CN107859890B - Multipole type omnibearing luminous LED light source and bracket thereof - Google Patents
Multipole type omnibearing luminous LED light source and bracket thereof Download PDFInfo
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- CN107859890B CN107859890B CN201711284813.8A CN201711284813A CN107859890B CN 107859890 B CN107859890 B CN 107859890B CN 201711284813 A CN201711284813 A CN 201711284813A CN 107859890 B CN107859890 B CN 107859890B
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- 230000005405 multipole Effects 0.000 title claims description 9
- 238000004806 packaging method and process Methods 0.000 claims abstract description 186
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims abstract description 6
- 239000000523 sample Substances 0.000 claims description 32
- 238000001746 injection moulding Methods 0.000 claims description 12
- 239000003086 colorant Substances 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 239000000243 solution Substances 0.000 description 10
- 238000004020 luminiscence type Methods 0.000 description 6
- 230000008033 biological extinction Effects 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 208000024891 symptom Diseases 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
- F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention discloses a multi-polar all-directional luminous LED light source and a bracket thereof, wherein the multi-polar all-directional luminous LED light source comprises: the LED packaging structure comprises a bracket, a plurality of LED chips and resin, wherein the LED chips and the resin are arranged on the bracket, the bracket is provided with a multi-stage packaging electrode platform structure which is mutually insulated and is used for conducting the LED chips, the LED chips are arranged on the periphery and the top of the multi-stage packaging electrode platform structure, the multi-stage packaging electrode platform structure comprises a first-stage packaging electrode platform formed at the upper end of the bracket, a second-stage packaging electrode platform and a third-stage packaging electrode platform which are sequentially stacked on the first-stage packaging electrode platform, and the first, second and third-stage packaging electrode platforms are respectively used as a first, second and third conducting electrode and are mutually insulated; the first electrode and the second electrode of the LED chip are respectively connected with the first-stage packaging electrode platform and the second-stage packaging electrode platform in a conducting mode, or the first electrode and the second electrode of the LED chip are respectively connected with the first-stage packaging electrode platform and the third-stage packaging electrode platform in a conducting mode, or the first electrode and the second electrode of the LED chip are respectively connected with the second-stage packaging electrode platform and the third-stage packaging electrode platform in a conducting mode.
Description
Technical field:
the invention relates to the technical field of LED products, in particular to a multi-polar all-directional luminous LED light source and a bracket thereof.
The background technology is as follows:
it is well known that conventional incandescent lamps have relatively high energy consumption and very low energy utilization, and about one tenth of the energy is converted into light energy, while the other energy is wasted. There is a constant desire to replace incandescent lamps with new light sources. Thus, energy saving lamps have been developed. Since it is inexpensive and well manufactured compared to incandescent lamps, it has been applied in a large number and has a tendency to gradually replace incandescent lamps. The energy-saving lamp emits light by adopting an electronic excitation principle, and has the advantage of saving electricity compared with an incandescent lamp. One disadvantage of energy-saving lamps is that: the energy-saving lamp contains mercury which plays an intermediate role in the energy-saving lamp tube, and the energy-saving lamp can not emit light without the mercury. In addition, the energy-saving lamp is still a glass product, is easy to crush, is not easy to transport and is not easy to install. Second, the power consumption is still large. Finally, the energy-saving lamp is easy to damage and has short service life.
The development direction of the current energy-saving lighting appliance is an LED lamp. Compared with the lighting lamp, the LED lamp has the following advantages:
1. energy saving. The energy consumption of the white light LED lamp is only 1/10 of that of an incandescent lamp, and the energy consumption of the white light LED lamp is 1/4 of that of an energy-saving lamp.
2. Long service life. The service life of the LED lamp can reach more than 10 ten thousand hours, which is far higher than that of an incandescent lamp and an energy-saving lamp.
3. May be started frequently. If the traditional energy-saving lamp and the incandescent lamp are frequently started or turned off, the filament can be blacked and broken quickly, and the LED lamp cannot be broken.
4. The solid state package is of the cold light source type, so that it is very convenient to transport and install, can be installed in any miniature and enclosed equipment, is not afraid of vibration, and basically does not consider heat dissipation.
5. Environmental protection, no harmful substances of mercury. The assembly parts of the LED lamp can be easily disassembled and assembled, and are convenient to recycle.
Based on the characteristics, the LED lamp gradually replaces other lighting fixtures. However, LED lamps also have certain drawbacks: because the LED chip emits light with strong directivity, the illuminated area is limited, and the light source of the LED chip is not divergent like an incandescent lamp and an energy-saving lamp. The application of LED lamps in daily lighting requires a solution to this problem. The common solution is to install a plurality of LEDs in the lighting lamp cap of a lamp, each LED corresponding to a different direction, so as to form divergent light. The disadvantages of this approach are apparent: the cost is high, and a plurality of LEDs are required to be installed on the lamp cap, so that the assembly process is complicated. Therefore, the solution is only to treat the symptoms and not the root cause, and the problem of the omnibearing light emission of the LED is not solved from the source.
In addition, a plurality of LEDs arranged in the lighting lamp cap of the lamp are connected in series, and are simultaneously turned on or turned off when the lamp works, so that the aim of adjusting the lighting of some LEDs or controlling the extinction of some LEDs can not be achieved, and particularly when LEDs with different colors are arranged, the lamp is more difficult to adjust the light, and great trouble is caused to a user. Although some LEDs are mounted on a PCB to controllably adjust light emission, only planar light emission is possible, but the purpose of omnidirectional light emission cannot be achieved.
In view of this, the present inventors have proposed the following means.
The invention comprises the following steps:
the invention aims to overcome the defects of the prior art and provides a multi-pole all-directional luminous LED light source and a bracket thereof.
In order to solve the technical problems, the invention adopts the following first technical scheme: the multi-polar omnidirectional luminous LED light source comprises: the LED packaging structure comprises a bracket, a plurality of LED chips arranged on the bracket and resin used for packaging the LED chips on the bracket, wherein the bracket is provided with a multi-stage packaging electrode platform structure which is mutually insulated and used for conducting the LED chips, the LED chips are arranged on the periphery and the top of the multi-stage packaging electrode platform structure, the multi-stage packaging electrode platform structure comprises a first-stage packaging electrode platform formed at the upper end of the bracket, a second-stage packaging electrode platform and a third-stage packaging electrode platform which are sequentially stacked on the first-stage packaging electrode platform, and the first, second and third-stage packaging electrode platforms are respectively used as a first, second and third conducting electrode and are mutually insulated; the first electrode and the second electrode of the LED chip are respectively connected with the first-stage packaging electrode platform and the second-stage packaging electrode platform in a conducting mode, or the first electrode and the second electrode of the LED chip are respectively connected with the first-stage packaging electrode platform and the third-stage packaging electrode platform in a conducting mode, or the first electrode and the second electrode of the LED chip are respectively connected with the second-stage packaging electrode platform and the third-stage packaging electrode platform in a conducting mode.
In the above technical solution, a threaded section for guiding connection is formed at the lower end of the bracket, and a first through hole penetrating through the lower end surface of the threaded section is formed downwards along the upper end surface of the first-stage packaging electrode table; the lower end of the second-stage packaging electrode table is provided with a first guide probe, the first guide probe penetrates through the first through hole and extends out of the lower end face of the threaded section, and the second-stage packaging electrode table is insulated from the bracket through a first insulating pad; the second-stage packaging electrode platform is provided with a second through hole which penetrates through the lower end face of the first guide probe downwards along the upper end face of the second-stage packaging electrode platform; the lower end of the third-stage packaging electrode platform is provided with a second guide probe, the second guide probe penetrates through the second through hole from top to bottom and extends out of the lower end face of the first guide probe, and the third-stage packaging electrode platform and the second-stage packaging electrode platform are insulated through a second insulating pad.
Furthermore, in the above technical solution, the first insulating pad is integrally fixed between the second-stage packaging electrode table and the bracket by injection molding; the second insulating pad is integrally fixed between the third-stage packaging electrode table and the second-stage packaging electrode table in an injection molding mode.
Furthermore, in the above technical solution, a positioning notch is formed on the outer side of the bracket; the plurality of LED chips at least comprise two LED chips with different colors.
In the above technical solution, the longitudinal sections of the second stage packaging electrode table and the third stage packaging electrode table are T-shaped; the cross sections of the upper end parts of the first-stage packaging electrode table, the second-stage packaging electrode table and the third-stage packaging electrode table are polygonal.
In the above technical scheme, the cross sections of the upper end parts of the first stage packaging electrode table, the second stage packaging electrode table and the third stage packaging electrode table are decagonal.
In order to solve the technical problems, the invention adopts the following second technical scheme: the support of the multi-pole type omnibearing luminous LED light source is provided with a multi-level packaging pole platform structure which is mutually insulated and used for conducting an LED chip, the multi-level packaging pole platform structure comprises a first-level packaging pole platform formed at the upper end of the support, and a second-level packaging pole platform and a third-level packaging pole platform which are sequentially stacked on the first-level packaging pole platform, wherein the first-level packaging pole platform, the second-level packaging pole platform and the third-level packaging pole platform are respectively used as a first conducting electrode, a second conducting electrode and a third conducting electrode which are mutually insulated; the first electrode and the second electrode of the LED chip are respectively connected with the first-stage packaging electrode platform and the second-stage packaging electrode platform in a conducting mode, or the first electrode and the second electrode of the LED chip are respectively connected with the first-stage packaging electrode platform and the third-stage packaging electrode platform in a conducting mode, or the first electrode and the second electrode of the LED chip are respectively connected with the second-stage packaging electrode platform and the third-stage packaging electrode platform in a conducting mode.
In the above technical solution, a threaded section for guiding connection is formed at the lower end of the bracket, and a first through hole penetrating through the lower end surface of the threaded section is formed downwards along the upper end surface of the first-stage packaging electrode table; the lower end of the second-stage packaging electrode table is provided with a first guide probe, the first guide probe penetrates through the first through hole and extends out of the lower end face of the threaded section, and the second-stage packaging electrode table is insulated from the bracket through a first insulating pad; the second-stage packaging electrode platform is provided with a second through hole which penetrates through the lower end face of the first guide probe downwards along the upper end face of the second-stage packaging electrode platform; the lower end of the third-stage packaging electrode platform is provided with a second guide probe, the second guide probe penetrates through the second through hole from top to bottom and extends out of the lower end face of the first guide probe, and the third-stage packaging electrode platform and the second-stage packaging electrode platform are insulated through a second insulating pad.
Furthermore, in the above technical solution, the first insulating pad is integrally fixed between the second-stage packaging electrode table and the bracket by injection molding; the second insulating pad is integrally fixed between the third-stage packaging electrode table and the second-stage packaging electrode table in an injection molding mode; and a positioning notch is formed on the outer side of the bracket.
In the above technical solution, the longitudinal sections of the second stage packaging electrode table and the third stage packaging electrode table are T-shaped; the cross sections of the upper end parts of the first-stage packaging electrode table, the second-stage packaging electrode table and the third-stage packaging electrode table are polygonal.
By adopting the technical scheme, compared with the prior art, the invention has the following beneficial effects: according to the invention, the LED chips are arranged around and at the top of the multi-stage packaging electrode table structure, so that the LED light-emitting device can emit light in all directions. According to the invention, the LED chips can be connected in series and/or in parallel through the multi-stage packaging electrode platform structure, so that any two of the first, second and third stage packaging electrode platforms can be controlled to be electrified to light the LED chips connected with the LED chips, the purposes of adjusting the luminescence of some LED chips or controlling the extinction of some LED chips can be realized, and particularly when LED chips with different colors are installed, the LED chips with different colors can be controlled to be lightened, the luminescence color can be controlled, the different luminescence requirements can be met, and the LED packaging electrode has extremely strong market competitiveness. In addition, the LED lamp can be widely applied to various lighting lamps, and has the advantages of small size, wide lighting direction and convenience in installation compared with the existing LED lamps.
Description of the drawings:
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is an exploded perspective view of the present invention;
FIG. 4 is a perspective view of a stent of the present invention;
FIG. 5 is an assembly view of a bracket and an LED chip according to the present invention;
fig. 6 is a top view of fig. 5.
The specific embodiment is as follows:
the invention will be further described with reference to specific examples and figures.
1-6, a multi-pole omnibearing luminous LED light source, comprising: the LED lamp comprises a bracket 1, a plurality of LED chips 2 arranged on the bracket 1 and resin 3 for packaging the LED chips 2 on the bracket 1, wherein the bracket 1 is provided with a multi-stage packaging electrode table structure 100 which is mutually insulated and used for conducting the LED chips 2, and the LED chips 2 are arranged on the periphery and the top of the multi-stage packaging electrode table structure 100, so that the LED lamp can realize omnibearing light emission. The LED lamp can be widely applied to various lighting lamps, and has the advantages of small volume, wide lighting direction and convenience in installation compared with the existing LED lamps.
The plurality of LED chips 2 at least comprise two LED chips 2 with different colors so as to meet different lighting requirements.
The resin 3 is usually an epoxy resin, and has the advantages of moisture resistance, insulation, high mechanical strength, and the like, and has a high refractive index and transmittance for light emitted from the LED chip 2.
The multi-stage packaging electrode table structure 100 comprises a first-stage packaging electrode table 11 formed at the upper end of the bracket 1, and a second-stage packaging electrode table 4 and a third-stage packaging electrode table 5 which are sequentially stacked on the first-stage packaging electrode table 11, wherein the first, second and third-stage packaging electrode tables 11, 4 and 5 are respectively used as a first, second and third conducting electrodes and are mutually insulated; the first and second electrodes of the LED chip 2 are respectively connected to the first and second stage packaging electrode platforms 11 and 4, or the first and second electrodes of the LED chip 2 are respectively connected to the first and third stage packaging electrode platforms 11 and 5, or the first and second electrodes of the LED chip 2 are respectively connected to the second and third stage packaging electrode platforms 4 and 5. That is, the first and second electrodes of the LED chip 2 may be connected to the first and second stage package electrode bases 11 and 4, or may be connected to the first and third stage package electrode bases 11 and 5, or may be connected to the second and third stage package electrode bases 4 and 5, so that the multiple LED chips 2 may be connected in series and/or in parallel through the multi-stage package electrode base structure 100, so as to control any two of the first, second and third stage package electrode bases 11, 4 and 5 to be electrified, so as to light the LED chip 2 connected therewith, thereby achieving the purpose of adjusting the light emission of some LED chips or controlling the extinction of some LED chips, especially when different color LED chips are mounted, the LED chips with different colors may be controlled to be lightened, thereby achieving the control of the light emission colors, meeting the different light emission requirements, and making the present invention have extremely strong market competitiveness.
The lower end of the bracket 1 is provided with a threaded section 12 for guiding connection, and the bracket 1 is provided with a first through hole 10 which penetrates through the lower end surface of the threaded section 12 downwards along the upper end surface of the first-stage packaging electrode table 11; the lower end of the second-stage packaging electrode platform 4 is provided with a first guide probe 41, the first guide probe 41 penetrates through the first through hole 10 and extends out of the lower end surface of the threaded section 12, and the second-stage packaging electrode platform 4 is insulated from the bracket 1 through a first insulating pad 61; the second-stage packaging electrode platform 4 is provided with a second through hole 40 which penetrates through the lower end surface of the first guide probe 41 downwards along the upper end surface; the lower end of the third stage packaging electrode table 5 is provided with a second conductive probe 51, the second conductive probe 51 is arranged in the second through hole 40 from top to bottom in a penetrating way and extends out of the lower end surface of the first conductive probe 41, the third stage packaging electrode table 5 and the second stage packaging electrode table 4 are insulated by a second insulating pad 62, the thread section 12 is used for being connected with an external lamp cap or lamp holder and forming electrical conduction, and the first conductive probe 41 and the second conductive probe 51 are also electrically connected with the lamp cap or the lamp holder.
The first insulating pad 61 is integrally fixed between the second-stage packaging electrode table 4 and the bracket 1 in an injection molding mode; the second insulating pad 62 is integrally fixed between the third-stage packaging electrode table 5 and the second-stage packaging electrode table 4 in an injection molding manner, and the assembly manner can ensure that the structure between the bracket 1 and the second-stage packaging electrode table 4 and the third-stage packaging electrode table 5 is more stable and the service life is longer.
The outside shaping of support 1 has the location breach to when above-mentioned first insulating pad 61 of injection moulding, second insulating pad 62, accessible tool is located with the butt joint of location breach, in order to locate support 1, prevents support 1 rotation or removal, guarantees the injection moulding quality of first insulating pad 61, second insulating pad 62.
The longitudinal sections of the second-stage packaging electrode table 4 and the third-stage packaging electrode table 5 are T-shaped; the cross sections of the upper end parts of the first-stage packaging electrode table 11, the second-stage packaging electrode table 4 and the third-stage packaging electrode table 5 are polygonal, so that at least one LED chip can be mounted on one side, and at least one LED chip is mounted on the top of the third-stage packaging electrode table 5, so that all-dimensional light emission is achieved. In this embodiment, the cross sections of the upper end portions of the first level packaging electrode table 11, the second level packaging electrode table 4 and the third level packaging electrode table 5 are all decagonal.
The LED chip 2 is arranged around and at the top of the multi-stage packaging electrode platform structure 100, so that the LED light-emitting device can emit light in all directions. The invention can connect a plurality of LED chips 2 in series and/or in parallel through the multi-stage packaging electrode platform structure 100, so that any two of the first, second and third stage packaging electrode platforms 11, 4 and 5 can be controlled to be electrified to light the LED chips 2 connected with the LED chips, the aim of adjusting the luminescence of some LED chips or controlling the extinction of some LED chips can be realized, and particularly when LED chips with different colors are arranged, the LED chips with different colors can be controlled to be lightened, the luminescence colors can be controlled, different luminescence requirements can be met, and the LED packaging electrode platform has extremely strong market competitiveness. In addition, the LED lamp can be widely applied to various lighting lamps, and has the advantages of small size, wide lighting direction and convenience in installation compared with the existing LED lamps.
It is understood that the foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, but rather is to be accorded the full scope of all such modifications and equivalent structures, features and principles as set forth herein.
Claims (8)
1. A multi-polar omnidirectional light emitting LED light source, comprising: support (1), a plurality of LED chip (2) of installing on support (1) and be used for encapsulating resin (3) on support (1) with LED chip (2), its characterized in that: the LED packaging structure comprises a support (1), wherein a multi-stage packaging electrode platform structure (100) which is mutually insulated and used for conducting an LED chip (2) is arranged on the periphery and the top of the multi-stage packaging electrode platform structure (100), the multi-stage packaging electrode platform structure (100) comprises a first-stage packaging electrode platform (11) formed at the upper end of the support (1), a second-stage packaging electrode platform (4) and a third-stage packaging electrode platform (5) which are sequentially stacked on the first-stage packaging electrode platform (11), and the first, second and third-stage packaging electrode platforms (11, 4 and 5) are respectively used as a first, second and third conducting electrode and are mutually insulated; the first electrode and the second electrode of the LED chip (2) are respectively connected with the first-stage packaging electrode platform and the second-stage packaging electrode platform (11 and 4), or the first electrode and the second electrode of the LED chip (2) are respectively connected with the first-stage packaging electrode platform and the third-stage packaging electrode platform (11 and 5), or the first electrode and the second electrode of the LED chip (2) are respectively connected with the second-stage packaging electrode platform and the third-stage packaging electrode platform (4 and 5);
the lower end of the bracket (1) is provided with a threaded section (12) for conducting connection, and the bracket (1) is provided with a first through hole (10) penetrating through the lower end surface of the threaded section (12) downwards along the upper end surface of the first-stage packaging electrode table (11); the lower end of the second-stage packaging electrode table (4) is provided with a first guide probe (41), the first guide probe (41) penetrates through the first through hole (10) and extends out of the lower end face of the threaded section (12), and the second-stage packaging electrode table (4) is insulated from the bracket (1) through a first insulating pad (61); the second-stage packaging electrode table (4) is provided with a second through hole (40) which penetrates through the lower end surface of the first guide probe (41) downwards along the upper end surface of the second-stage packaging electrode table; the lower end of the third-stage packaging electrode platform (5) is provided with a second guide connection probe (51), the second guide connection probe (51) penetrates through the second through hole (40) from top to bottom and extends out of the lower end face of the first guide connection probe (41), and the third-stage packaging electrode platform (5) and the second-stage packaging electrode platform (4) are insulated through a second insulating pad (62).
2. The multi-polar omnidirectional emission LED light source of claim 1, wherein: the first insulating pad (61) is integrally fixed between the second-stage packaging electrode table (4) and the bracket (1) in an injection molding mode; the second insulating pad (62) is integrally fixed between the third-stage packaging electrode table (5) and the second-stage packaging electrode table (4) in an injection molding mode.
3. The multi-polar omnidirectional emission LED light source of claim 1, wherein: a positioning notch is formed on the outer side of the bracket (1); the plurality of LED chips (2) at least comprise two LED chips (2) with different colors.
4. A multipole omnidirectional light-emitting LED light source according to any one of claims 1-3, characterized in that: the longitudinal sections of the second-stage packaging electrode table (4) and the third-stage packaging electrode table (5) are T-shaped; the cross sections of the upper end parts of the first-stage packaging electrode table (11) and the second-stage packaging electrode table (4) and the upper end part of the third-stage packaging electrode table (5) are polygonal.
5. The multi-polar omnidirectional emission LED light source of claim 4, wherein: the cross sections of the upper end parts of the first-stage packaging electrode table (11) and the second-stage packaging electrode table (4) and the upper end part of the third-stage packaging electrode table (5) are decagonal.
6. A support of multi-pole type all-round luminous LED light source, its characterized in that: the LED packaging structure comprises a support (1), a plurality of stages of packaging electrode platforms (100) which are mutually insulated and used for conducting LED chips (2), wherein the multistage packaging electrode platform (100) comprises a first stage packaging electrode platform (11) formed at the upper end of the support (1), a second stage packaging electrode platform (4) and a third stage packaging electrode platform (5) which are sequentially stacked on the first stage packaging electrode platform (11), and the first, second and third stage packaging electrode platforms (11, 4 and 5) are respectively used as a first, second and third conducting electrodes and are mutually insulated; the first electrode and the second electrode of the LED chip (2) are respectively connected with the first-stage packaging electrode platform and the second-stage packaging electrode platform (11 and 4), or the first electrode and the second electrode of the LED chip (2) are respectively connected with the first-stage packaging electrode platform and the third-stage packaging electrode platform (11 and 5), or the first electrode and the second electrode of the LED chip (2) are respectively connected with the second-stage packaging electrode platform and the third-stage packaging electrode platform (4 and 5);
the lower end of the bracket (1) is provided with a threaded section (12) for conducting connection, and the bracket (1) is provided with a first through hole (10) penetrating through the lower end surface of the threaded section (12) downwards along the upper end surface of the first-stage packaging electrode table (11); the lower end of the second-stage packaging electrode table (4) is provided with a first guide probe (41), the first guide probe (41) penetrates through the first through hole (10) and extends out of the lower end face of the threaded section (12), and the second-stage packaging electrode table (4) is insulated from the bracket (1) through a first insulating pad (61); the second-stage packaging electrode table (4) is provided with a second through hole (40) which penetrates through the lower end surface of the first guide probe (41) downwards along the upper end surface of the second-stage packaging electrode table; the lower end of the third-stage packaging electrode platform (5) is provided with a second guide connection probe (51), the second guide connection probe (51) penetrates through the second through hole (40) from top to bottom and extends out of the lower end face of the first guide connection probe (41), and the third-stage packaging electrode platform (5) and the second-stage packaging electrode platform (4) are insulated through a second insulating pad (62).
7. The holder for a multi-pole omnidirectional light emitting LED light source of claim 6, wherein: the first insulating pad (61) is integrally fixed between the second-stage packaging electrode table (4) and the bracket (1) in an injection molding mode; the second insulating pad (62) is integrally fixed between the third-stage packaging electrode table (5) and the second-stage packaging electrode table (4) in an injection molding mode; the outer side of the bracket (1) is provided with a positioning notch.
8. The holder for a multi-pole omnidirectional light emitting LED light source of any one of claims 6-7, wherein: the longitudinal sections of the second-stage packaging electrode table (4) and the third-stage packaging electrode table (5) are T-shaped; the cross sections of the upper end parts of the first-stage packaging electrode table (11) and the second-stage packaging electrode table (4) and the upper end part of the third-stage packaging electrode table (5) are polygonal.
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| WO2019148337A1 (en) * | 2018-01-31 | 2019-08-08 | 王进 | Multipole omnidirectional illumination led light source and support frame thereof |
| CN108980785B (en) * | 2018-04-23 | 2020-01-03 | 东莞市莱硕光电科技有限公司 | Manufacturing process of LED bracket |
| CN108506748B (en) * | 2018-04-30 | 2024-03-29 | 魏展生 | Multi-angle light source body |
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| CN201827845U (en) * | 2010-05-24 | 2011-05-11 | 王进 | Improved LED lamp bracket |
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| JP4729441B2 (en) * | 2006-06-09 | 2011-07-20 | スタンレー電気株式会社 | Vehicle lighting |
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| CN201827845U (en) * | 2010-05-24 | 2011-05-11 | 王进 | Improved LED lamp bracket |
| CN103000782A (en) * | 2011-09-13 | 2013-03-27 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure |
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