CN107859890A - A kind of multi-electrode type Omnibearing luminous LED light source and its support - Google Patents
A kind of multi-electrode type Omnibearing luminous LED light source and its support Download PDFInfo
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- CN107859890A CN107859890A CN201711284813.8A CN201711284813A CN107859890A CN 107859890 A CN107859890 A CN 107859890A CN 201711284813 A CN201711284813 A CN 201711284813A CN 107859890 A CN107859890 A CN 107859890A
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- 238000005538 encapsulation Methods 0.000 claims abstract description 113
- 238000004806 packaging method and process Methods 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims abstract description 4
- 239000000523 sample Substances 0.000 claims description 32
- 238000001746 injection moulding Methods 0.000 claims description 11
- 239000003086 colorant Substances 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract description 5
- 238000009434 installation Methods 0.000 description 8
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 208000024891 symptom Diseases 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
- F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
The present invention discloses a kind of multi-electrode type Omnibearing luminous LED light source and its support, and the multi-electrode type Omnibearing luminous LED light source includes：Support, some LED chips being installed on support and resin, mutually insulated and the multi-level packaging pole platform structure for turning on LED chip are provided with support, LED chip is installed on multi-level packaging pole platform structure surrounding and top, multi-level packaging pole platform structure includes taking shape in the first order encapsulation pole platform of pedestal upper end and stacked gradually in the second level encapsulation pole platform on first order encapsulation pole platform and third level encapsulation pole platform, first, second, third grade of encapsulation pole platform is respectively as first, second, third conductive electrode, mutually insulated between it；First, second electrode of the LED chip connects first, second grade of encapsulation pole platform respectively, either, first, second electrode of the LED chip connects first, third level encapsulation pole platform respectively, either, first, second electrode of the LED chip connects second, third grade of encapsulation pole platform respectively.
Description
Technical field：
The present invention relates to LED product technical field, refers in particular to a kind of multi-electrode type Omnibearing luminous LED light source and its support.
Background technology：
It is well known that traditional incandescent lamp energy consumption is higher, energy utilization rate is very low, probably only less than 1/10th
Energy becomes luminous energy, and other is all heat energy being wasted in vain.So people are trying every possible means with new light source always
To substitute incandescent lamp.Therefore, electricity-saving lamp just arises at the historic moment.For incandescent lamp being compared due to it, cheap and good making, so just
Substantial amounts of application has been obtained, has there is the trend for progressively substituting incandescent lamp.Electricity-saving lamp is luminous using electron excitation principle, relative to
Incandescent lamp, electricity-saving lamp have the advantages of power saving.But a shortcoming is exactly existing for electricity-saving lamp：Contain mercury in electricity-saving lamp, mercury is saving
Can be intermediation in fluorescent tube, no hydrargyrum energy-saving lamp would not light.Resulted in since so in electricity-saving lamp production process
With using having mercury pollution after discarded, in addition, electricity-saving lamp is still glassware, broken, bad transport, bad installation.Next, its
Power consumption or larger.Finally, electricity-saving lamp is easily damaged, short life.
And the developing direction of energy-saving illumination apparatus is exactly LED lamp at present.Relative to above-mentioned illuminator, LED has
Following advantage：
1st, save.The energy consumption of white LED lamp is only the 1/10 of incandescent lamp, and the 1/4 of electricity-saving lamp.
2nd, service life is grown.The life-span of LED up to more than 100,000 hours, significantly larger than incandescent lamp and electricity-saving lamp.
3rd, can be with frequent starting.If traditional electricity-saving lamp, incandescent lamp frequently start or turned off, filament will black,
Breaking down quickly, and LED will not.
4th, solid encapsulation, cold light Source Type is belonged to, so its easily transport and installation, can be installed in any miniature
In the equipment of closing, vibration is not afraid of, do not need substantially to consider radiating.
5th, it is environmentally friendly, without the harmful substance of mercury.The assembling parts of LED can be dismounted very easily, and recovery is convenient.
Based on These characteristics, LED will progressively substitute other illuminators.But LED lacks there is also certain
Fall into：There is very strong directionality because LED chip is luminous, the region that it illuminates is limited, rather than incandescent lamp, the light source of electricity-saving lamp
It is diverging.Described apply LED just needs solve this problem in normal lighting.At present common settling mode be
Installation plurality of LEDs in the Luminous lamp holder of one light fixture, different directions is corresponded to per LEDs, is thusly-formed the light of diverging.It is this
The shortcomings that mode, is apparent：Cost is high, because lamp holder needs to install multiple LED, makes assembling process complicate.As can be seen here,
The settling mode is only to cure the symptoms, not the disease, and does not solve the problems, such as that LED is omnibearing luminous from source.
In addition, the plurality of LEDs of installation is all series connection conducting in lamp luminescence lamp holder, it is all at work to light simultaneously
Or extinguish, it is unable to reach the purpose for adjusting that some LED are luminous or control some LED to extinguish, and particularly installs different colours
LED when, it is more difficult to dim, and larger puzzlement is caused to user.Although also there are some that LED is installed on into pcb board now
On lighted with controllable adjustment, still, it can only accomplish flat luminous and be unable to reach omnibearing luminous purpose.
In view of this, the present inventor proposes following technical scheme.
The content of the invention：
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of multi-electrode type Omnibearing luminous LED light source and
Its support.
In order to solve the above-mentioned technical problem, present invention employs the first following technical scheme：The comprehensive hair of the multi-electrode type
Light LED light source includes：Support, some LED chips being installed on support and the tree for being packaged in LED chip on support
Fat, mutually insulated and the multi-level packaging pole platform structure for turning on LED chip, the LED chip peace are provided with the support
Loaded on multi-level packaging pole platform structure surrounding and top, the multi-level packaging pole platform structure includes the first order for taking shape in pedestal upper end
Encapsulation pole platform and stack gradually in the second level encapsulation pole platform on first order encapsulation pole platform and third level encapsulation pole platform, this
First, second, third level encapsulates pole platform respectively as first, second, third conductive electrode, mutually insulated between it；The LED chip
First, second electrode connect respectively first, second grade encapsulation pole platform, either, first, second electrode of the LED chip
First, third level encapsulation pole platform is connected respectively, and either, first, second electrode of the LED chip connects second respectively, the
Three-level encapsulates pole platform.
Furthermore, in above-mentioned technical proposal, the pedestal lower end forms the thread segment for connecting, and the support
The first through hole through thread segment lower surface is offered downwards along first order encapsulation pole platform upper end；The second level encapsulates pole platform
Lower end, which has, first connects probe, and this first connects probe and be arranged in the first through hole, and stretches out in outside thread segment lower surface,
And insulated between second level encapsulation pole platform and support by the first felt pad；Second level encapsulation pole platform is opened downwards along its upper surface
Provided with the second through hole that probe lower surface is connected through first；The third level encapsulation pole platform lower end has second to connect probe,
This second connects probe and is from top to bottom arranged in second through hole, and stretches out in first and connect outside probe lower surface, and the 3rd
Insulated between level encapsulation pole platform and second level encapsulation pole platform by the second felt pad.
Furthermore, in above-mentioned technical proposal, first felt pad is integrally attached to the second level by injection molding manner
Encapsulate between pole platform and the support；Second felt pad is integrally attached to the third level by injection molding manner and encapsulates pole platform and the
Between the platform of second level package pole.
Furthermore, in above-mentioned technical proposal, the stent outer forms locating notch；Some LED chips are at least
Include the LED chip of two different colours.
Furthermore, in above-mentioned technical proposal, the longitudinal section of the second level encapsulation pole platform and third level encapsulation pole platform
It is in T shape；The first order encapsulation pole platform and second level encapsulation pole platform upper part, the third level encapsulate pole platform upper part
Cross section is polygon.
Furthermore, in above-mentioned technical proposal, first order encapsulation pole platform and second level encapsulation pole platform upper part,
The cross section of third level encapsulation pole platform upper part is decagon.
In order to solve the above-mentioned technical problem, present invention employs following second of technical scheme：The comprehensive hair of the multi-electrode type
Mutually insulated and the multi-level packaging pole platform structure for turning on LED chip, the multi-level packaging are provided with the support of light LED light source
Pole platform structure includes the first order encapsulation pole platform for taking shape in pedestal upper end and stacked gradually on first order encapsulation pole platform
The second level encapsulates pole platform and third level encapsulation pole platform, and this first, second, third grade encapsulation pole platform is respectively as first, second, the
Three conductive electrodes, mutually insulated between it；First, second electrode of the LED chip connects first, second grade of encapsulation pole respectively
Platform, either, first, second electrode of the LED chip connect first, third level encapsulation pole platform respectively, either, described
First, second electrode of LED chip connects second, third grade of encapsulation pole platform respectively.
Furthermore, in above-mentioned technical proposal, the pedestal lower end forms the thread segment for connecting, and the support
The first through hole through thread segment lower surface is offered downwards along first order encapsulation pole platform upper end；The second level encapsulates pole platform
Lower end, which has, first connects probe, and this first connects probe and be arranged in the first through hole, and stretches out in outside thread segment lower surface,
And insulated between second level encapsulation pole platform and support by the first felt pad；Second level encapsulation pole platform is opened downwards along its upper surface
Provided with the second through hole that probe lower surface is connected through first；The third level encapsulation pole platform lower end has second to connect probe,
This second connects probe and is from top to bottom arranged in second through hole, and stretches out in first and connect outside probe lower surface, and the 3rd
Insulated between level encapsulation pole platform and second level encapsulation pole platform by the second felt pad.
Furthermore, in above-mentioned technical proposal, first felt pad is integrally attached to the second level by injection molding manner
Encapsulate between pole platform and the support；Second felt pad is integrally attached to the third level by injection molding manner and encapsulates pole platform and the
Between the platform of second level package pole；The stent outer forms locating notch.
Furthermore, in above-mentioned technical proposal, the longitudinal section of the second level encapsulation pole platform and third level encapsulation pole platform
It is in T shape；The first order encapsulation pole platform and second level encapsulation pole platform upper part, the third level encapsulate pole platform upper part
Cross section is polygon.
After adopting the above technical scheme, the present invention has the advantages that compared with prior art：The present invention is by LED
Chip is installed on multi-level packaging pole platform structure surrounding and top, can realize the present invention with this omnibearing luminous.The present invention passes through
Multi-level packaging pole platform structure can make multiple LED chips be connected in series and/or be connected in parallel, reach controllable first, second,
Any two in third level encapsulation pole platform is powered, to light the LED chip being attached thereto, you can realize and adjust some LED cores
Piece is luminous or controls the purpose of some LED chips extinguishings, controllable to light when particularly installing the LED chip of different colours
The LED chip of different colours, reach control glow color, meet different lighting requirements, the order present invention has extremely strong market
Competitiveness.In addition, the present invention can be widely used in various illuminators, relatively current LED lamp, it has volume
Small, illumination orientations are wide, plurality of advantages easy for installation.
Brief description of the drawings：
Fig. 1 is the stereogram of the present invention；
Fig. 2 is the sectional view of the present invention；
Fig. 3 is the three-dimensional exploded view of the present invention；
Fig. 4 is the stereogram of medium-height trestle of the present invention；
Fig. 5 is medium-height trestle of the present invention and the installation diagram of LED chip；
Fig. 6 is Fig. 5 top view.
Embodiment：
With reference to specific embodiments and the drawings, the present invention is further described.
It is a kind of multi-electrode type Omnibearing luminous LED light source, it includes as shown in Fig. 1-6：Support 1, some it is installed on support
LED chip 2 on 1 and the resin 3 for LED chip 2 being packaged on support 1, are provided with mutually insulated on the support 1
And for turning on the multi-level packaging pole platform structure 100 of LED chip 2, the LED chip 2 is installed on multi-level packaging pole platform structure 100
Surrounding and top, it can realize the present invention with this omnibearing luminous.The present invention can be widely used in various illuminators, phase
To current LED lamp, it has small volume, and illumination orientations are wide, plurality of advantages easy for installation.
Some LED chips 2 comprise at least the LED chip 2 for having two different colours, to meet different lighting requirements.
The generally use epoxy resin of resin 3, it has a moisture-proof, insulating properties, the advantages that high mechanical strength, to LED
Chip 2 sends the refractive index and transmissivity height of light.
The multi-level packaging pole platform structure 100 include take shape in the upper end of support 1 the first order encapsulation pole platform 11 and according to
The secondary second level encapsulation pole platform 4 being laminated on first order encapsulation pole platform 11 and third level encapsulation pole platform 5, this first, second, third
Level encapsulation pole platform 11,4,5 is respectively as first, second, third conductive electrode, mutually insulated between it；The of the LED chip 2
First, second electrode connects first, second grade of encapsulation pole platform 11,4, either, first, second electrode of the LED chip 2 respectively
First, third level encapsulation pole platform 11,5 is connected respectively, and either, first, second electrode of the LED chip 2 connects the respectively
2nd, third level encapsulation pole platform 4,5.That is, first, second electrode of the LED chip 2 can connect first, second grade
Pole platform 11,4 is encapsulated, first, third level encapsulation pole platform 11,5 can also be connected, second, third grade of encapsulation pole platform can also be connected
4th, 5, by multi-level packaging pole platform structure 100 multiple LED chips 2 can be made to be connected in series and/or be connected in parallel with this, reached
Any two in controllable first, second, third grade of encapsulation pole platform 11,4,5 is powered, to light the LED chip being attached thereto
2, you can realize the purpose for adjusting that some LED chips are luminous or control some LED chips to extinguish, different colours are particularly installed
LED chip when, the controllable LED chip for lighting different colours, reach control glow color, meet different lighting requirements,
The order present invention has the extremely strong market competitiveness.
The lower end of support 1 forms the thread segment 12 for connecting, and the support 1 encapsulates the upper end of pole platform 11 along the first order
The first through hole 10 through the lower surface of thread segment 12 is offered downwards；Second level encapsulation pole platform 4 lower end has first to lead
Probe 41 is connect, this first connects probe 41 and is arranged in the first through hole 10, and stretches out in outside the lower surface of thread segment 12, and second
Insulated between level encapsulation pole platform 4 and support 1 by the first felt pad 61；Second level encapsulation pole platform 4 is opened downwards along its upper surface
Provided with the second through hole 40 that the lower surface of probe 41 is connected through first；Third level encapsulation pole platform 5 lower end has second to connect
Probe 51, this second connects probe 51 and is from top to bottom arranged in second through hole 40, and stretches out in first and connect under probe 41
Outside end face, and insulated between third level encapsulation pole platform 5 and second level encapsulation pole platform 4 by the second felt pad 62, the thread segment
12 are used to be connected with extraneous lamp holder or lamp socket, and formation electrically conducts, and described first connects probe 41, second connects probe 51
And it is electrically connected with lamp holder or lamp socket.
First felt pad 61 is integrally attached to the second level by injection molding manner and encapsulated between pole platform 4 and the support 1；
Second felt pad 62 is integrally attached to the third level by injection molding manner and encapsulated between pole platform 5 and second level encapsulation pole platform 4, this
Assembly method can ensure that structure is more firm between the support 1 and second level encapsulation pole platform 4 and third level encapsulation pole platform 5, makes
It is longer with the life-span.
The outside of support 1 forms locating notch, with this in above-mentioned first felt pad 61 of injection molding, the second felt pad
When 62, with locating support 1, it can prevent that support 1 from rotating or movement, guarantee first are exhausted by tool and locating notch butt junction location
The injection quality of edge pad 61, the second felt pad 62.
The longitudinal section of the second level encapsulation pole platform 4 and third level encapsulation pole platform 5 is in T shape；The first order encapsulation
Pole platform 11 and second level encapsulation pole platform 4 upper part, the cross section of third level encapsulation pole platform 5 upper part are polygon, with
This can install at least one LED chip on a side, and the top of third level encapsulation pole platform 5 is provided with least one LED chip,
Reach omnibearing luminous with this.With in the present embodiment, first order encapsulation pole platform 11 and second level encapsulation pole platform 4 upper end
Divide, the cross section of third level encapsulation pole platform 5 upper part is decagon.
LED chip 2 is installed on the surrounding of multi-level packaging pole platform structure 100 and top by the present invention, can be made with this of the invention real
It is existing omnibearing luminous.The present invention can be such that multiple LED chips 2 are connected in series and/or simultaneously by multi-level packaging pole platform structure 100
Connection connection, any two reached in controllable first, second, third grade of encapsulation pole platform 11,4,5 are powered, connected therewith with lighting
The LED chip 2 connect, you can realize the purpose for adjusting that some LED chips are luminous or control some LED chips to extinguish, particularly
When the LED chip of different colours is installed, the controllable LED chip for lighting different colours, reach control glow color, meet different
Lighting requirements, order the present invention there is the extremely strong market competitiveness.In addition, the present invention can be widely used in various illuminators
In, relatively current LED lamp, it has small volume, and illumination orientations are wide, plurality of advantages easy for installation.
Certainly, the foregoing is only the specific embodiment of the present invention, be not to limit the scope of the present invention, it is all according to
The equivalent change or modification that construction, feature and principle described in scope of the present invention patent are done, all should be included in Shen of the present invention
Please be in the scope of the claims.
Claims (10)
1. a kind of multi-electrode type Omnibearing luminous LED light source, it includes：Support (1), some LED chips being installed on support (1)
And the resin (3) for being packaged in LED chip (2) on support (1) (2), it is characterised in that：Set on the support (1)
There are mutually insulated and the multi-level packaging pole platform structure (100) for turning on LED chip (2), the LED chip (2) is installed on more
Level encapsulation pole platform structure (100) surrounding and top, the multi-level packaging pole platform structure (100), which includes, takes shape in support (1) upper end
First order encapsulation pole platform (11) and stack gradually in the second level encapsulation pole platform (4) in first order encapsulation pole platform (11) and the
Three-level encapsulation pole platform (5), this first, second, third grade encapsulation pole platform (11,4,5) are conductive respectively as first, second, third
Pole, mutually insulated between it；First, second electrode of the LED chip (2) connects first, second grade of encapsulation pole platform respectively
(11,4), either, first, second electrode of the LED chip (2) connect first, third level encapsulation pole platform (11,5) respectively,
Either, first, second electrode of the LED chip (2) connects second, third grade of encapsulation pole platform (4,5) respectively.
A kind of 2. multi-electrode type Omnibearing luminous LED light source according to claim 1, it is characterised in that：Under the support (1)
End forms the thread segment (12) for connecting, and the support (1) offers downwards along first order encapsulation pole platform (11) upper end
First through hole (10) through thread segment (12) lower surface；Described second level encapsulation pole platform (4) lower end has first to connect probe
(41), this first connects probe (41) and is arranged in the first through hole (10), and stretches out in outside thread segment (12) lower surface, and
Insulated between second level package pole platform (4) and support (1) by the first felt pad (61)；Second level encapsulation pole platform (4) is along thereon
End face is offered downwards through the first the second through hole (40) for connecting probe (41) lower surface；The third level encapsulation pole platform (5)
Lower end, which has, second connects probe (51), and this second connects probe (51) and be from top to bottom arranged in second through hole (40), and
Stretch out in first to connect outside probe (41) lower surface, and pass through between third level encapsulation pole platform (5) and second level encapsulation pole platform (4)
Second felt pad (62) insulate.
A kind of 3. multi-electrode type Omnibearing luminous LED light source according to claim 2, it is characterised in that：First insulation
Pad (61) is integrally attached to the second level by injection molding manner and encapsulated between pole platform (4) and the support (1)；Second felt pad
(62) third level is integrally attached to by injection molding manner to encapsulate between pole platform (5) and second level encapsulation pole platform (4).
A kind of 4. multi-electrode type Omnibearing luminous LED light source according to claim 1, it is characterised in that：The support (1) is outside
Side forms locating notch；Some LED chips (2) comprise at least the LED chip (2) for having two different colours.
A kind of 5. multi-electrode type Omnibearing luminous LED light source according to claim 1-4 any one, it is characterised in that：Institute
The longitudinal section for stating second level encapsulation pole platform (4) and third level encapsulation pole platform (5) is in T shape；The first order encapsulates pole platform
(11) and second level encapsulation pole platform (4) upper part, the cross section of third level encapsulation pole platform (5) upper part are polygon.
A kind of 6. multi-electrode type Omnibearing luminous LED light source according to claim 5, it is characterised in that：The first order envelope
It is ten to fill pole platform (11) and second level encapsulation pole platform (4) upper part, the cross section of third level encapsulation pole platform (5) upper part
Side shape.
A kind of 7. support of multi-electrode type Omnibearing luminous LED light source, it is characterised in that：It is provided with the support (1) mutually absolutely
Edge is simultaneously used for the multi-level packaging pole platform structure (100) for turning on LED chip (2), and the multi-level packaging pole platform structure (100) includes into
The first order of the type in support (1) upper end encapsulates pole platform (11) and stacked gradually in the second level on first order encapsulation pole platform (11)
Pole platform (4) and third level encapsulation pole platform (5) are encapsulated, this first, second, third grade encapsulates pole platform (11,4,5) respectively as the
First, second, third conductive electrode, mutually insulated between it；First, second electrode of the LED chip (2) connects first respectively,
Second level encapsulation pole platform (11,4), either, first, second electrode of the LED chip (2) connects the first, third level respectively
Pole platform (11,5) is encapsulated, either, first, second electrode of the LED chip (2) connects second, third grade of encapsulation pole respectively
Platform (4,5).
A kind of 8. support of multi-electrode type Omnibearing luminous LED light source according to claim 7, it is characterised in that：The branch
Frame (1) lower end forms the thread segment (12) for connecting, and the support (1) encapsulates pole platform (11) upper end downwards along the first order
Offer the first through hole (10) through thread segment (12) lower surface；Described second level encapsulation pole platform (4) lower end has first to lead
Probe (41) is connect, this first connects probe (41) and be arranged in the first through hole (10), and stretches out in thread segment (12) lower surface
Outside, and between second level encapsulation pole platform (4) and support (1) insulated by the first felt pad (61)；Second level encapsulation pole platform (4)
Offered downwards through the first the second through hole (40) for connecting probe (41) lower surface along its upper surface；The third level encapsulates pole
Platform (5) lower end, which has, second connects probe (51), and this second connects probe (51) and be from top to bottom arranged in second through hole (40)
In, and stretch out in first and connect outside probe (41) lower surface, and third level encapsulation pole platform (5) and second level encapsulation pole platform (4) it
Between pass through the second felt pad (62) insulate.
A kind of 9. support of multi-electrode type Omnibearing luminous LED light source according to claim 8, it is characterised in that：Described
One felt pad (61) is integrally attached to the second level by injection molding manner and encapsulated between pole platform (4) and the support (1)；Described second
Felt pad (62) is integrally attached to the third level by injection molding manner and encapsulated between pole platform (5) and second level encapsulation pole platform (4)；It is described
Locating notch is formed on the outside of support (1).
10. a kind of support of multi-electrode type Omnibearing luminous LED light source according to claim 7-9 any one, its feature
It is：The longitudinal section of the second level encapsulation pole platform (4) and third level encapsulation pole platform (5) is in T shape；The first order encapsulation
Pole platform (11) and second level encapsulation pole platform (4) upper part, the cross section of third level encapsulation pole platform (5) upper part are polygon
Shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201711284813.8A CN107859890B (en) | 2017-12-07 | 2017-12-07 | Multipole type omnibearing luminous LED light source and bracket thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711284813.8A CN107859890B (en) | 2017-12-07 | 2017-12-07 | Multipole type omnibearing luminous LED light source and bracket thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN107859890B CN107859890B (en) | 2024-04-12 |
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| CN201711284813.8A Active CN107859890B (en) | 2017-12-07 | 2017-12-07 | Multipole type omnibearing luminous LED light source and bracket thereof |
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| CN108980785A (en) * | 2018-04-23 | 2018-12-11 | 东莞市莱硕光电科技有限公司 | A kind of LED support manufacture craft |
| WO2019148337A1 (en) * | 2018-01-31 | 2019-08-08 | 王进 | Multipole omnidirectional illumination led light source and support frame thereof |
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|---|---|
| CN107859890B (en) | 2024-04-12 |
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