CN208521957U - A kind of anti-vulcanization LED lamp bead - Google Patents
A kind of anti-vulcanization LED lamp bead Download PDFInfo
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- CN208521957U CN208521957U CN201821123544.7U CN201821123544U CN208521957U CN 208521957 U CN208521957 U CN 208521957U CN 201821123544 U CN201821123544 U CN 201821123544U CN 208521957 U CN208521957 U CN 208521957U
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Abstract
The utility model discloses a kind of anti-vulcanization LED lamp bead, including LED support, LED chip, bonding gold thread, silicon nitride film, fluorescent adhesive layer；LED chip is installed, LED chip upper surface electrode is connected to LED support inner surface by being bonded gold thread in the LED support；LED support inner surface, LED chip outer surface are covered with silicon nitride film, are provided with fluorescent adhesive layer above silicon nitride film, fluorescent adhesive layer upper surface is flushed with LED support upper surface；The LED support includes plastic cement cofferdam, positive electrode substrate, negative electrode substrate, positive and negative anodes insulative bridge, is provided with positive electrode substrate, negative electrode substrate below the plastic cement cofferdam, is connected between positive electrode substrate, negative electrode substrate by positive and negative anodes insulative bridge.The utility model has the characteristics that low toxicity, anti-sulphur, environmental protection.
Description
Technical field
It is especially a kind of with low toxicity, anti-sulphur, environmentally friendly anti-vulcanization the utility model relates to a kind of anti-vulcanization LED lamp bead
LED lamp bead.
Background technique
LED lamp bead is exactly the english abbreviation abbreviation LED of light emitting diode, this is a popular address, and LED full name is half
Conductor light emitting diode, using made of semiconductor material, directly to convert electrical energy into luminous energy, electricity number is converted into optical signal
Luminescent device；Its main feature is that the advantages that low in energy consumption, high brightness, beautiful in colour, anti-vibration, service life length, cold light source, be real
" green illumination ".It is the lamp decoration product of new light sources in the future of 21 century using LED, necessarily replaces incandescent lamp, becomes mankind's illumination
Again revolution.The LED lamp bead of new light sources semiconductor be widely used in lamp ornaments lighting, LED large screen display, traffic lights, decoration,
Many production fields such as computer, electronic toy gift, interchanger, telephone set, advertisement, city brilliance engineering.
LED light is completely encapsulated in inside epoxy resin, it is all more firmer than traditional light bulb and fluorescent tube,
The part also not loosened in lamp body, these features make LED can be described as being hardly damaged, and the high energy conservation of LED light, become
The lamp bead type being most widely used at present.
The anti-sulphur ability of current LED lamp bead structure is poor, usually causes due to occurring vulcanizing in production, in the course of work
The phenomenon that LED lamp bead is scrapped；Conventional anti-sulphur method is covered on upper surface in storage glue bowl medial surface, the LED chip of LED support
Anti- vulcanization liquid is covered, anti-vulcanization liquid has strong volatility and toxicity, is easy that LED lamp bead producers is made to be poisoned.
Utility model content
The purpose of this utility model is to provide a kind of with low toxicity, anti-sulphur, environmentally friendly anti-vulcanization LED lamp bead.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of anti-vulcanization LED lamp bead, including LED support, LED chip, bonding gold thread, silicon nitride film, fluorescent adhesive layer；
LED chip is installed, LED chip upper surface electrode is connected to LED support by being bonded gold thread in the LED support
Inner surface；LED support inner surface, LED chip outer surface are covered with silicon nitride film, are provided with fluorescent glue above silicon nitride film
Layer, fluorescent adhesive layer upper surface is flushed with LED support upper surface；
The LED support includes plastic cement cofferdam, positive electrode substrate, negative electrode substrate, positive and negative anodes insulative bridge, under the plastic cement cofferdam
Side is provided with positive electrode substrate, negative electrode substrate, is connected between positive electrode substrate, negative electrode substrate by positive and negative anodes insulative bridge；
The cross sectional shape in the plastic cement cofferdam is that river mentions shape, and plastic cement cofferdam is in positive electrode substrate, negative electrode substrate, positive and negative anodes insulation
Bridge top surface edge surrounds storage glue bowl, installs LED on the positive electrode substrate, negative electrode substrate, positive and negative anodes insulative bridge in storage glue bowl
After chip, LED lamp bead is formed；Plastic cement cofferdam inner surface is reflective layer, and the light that LED lamp bead issues is through plastic cement cofferdam medial surface
After reflection, from plastic cement cofferdam injection LED lamp bead suitable for reading；
The LED chip is by the hydropexis of die bond heat-conducting glue above negative electrode substrate；LED chip upper surface is provided with P electricity
Pole, N electrode；Bonding gold thread is welded in P electrode, the other end of the bonding gold thread is welded on positive electrode substrate；It is welded in N electrode
There is bonding gold thread, the other end of the bonding gold thread is welded on negative electrode substrate；
The silicon nitride film is covered on the storage glue bowl medial surface of LED support, LED chip upper surface.
The utility model provides a kind of anti-vulcanization LED lamp bead, has the characteristics that low toxicity, anti-sulphur, environmental protection.The utility model
The utility model has the advantages that silicon nitride film is covered in the storage glue bowl of LED support by PECVD plasma reinforced chemical vapour deposition
Side, LED chip upper surface；Silicon nitride film is dense protective layer, is prevented from the element sulphur entered in fluorescent adhesive layer in air
With storage glue bowl bottom positive electrode substrate upper surface, negative electrode substrate upper surface contact, the element sulphur in air with sulfur oxide,
The form of the hydride of sulphur enters fluorescent adhesive layer；Element sulphur and the patina object of positive electrode substrate upper surface, negative electrode substrate upper surface are anti-
Photosphere reaction generates silver sulfide, and the color of silver sulfide is black, the silver sulfide reflecting power of black far away from patina object reflective layer,
LED lamp bead bottom is caused to black, LED lamp bead goes out light decrease, and light is uneven out；Conventional anti-sulphur method is in LED support
Anti- vulcanization liquid is covered on storage glue bowl medial surface, LED chip upper surface, anti-vulcanization liquid has strong volatility and toxicity, is easy to make
LED lamp bead producers poisoning；And silicon nitride film is that storage glue bowl is covered on by PECVD plasma reinforced chemical vapour deposition
On cup medial surface, LED chip upper surface, production process low toxicity, environmental protection.
Detailed description of the invention
In order to facilitate the understanding of those skilled in the art, the utility model will be further described below with reference to the accompanying drawings.
Fig. 1 is a kind of side cross-sectional view of anti-vulcanization LED lamp bead of the utility model；
Fig. 2 is a kind of side cross-sectional view of anti-vulcanization LED lamp bead of the utility model.
Specific embodiment
The purpose of this utility model can be achieved through the following technical solutions:
A kind of anti-vulcanization LED lamp bead is thin referring to Fig. 1-2, including LED support 1, LED chip 2, bonding gold thread 3, silicon nitride
Film 4, fluorescent adhesive layer 5；
LED chip 2 is installed, 2 upper surface electrode of LED chip is connected to LED by being bonded gold thread 3 in the LED support 1
1 inner surface of bracket；1 inner surface of LED support, 2 outer surface of LED chip are covered with silicon nitride film 4, set above silicon nitride film 4
It is equipped with fluorescent adhesive layer 5,5 upper surface of fluorescent adhesive layer is flushed with 1 upper surface of LED support；
The LED support 1 includes plastic cement cofferdam 11, positive electrode substrate 12, negative electrode substrate 13, positive and negative anodes insulative bridge 14, described
It is provided with positive electrode substrate 12, negative electrode substrate 13 below plastic cement cofferdam 11, passes through positive and negative anodes between positive electrode substrate 12, negative electrode substrate 13
Insulative bridge 14 connects；
The cross sectional shape in the plastic cement cofferdam 11 is that river mentions shape, and plastic cement cofferdam 11 is in positive electrode substrate 12, negative electrode substrate 13, just
14 top surface edge of negative insulation bridge surrounds storage glue bowl, and positive electrode substrate 12, negative electrode substrate 13, the positive and negative anodes stored up in glue bowl are exhausted
After LED chip is installed on edge bridge 14, LED lamp bead is formed；11 inner surface of plastic cement cofferdam is reflective layer, what LED lamp bead issued
Light is after the reflection of 11 medial surface of plastic cement cofferdam, from the injection LED lamp bead suitable for reading of plastic cement cofferdam 11；
The LED chip 2 is by the hydropexis of die bond heat-conducting glue above negative electrode substrate 13；2 upper surface of LED chip is provided with
P electrode, N electrode；Bonding gold thread 3 is welded in P electrode, the other end of the bonding gold thread 3 is welded on positive electrode substrate 12；N electricity
Bonding gold thread 3 is welded on extremely, the other end of the bonding gold thread 3 is welded on negative electrode substrate 13；
The silicon nitride film 4 is covered on the storage glue bowl medial surface of LED support, 2 upper surface of LED chip, and silicon nitride is thin
Film 4 is covered on the storage glue bowl medial surface of LED support by PECVD plasma reinforced chemical vapour deposition, table on LED chip 2
Face；Silicon nitride film 4 is dense protective layer, is prevented from the element sulphur and storage glue bowl bottom entered in fluorescent adhesive layer 5 in air
12 upper surface of positive electrode substrate, the contact of 13 upper surface of negative electrode substrate, the element sulphur in air is with sulfur oxide, the hydride of sulphur
Form enter fluorescent adhesive layer 5；Element sulphur and the patina object reflective layer of 12 upper surface of positive electrode substrate, 13 upper surface of negative electrode substrate are anti-
Silver sulfide should be generated, the color of silver sulfide is black, and the silver sulfide reflecting power of black is caused far away from patina object reflective layer
LED lamp bead bottom blacks, and LED lamp bead goes out light decrease, and light is uneven out；Conventional anti-sulphur method is the storage glue in LED support
Anti- vulcanization liquid is covered on bowl medial surface, 2 upper surface of LED chip, anti-vulcanization liquid has strong volatility and toxicity, is easy to make LED
Lamp bead producers poisoning；And silicon nitride film 4 is that storage glue bowl is covered on by PECVD plasma reinforced chemical vapour deposition
On medial surface, 2 upper surface of LED chip, production process low toxicity, environmental protection.
Working principle of the utility model is:
The utility model passes through bonding gold by being equipped with LED chip 2,2 upper surface electrode of LED chip in LED support 1
Line 3 is connected to 1 inner surface of LED support；1 inner surface of LED support, 2 outer surface of LED chip are covered with silicon nitride film 4, silicon nitride
Fluorescent adhesive layer 5 is provided with above film 4,5 upper surface of fluorescent adhesive layer is flushed with 1 upper surface of LED support；
Silicon nitride film 4 is covered on the inside of the storage glue bowl of LED support by PECVD plasma reinforced chemical vapour deposition
Face, 2 upper surface of LED chip；Silicon nitride film 4 is dense protective layer, is prevented from the element sulphur entered in fluorescent adhesive layer 5 in air
It is contacted with 12 upper surface of positive electrode substrate, 13 upper surface of negative electrode substrate of storage glue bowl bottom, the element sulphur in air is with the oxygen of sulphur
Compound, the form of hydride of sulphur enter fluorescent adhesive layer 5；Element sulphur and 12 upper surface of positive electrode substrate, 13 upper surface of negative electrode substrate
The reaction of patina object reflective layer generate silver sulfide, the color of silver sulfide is black, and the silver sulfide reflecting power of black is far away from silver
Compound reflective layer causes LED lamp bead bottom to black, and LED lamp bead goes out light decrease, and light is uneven out；Conventional anti-sulphur method is
Cover anti-vulcanization liquid on the storage glue bowl medial surface of LED support, 2 upper surface of LED chip, anti-vulcanization liquid have strong volatility and
Toxicity is easy that LED lamp bead producers is made to be poisoned；And silicon nitride film 4 is by PECVD plasma reinforced chemical vapour deposition
It is covered on storage glue bowl medial surface, on 2 upper surface of LED chip, production process low toxicity, environmental protection.
The utility model provides a kind of anti-vulcanization LED lamp bead, has the characteristics that low toxicity, anti-sulphur, environmental protection.The utility model
The utility model has the advantages that silicon nitride film is covered in the storage glue bowl of LED support by PECVD plasma reinforced chemical vapour deposition
Side, LED chip upper surface；Silicon nitride film is dense protective layer, is prevented from the element sulphur entered in fluorescent adhesive layer in air
With storage glue bowl bottom positive electrode substrate upper surface, negative electrode substrate upper surface contact, the element sulphur in air with sulfur oxide,
The form of the hydride of sulphur enters fluorescent adhesive layer；Element sulphur and the patina object of positive electrode substrate upper surface, negative electrode substrate upper surface are anti-
Photosphere reaction generates silver sulfide, and the color of silver sulfide is black, the silver sulfide reflecting power of black far away from patina object reflective layer,
LED lamp bead bottom is caused to black, LED lamp bead goes out light decrease, and light is uneven out；Conventional anti-sulphur method is in LED support
Anti- vulcanization liquid is covered on storage glue bowl medial surface, LED chip upper surface, anti-vulcanization liquid has strong volatility and toxicity, is easy to make
LED lamp bead producers poisoning；And silicon nitride film is that storage glue bowl is covered on by PECVD plasma reinforced chemical vapour deposition
On cup medial surface, LED chip upper surface, production process low toxicity, environmental protection.
Above content is only to the utility model structure example and explanation, the technology people of affiliated the art
Member makes various modifications or additions to the described embodiments or is substituted in a similar manner, without departing from reality
With novel structure or beyond the scope defined by this claim, all should belong to the protection range of the utility model.
Claims (2)
1. a kind of anti-vulcanization LED lamp bead, including LED support (1), LED chip (2), bonding gold thread (3), silicon nitride film (4),
Fluorescent adhesive layer (5), it is characterised in that:
It is equipped with LED chip (2) in the LED support (1), LED chip (2) upper surface electrode passes through bonding gold thread (3) connection
To LED support (1) inner surface；LED support (1) inner surface, LED chip (2) outer surface are covered with silicon nitride film (4), nitridation
It is provided with fluorescent adhesive layer (5) above silicon thin film (4), fluorescent adhesive layer (5) upper surface is flushed with LED support (1) upper surface；It is described
LED support (1) includes plastic cement cofferdam (11), positive electrode substrate (12), negative electrode substrate (13), positive and negative anodes insulative bridge (14), the modeling
It is provided with positive electrode substrate (12), negative electrode substrate (13) below glue cofferdam (11), is led between positive electrode substrate (12), negative electrode substrate (13)
Cross positive and negative anodes insulative bridge (14) connection；The cross sectional shape of the plastic cement cofferdam (11) is that river mentions shape, and plastic cement cofferdam (11) are in anode
Substrate (12), negative electrode substrate (13), positive and negative anodes insulative bridge (14) top surface edge surround storage glue bowl, store up the anode in glue bowl
Substrate (12), negative electrode substrate (13) after installing LED chip in positive and negative anodes insulative bridge (14), form LED lamp bead；The plastic cement encloses
Weir (11) inner surface is reflective layer, and the light that LED lamp bead issues is after the reflection of plastic cement cofferdam (11) medial surface, from plastic cement cofferdam (11)
Injection LED lamp bead suitable for reading；The LED chip (2) is by the hydropexis of die bond heat-conducting glue above negative electrode substrate (13)；LED core
Piece (2) upper surface is provided with P electrode, N electrode；Bonding gold thread (3), the other end weldering of the bonding gold thread (3) are welded in P electrode
It is connected on positive electrode substrate (12)；Bonding gold thread (3) is welded in N electrode, the other end of the bonding gold thread (3) is welded to cathode base
On plate (13).
2. a kind of anti-vulcanization LED lamp bead according to claim 1, which is characterized in that the silicon nitride film (4) is covered on
The storage glue bowl medial surface of LED support, LED chip (2) upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821123544.7U CN208521957U (en) | 2018-07-16 | 2018-07-16 | A kind of anti-vulcanization LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821123544.7U CN208521957U (en) | 2018-07-16 | 2018-07-16 | A kind of anti-vulcanization LED lamp bead |
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| Publication Number | Publication Date |
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| CN208521957U true CN208521957U (en) | 2019-02-19 |
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ID=65335731
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821123544.7U Active CN208521957U (en) | 2018-07-16 | 2018-07-16 | A kind of anti-vulcanization LED lamp bead |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111739991A (en) * | 2020-07-08 | 2020-10-02 | 江苏科慧半导体研究院有限公司 | Water-proof sulfur-releasing light-emitting device |
| CN117594716A (en) * | 2024-01-17 | 2024-02-23 | 深圳市中顺半导体照明有限公司 | Coating film anti-vulcanization treatment method, coating film anti-vulcanization equipment and storage medium |
-
2018
- 2018-07-16 CN CN201821123544.7U patent/CN208521957U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111739991A (en) * | 2020-07-08 | 2020-10-02 | 江苏科慧半导体研究院有限公司 | Water-proof sulfur-releasing light-emitting device |
| CN117594716A (en) * | 2024-01-17 | 2024-02-23 | 深圳市中顺半导体照明有限公司 | Coating film anti-vulcanization treatment method, coating film anti-vulcanization equipment and storage medium |
| CN117594716B (en) * | 2024-01-17 | 2024-04-26 | 深圳市中顺半导体照明有限公司 | Coating film anti-vulcanization treatment method, coating film anti-vulcanization equipment and storage medium |
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