CN208397718U - A kind of LED pasting type LED light source structure - Google Patents

Abstract

The utility model discloses a kind of LED pasting type LED light source structure, comprising: bracket and LED chip module and the crown top of burner, bracket be equipped with mutually insulated multi-level packaging pole platform structure, the multi-level packaging pole platform structure include take shape in pedestal upper end the first order encapsulation pole platform and stack gradually in the first order encapsulation pole platform on and mutually insulated second, third grade encapsulation pole platform；LED chip module includes the LED chip group of heat-radiating substrate and several groups on heat-radiating substrate, and the heat-radiating substrate back side is equipped with and corresponds respectively with first, second, third grade of encapsulation pole platform and dock the first, second, third back side conductive sheet of conducting；The heat-radiating substrate front is provided with the first, second, third front side conductive piece be connected respectively with the first, second, third back side conductive sheet, wherein, the positive and negative anodes of all LED chips are separately connected the first, second front side conductive piece at least one LED chip group, and the positive and negative anodes of all LED chips are separately connected first, third front side conductive piece at least one LED chip group.

Description

A kind of LED pasting type LED light source structure

Technical field:

The utility model relates to LED product technical fields, refer in particular to a kind of LED pasting type LED light source structure.

Background technique:

It is well known that traditional incandescent lamp energy consumption is higher, energy utilization rate is very low, probably only less than 1/10th Energy becomes luminous energy, and other is all thermal energy being wasted in vain.So people are trying every possible means always with new light source To substitute incandescent lamp.Therefore, energy-saving lamp just comes into being.Since it is compared to for incandescent lamp, cheaply and well make, so just A large amount of application has been obtained, has had the tendency that gradually replacing incandescent lamp.Energy-saving lamp is shone using electron excitation principle, relative to Incandescent lamp, energy-saving lamp have the advantages that power saving.But a disadvantage existing for energy-saving lamp is exactly: containing mercury in energy-saving lamp, mercury is saving It can be intermediation in fluorescent tube, no hydrargyrum energy-saving lamp would not shine.It has been resulted in since in this way in energy-saving lamp production process With use it is discarded after have mercury pollution, in addition, energy-saving lamp is still glassware, easily broken, bad transport, bad installation.Secondly, its Power consumption or larger.Finally, energy-saving lamp is easily damaged, the service life is short.

And the developing direction of energy-saving illumination apparatus is exactly LED lamp at present.Relative to above-mentioned illuminator, LED light has Following advantage:

1, energy saving.The energy consumption of white LED lamp is only the 1/10 of incandescent lamp, and the 1/4 of energy-saving lamp.

2, long service life.The service life of LED light up to 100,000 hours or more, significantly larger than incandescent lamp and energy-saving lamp.

It 3, can be with frequent starting.If traditional energy-saving lamp, incandescent lamp are frequently started or shut down, filament will black, It is cracking to break down, and LED light will not.

4, solid encapsulation belongs to cold light Source Type, so its easily transport and installation, can be installed in any miniature In closed equipment, it is not afraid of vibration, does not need substantially to consider heat dissipation.

5, environmentally friendly, the not no harmful substance of mercury.The assembling parts of LED light can be dismounted very easily, and recycling is convenient.

Based on These characteristics, LED light will gradually replace other illuminators.But there is also certain to lack for LED light Fall into: the plurality of LEDs installed in the Luminous lamp holder of LED light is all series connection conducting, is all to light or extinguish simultaneously at work, It, which is unable to reach, adjusts the purpose that certain LED shone or controlled certain LED extinguishings, when the LED of different colours is especially installed, It is more difficult to dim, and causes biggish puzzlement to user.

In view of this, proposing following technical scheme.

Utility model content:

The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of LED pasting type LED light source structure.

In order to solve the above-mentioned technical problem, the utility model uses following technical proposals: the LED pasting type LED light source Structure includes: bracket and the LED chip module being set on the bracket and for LED chip module to be packaged on bracket The crown top of burner is provided with mutually insulated and the multi-level packaging pole platform structure for LED chip module to be connected, the LED core on the bracket Piece mould group is installed on multi-level packaging pole platform structure periphery, which includes take shape in pedestal upper end first It grade encapsulation pole platform and stacks gradually in second level encapsulation pole platform and third level encapsulation pole platform on first order encapsulation pole platform, this One, second, third grade encapsulation pole platform is respectively as the first, second, third conductive electrode, between mutually insulated；The LED chip Mould group includes heat-radiating substrate and several groups are set to the LED chip group on the heat-radiating substrate, wherein the heat-radiating substrate back side It is provided with and encapsulates the first, second, third back that pole platform corresponds and docks conducting with described first, second, third grade respectively Face conductive sheet；The heat-radiating substrate front is provided with first be connected respectively with first, second, third back side conductive sheet, Two, third front side conductive piece, wherein the positive and negative anodes of all LED chips are separately connected first, at least one LED chip group Two front side conductive pieces, the positive and negative anodes of all LED chips are separately connected first, third front side conductive at least one LED chip group Piece.

Furthermore, in above-mentioned technical proposal, the heat-radiating substrate uses aluminum oxide substrate or aluminium nitride substrate, superconduction Any one in aluminum substrate.

Furthermore, in above-mentioned technical proposal, it is equal by circle that the multi-level packaging pole platform structure peripheral is formed with several The vertical installation surface of equal part distribution；The heat-radiating substrate back side of the LED chip module is mounted in the vertical installation surface.

Furthermore, in above-mentioned technical proposal, described first, second, third grade encapsulates the transversal of pole platform upper part Face is in polygon.

Furthermore, in above-mentioned technical proposal, the pedestal lower end forms thread segment, and the second level encapsulates pole platform The first of lower end connects probe and stretches out in outside the thread segment lower end across thread segment；The second of third level encapsulation pole platform lower end It connects that probe sequentially passes through second level encapsulation pole platform and thread segment stretches out in outside the thread segment lower end, and connects probe simultaneously with first Column distribution, forms arranged in dislocation, and this first connects probe lower end and connect probe lower end with second and flush.

Furthermore, in above-mentioned technical proposal, the pedestal lower end forms thread segment, and the second level encapsulates pole platform The first of lower end connects probe and stretches out in outside the thread segment lower end across thread segment central part；Under the third level encapsulation pole platform The second of end connects probe and sequentially passes through second level encapsulation pole platform and first connect probe and stretch out in outside the thread segment lower end, the spiral shell Line section connects probe with first, second connects probe and form coaxial assembly.

Furthermore, in above-mentioned technical proposal, the second level encapsulation pole platform and third level encapsulation pole platform are in T word Shape.

Furthermore, the interval injection molding in above-mentioned technical proposal, between the second level encapsulation pole platform and bracket There is the first insulation sleeve, which separates second level encapsulation pole platform with bracket, and makes mutually insulated between it；Described Interval between second level package pole platform and third level encapsulation pole platform is injection molded with the second insulation sleeve, and second insulation sleeve is by second Grade encapsulation pole platform is separated with third level encapsulation pole platform, and makes mutually insulated between it.

After adopting the above technical scheme, the utility model have the following beneficial effects: compared with prior art it is practical It is novel the LED chip group in each LED chip module to be made to carry out series connection and/or parallel connection by multi-level packaging pole platform structure Connection, any two reached in controllable first, second, third grade of encapsulation pole platform are powered, to light the LED core being attached thereto Piece group, control can be realized, and certain organizes purpose that LED chip group shone or controlled certain group LED chip group extinguishing, especially installs When the LED chip of different colours, the controllable LED chip for lighting different colours reaches control luminescent color, meets different hairs Light requirement, enables the utility model have the extremely strong market competitiveness.In addition, each LED chip module of the utility model includes There are multiple LED chip groups, and every group of LED chip group all includes multiple LED chips, the utility model can be greatly enhanced with this Light emission luminance；Furthermore the utility model can be used as auto lamp use, wherein at least one set LED chip group can be used as high beam It using, the positive and negative anodes of all LED chips are separately connected the first, second front side conductive piece in this group of LED chip group, at least one LED chip group is used as dipped headlight, and the positive and negative anodes of all LED chips are separately connected first, third in this group of LED chip group Front side conductive piece, control can be realized, and certain organizes purpose that LED chip group shone or controlled certain group LED chip group extinguishing, reaches Control high beam and the luminous problem of dipped headlight.

Detailed description of the invention:

Fig. 1 is the perspective view of the utility model；

Fig. 2 is the cross-sectional view of the utility model；

Fig. 3 is the stereogram exploded view of the utility model；

Fig. 4 is the structural schematic diagram after the utility model disassembly crown top of burner；

Fig. 5 is the back view of heat-radiating substrate in the utility model；

Fig. 6 is the front elevation of heat-radiating substrate in the utility model；

Fig. 7 is the front elevation of LED chip module in the utility model；

Fig. 8 is the perspective view of the utility model another kind structure；

Fig. 9 is the stereogram exploded view of the utility model another kind structure.

Specific embodiment:

The present invention will be further described with attached drawing combined with specific embodiments below.

It is a kind of LED pasting type LED light source structure as shown in Fig. 1-4 comprising: bracket 1 and it is set to the bracket 1 On LED chip module 2 and the crown top of burner 3 for being packaged in LED chip module 2 on bracket 1, be provided with phase on the bracket 1 It mutually insulate and the multi-level packaging pole platform structure 100 for LED chip module 2 to be connected, the LED chip module 2 is installed on the multistage Encapsulate around pole platform structure 100, with this realize around the multi-level packaging pole platform structure 100 can 360 degrees omnidirection shine, meet not Same requirement.

In conjunction with shown in Fig. 5-7, the multi-level packaging pole platform structure 100 includes to take shape in the first order envelope of 1 upper end of bracket It fills pole platform 11 and stacks gradually in second level encapsulation pole platform 4 and third level encapsulation pole platform 5 on first order encapsulation pole platform 11, it should First, second, third grade of encapsulation pole platform 11,4,5 respectively as the first, second, third conductive electrode, between mutually insulated, In, the LED chip module 2 includes heat-radiating substrate 21 and several groups are set to the LED chip group on the heat-radiating substrate 21 22, wherein 21 back side of heat-radiating substrate is provided with a pair of with first, second, third grade of encapsulation pole platform 11,4,5 one respectively It should and dock the first, second, third back side conductive sheet 211,212,213 of conducting；21 front of heat-radiating substrate is provided with difference With first, second, third back side conductive sheet 211,212,213 be connected the first, second, third front side conductive piece 214, 215,216, first, second, third back side conductive sheet 211,212,213 and the first, second, third front side conductive piece 214, 215,216 pass through pad and are connected, wherein the positive and negative anodes of all LED chips are separately connected at least one LED chip group 22 One, the second front side conductive piece 214,215, the positive and negative anodes of all LED chips are separately connected at least one LED chip group 22 One, third front side conductive piece 214,216.That is, the utility model by multi-level packaging pole platform structure 100 can make it is each LED chip group 22 is connected in series and/or is connected in parallel in LED chip module 2, reaches controllable first, second, third grade Any two encapsulated in pole platform 11,4,5 are powered, and to light the LED chip group 22 being attached thereto, can be realized and control certain group LED chip group 22 shines or controls the purpose that certain group LED chip group 22 is extinguished, and especially installs the LED chip of different colours When, the controllable LED chip for lighting different colours reaches control luminescent color, meets different lighting requirements, enables this practical new Type has the extremely strong market competitiveness.In addition, each LED chip module 2 of the utility model includes multiple LED chip groups 22, and every group of LED chipset 22 all includes multiple LED chips, and the light emission luminance of the utility model can be greatly enhanced with this； Furthermore the utility model can be used as auto lamp use, wherein at least one set LED chip group 22 can be used as high beam use, should The positive and negative anodes of all LED chips are separately connected the first, second front side conductive piece 214,215 in group LED chip group 22, at least one LED chip group 22 is used as dipped headlight, in this group of LED chip group 22 positive and negative anodes of all LED chips be separately connected first, Third front side conductive piece 214,216, can be realized control certain group LED chip group 22 shine or control certain group LED chip group 22 The purpose of extinguishing reaches control high beam and the luminous problem of dipped headlight.

The heat-radiating substrate 21 using any one in aluminum oxide substrate or aluminium nitride substrate, superconduction aluminum substrate so that Make the heat-radiating substrate 21 that there is good heat-conducting effect.

As shown in connection with fig. 4,100 periphery of multi-level packaging pole platform structure is formed with several by the perpendicular of the equal equal part distribution of circle Straight mounting surface 10；The quantity of the LED chip module 2 is multiple, 21 back side of the heat-radiating substrate attachment of each LED chip module 2 In in the vertical installation surface 10, enable the utility model light-emitting surface extremely wide, so that can reach 360 degree of luminous efficacies.

The cross section of first, second, third grade of encapsulation, 11,4,5 upper part of pole platform is in polygon.

In conjunction with shown in Fig. 1-4,1 lower end of bracket forms thread segment 12, the second level encapsulation 4 lower end of pole platform First connects probe 41 stretches out in outside 12 lower end of thread segment across 12 central part of thread segment；The third level encapsulates pole platform 5 The second of lower end connects probe 51 and sequentially passes through second level encapsulation pole platform 4 and first connect probe 41 and stretch out under the thread segment 12 End is outer, which connects probe 41 with first, second connects probe 51 and form coaxial assembly.

In conjunction with shown in Fig. 8,9,1 lower end of bracket forms thread segment 12, the second level encapsulation 4 lower end of pole platform First connects probe 41 stretches out in outside 12 lower end of thread segment across thread segment 12；The of third level encapsulation 5 lower end of pole platform Two connect that probe 51 sequentially passes through second level encapsulation pole platform 4 and thread segment 12 stretches out in outside 12 lower end of thread segment, and with first Probe 41 and column distribution are connected, forms arranged in dislocation, and this first connects 41 lower end of probe with second to connect 51 lower end of probe neat Flat, opposite thread section 12, first connect probe 41 and second connect for probe 51 is co-axially mounted, and structure is simpler, It assembles up also more convenient, can effectively reduce cost, improve the market competitiveness.

In conjunction with shown in Fig. 1-9, the second level encapsulation pole platform 4 and third level encapsulation pole platform 5 are T-shaped.Described second Interval between grade encapsulation pole platform 4 and bracket 1 is injection molded with the first insulation sleeve 6, which encapsulates pole for the second level Platform 4 is separated with bracket 1, and makes mutually insulated between it；Between the second level encapsulation pole platform 4 and third level encapsulation pole platform 5 Interval be injection molded with the second insulation sleeve 7, second insulation sleeve 7 by the second level encapsulation pole platform 4 and the third level encapsulation pole platform 5 every It opens, and makes mutually insulated between it.

In conclusion the utility model can be made in each LED chip module 2 by multi-level packaging pole platform structure 100 LED chip group 22 is connected in series and/or is connected in parallel, and controllable first, second, third grade of encapsulation pole platform 11,4,5 is reached In any two be powered, to light the LED chip group 22 being attached thereto, can be realized control certain group LED chip group 22 shine It is controllable to light not or when controlling the purpose, the especially LED chip of installation different colours that certain group LED chip group 22 is extinguished With the LED chip of color, reach control luminescent color, meet different lighting requirements, enables the utility model that there is extremely strong city Field competitiveness.In addition, each LED chip module 2 of the utility model includes multiple LED chip groups 22, and every group of LED chip Group 22 all includes multiple LED chips, and the light emission luminance of the utility model can be greatly enhanced with this；Furthermore the utility model can It is used as auto lamp, wherein at least one set LED chip group 22 can be used as high beam use, institute in this group of LED chip group 22 There are the positive and negative anodes of LED chip to be separately connected the first, second front side conductive piece 214,215, at least one LED chip group 22 is as close Light lamp uses, in this group of LED chip group 22 positive and negative anodes of all LED chips be separately connected first, third front side conductive piece 214, 216, control can be realized, and certain organizes purpose that LED chip group 22 shone or controlled certain group extinguishing of LED chip group 22, reaches control High beam and the luminous problem of dipped headlight.

It certainly, is not to limit the utility model and implement the foregoing is merely specific embodiment of the utility model Range, all equivalent change or modifications done according to structure, feature and principle described in present utility model application the scope of the patents, should all wrap It includes in present utility model application the scope of the patents.

Claims (8)

1. a kind of LED pasting type LED light source structure comprising: bracket (1) and the LED chip mould being set on the bracket (1) Group (2) and for LED chip module (2) to be packaged in the crown top of burner (3) on bracket (1), is provided with mutually absolutely on the bracket (1) Edge and the multi-level packaging pole platform structure (100) for being used to be connected LED chip module (2), the LED chip module (2) are installed on multistage It encapsulates around pole platform structure (100), which includes to take shape in the first order of bracket (1) upper end It encapsulates pole platform (11) and stacks gradually in second level encapsulation pole platform (4) and third level encapsulation in first order encapsulation pole platform (11) Pole platform (5), this first, second, third grade encapsulation pole platform (11,4,5) respectively as the first, second, third conductive electrode, between Mutually insulated；

It is characterized by: the LED chip module (2) includes that heat-radiating substrate (21) and several groups are set to the heat-radiating substrate (21) the LED chip group (22) on, wherein heat-radiating substrate (21) back side be provided with respectively with described first, second, third grade Encapsulation pole platform (11,4,5) corresponds and docks the first, second, third back side conductive sheet (211,212,213) of conducting；It should Heat-radiating substrate (21) front be provided with respectively with first, second, third back side conductive sheet (211,212,213) conducting the One, second, third front side conductive piece (214,215,216), wherein all LED chips at least one LED chip group (22) Positive and negative anodes are separately connected the first, second front side conductive piece (214,215), all LED chips at least one LED chip group (22) Positive and negative anodes be separately connected first, third front side conductive piece (214,216).

2. a kind of LED pasting type LED light source structure according to claim 1, it is characterised in that: the heat-radiating substrate (21) Using any one in aluminum oxide substrate or aluminium nitride substrate, superconduction aluminum substrate.

3. a kind of LED pasting type LED light source structure according to claim 1, it is characterised in that: multi-level packaging pole platform Structure (100) periphery is formed with several by the vertical installation surface (10) of the equal equal part distribution of circle；The LED chip module (2) Heat-radiating substrate (21) back side is mounted in the vertical installation surface (10).

4. a kind of LED pasting type LED light source structure according to claim 3, it is characterised in that: described first, second, The cross section that three-level encapsulates pole platform (11,4,5) upper part is in polygon.

5. a kind of LED pasting type LED light source structure according to claim 2, it is characterised in that: bracket (1) lower end It forms thread segment (12), the first of second level encapsulation pole platform (4) lower end connects probe (41) and stretch across thread segment (12) Outside for thread segment (12) lower end；The second of third level encapsulation pole platform (5) lower end connects probe (51) and sequentially passes through the Second level package pole platform (4) and thread segment (12) stretch out in outside thread segment (12) lower end, and connect probe (41) side by side with first Distribution, forms arranged in dislocation, and this first connects probe (41) lower end and connect probe (51) lower end with second and flush.

6. a kind of LED pasting type LED light source structure according to claim 2, it is characterised in that: bracket (1) lower end It forms thread segment (12), the first of second level encapsulation pole platform (4) lower end connects probe (41) in thread segment (12) Center portion point stretches out in outside thread segment (12) lower end；The second of third level encapsulation pole platform (5) lower end connect probe (51) according to It is secondary to pass through second level encapsulation pole platform (4) and first connect probe (41) and stretch out in outside thread segment (12) lower end, the thread segment (12) probe (41) is connected with first, second is connected probe (51) and is formed coaxial assembly.

7. a kind of LED pasting type LED light source structure according to claim 5 or 6, it is characterised in that: the second level envelope Pole platform (4) and third level encapsulation pole platform (5) are filled T-shaped.

8. a kind of LED pasting type LED light source structure according to claim 5 or 6, it is characterised in that: the second level envelope Interval between dress pole platform (4) and bracket (1) is injection molded with the first insulation sleeve (6), which seals the second level Dress pole platform (4) is separated with bracket (1), and makes mutually insulated between it；Second level encapsulation pole platform (4) and the third level encapsulate pole Interval between platform (5) is injection molded with the second insulation sleeve (7), and second insulation sleeve (7) is by second level encapsulation pole platform (4) and the Three-level encapsulation pole platform (5) separates, and makes mutually insulated between it.