CN208402195U - A kind of support plate layout of CSP module - Google Patents
A kind of support plate layout of CSP module Download PDFInfo
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- CN208402195U CN208402195U CN201820392971.9U CN201820392971U CN208402195U CN 208402195 U CN208402195 U CN 208402195U CN 201820392971 U CN201820392971 U CN 201820392971U CN 208402195 U CN208402195 U CN 208402195U
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Abstract
The utility model relates to Intelligent card package technical fields, and in particular to a kind of support plate layout of CSP module, comprising: support plate ontology (1)；The support plate unit (2) of several same sizes, it is arranged on the support plate ontology (1) in the matrix form, and the opposite center of two adjacent support plate units (2) in X direction is having a size of 8.08-9.4mm, for the support plate unit (2) of adjacent two along the opposite center of Y-direction having a size of 9.6-13.55mm, the size of each support plate unit (2) is (6.78-8.1) mm × (9.62-12.2) mm.It is reasonable that the utility model provides a kind of arrangement of support plate unit on support plate ontology, the support plate layout of the high CSP module of production efficiency of equipment.
Description
Technical field
The utility model relates to Intelligent card package technical fields, and in particular to a kind of support plate layout of CSP module.
Background technique
As smart card is using more and more extensive, the production requirement of CSP module increased, traditional ribbon carrier band
The charging and discharging of CSP module, while transport difficult in production are seriously affected in process.In order to overcome above-mentioned lack
It falls into, now has begun and produced using support plate formula, to solve the input and output material and transportation problem in production process, but due to support plate layout
The limitation of quantity, production efficiency of equipment and not up to optimum state.
In order to solve the above-mentioned technical problem, Chinese patent literature CN202151007U discloses a kind of for Contact Type Ic Card
The PCB electronic carrier board of module, comprising: the PCB electronic carrier board has motherboard, and the one side of the motherboard is equipped with multiple same sizes
Isolated area unit, each isolated area unit be equipped at least one subregion, all subregion be equipped with multiple contact surface lists
Member, the Contact surface element form matrix arrangement, in all subregion, the opposite center size of adjacent Contact surface element
For 9.5mm × 13.65mm；The another side of the motherboard is equipped with multiple pads.The layout arrangement of the specific dimensions is to a certain degree
On saved cost, but since CSP module size actually required during being embedded in card base is smaller, above-mentioned support plate is still
There are the wastes of certain substrate.
Utility model content
Therefore, the technical problem to be solved by the present invention is to overcome Contact surface element in the prior art on motherboard
Arrangement it is unreasonable, the defect for causing substrate to waste, so that it is reasonable to provide a kind of arrangement of support plate unit on support plate ontology, if
The support plate layout of the CSP module of standby high production efficiency.
In order to solve the above-mentioned technical problem, the utility model provides a kind of support plate layout of CSP module, comprising:
Support plate ontology；
The support plate unit of several same sizes is arranged in the matrix form on the support plate ontology, and adjacent two
The opposite center of the support plate unit in X direction is having a size of 8.08-9.4mm, and the support plate unit of adjacent two is along the side Y
To opposite center having a size of 9.6-13.55mm, the size of each support plate unit be (6.78-8.1) mm ×
(9.62-12.2)mm。
The support plate layout of the CSP module, times that line number of the support plate unit on the support plate ontology is 3 or 4
Number, the multiple that columns is 3 or 4.
The support plate layout of the CSP module, the size of the support plate unit are 7.28mm × 10.04mm, adjacent two
The opposite center of a support plate unit is having a size of 8.58mm × 11.22mm.
The support plate layout of the CSP module, the size of the support plate ontology are 244mm × 180mm, several described loads
Plate unit is arranged on the support plate ontology in 15 rows × 27 column form.
The support plate layout of the CSP module, several described support plate units are arranged in institute in 16 rows × 27 column form
It states on support plate ontology.
The support plate layout of the CSP module, the edge formation of the support plate ontology have several feeding sides for identification
To the first gold-plated mark, the periphery of each support plate unit is arranged at intervals with several the second gold-plated marks.
The short side edge of the support plate layout of the CSP module, the support plate ontology also forms feeding side for identification
To the gold-plated mark of third, the support plate ontology forms chamfering close to the edge of the gold-plated mark of the third.
The support plate layout of the CSP module further includes several first positioning for being molded over the support plate body edges
Hole and second location hole, the first positioning hole and the second location hole are interspersed, and the second location hole is only distributed
It is identical as the line number of the support plate unit in the short side edge of the support plate ontology.
The support plate layout of the CSP module forms in the support plate unit for by the front of the support plate unit
With the through-hole of reverse side electrical connection, the number of the through-hole is 1-3, and the hole wall of the through-hole carries out gold-plated processing, Gold plated Layer
Thickness be not less than 0.02 μm, copper plate with a thickness of 8-13 μm.
The support plate layout of the CSP module forms in the support plate unit for by the front of the support plate unit
With the blind hole of reverse side electrical connection, the number of the blind hole is 1-3, and the inner wall of the blind hole passes through gold-plated processing, and is printed with
Tin cream.
Technical solutions of the utility model have the advantages that
1. the support plate layout of CSP module provided by the utility model, the phase of the support plate unit of adjacent two in X direction
To center position dimension be 8.08-9.4mm, the support plate unit of adjacent two along the opposite center of Y-direction having a size of
9.6-13.55mm, the size of each support plate unit are (6.78-8.1) mm × (9.62-12.2) mm.Make in this way in satisfaction
Under the premise of with demand, the space on support plate ontology is utilized to the full extent, reduces unnecessary waste, improves simultaneously
The production efficiency of equipment is conducive to mass production.
2. the support plate layout of CSP module provided by the utility model, support plate ontology and the gold-plated mark of support plate cell edges first
Know the setting with the second gold-plated mark and the setting of third gold-plated mark and chamfering, operating personnel and the equal energy of equipment can be made
In time, feeding direction is accurately identified, the waste of chip and support plate ontology caused by preventing because of feeding mistake improves production efficiency.
3. the support plate layout of CSP module provided by the utility model, the obverse and reverse of support plate unit are electrically connected by through-hole
It connects, on the one hand improves the reliability of product, on the other hand reduce tin cream filling, reduce production cost, improve equipment
Productivity.
Detailed description of the invention
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the schematic diagram of the support plate layout of CSP module provided by the utility model；
Fig. 2 is the top view of support plate unit in Fig. 1；
Fig. 3 is the cross-sectional view of support plate unit in Fig. 1.
Description of symbols:
1- support plate ontology；2- support plate unit；The gold-plated mark of 3- first；The gold-plated mark of 4- second；The gold-plated mark of 5- third；6-
Chamfering；7- first positioning hole；8- second location hole；9- support plate model electroplating region；21- support plate base；22- contact layer；23- welding
Pin；24- lead；25- through-hole.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, originally
Field those of ordinary skill every other embodiment obtained without making creative work belongs to practical
Novel protected range.
In addition, as long as technical characteristic involved in the utility model different embodiments disclosed below is each other
Not constituting conflict can be combined with each other.
A kind of specific embodiment of the support plate layout of CSP module as shown in Figs. 1-3, including support plate ontology 1 and with square
Formation formula is arranged in the support plate unit 2 of several same sizes on the support plate ontology 1.It is provided on support plate ontology 1 several
The support plate unit 2 of a same size, the support plate unit 2 is provided with welding pin on one side, if opposite another side is provided with
Dry contact；And the opposite center of two adjacent support plate units 2 in X direction is having a size of 8.08-9.4mm, it is adjacent
Two support plate units 2 along the opposite center of Y-direction having a size of 9.6-13.55mm, each support plate unit 2
Having a size of (6.78-8.1) mm × (9.62-12.2) mm.In this way 2 size of support plate unit and two adjacent support plate units 2 it
Between spacing optimization after, the support plate ontology 1 of same size, so that it may greater number of support plate unit 2 of arranging.
The multiple that line number of the support plate unit 2 on the support plate ontology 1 is 3 or 4, the multiple that columns is 3 or 4.?
In the present embodiment, the size of the support plate ontology 1 is 244mm × 180mm, several described support plate units 2 are with 15 rows × 27 column
Form be arranged on the support plate ontology 1, the size of the support plate unit 2 is 7.28mm × 10.04mm, two adjacent institutes
The opposite center of support plate unit 2 is stated having a size of 8.58mm × 11.22mm.
The edge formation of the support plate ontology 1 have several for identification feeding direction first it is gold-plated mark 3, first plating
Gold mark 3 can be square, circle or triangle, the gold-plated mark 3 of the first of different support plate models are carried out using different shape
It distinguishes, different support plates is identified convenient for equipment.The periphery of each support plate unit 2 is arranged at intervals with several the second gold-plated marks
Know 4, specifically, four edges of each support plate unit 2 are provided with a second gold-plated mark 4.First 3 Hes of gold-plated mark
Second gold-plated mark 4 carries out the confirmation of 1 feedstock direction of support plate ontology for printing equipment, and printing equipment can also utilize the first plating
Gold mark 3 and the second gold-plated mark 4 carry out the positioning of support plate ontology 1 and steel mesh, and tin cream is successfully printed on to support plate ontology 1
On corresponding welding pin, it is convenient for subsequent production.
The short side edge of the support plate ontology 1 also forms the gold-plated mark 5 of third in feeding direction for identification, in this reality
It applies in example, the gold-plated mark 5 of third is gold-plated arrow；Edge molding of the support plate ontology 1 close to the gold-plated mark 5 of the third
There is chamfering 6, the size of chamfering 6 is 3mm × 3mm.In conjunction with gold-plated arrow and chamfering 6, equipment and operating personnel can be accurate, timely
Identify feedstock direction, when pan feeding anisotropy, equipment is identified less than respective identification, can not be produced.
It further include several first positioning holes 7 and second location hole 8 for being molded over 1 edge of support plate ontology, described
A positioning hole 7 and the second location hole 8 are interspersed, and the second location hole 8 is distributed only over the short of the support plate ontology 1
Side edge is identical as the line number of the support plate unit 2.The diameter of first positioning hole 7 is 2mm, and the diameter of second location hole 8 is
1.5mm。
It further include the support plate model electroplating region 9 for being molded over 1 lower edge of support plate ontology, the character of support plate model plating is used
In the different support plate ontology 1 of differentiation.
The support plate unit 2 is including support plate base 21 and sets up the contact layer 22 and welding pin in 21 two sides of support plate base separately
23, lead 24 form in the support plate unit 2 for by the through-hole 25 of the obverse and reverse electrical connection of the support plate unit 2,
The quantity of through-hole 25 is 1-3, and the hole wall of the through-hole 25 carries out gold-plated processing, and the thickness of Gold plated Layer is not less than 0.02 μm,
Copper plate with a thickness of 8-13 μm.
As alternative embodiment, formed in the support plate unit 2 for by the front of the support plate unit 2 and instead
The blind hole of face electrical connection, the number of the blind hole are 1-3, and the inner wall of the blind hole passes through gold-plated processing, and is printed with tin cream,
To realize electrical connection.
As alternative embodiment, several described support plate units 2 are arranged in the load in 16 rows × 27 column form
On plate ontology 1.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes among the protection scope created still in the utility model.
Claims (10)
1. a kind of support plate layout of CSP module characterized by comprising
Support plate ontology (1)；
The support plate unit (2) of several same sizes is arranged in the matrix form on the support plate ontology (1), and adjacent two
The opposite center of a support plate unit (2) in X direction is having a size of 8.08-9.4mm, the support plate unit of adjacent two
(2) along the opposite center of Y-direction having a size of 9.6-13.55mm, the size of each support plate unit (2) is (6.78-
8.1)mm×(9.62-12.2)mm。
2. the support plate layout of CSP module according to claim 1, which is characterized in that the support plate unit (2) is in the load
The multiple that line number on plate ontology (1) is 3 or 4, the multiple that columns is 3 or 4.
3. the support plate layout of CSP module according to claim 1, which is characterized in that the size of the support plate unit (2) is
7.28mm × 10.04mm, the opposite center of the support plate unit (2) of adjacent two is having a size of 8.58mm × 11.22mm.
4. the support plate layout of CSP module according to claim 2, which is characterized in that the size of the support plate ontology (1) is
244mm × 180mm, several described support plate units (2) are arranged on the support plate ontology (1) in 15 rows × 27 column form.
5. the support plate layout of CSP module according to claim 2, which is characterized in that several described support plate units (2) with
16 rows × 27 column form is arranged on the support plate ontology (1).
6. the support plate layout of CSP module according to claim 1, which is characterized in that the edge of the support plate ontology (1) at
Type has the first gold-plated mark (3) in several feeding directions for identification, the periphery interval setting of each support plate unit (2)
There are several the second gold-plated marks (4).
7. the support plate layout of CSP module according to claim 1, which is characterized in that the short side side of the support plate ontology (1)
Edge also forms the gold-plated mark (5) of third in feeding direction for identification, and the support plate ontology (1) is close to the gold-plated mark of the third
The edge for knowing (5) forms chamfering (6).
8. the support plate layout of CSP module according to claim 1, which is characterized in that further include being molded over the support plate sheet
Several first positioning holes (7) and second location hole (8) at body (1) edge, the first positioning hole (7) and second positioning
Hole (8) is interspersed, and the second location hole (8) is distributed only over the short side edge of the support plate ontology (1), with the support plate
The line number of unit (2) is identical.
9. the support plate layout of CSP module according to claim 1, which is characterized in that formed in the support plate unit (2)
Through-hole (25) for the obverse and reverse of the support plate unit (2) to be electrically connected, the number of the through-hole (25) are 1-3,
And the hole wall of the through-hole (25) carries out gold-plated processing, the thickness of Gold plated Layer is not less than 0.02 μm, copper plate with a thickness of 8-13 μ
m。
10. the support plate layout of CSP module according to claim 1, which is characterized in that molding in the support plate unit (2)
Have for by the blind hole of the obverse and reverse electrical connection of the support plate unit (2), the number of the blind hole to be 1-3, described blind
The inner wall in hole passes through gold-plated processing, and is printed with tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820392971.9U CN208402195U (en) | 2018-03-22 | 2018-03-22 | A kind of support plate layout of CSP module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820392971.9U CN208402195U (en) | 2018-03-22 | 2018-03-22 | A kind of support plate layout of CSP module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208402195U true CN208402195U (en) | 2019-01-18 |
Family
ID=65063290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820392971.9U Active CN208402195U (en) | 2018-03-22 | 2018-03-22 | A kind of support plate layout of CSP module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208402195U (en) |
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2018
- 2018-03-22 CN CN201820392971.9U patent/CN208402195U/en active Active
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