CN208543660U - A kind of silicon crystal wire-electrode cutting device - Google Patents
A kind of silicon crystal wire-electrode cutting device Download PDFInfo
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- CN208543660U CN208543660U CN201820569937.4U CN201820569937U CN208543660U CN 208543660 U CN208543660 U CN 208543660U CN 201820569937 U CN201820569937 U CN 201820569937U CN 208543660 U CN208543660 U CN 208543660U
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- silicon crystal
- cutting
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- cutting device
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Abstract
The utility model discloses a kind of silicon crystal wire-electrode cutting devices, belong to crystal-cut technical field.Cable directive wheel (1) edge connection cutting cable (6) described in the utility model;The silicon crystal fixed device (2) and spray equipment (7) are arranged above device;The spray equipment (7) is by fluid reservoir (3), spray tank (4) and diversion trench (5);Fluid reservoir (3) are set above the diversion trench (5);Spray tank (4) are arranged in diversion trench (5) lower end;Nozzle (8) are set in the spray tank (4).Silicon crystal wire-electrode cutting device provided by the utility model has excellent cutting efficiency.
Description
Technical field
The invention discloses a kind of silicon crystal wire-electrode cutting devices, belong to crystal-cut technical field.
Background technique
Multi-wire cutting technology is more advanced crystal silicon processing technique in the world at present, its principle is by a height
The steel wire of speed movement drives the cutting blade material being attached on steel wire to be rubbed to hard brittle materials such as semiconductors and reach cutting effect
Fruit.Multi-wire cutting technology has compared with traditional saw blade, grinding wheel and inner circle cutting with high-efficient, production capacity height, precision height
The advantages that, multi-wire cutting technology is at present using hard and brittle material cutting technologies such as widest semiconductors.
Existing multi-wire saw equipment such as crystalline silicon ingot cutting machine etc. typically at least includes: rack, is set to described
For carrying the workbench of crystalline silicon ingot in rack, for the wire storage tube of wrapping wire, multiple guide rollers and liftable cutting roller etc.,
In the cutting process to crystalline silicon ingot, pass through the guidance of more than ten of guide roller as the steel wire of cutting line, in multiple cutting rollers
Between it is upper form a bracing cable net, and when crystalline silicon ingot to be processed is fixed on the workbench, cutting roller is lowered, and
Pressure pump under the action of, cutting liquid is sprayed to steel wire and crystalline silicon by the cutting liquid automatic spraying device being assemblied in equipment
The cutting parts of ingot drive cutting liquid to move back and forth by steel wire, generate cutting to workpiece using the abrasive sand in cutting liquid, will
Crystalline silicon ingot is once cut into several sections simultaneously.In this course, the cutting liquid for being sprayed to cutting parts only accounts for always spraying
About 20% ratio of amount, in other words, the practical cutting liquid sprayed about 80% of cutting liquid automatic spraying device is all
It is wasted, and the cutting liquid that this part is wasted is not easily recycled, and is unfavorable for reducing processing cost;Furthermore due to high speed
The cutting line of operation is a superfine cutting gap workpiece wound cutting formation, it is ensured that above-mentioned cutting liquid automatic spraying dress
The cutting liquid sprayed is set fully to fall into the gap nor easy thing, so in practical cutting process, when have on cutting line
The case where cutting liquid is cut is not carried, and then is unfavorable for guaranteeing the cutting quality of workpiece.So traditional silicon crystal
Wire-electrode cutting device there is also the bad problem of cutting efficiency, the actually current urgent problem to be solved of the dealer of related fields.
Summary of the invention
The present invention solves the technical problem of: it is asked for traditional silicon crystal wire-electrode cutting device cutting efficiency is bad
Topic, provides a kind of silicon crystal wire-electrode cutting device.
In order to solve the above-mentioned technical problem, the technical scheme adopted by the invention is that:
A kind of silicon crystal wire-electrode cutting device, including cable directive wheel 1, the fixed device 2 of silicon crystal, fluid reservoir 3, spray tank 4,
Diversion trench 5 cuts cable 6, spray equipment 7, nozzle 8;
1 edge of the cable directive wheel connection cutting cable 6;The fixed device 2 of the silicon crystal and the setting of spray equipment 7 exist
Above device;The spray equipment 7 is by fluid reservoir 3, spray tank 4 and diversion trench 5;Fluid reservoir 3 is set above the diversion trench 5;
Spray tank 4 is arranged in 5 lower end of diversion trench;Nozzle 8 is set in the spray tank 4.
The cable directive wheel 1 is diagonally there are four settings.
The cable directive wheel 1 is provided with guiding groove with cutting 6 contact position of cable.
Cutting liquid is provided in the fluid reservoir 3;The cutting liquid be by following parts by weight raw material configuration and
At: 30~40 parts of polyethylene glycol, 8~10 parts of ethylene glycol amines, 10~20 parts of polyvinyl alcohol liquid, 3~5 parts of Bacillus pasteuriis, 10
~20 parts of silicon carbide, 3~5 parts of glucose solutions, 3~5 parts of glycerol, 3~5 parts of ethylene glycol, 3~5 parts of urea, 3~5 parts of calcium nitrate
Solution, 3~5 parts of lauryl sodium sulfate, 3~5 parts of sodium citrates, 3~5 parts of papermaking black wash.
Removable baffle is set below the fluid reservoir 3.
It is low that the diversion trench 5 is set as intermediate high both ends.
The cutting cable 6 is made of stainless steel;The stainless steel be Stainless steel 316, stainless steel 304, stainless steel 304,
Any one in stainless steel 201 or stainless steel 200.
8 aperture of nozzle is 0.4~0.5mm.
The beneficial effects of the present invention are:
(1) technical solution of the present invention firstly, silicon crystal is placed in the fixed device of silicon crystal, is then beaten in use
The removable baffle below fluid reservoir is opened, cutting liquid enters spray tank from diversion trench, then is sprayed by spray tank nozzle, cutting liquid spray
It is coated in steel wire surface, then controls cable directive wheel quick rotation, then open by the transmission control cutting cable of cable directive wheel
Begin to cut work, since the silicon-carbide particle hardness on cutting cable is greater than the hardness of silicon wafer, the carbonization on cutting cable surface
Silicon and silicon wafer friction cuttings, to improve the working efficiency of device;
(2) present invention by cutting liquid add polyvinyl alcohol liquid, during the preparation process, polyvinyl alcohol can in system
Calcium ion occur it is coordination cross-linked, formed gel network be dispersed in system, using so that silicon-carbide particle is good
Cheng Zhong, gel network carry silicon-carbide particle and are attached to steel wire surface, increase silicon-carbide particle and silicon crystal contact frictional resistance,
Further improve the cutting efficiency of device.
Detailed description of the invention
Fig. 1 is silicon crystal wire-electrode cutting device main view of the present invention;
Fig. 2 is silicon crystal wire-electrode cutting device side view of the present invention;
Fig. 3 is silicon crystal wire-electrode cutting device spray tank detail view of the present invention.
Wherein, 1, cable directive wheel;2, the fixed device of silicon crystal;3, fluid reservoir;4, spray tank;5 diversion trenches;6, net is cut
Line;7, spray equipment;8, nozzle.
Specific embodiment
A kind of silicon crystal wire-electrode cutting device, including cable directive wheel 1, the fixed device 2 of silicon crystal, fluid reservoir 3, spray tank 4,
Diversion trench 5 cuts cable 6, spray equipment 7, nozzle 8;1 edge of the cable directive wheel connection cutting cable 6;The silicon crystal
Fixed device 2 and spray equipment 7 are arranged above device;The spray equipment 7 is by fluid reservoir 3, spray tank 4 and diversion trench 5;Institute
State setting fluid reservoir 3 above diversion trench 5;Spray tank 4 is arranged in 5 lower end of diversion trench;Nozzle 8 is set in the spray tank 4;This
When invention work, firstly, polyvinyl alcohol and water 1:50~1:100 in mass ratio are placed in No. 1 beaker, with glass bar stirring 10~
No. 1 beaker after then standing 3~4h of swelling, is placed in digital display and tested the speed in constant temperature blender with magnetic force by 20min, in temperature be 60~
80 DEG C, under the conditions of revolving speed is 300~500r/min, heating stirring mixes 40~60min, obtains polyvinyl alcohol liquid, in parts by weight
Meter, by 30~40 parts of polyethylene glycol, 8~10 parts of ethylene glycol amines, 10~20 parts of polyvinyl alcohol liquid, 3~5 parts of Bacillus pasteuriis,
10~20 parts of silicon carbide, 3~5 parts of glucose solutions, 3~5 parts of glycerol, 3~5 parts of ethylene glycol, 3~5 parts of urea, 3~5 parts of quality
The calcium nitrate solution that score is 8~10%, 3~5 parts of lauryl sodium sulfate, 3~5 parts of sodium citrates, 3~5 parts of papermaking black wash are set
In No. 2 beakers, under the conditions of revolving speed is 300~500r/min, it is stirred 30~50min, obtains cutting liquid, then by silicon wafer
Body is placed in the fixed device 2 of silicon crystal, then turns on the removable baffle of 3 lower section of fluid reservoir, and cutting liquid enters from diversion trench 5 to be sprayed
Tank 4, then sprayed by 4 nozzle of spray tank, cutting liquid is sprayed on steel wire surface, then controls 1 quick rotation of cable directive wheel, then
Start to cut work by the transmission of cable directive wheel control cutting cable 6, after the completion of task to be cut, stops cable directive wheel
After running, the removable baffle of 3 lower section of fluid reservoir, i.e. completion cutting operation are closed.The cable directive wheel 1 is diagonally provided with four
It is a.The cable directive wheel 1 is provided with guiding groove with cutting 6 contact position of cable.It is arranged below the fluid reservoir 3 removable
Baffle.It is low that the diversion trench 5 is set as intermediate high both ends.The cutting cable 6 is made of stainless steel.The stainless steel is stainless
Any one in steel 316, stainless steel 304, stainless steel 304, stainless steel 201 or stainless steel 200.8 aperture of nozzle is 0.4
~0.5mm.
Claims (8)
1. a kind of silicon crystal wire-electrode cutting device, it is characterised in that: including cable directive wheel (1), silicon crystal is fixed device (2), storage
Flow container (3), spray tank (4), diversion trench (5) are cut cable (6), spray equipment (7), nozzle (8);
Cable directive wheel (1) edge connection cutting cable (6);The silicon crystal fixed device (2) and spray equipment (7) are set
It sets above device;The spray equipment (7) is by fluid reservoir (3), spray tank (4) and diversion trench (5);On the diversion trench (5)
Side's setting fluid reservoir (3);Spray tank (4) are arranged in diversion trench (5) lower end;Nozzle (8) are set in the spray tank (4).
2. a kind of silicon crystal wire-electrode cutting device according to claim 1, it is characterised in that: the cable directive wheel (1) is diagonal
There are four settings.
3. a kind of silicon crystal wire-electrode cutting device according to claim 1, it is characterised in that: the cable directive wheel (1) with cut
It cuts cable (6) contact position and is provided with guiding groove.
4. a kind of silicon crystal wire-electrode cutting device according to claim 1, it is characterised in that: set in the fluid reservoir (3)
It is equipped with cutting liquid.
5. a kind of silicon crystal wire-electrode cutting device according to claim 1, it is characterised in that: setting below the fluid reservoir (3)
Removable baffle.
6. a kind of silicon crystal wire-electrode cutting device according to claim 1, it is characterised in that: during the diversion trench (5) is set as
Between high both ends it is low.
7. a kind of silicon crystal wire-electrode cutting device according to claim 1, it is characterised in that: the cutting cable (6) is by stainless
Steel is made;The stainless steel is Stainless steel 316, stainless steel 304, and stainless steel 304 is any in stainless steel 201 or stainless steel 200
It is a kind of.
8. a kind of silicon crystal wire-electrode cutting device according to claim 1, it is characterised in that: nozzle (8) aperture be 0.4~
0.5mm。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820569937.4U CN208543660U (en) | 2018-04-20 | 2018-04-20 | A kind of silicon crystal wire-electrode cutting device |
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CN201820569937.4U CN208543660U (en) | 2018-04-20 | 2018-04-20 | A kind of silicon crystal wire-electrode cutting device |
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CN208543660U true CN208543660U (en) | 2019-02-26 |
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CN201820569937.4U Expired - Fee Related CN208543660U (en) | 2018-04-20 | 2018-04-20 | A kind of silicon crystal wire-electrode cutting device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110370442A (en) * | 2019-08-08 | 2019-10-25 | 张志磊 | A kind of uniform discharge and the silicon carbide charging device with recycling and reusing function |
-
2018
- 2018-04-20 CN CN201820569937.4U patent/CN208543660U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110370442A (en) * | 2019-08-08 | 2019-10-25 | 张志磊 | A kind of uniform discharge and the silicon carbide charging device with recycling and reusing function |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190625 Address after: 225300 Ma Chuan Road, Gaogang District, Taizhou City, Jiangsu Province Patentee after: TAIZHOU YINHONG MACHINERY EQUIPMENT Co.,Ltd. Address before: 213000 room 2-2208, Wanda Plaza, Xinbei District, Changzhou, Jiangsu Patentee before: CHANGZHOU LANSEN ENVIRONMENTAL PROTECTION EQUIPMENT Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190226 |