CN208570572U - A kind of objective table being applicable in more size wafers - Google Patents

Abstract

The utility model relates to carrying apparatus fields, more particularly to a kind of objective table for being applicable in more size wafers, the wafer is set on the plastic film, the plastic foil surrounding posts iron hoop, the objective table includes the sucker for adsorbing wafer and the absorbent module for adsorbing iron hoop, the sucker is equipped with more size cuttings, and the absorbent module is mounted on the side of sucker.The wafer of different size can be placed along different cuttings, then adsorb iron hoop by absorbent module, so that objective table is capable of fixing the wafer of different size, compatibility is high.

Description

A kind of objective table being applicable in more size wafers

Technical field

The utility model relates to carrying apparatus fields, and in particular to a kind of objective table for being applicable in more size wafers.

Background technique

Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer； It can be processed on silicon and is fabricated to various circuit component structures, and become the IC product for having specific electrical functionality.

Conventional wafer is divided into four cun and six cun, and is on the market four cun of wafers for the mainstream cutting machine of cutting crystal wafer Cutting machine and six cun of dicing saws, possess fixed dimension, are typically only capable to be exclusively used in four cun of wafers or six cun of wafers, each other not It is compatible.If have four cun of wafers and six cun of wafers concurrently with a batch product, the cutting machine of two kinds of specifications can only be prepared, increase and add Work cost.

Utility model content

The technical problem to be solved by the present invention is in view of the above drawbacks of the prior art, provide a kind of applicable more The objective table of size wafer solves the problems, such as that objective table is capable of fixing plurality of specifications wafer.

To solve this technical problem, the utility model provides a kind of objective table for being applicable in more size wafers, and the wafer is set On the plastic film, the plastic foil surrounding posts iron hoop, and the objective table includes sucker for adsorbing wafer and for adsorbing The absorbent module of iron hoop, the sucker are equipped with more size cuttings, and the absorbent module is mounted on the side of sucker.

Wherein, preferred version is: the absorbent module includes the first suction nozzle, the second suction nozzle and fixing seat, and described first inhales Mouth and the second suction nozzle are arranged in fixing seat, and distance of first suction nozzle apart from sucker is less than the second suction nozzle distance and inhales The distance of disk.

Wherein, preferred version is: the absorbent module further include the first support base, the first adjusting rod, the second support base and Second adjusting rod, first support base are equipped with the first aperture for matching with the bottom end of the first adjusting rod, and described second Support seat is equipped with the second aperture matched with the bottom end of the second adjusting rod；First support base is mounted in fixing seat, institute It states the first adjusting rod to be mounted on the first support base by the first aperture, first suction nozzle is mounted on the first adjusting rod；Institute It states the second support base to be mounted in fixing seat, second adjusting rod is mounted on the second support base by the second aperture, described Second suction nozzle is mounted on the second adjusting rod.

Wherein, preferred version is: absorbent module there are four setting on the sucker.

Wherein, preferred version is: the objective table further includes lasso, and the sucker is set in lasso.

Wherein, preferred version is: the objective table further includes light source and the internal mounting base for being equipped with cavity, and the light source is set It sets in the cavities, the lasso is arranged above mounting base, and the side of mounting base is arranged in the absorbent module.

Wherein, preferred version is: the objective table further includes planarity adjustment component, and the planarity adjustment component includes Height adjustment screw and lock screw, the lasso are equipped with the first through hole that matches with height adjustment screw, be additionally provided with The second through-hole that lock screw matches, the mounting base are equipped with the third through-hole that matches with lock screw, and described second Through-hole is connected to third through-hole；The height adjustment screw passes through first through hole and contradicts mounting base, and the lock screw passes through Second through-hole and third through-hole are fixed.

Wherein, preferred version is: there are four the planarity adjustment component is set.

Wherein, preferred version is: the objective table further includes rotation motor, and the mounting base is arranged on rotation motor.

Wherein, preferred version is: the scored surface is equipped with frosted layer.

The beneficial effects of the utility model are that compared with prior art, the utility model is a kind of applicable more by designing The objective table of size wafer, sucker are equipped with cutting, and the wafer of different size can be placed along different cuttings, then pass through absorption Component adsorbs iron hoop, so that objective table is capable of fixing the wafer of different size, compatibility is high；In addition, it is additionally provided with light source, it can To provide vision positioning when wafer cutting；Also, it is additionally provided with planarity adjustment component, the flatness of sucker can be adjusted, is guaranteed Sucker is on a horizontal.

Detailed description of the invention

Below in conjunction with accompanying drawings and embodiments, the utility model is described in further detail, in attached drawing:

Fig. 1 is the schematic diagram of the utility model objective table；

Fig. 2 is the explosive view of the utility model objective table；

Fig. 3 is the schematic diagram of the utility model planarity adjustment component.

Specific embodiment

Now in conjunction with attached drawing, elaborate to the preferred embodiment of the utility model.

As shown in figures 1 and 3, the utility model provides a kind of preferred embodiment of objective table for being applicable in more size wafers.

Specifically, with reference to Fig. 1, a kind of objective table, the objective table is for carrying the wafer of sizes specification, the crystalline substance Circle is set on the plastic film, and the plastic foil is surrounded by iron hoop, due to plastic foil one-sided tacky, one-sided smooth, stickiness one side Viscous wafer and iron hoop can be glued, the objective table includes the sucker 1 for adsorbing wafer, and the sucker 1 is equipped with more size cuttings, The wafer of different dimensions corresponds to cutting placement, for example, with reference to Fig. 2, the corresponding four cun of cuttings 11 of four cun of wafers, six cun of wafers pair Answer six cun of cuttings 12；The objective table further includes the absorbent module 2 that at least one is used to adsorb iron hoop, and the absorbent module 2 is set On the side for setting sucker 1.When wafer is placed on the suction cup 1, the smooth face contact sucker 1 of the plastic foil, the sucker 1 Air is extracted, makes wafer adsorption above it, meanwhile, the absorbent module 2 adsorbs iron hoop.Since the weight of iron hoop is greater than wafer And plastic foil, wafer and plastic foil are adsorbed by sucker 1, and iron hoop is adsorbed by absorbent module 2, can guarantee the steady of absorption Qualitative and reliability.

Wherein, with reference to Fig. 2, the absorbent module 2 includes the first suction nozzle 21, the second suction nozzle 24 and fixing seat 27, and described the One suction nozzle 21 and the second suction nozzle 24 are arranged in fixing seat 27, and first suction nozzle 21 and the second suction nozzle 24 are in fixing seat On 27 in tandem, distance of first suction nozzle 21 apart from sucker 1 is less than distance of second suction nozzle 24 apart from sucker 1. First suction nozzle 21 is used to adsorb the iron hoop of four cun of wafers, and second suction nozzle 24 is used to adsorb the iron hoop of six cun of wafers.Root According to the size for the wafer to be cut, first suction nozzle 21 and the second suction nozzle 24 can carry out free switching by vacuum valve.

Further, with reference to Fig. 2, the absorbent module 2 further includes the first support base 23, the first adjusting rod 22, second Seat 26 and the second adjusting rod 25 are supportted, first support base 23 is equipped with the first hole matched with the bottom end of the first adjusting rod 22 Mouth 231, second support base 26 are equipped with the second aperture 261 matched with the bottom end of the second adjusting rod 25；Described first Support base 23 is mounted in fixing seat 27, and first adjusting rod 22 is mounted on the first support base 23 by the first aperture 231, First suction nozzle 21 is mounted on the first adjusting rod 22；Second support base 26 is mounted in fixing seat 27, and described second Adjusting rod 25 is mounted on the second support base 26 by the second aperture 261, and second suction nozzle 24 is mounted on the second adjusting rod 25 On.By turning the first adjusting rod 22 and the second adjusting rod 25, the height of the first suction nozzle 21 and the second suction nozzle 24 can be adjusted, is made The top of all first suction nozzles 21 is located at sustained height, and the top of all second suction nozzles 24 is made to be located at sustained height, guarantees iron When ring absorption is fixed, plane is in same horizontal line, without run-off the straight.First aperture 231 and the second aperture 261 Equipped with multiple, the first adjusting rod 22 can be fixed on suitable first aperture 231 by user according to the actual situation, and by second Adjusting rod 25 is fixed on suitable second aperture 261.

Certainly, first support base 23 and the first adjusting rod 22 can be wholely set as the same part, and described second Support seat 26 and the second adjusting rod 25 can also be wholely set as the same part, as long as can be realized corresponding function.

Preferably, absorbent module 2 there are four being set on the sucker 1, specifically, first suction nozzle 21, the second suction nozzle 24, there are four fixing seat 27, the first support base 23, the first adjusting rod 22, the second support base 26 and the second adjusting rod 25 are all provided with, and And it is evenly distributed on the surrounding of sucker 1.

More specifically, the objective table further includes lasso 3 with reference to Fig. 1 and Fig. 2, the sucker 1 is set in lasso 3.Institute Stating objective table further includes light source 4 and the internal mounting base 5 for being equipped with cavity, and in the cavities, the lasso 3 is set for the setting of light source 4 It sets above mounting base 5, the side of mounting base 5 is arranged in the absorbent module 2.When wafer is cut, 4 energy of light source Light enough is provided for cutting machine, the vision positioning of cutting route is carried out convenient for cutting machine.The objective table further includes rotation motor 6, the mounting base 5 is arranged on rotation motor 6.The rotation motor 6 is able to drive objective table unitary rotation, cuts for wafer Angle compensation is provided.

Again specifically, and Fig. 3 is referred to, the objective table further includes planarity adjustment component 7, the planarity adjustment component 7 include height adjustment screw 71 and lock screw 72, and it is logical that the lasso 3 is equipped with first matched with height adjustment screw 71 Hole, is additionally provided with the second through-hole matched with lock screw 72, and the mounting base 5 is equipped with the matched with lock screw 72 Three through-holes, second through-hole are connected to third through-hole；The height adjustment screw 71 passes through first through hole and contradicts mounting base 5, the lock screw 72 sequentially passes through the second through-hole from top to bottom and third through-hole is fixed.

Wherein, it there are four the planarity adjustment component 7 is set, and is evenly distributed on lasso 3 and mounting base 5.Pass through Turn one of height adjustment screw 71, due to height adjustment screw 71 contradict mounting base 5, enable to 3 side of lasso compared with Height, so that the flatness of sucker 1 is changed.When the top of all height adjustment screws 71 is located at sustained height, Fixed by lock screw 72, the sucker 1 is on horizontal line, and the suction nozzle can be concordant with sucker 1.

Preferably, the scored surface is equipped with frosted layer.Since wafer is during loading and unloading, the plastic foil is easy Viscous when needing to take out wafer, to be passed through air on the suction cup 1, since cutting has frosted layer, the wafer can be easily removed, Avoid mucous membrane.

In conclusion the above is only the preferred embodiments of the present utility model only, it is not intended to limit the utility model Protection scope.Any modification made within the spirit and principle of the utility model, equivalent replacement, improve etc., it should all wrap Containing within the protection scope of the present utility model.

Claims (10)

1. a kind of objective table for being applicable in more size wafers, the wafer are set on the plastic film, the plastic foil surrounding posts iron hoop, It is characterized by: the objective table includes the sucker for adsorbing wafer and the absorbent module for adsorbing iron hoop, the sucker More size cuttings are equipped with, the absorbent module is mounted on the side of sucker.

2. objective table according to claim 1, it is characterised in that: the absorbent module includes the first suction nozzle, the second suction nozzle And fixing seat, first suction nozzle and the second suction nozzle are arranged in fixing seat, distance of first suction nozzle apart from sucker is small In distance of second suction nozzle apart from sucker.

3. objective table according to claim 2, it is characterised in that: the absorbent module further includes the first support base, first Adjusting rod, the second support base and the second adjusting rod, first support base are equipped with and match with the bottom end of the first adjusting rod First aperture, second support base are equipped with the second aperture matched with the bottom end of the second adjusting rod；First support Seat is mounted in fixing seat, and first adjusting rod is mounted on the first support base by the first aperture, the first suction nozzle peace On the first adjusting rod；Second support base is mounted in fixing seat, and second adjusting rod is installed by the second aperture On the second support base, second suction nozzle is mounted on the second adjusting rod.

4. objective table according to claim 1, it is characterised in that: absorbent module there are four being set on the sucker.

5. objective table according to any one of claims 1 to 4, it is characterised in that: the objective table further includes lasso, the suction Disk is set in lasso.

6. objective table according to claim 5, it is characterised in that: the objective table further includes that light source and inside are equipped with cavity Mounting base, in the cavities, the lasso is arranged above mounting base for light source setting, and the absorbent module setting is being installed The side of seat.

7. objective table according to claim 6, it is characterised in that: the objective table further includes planarity adjustment component, institute Stating planarity adjustment component includes height adjustment screw and lock screw, and the lasso is equipped with and matches with height adjustment screw First through hole, be additionally provided with the second through-hole matched with lock screw, the mounting base is equipped with and matches with lock screw Third through-hole, second through-hole is connected to third through-hole；The height adjustment screw passes through first through hole and contradicts installation Seat, the lock screw passes through the second through-hole and third through-hole is fixed.

8. objective table according to claim 7, it is characterised in that: there are four the planarity adjustment component is set.

9. objective table according to claim 6, it is characterised in that: the objective table further includes rotation motor, the installation Seat is arranged on rotation motor.

10. objective table according to claim 1, it is characterised in that: the scored surface is equipped with frosted layer.