis translation stage 42 and Z axis lifting platform 43, wherein X-axis translation stage 41 is mounted on base 10；Y-axis translation stage 42 is installed
On X-axis translation stage 41；Z axis lifting platform 43 is mounted on Y-axis translation stage 42, and rotating platform 44 is mounted on Z axis lifting platform 43.
By the effect of three axis mobile platforms and rotating platform 44, laser oblique incidence mode is adjusted convenient for cooperation swing arm unit 30.
Three axis mobile platforms in the present embodiment can be the structure slide construction of sliding block lead screw mating connection, can also be
Bindiny mechanism or cylinder slide block structure, as long as other modes of texturing under the design of the utility model, practical new at this
Within the protection scope of type.Similarly, when actual design rotating platform 44, can be come with the structure of channel motor mate gear rack gear
Rotating platform is driven to realize the rotation function of rotating platform 44, structure is simple, is easy to implement.
It recombines shown in Fig. 1, the base 10 in the present embodiment includes marble damping base 11 and marble support frame
12, which is mounted in marble damping base 11；Marble support frame 12 is mounted in marble damping base 11,
Light path system 20 and swing arm unit 30 are installed on marble support frame 12, and intensity is high, convenient for entire etching laser machining into
Row damping and installation.Certainly, in the other embodiments of the utility model, base 10 can also be set using other materials,
Such as steel plate adds the structure of damping rubber pad, as long as other modes of texturing under the design of the utility model, practical at this
Within novel protection scope.
Etching laser machining in the present embodiment further includes control cabinet 50 and computer (not shown), and computer includes master
Machine and display, the control cabinet 50 and computer are arranged at bottom of the marble support frame 12 far from workbench 40, structure
It is compact, it can reduce the volume of entire etching laser machining, control cabinet 50 can power and control to entire etching laser machining, calculate
Machine determines laser beam scan path to control galvanometer.
Referring to shown in Fig. 1 to Fig. 3, another aspect according to the present utility model provides a kind of superhard material processing method,
The superhard material processing method realizes that superhard material processing method includes the following steps: using above-mentioned etching laser machining
Step S1 is carried out first: choosing superhard material 60 to be processed, the surface of superhard material 60 is cleaned, it is ensured that
The surface free from admixture of superhard material 60；Step S2 is carried out again: the superhard material 60 cleaned is fixed on work by special mould clamp
Make on platform 40；Step S3 is carried out again: adjustment light path system 20, synchronous adjustment focal position of laser and the calculating in etching laser machining
The cutting path that galvanometer 23 is set on machine makes 60 surface of superhard material and laser scanning line on workbench 40 generate opposite fortune
It is dynamic；In step s3, there are three types of specific movement relations, the first is the movement of superhard material 60, and laser scanning line position is static；
Second static for superhard material 60, the movement of laser scanning line position；The third is superhard material 60 and laser scanning line position
It moves simultaneously, is adjusted and sets with specific reference to actual process requirements；Then step S4 is carried out again: making galvanometer 23 with first
Predetermined drift angle and the first predetermined power density are quickly flattened and are thinned to surface of ultra-hard material, and are changed using workbench 40
Leveling and thinned direction, it is repeated multiple times to promising result, and then reach and quick rough machined process is carried out to superhard material 60；Most
Step S5 is carried out afterwards: making galvanometer 23 to be higher than the second predetermined drift angle of the first predetermined drift angle and lower than the first predetermined power density
Second predetermined power density is finely flattened and is thinned to 60 surface of superhard material, and is changed leveling using workbench 40 and subtracted
Thin direction, it is repeated multiple times to promising result, and then achieve the purpose that carry out retrofit to superhard material 60.
The drift angle of galvanometer 23 in the present embodiment is adjusted by swing arm unit 30.
Preferably, the first predetermined drift angle is 35 ° to 60 °, and the second predetermined drift angle is 60 ° to 90 °.
The first predetermined power density and the second predetermined power density in the present embodiment are carried out according to actual rapidoprint
Design.
Specifically, clean 60 surface of superhard material to be processed is located in swing arm unit 30 axis height by special mould clamp
Degree；Rotary swinging arm 32 is between 35 ° -60 °, depending on 60 surface irregularity of superhard material.Principle is flattened as shown in Fig. 2, with pivot angle
Increase working depth to reduce, leveling precision improves.Surface is thinned between preferably 60 ° -90 °；The scanning of galvanometer 23 is simultaneously by working
Platform 40 drives superhard material 60 to move, by the relative motion of superhard material 60 and laser scanning line complete machined surface leveling,
The task of being thinned.To realize that more preferable processing effect angle rotatable is repeatedly processed, roughing is carried out using the long pulsewidth of high power,
Low-power narrow spaces are finished.
It can be seen from the above description that the above embodiments of the utility model achieve the following technical effects:
(1) the utility model is high using laser energy density, and controllability is good, and speed is fast, and feature with high accuracy is aided with survey
Amount-feedback closed loop processing mode can efficiently reach surface of ultra-hard material leveling, thinned requirement.Swing arm unit design makes
It obtains focal plane and passes through swing arm axis always, thus greatly save fixed-focus to the knife time under different pivot angles.
(2) the utility model can avoid the generation of mechanical damage layer using the non-contacting feature of laser processing technology.
(3) the non-contacting processing method of the utility model avoids stress injury；It can also be to the material of poorly conductive
And non-conductive diamond etc. is processed, without considering materials conductive performance.
(4) laser processing of the utility model avoids the loss of the assistant chemicals solution such as abrasive material, electrode, grinding fluid, section
About cost while reduce environmental pollution.It, can be by on-line measurement, monitoring device use in the utility model when practical application
Device in.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.
Claims (8)
1. a kind of etching laser machining characterized by comprising
Base (10)；
Light path system (20), the light path system (20) include laser (21), camera, coaxial optical path component (22), galvanometer
(23) and field lens (24), the coaxial optical path component (22) connect with the laser (21) and the camera, the vibration
Mirror (23) is fixed on the one end of the coaxial optical path component (22) far from the laser (21), and the field lens (24) is fixedly connected
In the bottom of the galvanometer (23)；
Swing arm unit (30), the swing arm unit (30) are mounted on the base (10) to drive the coaxial optical path component
(22) it swings；
Workbench (40), the workbench (40) are movably mounted on the base (10) and are located at the field lens (24)
Bottom.
2. etching laser machining according to claim 1, which is characterized in that the coaxial optical path component (22) includes:
Lens barrel (221), the lens barrel (221) include laser lens barrel and camera lens barrel, the laser lens barrel and the laser
Device (21) connection, the camera lens barrel are connect with the camera；
Beam expander (222), the beam expander (222) are mounted in the laser lens barrel；
Light path coaxial device (223), the light path coaxial device (223) are arranged in the laser lens barrel far from the laser
(21) one end；
Imaging system (224), the imaging system (224) are mounted on the camera lens barrel close to one end of the camera.
3. etching laser machining according to claim 1, which is characterized in that the swing arm unit (30) includes:
Swing arm rotating mechanism (31), the swing arm rotating mechanism (31) are installed in rotation on the base (10)；
Swing arm (32), the first end of the swing arm (32) are mounted on the swing arm rotating mechanism (31), the coaxial optical path group
Part (22) is mounted on the second end of the swing arm (32).
4. etching laser machining according to claim 3, which is characterized in that the swing arm rotating mechanism (31) further includes rotation
Axis and driving motor, the driving motor are mounted on the base (10) and are drivingly connected with the rotary shaft.
5. etching laser machining according to claim 1, which is characterized in that the workbench (40) includes:
Three axis mobile platforms, the three axis mobile platform are mounted on the base (10)；
Rotating platform (44), the rotating platform (44) are mounted on the three axis mobile platform.
6. etching laser machining according to claim 5, which is characterized in that the three axis mobile platform includes:
X-axis translation stage (41), the X-axis translation stage (41) are mounted on the base (10)；
Y-axis translation stage (42), the Y-axis translation stage (42) are mounted on the X-axis translation stage (41)；
Z axis lifting platform (43), the Z axis lifting platform (43) are mounted on the Y-axis translation stage (42), the rotating platform (44)
It is mounted on the Z axis lifting platform (43).
7. etching laser machining according to claim 1, which is characterized in that the base (10) includes:
Marble damping base (11), the workbench (40) are mounted on the marble damping base (11)；
Marble support frame (12), the marble support frame (12) is mounted on the marble damping base (11), described
Light path system (20) and the swing arm unit (30) are installed on the marble support frame (12).
8. etching laser machining according to claim 7, which is characterized in that the etching laser machining further includes control cabinet (50)
And computer, the control cabinet (50) and the computer installation are in the separate workbench of the marble support frame (12)
(40) bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821175171.8U CN208644400U (en) | 2018-07-24 | 2018-07-24 | Etching laser machining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821175171.8U CN208644400U (en) | 2018-07-24 | 2018-07-24 | Etching laser machining |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208644400U true CN208644400U (en) | 2019-03-26 |
Family
ID=65785867
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821175171.8U Active CN208644400U (en) | 2018-07-24 | 2018-07-24 | Etching laser machining |
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| Country | Link |
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| CN (1) | CN208644400U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108723609A (en) * | 2018-07-24 | 2018-11-02 | 廊坊西波尔钻石技术有限公司 | Etching laser machining and superhard material processing method |
| CN110303247A (en) * | 2019-05-23 | 2019-10-08 | 广东金鉴实验室科技有限公司 | A kind of laser mail opener |
-
2018
- 2018-07-24 CN CN201821175171.8U patent/CN208644400U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108723609A (en) * | 2018-07-24 | 2018-11-02 | 廊坊西波尔钻石技术有限公司 | Etching laser machining and superhard material processing method |
| CN108723609B (en) * | 2018-07-24 | 2024-06-14 | 廊坊西波尔钻石技术有限公司 | Laser etching machine and superhard material processing method |
| CN110303247A (en) * | 2019-05-23 | 2019-10-08 | 广东金鉴实验室科技有限公司 | A kind of laser mail opener |
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