CN209562893U - Ultra-thin aluminum base circuit board - Google Patents
Ultra-thin aluminum base circuit board Download PDFInfo
- Publication number
- CN209562893U CN209562893U CN201821629224.9U CN201821629224U CN209562893U CN 209562893 U CN209562893 U CN 209562893U CN 201821629224 U CN201821629224 U CN 201821629224U CN 209562893 U CN209562893 U CN 209562893U
- Authority
- CN
- China
- Prior art keywords
- layer
- baffle
- ultra
- circuit board
- thermovent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 239000010410 layer Substances 0.000 claims abstract description 37
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 15
- 239000011241 protective layer Substances 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 239000011257 shell material Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 241000790917 Dioxys <bee> Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of ultra-thin aluminum base circuit boards, it includes substrate etc., first baffle is located at the side of the first thermovent, first thermovent is located at the side of the second baffle, second baffle is located at the side of location hole, location hole is located at the side of slot, slot is located at the side of cooling fin, cooling fin is located at the side of versatile interface, versatile interface is located at the side of the second thermovent, second thermovent is located at the side of socket, socket is located at the side of connector, connector is located at one end of substrate, wherein substrate includes up-protective layer, refractory layer, antioxidation coating, waterproof layer, toughening layer, increase conducting shell, lower protective layer etc..The ultra-thin aluminum base circuit board of the utility model can be heat-resisting well, can it is anti-oxidation and improve heat dissipation performance, also have ultra-thin characteristic, be convenient for carrying.
Description
Technical field
The utility model relates to a kind of circuit boards, more particularly to a kind of ultra-thin aluminum base circuit board.
Background technique
Existing circuit board can not be heat-resisting well, can not be anti-oxidation, and thermal diffusivity is poor, and thickness is very thick.
Summary of the invention
The technical problem to be solved by the utility model is to provide a kind of ultra-thin aluminum base circuit boards, can be resistance to well
Heat, being capable of anti-oxidation and raising heat dissipation performance band.
The utility model is to solve above-mentioned technical problem by following technical proposals: a kind of ultra-thin aluminum base circuit board,
It is characterized in that, it include substrate, it is the first baffle, the first thermovent, the second baffle, location hole, slot, cooling fin, more
Functional interface, the second thermovent, socket, connector, the first baffle are located at the downside of the first thermovent, multiple first thermovents
Between two location holes, the second baffle is located at the right side of the first baffle, and location hole is located at the side of slot, and four are inserted
Slot is located at four sides of cooling fin, and cooling fin is located at the side of versatile interface, and versatile interface is located at the second thermovent
Side, the second thermovent are located at the side of socket, and socket is located at the side of connector, and connector is located at one end of substrate, in which:
Substrate includes up-protective layer, refractory layer, antioxidation coating, waterproof layer, toughening layer, increases conducting shell, lower protective layer, and up-protective layer is located at resistance to
The top of thermosphere, refractory layer are located at the top of antioxidation coating, and antioxidation coating is located at the top of waterproof layer, and waterproof layer is located at toughening layer
Top, toughening layer is located at the top for increasing conducting shell, increases conducting shell and be located at the top of lower protective layer.
Preferably, the substrate is equipped with screw hole.
Preferably, first baffle is equipped with convex block.
Preferably, second baffle is equipped with convex block.
Preferably, structure glue is equipped with above the antioxidation coating.
The positive effect of the utility model is: the ultra-thin aluminum base circuit board of the utility model can be heat-resisting well,
It being capable of anti-oxidation and raising heat dissipation performance.
Detailed description of the invention
Fig. 1 is the overall structure figure of the utility model.
Fig. 2 is the board structure figure of the utility model.
Specific embodiment
The utility model preferred embodiment is provided, with reference to the accompanying drawing the technical solution of the utility model is described in detail.
As shown in Figure 1 to Figure 2, the ultra-thin aluminum base circuit board of the utility model includes substrate 1, the heat dissipation of the first baffle 2, first
Mouth the 3, second baffle 4, location hole 5, slot 6, cooling fin 7, versatile interface 8, the second thermovent 9, socket 10, connector
11, the first baffle 2 is located at the downside of the first thermovent 3, and multiple first thermovents 3 are located between two location holes 5, and second leads
Stream block 4 is located at the right side of the first baffle 2, and location hole 5 is located at the side of slot 6, and four slots 6 are located at cooling fin 7
Four sides, cooling fin 7 are located at the side of versatile interface 8, and versatile interface 8 is located at the side of the second thermovent 9, the second thermovent
9 are located at the side of socket 10, and socket 10 is located at the side of connector 11, and connector 11 is located at one end of substrate 1, in which: substrate 1
Including up-protective layer 12, refractory layer 13, antioxidation coating 14, waterproof layer 15, toughening layer 16, increase conducting shell 17, lower protective layer 18, upper guarantor
Sheath 12 is located at the top of refractory layer 13, and refractory layer 13 is located at the top of antioxidation coating 14, and antioxidation coating 14 is located at waterproof layer 15
Top, waterproof layer 15 is located at the top of toughening layer 16, and toughening layer 16 is located at the top for increasing conducting shell 17, increases conducting shell 17 and is located at lower guarantor
The top of sheath 18.
Substrate 1 is equipped with screw hole, can facilitate fixation in this way.
First baffle 2 is equipped with convex block so that it is convenient to water conservancy diversion.
Second baffle 4 is equipped with convex block so that it is convenient to water conservancy diversion.
It is equipped with structure glue above antioxidation coating 14, fixed and bonding can be facilitated in this way.
The working principle of the utility model is as follows: ultra-thin aluminum base circuit board is a kind of for saving the new-type circuit of material
Plate, its heat dissipation effect is fabulous, possesses good insulation performance and mechanical performance, has ultra-thin characteristic.Substrate is equipped with upper protection
Layer, antioxidation coating, waterproof layer, toughening layer, increases conducting shell, lower protective layer at refractory layer, and up-protective layer material uses aluminum substrate, aluminium base
Plate possesses good hardness, improves the hardness of substrate, and substrate is allowed to be not readily susceptible to external damage.Heat-resisting layer material uses aluminium
Alloy, aluminium alloy capability stabilization can high temperature resistant, can guarantee high temperature resistant in this way.Antioxidation coating material uses silica, dioxy
SiClx is not easy oxidation by air and properties are good, can be improved board quality for anti-oxidation.Waterproof layer material uses
Nylon, the properties of nylon well can waterproof, have good waterproof performance.Toughening layer material uses phenolic resin, phenol
The properties of urea formaldehyde are good, improve heat dissipation performance, can enhance the toughness of circuit board for toughening layer, increase conducting shell material and adopt
With copper foil, copper foil is good conductive material, moderate, can enhance the conductive capability of circuit board for increasing conducting shell.Lower guarantor
Jacket material uses polyethylene, and polyethylene improves heat dissipation performance, can enhance the toughness of circuit board in this way and plasticity avoids damaging.The
One baffle and the second baffle can be improved the sensitivity of circuit board using conductive metal and for water conservancy diversion in this way.The
One thermovent and the second thermovent can reduce the energy consumption of circuit board for radiating in this way.Location hole is used for fixing circuit board, in this way
It is avoided that the loosening of circuit board causes circuit to damage.For being inserted into other device, many places for being able to achieve circuit board in this way connect slot
It connects.Cooling fin further increases heat dissipation effect for radiating.Versatile interface be used for data line connection, in this way can with it is a variety of
Different mechanical connections plays the effect that multi-panel uses.Socket is able to achieve many places of circuit board for being inserted into other device in this way
Connection.Connector is able to achieve the fixation and connection of circuit board for connecting other device in this way.
In conclusion the ultra-thin aluminum base circuit board of the utility model can be heat-resisting well, it being capable of anti-oxidation and raising heat dissipation
Performance.
Particular embodiments described above, the technical issues of to the solution of the utility model, technical scheme and beneficial effects
It has been further described, it should be understood that the foregoing is merely specific embodiment of the utility model, not
For limiting the utility model, within the spirit and principle of the utility model, any modification for being made, changes equivalent replacement
Into etc., it should be included within the scope of protection of this utility model.
Claims (5)
1. a kind of ultra-thin aluminum base circuit board, which is characterized in that it includes substrate, the first baffle, the first thermovent, the second water conservancy diversion
Block, location hole, slot, cooling fin, versatile interface, the second thermovent, socket, connector, the first baffle are located at first and dissipate
The side of hot mouth, the first thermovent are located at the side of the second baffle, and the second baffle is located at the side of location hole, position hole location
In the side of slot, slot is located at the side of cooling fin, and cooling fin is located at the side of versatile interface, and versatile interface is located at the
The side of two thermovents, the second thermovent are located at the side of socket, and socket is located at the side of connector, and connector is located at substrate
One end, in which: substrate includes up-protective layer, refractory layer, antioxidation coating, waterproof layer, toughening layer, increases conducting shell, lower protective layer, upper guarantor
Sheath is located at the top of refractory layer, and refractory layer is located at the top of antioxidation coating, and antioxidation coating is located at the top of waterproof layer, waterproof layer
Positioned at the top of toughening layer, toughening layer is located at the top for increasing conducting shell, increases the top that conducting shell is located at lower protective layer.
2. ultra-thin aluminum base circuit board as described in claim 1, which is characterized in that the substrate is equipped with screw hole.
3. ultra-thin aluminum base circuit board as described in claim 1, which is characterized in that first baffle is equipped with convex block.
4. ultra-thin aluminum base circuit board as described in claim 1, which is characterized in that second baffle is equipped with convex block.
5. ultra-thin aluminum base circuit board as described in claim 1, which is characterized in that be equipped with structure glue above the antioxidation coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821629224.9U CN209562893U (en) | 2018-10-09 | 2018-10-09 | Ultra-thin aluminum base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821629224.9U CN209562893U (en) | 2018-10-09 | 2018-10-09 | Ultra-thin aluminum base circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209562893U true CN209562893U (en) | 2019-10-29 |
Family
ID=68298919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821629224.9U Expired - Fee Related CN209562893U (en) | 2018-10-09 | 2018-10-09 | Ultra-thin aluminum base circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209562893U (en) |
-
2018
- 2018-10-09 CN CN201821629224.9U patent/CN209562893U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191029 |