CN203288643U - Flexible substrate for light-emitting diode - Google Patents
Flexible substrate for light-emitting diode Download PDFInfo
- Publication number
- CN203288643U CN203288643U CN2013202619638U CN201320261963U CN203288643U CN 203288643 U CN203288643 U CN 203288643U CN 2013202619638 U CN2013202619638 U CN 2013202619638U CN 201320261963 U CN201320261963 U CN 201320261963U CN 203288643 U CN203288643 U CN 203288643U
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- China
- Prior art keywords
- emitting diode
- light
- base plate
- soft base
- outer portion
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a flexible substrate for a light-emitting diode. The flexible substrate for the light-emitting diode is of a sheet-shaped structure, and comprises an interface layer, a printed circuit layer arranged on the interface layer, an ink layer arranged on the printed circuit layer, and a metal layer arranged below the interface layer. With the adoption of the structure aforementioned, the flexible substrate for the light-emitting diode disclosed by the utility model is simple in structure, flexible, capable of being fixedly connected to an LED lamp panel with any shape in a matching manner according to the needs of users, and high in universality.
Description
Technical field
The utility model relates to LED mounting technique field, is specifically related to the light-emitting diode soft base plate.
Background technology
Traditional LED circuit connector that is used for fixed L ED is that thickness is copper coin or the aluminium sheet of 0.6mm-2mm, for solid shape can not be out of shape, can't be along with the form fit of LED lamp plate installed surface, and versatility is low.
The utility model content
The purpose of this utility model is to provide the light-emitting diode soft base plate, and having solved existing LED circuit connector is that solid shape can not be out of shape, the problem that versatility is low.
For achieving the above object, the utility model adopts following technical scheme:
The light-emitting diode soft base plate, described light-emitting diode soft base plate structure in the form of sheets, comprise interface layer, be located at layer printed circuit board on this interface layer, be located at the ink lay on this layer printed circuit board and be located at metal level under interface layer.
Further, described layer printed circuit board is the layer printed circuit board that copper or aluminum material are made.
Further, the thickness of described layer printed circuit board is 30 μ m～90 μ m.
Further, described metal level is the metal level that copper or aluminum material are made.
Further, described interface layer is the epoxy resin layer that heat-conducting effect is arranged.
Further, the structure of described light-emitting diode soft base plate for by rounded portions and the outer portion that is connected with this rounded portions, being formed; Outer portion is arranged around the outer rim of rounded portions, and is provided with opening; The center of circle of outer portion and the center of circle of rounded portions are staggeredly arranged.
Further, between the center of circle of the center of circle of described outer portion and described rounded portions at a distance of 3～7mm.
Further, the external diameter of described outer portion is 60～70mm, and the internal diameter of outer portion is 20～30mm, and the external diameter of described rounded portions is 15～20mm, between the center of circle of described outer portion and the center of circle of described rounded portions at a distance of 3～7mm.
Further, described rounded portions be connected outer portion and connect by the long connecting portion of 0～1mm.
Further, described rounded portions be connected outer portion and connect by connecting portion.
Compared with prior art, the beneficial effects of the utility model are as follows:
The utility model adopts above structure, and is simple in structure, has flexibility, can coordinate and be fixed on the LED lamp plate of arbitrary shape according to user's needs, and versatility is high.
Interface layer in the utility model embodiment is made by the epoxy resin with good heat conductive effect, therefore have good heat-conducting effect, its thermal conductivity is more than 1W/mk, and the thermal conductivity of traditional wiring board dielectric layer only has below 1W/mk.
Description of drawings
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, in below describing embodiment, the accompanying drawing of required use is briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the front elevational schematic of the utility model light-emitting diode soft base plate embodiment;
Fig. 2 is the generalized section of Fig. 1 along the X-X direction;
In figure, the 1-interface layer; The 2-layer printed circuit board; The 3-ink lay; The 4-metal level; The 5-rounded portions; The center of circle of 51-rounded portions; The 6-outer portion; The 61-opening; The center of circle of 62-outer portion.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.
Light-emitting diode soft base plate as shown in Fig. 1 and Fig. 2 embodiment, comprise interface layer 1, be located at layer printed circuit board 2 on this interface layer 1, be located at the ink lay 3 on this layer printed circuit board and be located at metal level 4 under interface layer 1.
Layer printed circuit board 2 is the layer printed circuit board that copper or aluminum material are made.The thickness of layer printed circuit board 2 is 30 μ m～90 μ m.Metal level 4 is the metal level that copper or aluminum material are made.Interface layer 1 is the epoxy resin layer that heat-conducting effect is arranged.
The structure of light-emitting diode soft base plate for by rounded portions 5 and the outer portion 6 that is connected with this rounded portions 5, being formed in the present embodiment; Outer portion 6 is arranged around the outer rim of rounded portions 5, and is provided with opening 61; The center of circle 62 of outer portion and the center of circle 51 of rounded portions are staggeredly arranged.Between the center of circle 62 of outer portion and the center of circle 51 of rounded portions, distance is L1, and this L1 meets 3mm≤L1≤7mm.Further, rounded portions be connected outer portion and connect by connecting portion.
In the present embodiment, L1 is 4.9mm.The external diameter R1 of outer portion meets 60mm≤R1≤75mm, preferred 66.7mm; The internal diameter R2 of outer portion meets 22mm≤R2≤30mm, preferred 25.0mm; The external diameter R3 of rounded portions meets 15mm≤R3≤20mm, preferred 19.5mm.The long L2 of connecting portion meets 0mm≤L2≤1mm, preferred 0.8mm.The angle A of opening 61 is 68 °.
Other structure of the present embodiment light-emitting diode soft base plate is referring to prior art.
The utility model is not limited to above-mentioned execution mode, if various changes of the present utility model or modification are not broken away from spirit and scope of the present utility model, if within these changes and modification belonged to claim of the present utility model and equivalent technologies scope, the utility model also was intended to comprise these changes and modification.
Claims (10)
1. light-emitting diode soft base plate is characterized in that: described light-emitting diode soft base plate structure in the form of sheets comprises interface layer, is located at layer printed circuit board on this interface layer, is located at the ink lay on this layer printed circuit board and is located at metal level under interface layer.
2. light-emitting diode soft base plate according to claim 1, it is characterized in that: described layer printed circuit board is the layer printed circuit board that copper or aluminum material are made.
3. light-emitting diode soft base plate according to claim 1, it is characterized in that: the thickness of described layer printed circuit board is 30 μ m～90 μ m.
4. light-emitting diode soft base plate according to claim 1, it is characterized in that: described metal level is the metal level that copper or aluminum material are made.
5. light-emitting diode soft base plate according to claim 1, it is characterized in that: described interface layer is the epoxy resin layer that heat-conducting effect is arranged.
6. the described light-emitting diode soft base plate of according to claim 1 to 5 any one, is characterized in that: the structure of described light-emitting diode soft base plate for rounded portions and the outer portion that is connected with this rounded portions, consisting of; Outer portion is arranged around the outer rim of rounded portions, and is provided with opening; The center of circle of outer portion and the center of circle of rounded portions are staggeredly arranged.
7. light-emitting diode soft base plate according to claim 6 is characterized in that: between the center of circle of described outer portion and the center of circle of described rounded portions at a distance of 3～7mm.
8. light-emitting diode soft base plate according to claim 6, it is characterized in that: the external diameter of described outer portion is 60～70mm, the internal diameter of outer portion is 20～30mm, and the external diameter of described rounded portions is 15～20mm, between the center of circle of described outer portion and the center of circle of described rounded portions at a distance of 3～7mm.
9. light-emitting diode soft base plate according to claim 8 is characterized in that: described rounded portions be connected outer portion and connect by the long connecting portion of 0～1mm.
10. light-emitting diode soft base plate according to claim 6 is characterized in that: described rounded portions be connected outer portion and connect by connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202619638U CN203288643U (en) | 2013-05-14 | 2013-05-14 | Flexible substrate for light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202619638U CN203288643U (en) | 2013-05-14 | 2013-05-14 | Flexible substrate for light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203288643U true CN203288643U (en) | 2013-11-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202619638U Expired - Fee Related CN203288643U (en) | 2013-05-14 | 2013-05-14 | Flexible substrate for light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203288643U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106392949A (en) * | 2016-09-30 | 2017-02-15 | 陕西国强光电科技股份有限公司 | Flying saucer lamp soft substrate assembling clamp and method |
-
2013
- 2013-05-14 CN CN2013202619638U patent/CN203288643U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106392949A (en) * | 2016-09-30 | 2017-02-15 | 陕西国强光电科技股份有限公司 | Flying saucer lamp soft substrate assembling clamp and method |
| CN106392949B (en) * | 2016-09-30 | 2018-06-29 | 陕西国强光电科技股份有限公司 | A kind of flying saucer lamp soft base plate assembling jig and assembly method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131113 Termination date: 20190514 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |