CN208622699U - The encapsulating structure of the compatible humidity sensor of CMOS - Google Patents
The encapsulating structure of the compatible humidity sensor of CMOS Download PDFInfo
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- CN208622699U CN208622699U CN201821212515.8U CN201821212515U CN208622699U CN 208622699 U CN208622699 U CN 208622699U CN 201821212515 U CN201821212515 U CN 201821212515U CN 208622699 U CN208622699 U CN 208622699U
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- humidity sensor
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- cavity
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Abstract
The encapsulating structure of the compatible humidity sensor of CMOS.It is related to encapsulation technology field, more particularly, to a kind of encapsulating structure for the compatible humidity sensor of CMOS.It is simple to provide a kind of structure, facilitates processing, improves the encapsulating structure of the compatible humidity sensor of CMOS of package quality reliability.Including ceramic substrate, humidity sensor chip and cover board；The cover board is equipped with ventilation circular hole, and the cover board is bonded in the top surface of ceramic substrate.At work, humidity sensor chip is fixed in the cavity of ceramic substrate the utility model by epoxy available resin glue, and humidity sensor chip is connected with the metal pins of ceramic substrate；Ventilation circular hole is stamped on plastic cover plate, miillpore filter is pasted onto the reverse side of plastic cover plate, is finally pasted together plastic cover plate and ceramic substrate using epoxy resin, completes encapsulation.
Description
Technical field
The utility model relates to encapsulation technology fields, more particularly, to a kind of encapsulation for the compatible humidity sensor of CMOS
Structure.
Background technique
Humidity refers to the content of vapor in the atmosphere.With the development of industry, humidity has become decision production and life
The key factor of amenity level living.To obtain comfortable environment, temperature is not only controlled, and to control humidity.Example
Such as, if greenhouse production does not control moisture potential and must influence yield, if industrial production does not control humidity and will lead to product quality decline,
The humid control of air-conditioned room could comfortable between 40%RH~70%RH.Nowadays, Humidity Detection and control technology be
Be widely applied, especially military, meteorological, industry, agricultural, medical treatment, building and in terms of.In military affairs
Field, the storage and maintenance of firearms and ammunition, military equipment, weaponry etc. require stringent control humidity；In meteorological field,
Humidity has status of equal importance with meteorologic parameters such as temperature, wind speed and directions；Agriculturally, only strict control
The humidity in greenhouse and greenhouse could make crops obtain most good growing environment, accelerate the growth of crops；In industry side
Face, the manufacturing process of the industry such as steel, chemistry, food require to monitor and control humidity；In terms of medical treatment, ward, medical instrument
The conditioning of device maintenance and electron lens, requires stringent control humidity.
CMOS is Complementary Metal Oxide Semiconductor(complementary metal oxide semiconductor)
Abbreviation.The chip that it refers to a kind of technology of manufacture large scale integrated chip or is manufactured with this technology.With
The fast development of integrated circuit and semicon industry, manufacturing microsensor and actuator using MEMS technology becomes research
Hot spot.It is affected by this, Integrated Humidity Sensor is made as mesh in humidity sensor and measuring circuit using standard CMOS process
The research hotspot of preceding humidity sensor.But with the appearance of novel chip, new class is brought to the encapsulation of humidity sensor
Topic and challenge.Firstly, the raising of humidity sensor chip sensitivity promotes the raising of measurement accuracy, but simultaneously but also humidity
Sensor be easier by test environment interference, thus encapsulation when must be taken into consideration to Integrated Humidity Sensor chip into
Row insulation blocking；Secondly, Integrated Humidity Sensor has measuring circuit, how protection circuit is not by the environmental pollution of surrounding
Or it destroys and the fuel factor that generates requires to carry out emphasis when encapsulation when the electrical connection of measuring circuit and circuit work
Consider.
Therefore, it is necessary to propose a kind of encapsulation technology for the compatible humidity sensor of CMOS to solve the above problems.
Utility model content
The utility model facilitates processing, improves package quality reliability in view of the above problems, to provide a kind of structure simple
The compatible humidity sensor of CMOS encapsulating structure.
The technical solution of the utility model is: including ceramic substrate, humidity sensor chip and cover board；
It is equipped with cavity in the middle part of the top surface of the ceramic substrate, is equipped with lead frame, the two sides of ceramic substrate in the cavity
Pin is respectively equipped with,
The humidity sensor chip is located in cavity and is connect by lead frame with pin；
The cover board is equipped with ventilation circular hole, and the cover board is bonded in the top surface of ceramic substrate.
The ventilation circular hole is located at the top of cavity.
It further include miillpore filter, the miillpore filter is located at side of the cover board towards ceramic substrate, the miillpore filter
Sectional area is identical with the sectional area of cavity, and the miillpore filter is for covering cavity.
The side of the cover board towards ceramic substrate is surrounded by epoxide-resin glue.
At work, humidity sensor chip is fixed on the cavity of ceramic substrate to the utility model by epoxy available resin glue
It is interior, humidity sensor chip is connected with the metal pins of ceramic substrate；Ventilation circular hole is stamped on plastic cover plate, and micropore is filtered
Film is pasted onto the reverse side of plastic cover plate, is finally pasted together plastic cover plate and ceramic substrate using epoxy resin, completes envelope
Dress.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model,
Fig. 2 is the structural schematic diagram of ceramic substrate,
Fig. 3 is the attachment structure schematic diagram of ceramic substrate and humidity sensor chip,
Fig. 4 is the structural schematic diagram of cover board；
1 is ceramic substrate in figure, and 10 be cavity, and 11 be lead frame, and 12 be pin, and 2 be humidity sensor chip, and 3 are
Cover board, 30 be ventilation circular hole, and 4 be miillpore filter, and 5 be epoxide-resin glue, and 6 be lead.
Specific embodiment
The utility model is as shown in Figs 1-4, including ceramic substrate 1, humidity sensor chip 2 and cover board 3；
It is equipped with cavity 10 in the middle part of the top surface of the ceramic substrate, is equipped with lead frame 11 in the cavity, ceramic substrate
Two sides are respectively equipped with pin 12,
The humidity sensor chip is located in cavity and is connect by lead frame with pin；Humidity sensor chip
Connecting lead wire frame is bonded by lead 6；
The cover board 3 is equipped with ventilation circular hole 30, and the cover board is bonded in the top surface of ceramic substrate.
The ventilation circular hole is located at the top of cavity.
It further include miillpore filter 4, the miillpore filter is located at side of the cover board towards ceramic substrate, the miillpore filter
Sectional area is identical with the sectional area of cavity, and the miillpore filter is for covering cavity；So that cover board and ceramic substrate pass through epoxy
Resin glue connection is reliable.
The side of the cover board towards ceramic substrate is surrounded by epoxide-resin glue 5.
Ceramic substrate in the utility model has a biggish cavity and an interior step.The space of cavity is enough
Greatly, it is fully able to put down wet sensitive chip.Wherein interior step is mainly formed by lead frame, is that chip connects place with pin.
Because there is a resistor stripe in humidity sensor chip, it can generate a large amount of heat when work, and the tool of ceramic substrate
There is good heating conduction, is conducive to radiate.The electrical property and mechanical performance of ceramic substrate can also be met the requirements, while ceramics
The cost of substrate is not also high.On the lead frames by wet sensitive chip conducting resinl or adhering with epoxy resin first, resin is cured, makes
Wet sensitive chip is fixed, then the welding zone on wet sensitive chip is connect with the bonding region of lead frame pin with wire bonding method.
Since humidity sensor is non-hermetic enclosure, cover board needs enough mechanical strengths, and insulation performance is relatively good.Cause
This, selects common rigid plastic sheet as the cover board of humidity sensor encapsulating structure.The structure of cover board is porous structural cover board.
This structure is that multiple holes less than 1mm are stamped on plastic cover plate, can both make cavity inside and extraneous contact surface
Knot keeps being basically unchanged, and can be to avoid miillpore filter disrepair phenomenon.
In order to protect humidity sensor from the influence of dust and other granule foreigns in air, need to select micropore
Protection filter membrane of the filter membrane as humidity sensor chip.Miillpore filter is able to achieve function following aspects:
1), in order to guarantee that humidity sensor can normally work and extend service life of humidity sensor, miillpore filter must
It must can cross the dust or other granule foreigns in air filtering；
2), the transmission that the middle aqueous vapor of guarantee air and air can be unimpeded, it is unimpeded to mean using micropore
After filter membrane, the humidity inside and outside filter membrane does not have difference；
3), there are certain mechanical strength and corrosion resistance, it is relatively solid durable；
Have chosen polyvinylidene fluoride miillpore filter (hydrophobicity).The enhanced miillpore filter of polyvinylidene fluoride is using certainly
Move continuous film-making machine by polyvinylidene fluoride number resin, solvent, pore additive constitute casting solution double-coated in polyester without
In woven fabric, it is prepared through inversion of phases.Film high mechanical strength, tensile strength (N/50mm) are longitudinally greater than 250, are laterally greater than
150.It has strong negative static behaviour and hydrophobicity, excellent corrosion resistance, is resistant to most of organic solvent, is a kind of
It is able to carry out gas dehumidification, degerming, dust removal and filtration obtain novel precise filter medium.
Claims (4)
- The encapsulating structure of the compatible humidity sensor of 1.CMOS, which is characterized in that including ceramic substrate, humidity sensor chip and lid Plate；It is equipped with cavity in the middle part of the top surface of the ceramic substrate, lead frame is equipped in the cavity, the two sides of ceramic substrate are distinguished Equipped with pin,The humidity sensor chip is located in cavity and is connect by lead frame with pin；The cover board is equipped with ventilation circular hole, and the cover board is bonded in the top surface of ceramic substrate.
- 2. the encapsulating structure of the compatible humidity sensor of CMOS according to claim 1, which is characterized in that the ventilation circular hole Positioned at the top of cavity.
- 3. the encapsulating structure of the compatible humidity sensor of CMOS according to claim 1 or 2, which is characterized in that further include micro- Hole filter membrane, the miillpore filter are located at side of the cover board towards ceramic substrate, the sectional area of the miillpore filter and cutting for cavity Area is identical, and the miillpore filter is for covering cavity.
- 4. the encapsulating structure of the compatible humidity sensor of CMOS according to claim 1, which is characterized in that the cover board direction The side of ceramic substrate is surrounded by epoxide-resin glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821212515.8U CN208622699U (en) | 2018-07-27 | 2018-07-27 | The encapsulating structure of the compatible humidity sensor of CMOS |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821212515.8U CN208622699U (en) | 2018-07-27 | 2018-07-27 | The encapsulating structure of the compatible humidity sensor of CMOS |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208622699U true CN208622699U (en) | 2019-03-19 |
Family
ID=65707981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821212515.8U Active CN208622699U (en) | 2018-07-27 | 2018-07-27 | The encapsulating structure of the compatible humidity sensor of CMOS |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208622699U (en) |
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2018
- 2018-07-27 CN CN201821212515.8U patent/CN208622699U/en active Active
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