CN207802370U - A kind of microphone and capacitance type sensor integrated morphology - Google Patents
A kind of microphone and capacitance type sensor integrated morphology Download PDFInfo
- Publication number
- CN207802370U CN207802370U CN201721860574.1U CN201721860574U CN207802370U CN 207802370 U CN207802370 U CN 207802370U CN 201721860574 U CN201721860574 U CN 201721860574U CN 207802370 U CN207802370 U CN 207802370U
- Authority
- CN
- China
- Prior art keywords
- microphone
- module
- capacitive sensor
- substrate
- sensor module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 35
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
The utility model provides a kind of microphone and capacitance type sensor integrated morphology, including substrate, microphone module, capacitance type sensor module and lumen；Substrate is equipped with groove, and microphone module and capacitance type sensor module are respectively positioned in groove, and substrate, microphone module and capacitance type sensor module composition lumen；Substrate is equipped with the trepanning being connected with lumen, so that lumen is connected with the external world.The disclosure becomes one microphone module and capacitance type sensor module, and integrated morphology is small, at low cost.
Description
Technical Field
The utility model relates to a MEMS chip field, more specifically, the utility model relates to a microphone and capacitive sensor integrated configuration.
Background
With the rapid development of the field of intelligent electronic devices, people have made higher and higher requirements on the intelligent electronic devices. The intelligent electronic equipment is internally provided with sensors with various functions, and the development trend of the existing sensors is miniaturization and integration. The existing integrated sensor is usually formed by directly packaging two sensor chips, which is not only large in size but also high in cost.
Therefore, how to provide an integrated sensor with small volume and low cost becomes a technical problem to be solved urgently in the field.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a small, with low costs microphone and capacitanc sensor integrated configuration.
According to an aspect of the present invention, there is provided a microphone and capacitive sensor integrated structure.
The microphone and capacitive sensor integrated structure comprises a substrate, a microphone module, a capacitive sensor module and a middle cavity; wherein,
a groove is formed in the substrate, the microphone module and the capacitive sensor module are both positioned in the groove, and the substrate, the microphone module and the capacitive sensor module form the middle cavity;
the base is provided with an opening communicated with the middle cavity, so that the middle cavity is communicated with the outside.
Optionally, the microphone module is adjacent to the opening of the recess compared to the capacitive sensor module.
Optionally, the microphone module comprises a microphone back pole and a microphone diaphragm, the microphone back pole being provided on a surface of the microphone diaphragm;
the capacitive sensor module includes a sensor diaphragm, a sensor back pole, and a vacuum cavity between the sensor diaphragm and the sensor back pole, the sensor diaphragm being adjacent to the middle cavity as compared to the sensor back pole.
Optionally, the microphone diaphragm is further from the central cavity than the microphone backplate.
Optionally, the microphone module is located on a sidewall of the groove, and the capacitive sensor module is located at a bottom of the groove.
Optionally, a package connecting portion is disposed on the substrate, and the package connecting portion is located at an opening end of the groove.
Optionally, a plurality of openings are formed in the substrate, and the openings are uniformly arranged around the middle cavity.
Optionally, the substrate is a silicon substrate.
Optionally, a microphone module pad and a capacitive sensor module pad are arranged in the substrate, and the microphone module pad and the capacitive sensor module pad are respectively connected with the microphone module and the capacitive sensor module.
Optionally, the capacitive sensor module is a pressure sensor module.
The utility model discloses a technological effect lies in, this disclosure is integrated as an organic whole with microphone module and capacitanc sensor module, and integrated structure is small, and is with low costs. In addition, the microphone module and the capacitive sensor module are both positioned in the groove of the substrate, so that foreign matters can be prevented from contacting with the microphone module and/or the capacitive sensor module, and the problem of foreign matter sensitivity is effectively solved.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of an embodiment of an integrated microphone and capacitive sensor structure according to the present disclosure.
3 fig. 32 3 is 3 a 3 sectional 3 view 3 taken 3 along 3 the 3 line 3 a 3- 3 a 3 in 3 fig. 31 3. 3
The figures are labeled as follows:
the microphone comprises a substrate-1, a groove-11, an opening-12, a packaging connecting part-13, a microphone module-2, a microphone back pole-21, a microphone diaphragm-22, a microphone module bonding pad-23, a capacitance type sensor module-3, a sensor diaphragm-31, a sensor back pole-32, a vacuum cavity-33, a capacitance type sensor module bonding pad-34 and a middle cavity-4.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
As shown in fig. 1 and 2, the present disclosure provides a microphone and capacitive sensor integrated structure. The microphone and capacitive sensor integrated structure comprises a substrate 1, a microphone module 2, a capacitive sensor module 3 and a middle cavity 4. The material of the substrate 1 can be set according to actual requirements, such as silicon. The capacitive sensor module 3 may be, for example, a pressure sensor module, a force-sensitive sensor module, or the like. Typically, the microphone module 2 comprises a microphone module back pole and a microphone module diaphragm; the capacitive sensor module 3 comprises a capacitive sensor module back electrode and a capacitive sensor module membrane.
Be equipped with recess 11 on the basement 1, microphone module 2 and capacitive sensor module 3 all are located recess 11, and basement 1, microphone module 2 and capacitive sensor module 3 constitute lumen 4. The middle cavity 4 can provide a certain movement space for the diaphragm of the microphone module 2 and the diaphragm of the capacitive sensor module 3, so as to avoid the mutual interference of the diaphragms. In specific implementation, the microphone module 2 may be disposed adjacent to the opening of the groove 11, or the capacitive sensor module 3 may be disposed adjacent to the opening of the groove 11, as required.
The base 1 is provided with an opening 12 communicating with the central chamber 4 so that the central chamber 4 communicates with the outside. The middle chamber 4 communicated with the outside can receive sound signals and/or pressure intensity of the outside. In practice, the sound holes may correspond to the openings 12 or to the openings of the recesses 11.
The microphone module 2 and the capacitance type sensor module 3 are integrated into a whole, and the integrated structure is small in size and low in cost. The microphone module 2 and the capacitive sensor module 3 are both positioned in the groove 11 of the substrate 1, which is beneficial to avoiding the contact of foreign matters with the microphone module 2 and/or the capacitive sensor module 3, thereby effectively solving the problem of foreign matter sensitivity.
When the opening end of the groove 11 of the substrate 1 is a packaging end, that is, the opening end of the groove 11 is connected to a carrier substrate for packaging, the microphone module 2 and the capacitive sensor module 3 can be prevented from contacting with foreign matters. In addition, when the opening end of the groove 11 of the substrate 1 is the encapsulation end, the influence of the encapsulation pressure on the capacitive sensor module 3 can be effectively reduced, and particularly, if the capacitive sensor module 3 is far away from the opening of the groove 11 compared with the microphone module 2, the influence of the encapsulation pressure on the capacitive sensor module 3 can be further reduced.
When the microphone and capacitive sensor integrated structure is manufactured, the microphone module 2 and the capacitive sensor module 3 can be respectively formed on two independent substrates, and then the two substrates are bonded together through silicon to form the microphone and capacitive sensor integrated structure.
Optionally, this arrangement of the microphone module 2 facilitates a better protection of the capacitive sensor module 3 than if the capacitive sensor module 3 were adjacent to the opening of the recess 11.
Optionally, the microphone module 2 comprises a microphone back pole 21 and a microphone diaphragm 22, the microphone back pole 21 being provided on a surface of the microphone diaphragm 22. The microphone back pole 21 may be formed on the microphone diaphragm 22 by a surface micro-machining process.
The capacitive sensor module 3 comprises a sensor diaphragm 31, a sensor back-pole 32 and a vacuum cavity 33 between the sensor diaphragm 31 and the sensor back-pole 32, the sensor diaphragm 31 being adjacent to the middle cavity 4 compared to the sensor back-pole 32.
Optionally, the microphone diaphragm 22 is remote from the central cavity 4 compared to the microphone back-pole 21.
Optionally, the microphone module 2 is located on a sidewall of the recess 11 and the capacitive sensor module 3 is located at a bottom of the recess 11. Further, the substrate 1 is provided with an encapsulation connection portion 13, and the encapsulation connection portion 13 is located at the opening end of the groove 11. The package connecting portion 13 may be connected to the carrier substrate, so as to effectively protect the microphone module 2 and the capacitive sensor module 3 at the same time, and prevent the microphone module 2 and the capacitive sensor module 3 from contacting with foreign objects.
Optionally, in order to ensure that the central cavity 4 effectively and reliably receives external sound signals and/or pressure, a plurality of openings 12 are provided on the substrate 1, and the openings 12 are uniformly arranged around the central cavity 4.
Optionally, the substrate 1 is a silicon substrate.
Optionally, a microphone module pad 23 and a capacitive sensor module pad 34 are disposed in the substrate 1, and the microphone module pad 23 and the capacitive sensor module pad 34 are connected to the microphone module 2 and the capacitive sensor module 3, respectively. More specifically, the microphone module pad 23 may be electrically connected to the microphone diaphragm 22, and the capacitive sensor module pad 34 may be electrically connected to the sensor diaphragm 31. The microphone module pad 23 and the capacitive sensor module pad 34 may be formed by ion implantation.
Optionally, the capacitive sensor module 3 is a pressure sensor module.
Although some specific embodiments of the present invention have been described in detail by way of illustration, it should be understood by those skilled in the art that the above illustration is only for purposes of illustration and is not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. An integrated structure of a microphone and a capacitive sensor is characterized by comprising a substrate, a microphone module, a capacitive sensor module and a middle cavity; wherein,
a groove is formed in the substrate, the microphone module and the capacitive sensor module are both positioned in the groove, and the substrate, the microphone module and the capacitive sensor module form the middle cavity;
the base is provided with an opening communicated with the middle cavity, so that the middle cavity is communicated with the outside.
2. The integrated microphone and capacitive sensor structure of claim 1, wherein the microphone module is adjacent to the opening of the recess compared to the capacitive sensor module.
3. The integrated microphone and capacitive sensor structure of claim 1, wherein the microphone module comprises a microphone back pole and a microphone diaphragm, the microphone back pole being disposed on a surface of the microphone diaphragm;
the capacitive sensor module includes a sensor diaphragm, a sensor back pole, and a vacuum cavity between the sensor diaphragm and the sensor back pole, the sensor diaphragm being adjacent to the middle cavity as compared to the sensor back pole.
4. The integrated microphone and capacitive sensor structure of claim 1, wherein the microphone diaphragm is distal from the central cavity compared to the microphone backplate.
5. The integrated microphone and capacitive sensor structure of claim 1, wherein the microphone module is located on a sidewall of the recess and the capacitive sensor module is located at a bottom of the recess.
6. The integrated microphone and capacitive sensor structure of claim 5, wherein the substrate has a package connection portion thereon, the package connection portion being located at an open end of the recess.
7. The integrated microphone and capacitive sensor structure of claim 1, wherein the substrate has a plurality of openings formed therein, and the openings are uniformly disposed around the central cavity.
8. The integrated microphone and capacitive sensor structure of claim 1, wherein the substrate is a silicon substrate.
9. The integrated microphone and capacitive sensor structure of claim 1, wherein the substrate has a microphone module pad and a capacitive sensor module pad disposed therein, and the microphone module pad and the capacitive sensor module pad are connected to the microphone module and the capacitive sensor module, respectively.
10. The integrated microphone and capacitive sensor structure of any one of claims 1 to 9, wherein the capacitive sensor module is a pressure sensor module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721860574.1U CN207802370U (en) | 2017-12-26 | 2017-12-26 | A kind of microphone and capacitance type sensor integrated morphology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721860574.1U CN207802370U (en) | 2017-12-26 | 2017-12-26 | A kind of microphone and capacitance type sensor integrated morphology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207802370U true CN207802370U (en) | 2018-08-31 |
Family
ID=63279248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721860574.1U Active CN207802370U (en) | 2017-12-26 | 2017-12-26 | A kind of microphone and capacitance type sensor integrated morphology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207802370U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111107473A (en) * | 2019-12-13 | 2020-05-05 | 歌尔股份有限公司 | Integrated structure and method of MIC and pressure sensor |
-
2017
- 2017-12-26 CN CN201721860574.1U patent/CN207802370U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111107473A (en) * | 2019-12-13 | 2020-05-05 | 歌尔股份有限公司 | Integrated structure and method of MIC and pressure sensor |
| CN111107473B (en) * | 2019-12-13 | 2022-02-25 | 潍坊歌尔微电子有限公司 | Integrated structure and method of MIC and pressure sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205590278U (en) | Semiconductor integrated equipment and electronic equipment | |
| US10349184B2 (en) | Microphone and pressure sensor | |
| EP3249952B1 (en) | Integrated structure of mems microphone and pressure sensor, and manufacturing method thereof | |
| US8670579B2 (en) | MEMS microphone | |
| US8331589B2 (en) | MEMS microphone | |
| CN104249990B (en) | MEMS device and its manufacturing process comprising fluid path | |
| CN205912258U (en) | Micro electromechanical microphone and electronic system | |
| CN105792083B (en) | Micro-electromechanical microphone package | |
| US10407300B2 (en) | Integrated structure of mems pressure sensor and mems inertia sensor | |
| JP5174673B2 (en) | Electronic device with substrate level assembly and method of manufacturing the same | |
| US7763972B2 (en) | Stacked package structure for reducing package volume of an acoustic micro-sensor | |
| CN106535071B (en) | Integrated device of MEMS microphone and environmental sensor and manufacturing method thereof | |
| US20120280335A1 (en) | Component | |
| US9271087B1 (en) | Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof | |
| US20150373446A1 (en) | Multi-floor type mems microphone | |
| KR101554364B1 (en) | MEMS microphone package using lead frame | |
| CN203748007U (en) | MEMS microphone and electronic device | |
| CN207475875U (en) | A kind of encapsulating structure of microphone, environmental sensor | |
| CN207802370U (en) | A kind of microphone and capacitance type sensor integrated morphology | |
| TW200711510A (en) | Mems microphone and package | |
| US9516424B2 (en) | Micromechanical sensor system combination and a corresponding manufacturing method | |
| US9955268B2 (en) | Micro-electrical-mechanical system (MEMS) microphone | |
| TWI573469B (en) | Mems microphone module | |
| WO2023160719A1 (en) | Vibration sensor, electronic device, and vibration detection method | |
| CN105246013B (en) | Microphone apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200610 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |