CN208462145U - A kind of printed circuit board - Google Patents
A kind of printed circuit board Download PDFInfo
- Publication number
- CN208462145U CN208462145U CN201821237469.7U CN201821237469U CN208462145U CN 208462145 U CN208462145 U CN 208462145U CN 201821237469 U CN201821237469 U CN 201821237469U CN 208462145 U CN208462145 U CN 208462145U
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- CN
- China
- Prior art keywords
- circuit board
- welding piece
- printed circuit
- board body
- bonding point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to welding technology field more particularly to a kind of printed circuit boards based on Wire Bonding Technology, including circuit board body and welding piece；The material of the welding piece is copper, and the one side of the welding piece is welded and fixed with circuit board body and is electrically connected with the conductive layer being arranged in inside circuit board body, and the opposite another side surface of the one side of the welding piece is silver coated.The component using Wire Bonding Technology will be needed to be welded on the silver layer, Wire Bonding Technology is applied on printed circuit board to realize, promotes the development of Wire Bonding Technology.
Description
Technical field
The utility model relates to welding technology field more particularly to a kind of printed circuit boards based on Wire Bonding Technology.
Background technique
FR4 circuit board has at low cost at present, can quickly produce, and can do the advantages such as multilayer cabling, in major electricity
Subdomains are widely used, however Wire Bonding Technology (as Wire Bonding) can only be welded on high silver-plated of density
On ceramic pcb board or on the silver-plated part of metal, it can not be directly welded on FR4 circuit board, greatly limit wire bonding
The development of technology.
Utility model content
In order to overcome the defects of the prior art described above, the technical problem to be solved by the utility model is to provide a kind of printings
Wire Bonding Technology can be applied on FR4 circuit board, promote the development of Wire Bonding Technology by circuit board.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model are as follows:
A kind of printed circuit board, including circuit board body and welding piece；The material of the welding piece is copper, the welding piece
One side be welded and fixed with circuit board body and be electrically connected with the conductive layer being arranged in inside circuit board body, the welding piece
One side it is opposite another side surface it is silver coated.
Further, the welding piece with a thickness of 0.5mm, the silver layer with a thickness of 0.05mm-0.1mm.
Further, the silver layer surface is equipped with more than two arranged side by side bonding points, between two neighboring bonding point
Spacing be 0.08mm-0.1mm.
Further, the bonding point is groove, and the cross-sectional profiles of the groove are ellipse, the groove depth of the groove
It is gradually increased from one end corresponding to oval long axis to the other end.
Further, the spacing at the bonding point another side edge opposite with the one side of welding piece is 2mm-3mm.
The utility model has the beneficial effects that:
A kind of printed circuit board provided by the utility model, specifically adding material on the basis of common printed circuit board is
The welding piece of copper, one side and the circuit board body of the welding piece be welded and fixed and with leading inside circuit board body is set
Electric layer electrical connection, the opposite another side surface of the one side of the welding piece is silver coated, will need using wire bonding skill
The component of art is welded on the silver layer, and Wire Bonding Technology is applied on printed circuit board to realize, promotes lead key
The development of conjunction technology.
Detailed description of the invention
Fig. 1 show a kind of cross-sectional view of printed circuit board of the utility model；
Fig. 2 show a kind of top view of printed circuit board of the utility model；
Label declaration:
1, circuit board body；11, conductive layer；
2, welding piece；21, silver layer；211, bonding point.
Specific embodiment
For technology contents, the objects and the effects that the utility model is described in detail, below in conjunction with embodiment and match
Attached drawing is closed to be explained.
The design of the utility model most critical is: add material be copper welding piece, the one side of the welding piece with
Conductive layer electrical connection inside circuit board body is set, and another side surface is silver coated, will need using wire bonding skill
The component of art is welded on the silver layer.
It please refers to shown in Fig. 1-2, a kind of printed circuit board of the utility model, including circuit board body and welding piece；Institute
The material for stating welding piece is copper, and the one side and circuit board body of the welding piece are welded and fixed and with setting in circuit board body
Internal conductive layer electrical connection, the opposite another side surface of the one side of the welding piece are silver coated.
As can be seen from the above description, the utility model has the beneficial effects that: a kind of printed circuit provided by the utility model
Plate specifically adds the welding piece that material is copper, the one side and circuit of the welding piece on the basis of common printed circuit board
Plate ontology is welded and fixed and is electrically connected with the conductive layer being arranged in inside circuit board body, and the one side of the welding piece is opposite
Another side surface is silver coated, and the component using Wire Bonding Technology will be needed to be welded on the silver layer, thus realize by
Wire Bonding Technology is applied on printed circuit board, promotes the development of Wire Bonding Technology.
It should be understood that wire bonging is aluminum steel, must surface degree require and hardness it is higher
Bonging is carried out in plane, but the common material circuit board surface of FR4 sprays tin, cannot directly use the wire bonging work of aluminium
Skill, if circuit board is made into the high gilding of surface requirements, entire cost will be substantially increased, so in commonly spray tin circuit
Increasing welding piece provided by the utility model on plate to carry out wire bonging is great prospect.
Further, the welding piece with a thickness of 0.5mm, the silver layer with a thickness of 0.05mm-0.1mm.
As can be seen from the above description, can satisfy the need of hardness and wire bonging technique according to above-mentioned size design
It asks.
Further, the silver layer surface is equipped with more than two arranged side by side bonding points, between two neighboring bonding point
Spacing be 0.08mm-0.1mm.
As can be seen from the above description, according to above-mentioned bonding point design, it is sufficient to meet the needs of wire bonging technique.It is adjacent
Spacing between two bonding points is 0.08mm-0.1mm, under the requirement for meeting electric property, greatly reduces footprint area.
Further, the bonding point is groove, and the cross-sectional profiles of the groove are ellipse, the groove depth of the groove
It is gradually increased from one end corresponding to oval long axis to the other end.
As can be seen from the above description, according to the concrete structure design of above-mentioned bonding point, in wire bonging technical process,
It is as the first bonding point, and oval long axis direction and the component in wire bonging technique are perpendicular, and are bonded
One end to the other end corresponding to the certainly oval long axis of the groove depth of point is gradually increased, and bracket groove is deeper, and further away from component, slot is got over
Shallowly, closer to component, it is stronger that slot shallowly locates corresponding side wall hardness, conducive to the electric stability of wire bonging technique.
Further, the spacing at the bonding point another side edge opposite with the one side of welding piece is 2mm-3mm.
Under the requirement for meeting electric property, footprint area is greatly reduced.
It please refers to shown in Fig. 1-2, the embodiments of the present invention one are as follows:
A kind of printed circuit board of the utility model, including circuit board body 1 and welding piece 2；The material of the welding piece 2
For copper, the one side and circuit board body of the welding piece 2 be welded and fixed and with the conductive layer that is arranged in inside circuit board body
11 electrical connections, the opposite another side surface silver coated 21 of the one side of the welding piece 2.
Wherein, the welding piece with a thickness of 0.5mm, length 6mm, width 4mm, the silver layer with a thickness of
0.05mm-0.1mm, preferably 0.8mm.According to above-mentioned size design, hardness and wire bonging technique can satisfy
Demand.When the thickness of the silver layer uses 0.8mm, effect is best.
21 surface of silver layer is equipped with more than two arranged side by side bonding points 211, between two neighboring bonding point between
Away from for 0.08mm-0.1mm, preferably 0.1mm.According to above-mentioned bonding point design, it is sufficient to meet the need of wire bonging technique
It asks.Under the requirement for meeting electric property, footprint area is greatly reduced.
The bonding point 211 is groove, and the cross-sectional profiles of the groove are ellipse, and the groove depth of the groove is certainly oval
One end corresponding to shape long axis to the other end is gradually increased.The bonding point another side side opposite with the one side of welding piece
The spacing on edge is 2mm-3mm, and practical is 3mm.According to the concrete structure design of above-mentioned bonding point, in wire bonging technique mistake
Cheng Zhong, as the first bonding point, and oval long axis direction and the component in wire bonging technique are perpendicular, and
One end to the other end corresponding to the certainly oval long axis of the groove depth of bonding point is gradually increased, and bracket groove is deeper, further away from component, slot
More shallow, closer to component, it is stronger that slot shallowly locates corresponding side wall hardness, conducive to the electric stability of wire bonging technique.
In conclusion a kind of printed circuit board provided by the utility model, specifically on the basis of common printed circuit board
The welding piece that material is copper is added, the one side and circuit board body of the welding piece are welded and fixed and with setting in circuit board sheet
The conductive layer electrical connection in internal portion, the opposite another side surface of the one side of the welding piece is silver coated, will need to use
The component of Wire Bonding Technology is welded on the silver layer, and Wire Bonding Technology is applied on printed circuit board to realize,
Promote the development of Wire Bonding Technology.
The above description is only the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all
Equivalents made based on the specification and figures of the utility model are applied directly or indirectly in relevant technology neck
Domain is also included in the patent protection scope of the utility model.
Claims (5)
1. a kind of printed circuit board, which is characterized in that including circuit board body and welding piece；The material of the welding piece is copper,
The one side of the welding piece is welded and fixed with circuit board body and is electrically connected with the conductive layer being arranged in inside circuit board body,
The opposite another side surface of the one side of the welding piece is silver coated.
2. printed circuit board according to claim 1, which is characterized in that the welding piece with a thickness of 0.5mm, the silver
Layer with a thickness of 0.05mm-0.1mm.
3. printed circuit board according to claim 1, which is characterized in that the silver layer surface is equipped with two or more and sets side by side
The bonding point set, the spacing between two neighboring bonding point are 0.08mm-0.1mm.
4. printed circuit board according to claim 3, which is characterized in that the bonding point is groove, the cross of the groove
Cross section profile is ellipse, and one end to the other end corresponding to the certainly oval long axis of the groove depth of the groove is gradually increased.
5. printed circuit board according to claim 3, which is characterized in that the bonding point is opposite with the one side of welding piece
Another side edge spacing be 2mm-3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821237469.7U CN208462145U (en) | 2018-08-02 | 2018-08-02 | A kind of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821237469.7U CN208462145U (en) | 2018-08-02 | 2018-08-02 | A kind of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208462145U true CN208462145U (en) | 2019-02-01 |
Family
ID=65179080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821237469.7U Active CN208462145U (en) | 2018-08-02 | 2018-08-02 | A kind of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208462145U (en) |
-
2018
- 2018-08-02 CN CN201821237469.7U patent/CN208462145U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |