CN208597198U

CN208597198U - A kind of novel soft-hard board structure

Info

Publication number: CN208597198U
Application number: CN201821281160.8U
Authority: CN
Inventors: 穆敦发
Original assignee: Shanghai Fast-Pcb Circuit Technology Corp Ltd
Current assignee: Shanghai Fast-Pcb Circuit Technology Corp Ltd
Priority date: 2018-08-09
Filing date: 2018-08-09
Publication date: 2019-03-12
Anticipated expiration: 2028-08-09

Abstract

The utility model relates to a kind of novel soft-hard board structures, including PCB hardboard, FPC soft board, the both ends of the FPC soft board are coated with binder and are laminated with the center of the PCB hardboard and connect, it is also covered with flexible mantle in the positive and negative groove that the FPC soft board and the PCB hardboard are formed by thickness difference, is also covered with rigid pad film on the surface of the flexibility mantle.Compared with prior art, the advantages that the utility model has flash rate low, simple process and low cost, machining accuracy is high.

Description

A kind of novel soft-hard board structure

Technical field

The utility model relates to a kind of circuit boards, more particularly, to a kind of novel soft-hard board structure.

Background technique

Rigid Flex is the printed circuit board that different hardboard parts are connected into an entirety by soft board, is had complete Electric property.The characteristics of Rigid Flex is due to design itself, soft board region and hardboard area thickness are significantly different, and there are bright Aobvious difference in thickness.In shape milling, hardboard region is due to being close to table top, very close to each other, milling end in milling cutter motion process Face is smooth, smooth, and soft board region is since thickness is thinner than hardboard area, Hanging sectionally when milling, and cutting effect is poor.In addition, soft board Material is polyimides pure resin, does not have glass cloth reinforcing material, very soft, causes to need molding edge cutting imperfect, milling It is very big to cut burr.

To solve the problems, such as that flexible board area milling burr is big, milling is difficult, as shown in Figure 1,3 can be added gasket in flexible board area 2 Filling increases flexible board area height, keeps flexible board area 2 and 1 height of hardboard area close, and milling cutter and flexible board area are in close contact as far as possible, from And improve soft board milling quality, but still can not solve flexible board area in this way does not have reinforcing material to cause milling burr is remaining to ask Topic, generally needs to place under repair to edges of boards burr after milling is complete, not only heavy workload, damages soft board when being also easy to repair The case where area.Another method is the machinery milling of hardboard area, flexible board area laser milling.But it is relatively thin to be only applicable to plate thickness in this way The Rigid Flex of (thickness 1.0mm or less), thicker for plate thickness (thickness 1.0mm or more), soft board and hardboard area drop are larger The case where (gap 0.5mm or more), flexible board area out-of-flatness, laser milling energy is uneven, and flexible board area is easy to burn black and easy to be inclined Position, leads to outer dimension deviation.

Utility model content

The purpose of this utility model is exactly to provide a kind of novel soft-hard to overcome the problems of the above-mentioned prior art Board structure.

The purpose of this utility model can be achieved through the following technical solutions:

A kind of novel soft-hard board structure, including PCB hardboard, FPC soft board, the both ends of the FPC soft board are coated with viscous It ties agent and is laminated with the center of the PCB hardboard and connected, the FPC soft board and the PCB hardboard are formed just because of thickness difference It is also covered with flexible mantle in anti-groove, is also covered with rigid pad film on the surface of the flexibility mantle.

Preferably, the flexible mantle with a thickness of 0.3mm~0.6mm.

Preferably, the type of the flexible mantle is polyurethane film, and polyvinyl chloride film and polyester film are wherein appointed It anticipates one kind.

Preferably, the rigid pad film with a thickness of 0.5~0.8mm.

Preferably, the type of the rigid pad film is that dimethyl silicone polymer synthesizes film or Polymethyl methacrylate Film.

Preferably, the FPC soft board uses the mono- dual platen of FCCL.

Preferably, for the material of the PCB hardboard using copper FR-4 plate is covered, PP+CU plate and RCC plate are wherein any A kind of material.

Preferably, the binder is epoxy resin or acrylic resin.

Preferably, the soldering resistance of the FPC soft board is 300 DEG C/30S.

Preferably, the thawing critical-temperature of the PCB hardboard is 125 DEG C~210 DEG C.

Compared with prior art, the utility model has the advantage that

(1) due to the membrane material different provided with two layers of characteristic and material in flexible board area, and then make whole soft or hard combination Plate is suitable for laser or machine cuts, using the different physical characteristics of different films, and then makes the reduction of flash rate.

(2) the thickness setting of membrane material and the precision of cutting technique match, and technique cutting accuracy is more preferable.

(3) by the way that the soldering resistance of soft board and the thawing critical-temperature of hardboard is respectively set, and then make whole Rigid Flex Laser or machine cuts are suitable for, flash rate substantially reduces.

Detailed description of the invention

In order to further elucidate the utility model each embodiment the above and other advantages and features, will with reference to attached drawing come The more specific description of each embodiment of the utility model is presented.It is appreciated that these attached drawings only describe the allusion quotation of the utility model Type embodiment, therefore be not to be regarded as being restriction on its scope.Also, the relative position of various pieces shown in the accompanying drawings and Size is exemplary, and is not to be construed as the position uniquely determined between various pieces or size relationship.

Fig. 1 is the schematic diagram of the section structure of the prior art；

Fig. 2 is the section result schematic diagram of the utility model；

Drawing reference numeral explanation:

1 is hardboard area；2 be flexible board area；3 be gasket；11 be PCB hardboard；12 be FPC soft board；13 be flexible mantle；14 are Rigid pad film.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model It clearly and completely describes, it is clear that described embodiment is a part of the embodiment of the utility model, rather than is all implemented Example.Based on the embodiments of the present invention, those of ordinary skill in the art institute without making creative work The every other embodiment obtained all should belong to the range of the utility model protection.

It is illustrated in figure 2 a kind of the schematic diagram of the section structure of novel soft-hard board structure of the utility model, including PCB hard Plate 11, FPC soft board 12, FPC soft board 12 use the mono- dual platen of FCCL, and soldering resistance is 300 DEG C/30S, and PCB hardboard 11, which uses, to be covered Copper FR-4 plate, PP+CU plate and RCC plate any of them material, melting critical-temperature is 125 DEG C~210 DEG C, The both ends of FPC soft board 12 are coated with binder and are laminated with the center of PCB hardboard 11 and connect, FPC soft board 12 and PCB hardboard 11 because Thickness difference and be also covered with flexible mantle 13 in the positive and negative groove that is formed, be also covered with rigid pad film on the surface of flexible mantle 13 14, flexible mantle 13 with a thickness of 0.3mm~0.6mm, adoptable material is polyurethane film, polyvinyl chloride film and poly- Ester film any of them, rigid pad film 14 with a thickness of 0.5~0.8mm, adoptable material is polydimethylsiloxanes Alkane synthesizes film or Polymethyl methacrylate film.

For drop between soft board and hardboard compared with as large as drop 0.5mm or more Rigid Flex, due to soft board shape It is laser milling on the basis of smooth for the first time, not only milling is high-quality at soft board edge, while dimensional accuracy is high, can accomplish Within +/- 0.05mm, far beyond the requirement of 0.15mm generally +/- to shape dimensional accuracy.

Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to In this, anyone skilled in the art within the technical scope disclosed by the utility model, can be readily occurred in various Equivalent modifications or substitutions, these modifications or substitutions should be covered within the scope of the utility model.Therefore, this is practical Novel protection scope should be subject to the protection scope in claims.

Claims

1. a kind of novel soft-hard board structure, including PCB hardboard (11), FPC soft board (12), the two of the FPC soft board (12) End be coated with binder and with the center of the PCB hardboard (11) be laminated connect, which is characterized in that the FPC soft board (12) with It is also covered with flexible mantle (13) in the positive and negative groove that the PCB hardboard (11) is formed, on the surface of the flexibility mantle (13) It is also covered with rigid pad film (14).

2. a kind of novel soft-hard board structure according to claim 1, which is characterized in that the flexible mantle (13) With a thickness of 0.3mm~0.6mm.

3. a kind of novel soft-hard board structure according to claim 1 or 2, which is characterized in that the flexible mantle (13) type is polyurethane film, polyvinyl chloride film and polyester film any of them.

4. a kind of novel soft-hard board structure according to claim 1, which is characterized in that the rigid pad film (14) With a thickness of 0.5~0.8mm.

5. a kind of novel soft-hard board structure according to claim 1 or 4, which is characterized in that the rigid pad film (14) type is that dimethyl silicone polymer synthesizes film or Polymethyl methacrylate film.

6. a kind of novel soft-hard board structure according to claim 1, which is characterized in that the FPC soft board (12) Using the mono- dual platen of FCCL.

7. a kind of novel soft-hard board structure according to claim 1, which is characterized in that the PCB hardboard (11) Material using covering copper FR-4 plate, PP+CU plate and RCC plate any of them material.

8. a kind of novel soft-hard board structure according to claim 1, which is characterized in that the binder is epoxy Resin or acrylic resin.

9. a kind of novel soft-hard board structure according to claim 1 or 6, which is characterized in that the FPC soft board (12) soldering resistance is 300 DEG C/30S.

10. a kind of novel soft-hard board structure according to claim 1 or 6, which is characterized in that the PCB hardboard (11) thawing critical-temperature is 125 DEG C~210 DEG C.