CN208384071U - A kind of test platform and test device - Google Patents
A kind of test platform and test device Download PDFInfo
- Publication number
- CN208384071U CN208384071U CN201821123966.4U CN201821123966U CN208384071U CN 208384071 U CN208384071 U CN 208384071U CN 201821123966 U CN201821123966 U CN 201821123966U CN 208384071 U CN208384071 U CN 208384071U
- Authority
- CN
- China
- Prior art keywords
- test
- test platform
- groove
- vacuum pump
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a kind of test platform and test devices.The test platform includes objective table and vacuumizing assembly, it is arranged on the objective table fluted, the groove is for accommodating test fluid, the bottom surface of the groove is provided with multiple adsorption holes for being used to fix workpiece, and the form and dimension for the binding domain that multiple adsorption holes are formed is adapted with the form and dimension of the workpiece；The vacuumizing assembly is connected to the adsorption hole.Workpiece is fixed on the bottom surface of groove by vacuum suction by the test platform, and adsorption hole adsorbs the surface of workpiece, guarantees workpiece surfacing during the test, probe is facilitated to test, and is conducive to the accuracy for improving test result；Test fluid is accommodated in groove, test fluid can replace separation layer in the prior art and play the role of air-isolation, to avoid that air breakdown occurs in test process, advantageously reduce the testing cost of workpiece.
Description
Technical field
The utility model relates to microelectronics technology more particularly to a kind of test platform and test devices.
Background technique
With the rapidly development of third generation semicon industry, semiconductor material gallium nitride is due to, electricity big with forbidden bandwidth
The features such as sub- saturation drift velocity is high, disruptive field intensity is high, good heat conductivity, has become current research hotspot.In test side
Face, demand and measurement method to test have very strict requirements, high-precision measurement are needed in the test of process monitoring,
The performance of semiconductor devices just can be preferably embodied in this way.
Currently, semiconductor devices such as wafer utilizes probe progress electric performance test after generally clamping by fixture.Due to
Voltage is higher in test process, is easy to appear air breakdown phenomenon, wafer is caused to damage.For this purpose, before testing, needing partly leading
Separation layer is set on body device or semiconductor device device is immersed in Insulation test liquid, being reached by isolation air prevents sky
The purpose of gas breakdown.Existing test method has the following problems:
1, the edge of wafer is easy warpage, in the biggish situation of warpage, not can guarantee wafer by the fixed wafer of fixture
It is smooth, semiconductor devices test when need Substrate ground, will lead to different location using the wafer that fixture is fixed with warpage
Grounding it is different, to influence the accuracy of test result；
2, it is at high cost to increase separation layer, and separation layer easily causes electric property failure.
Therefore, a kind of test platform is needed to solve to cause because of silicon wafer warpage out-of-flatness test result inaccuracy and test
The problems such as at high cost
Utility model content
One purpose of the utility model is to propose a kind of test platform, it is ensured that wafer is put down during the test
It is whole, air breakdown can be prevented, testing cost is low.
For this purpose, the utility model uses following technical scheme:
A kind of test platform, comprising:
Objective table, is arranged on the objective table fluted, and for accommodating test fluid, the bottom surface of the groove is set the groove
It is equipped with multiple for fixing the adsorption hole of workpiece, the form and dimension and the work of the binding domain that multiple adsorption holes are formed
The form and dimension of part is adapted；And
Vacuumizing assembly, the vacuumizing assembly are connected to the adsorption hole.
Wherein, the bottom surface of the groove is provided with multiple adsorption holes, and multiple adsorption holes are distributed in rice font.
Wherein, the test platform further include:
Sinker, the sinker are fixed on the bottom of the objective table.
Wherein, the vacuumizing assembly includes the first vacuum pump, and first vacuum pump is connected to the adsorption hole.
Wherein, vacuum chamber is provided in the test platform, the vacuum chamber is true with the adsorption hole and the pumping respectively
Empty component connection.
Wherein, the vacuumizing assembly further include:
First pipe, the both ends of the first pipe are connected to the vacuum chamber and first vacuum pump respectively；And
Second pipe, one end of the second pipe are connected to the first vacuum pump, the other end and the groove and/or waste liquid
Bottle connection.
Wherein, the vacuumizing assembly further includes filter device.
Wherein, the vacuumizing assembly further include:
Cooling device, the cooling device are set on the first pipe or the second pipe；
The edge of the bottom surface of the groove is additionally provided with drainage hole, and the drainage hole is connected to the vacuum chamber.
Wherein, the edge of the bottom surface of the groove is additionally provided with drainage hole, and liquid storage chamber, institute are provided in the test platform
Liquid storage chamber is stated to be connected to the drainage hole；
The test platform further include:
Recirculation assembly, the recirculation assembly include:
Second vacuum pump, second vacuum pump are connected to the liquid storage chamber and the groove respectively；
Third pipeline, the both ends of the third pipeline are connected to the liquid storage chamber and second vacuum pump respectively；
The both ends of 4th pipeline, the 4th pipeline are connected to the second vacuum pump and the groove respectively；And
Cooling device, the cooling device are set on the third pipeline or the 4th pipeline.
Another purpose of the utility model is to propose a kind of test device, it is ensured that wafer is put down during the test
It is whole, air breakdown can be prevented, testing cost is low.
For this purpose, the utility model uses following technical scheme:
A kind of test device, including test suite further include test platform as described above.
The utility model has the advantages that the utility model provides a kind of test platform and test device.The test platform is inhaled by vacuum
The attached bottom surface that workpiece is fixed on to groove, adsorption hole adsorb the surface of workpiece, guarantee workpiece surfacing during the test, side
Just probe is tested, and is conducive to the accuracy for improving test result；Test fluid is accommodated in groove, test fluid can replace existing skill
Separation layer in art plays the role of air-isolation, to avoid that air breakdown occurs in test process, advantageously reduces workpiece
Testing cost.
Detailed description of the invention
Fig. 1 is the cross-sectional view for the test platform that the utility model embodiment 1 provides；
Fig. 2 is the top view for the objective table that the utility model embodiment 1 provides；
Fig. 3 is the cross-sectional view for the test platform that the utility model embodiment 2 provides；
Fig. 4 is the top view for the objective table that the utility model embodiment 2 provides.
Wherein:
1, objective table；11, groove；111, adsorption hole；112, drainage hole；2, sinker；21, vacuum chamber；31, the first vacuum
Pump；32, first pipe；33, second pipe；34, the second vacuum pump；35, third pipeline；36, the 4th pipeline.
Specific embodiment
The technical issues of to solve the utility model, the technical solution of use and the technical effect that reaches are clearer,
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
Embodiment 1
A kind of test device is present embodiments provided, can be used for the electrical performance testing of semiconductor devices, the present embodiment
In by semiconductor devices be wafer for be introduced.
Test device includes test platform and test suite.Wafer is fixed on test platform, and test suite can wrap
Probe, probe and wafer contacts are included, thus the electrical property of test wafer.
Since the edge of wafer is easy warpage, test result will affect after silicon wafer warpage.To solve the above problems, such as Fig. 1
Shown, test platform includes objective table 1 and vacuumizing assembly.Fluted 11 are arranged on objective table 1, is arranged on the bottom surface of groove 11
There are multiple adsorption holes 111, one end of adsorption hole 111 is directly connected to the bottom surface of groove 11, and the other end directly connects with vacuum chamber 21
It is logical；Adsorption hole 111 is connected to vacuumizing assembly, and the form and dimension and workpiece of the binding domain of the formation of multiple adsorption holes 111
Form and dimension be adapted.
In the present embodiment, wafer is fixed on the bottom surface of groove 11 by vacuum suction, due to the formation of multiple adsorption holes 111
The form and dimension of binding domain be adapted with the form and dimension of wafer, it is ensured that the surfacing of wafer avoids side
Edge warpage advantageously ensures that contact effect of the probe with wafer, improves the accuracy of test result.
To avoid air in test process from being broken down by high-voltage, can be used for accommodating test fluid and workpiece for measurement in groove 11,
Workpiece for measurement is located in test fluid, can be with air insulated, to avoid leading to workpiece damage because of air breakdown.Specifically,
Test fluid can be insulating solution, such as perfluoropolyether (Perfluoropolyethers, PFPE), and perfluoropolyether has good
Chemical stability and insulating properties.In other embodiments, test fluid may be other insulating solutions.
Test platform further includes sinker 2, and sinker 2 is fixed on the bottom of objective table 1, can increase the weight of test platform
Amount, to guarantee stability of the test platform in moving process.Optionally, the weight of sinker 2 can be according to the big of wafer
Motor Capability small and that driving test platform is mobile is configured.
Vacuumizing assembly includes the first vacuum pump 31, and the first vacuum pump 31 is connected to multiple adsorption holes 111, to adsorb
Vacuum environment is formed in hole 111, to fix wafer.The first vacuum pump 31 is connected to multiple adsorption holes 111 for convenience, is tested
Vacuum chamber 21 is also provided in platform, vacuum chamber 21 is connected to adsorption hole 111, and the first vacuum pump 31 connects with vacuum chamber 21
It is logical, it can simplify the connection structure of the first vacuum pump 31 and multiple adsorption holes 111.Optionally, vacuum chamber 21, which can be set, is carrying
In object platform, also can be set in sinker 2, can with as shown in Figure 1, the top surface of sinker 2 is recessed groove body, groove body with
The bottom surface of objective table, which is enclosed, to be set to form vacuum chamber 21.Can certainly be that the bottom surface of objective table is recessed groove body, the groove body with match
The top surface of weight seat 2 forms vacuum chamber 21 or the bottom surface of objective table and the top surface of sinker 2 is provided with groove body, and two groove bodies enclose
If forming vacuum chamber 21.
When in order to avoid test, test fluid is entered in vacuum chamber 21 by adsorption hole 111, the absorption that adsorption hole 111 is formed
Area is desirably no more than the base area of wafer, to avoid the bottom surface of the fixed rearward recess 11 of wafer, there are extra adsorption holes
111, and then test fluid is avoided to enter in vacuum chamber 21 by extra adsorption hole 111.
In the present embodiment, vacuumizing assembly further includes first pipe 32 and second pipe 33, the both ends point of first pipe 32
It is not connected to the first vacuum pump 31 and vacuum chamber 21, the both ends of second pipe 33 connect with the first vacuum pump 31 and groove 11 respectively
It is logical, by setting first pipe 32 and second pipe 33, groove 11, vacuum chamber 21 and the first vacuum pump 31 can be formed and are closed
Circuit.On the one hand, vacuum chamber 21 can be inhaled vacuum by the first vacuum pump 31, to pass through the fixed wafer of adsorption hole 111；Another party
Face, the first vacuum pump 31 test fluid for entering vacuum chamber 21 can also be discharged, and discharged test fluid can pass through the second pipe
Road 33 refills in groove 11, realizes recycling.
In other embodiments, second pipe 33 can also export the test fluid being discharged by vacuum chamber 21 into waste liquid bottle
Storage carries out subsequent processing.
Vacuumizing assembly further includes filter device, and filter device can be set in first pipe 32, second pipe 33 or the
In one vacuum pump 31, for filtering the impurity in test fluid, the test fluid doped with impurity is avoided to re-inject into groove 11
Cause test short circuit or other tests abnormal.
For carrying wafer, shape and size can be adjusted according to the form and dimension of wafer for the bottom surface of groove 11
It is whole.For the versatility for improving test platform, the size of the bottom surface of groove 11 can be arranged according to maximum sized wafer, so as to simultaneous
Hold the wafer of small size.
In the present embodiment, as shown in Fig. 2, the bottom surface of groove 11 is circle, multiple adsorption holes 111 thereon are in rice font point
Cloth.Multiple adsorption holes 111 can reduce the adsorptive pressure that wafer receives in rice font, can be avoided wafer during the test because
Pull of vacuum is excessive and fragmentation, and is less than the wafer of 1mm for warpage, can both guarantee that wafer adsorbed completely, surfacing, also
The stress that warpage position generates when can reduce absorption makes situations such as wafer crackle or directly rupture.In addition, adsorption hole 111 is in rice
Good fixing effect of the font to wafer, it is possible to reduce test fluid enters the probability of vacuum chamber 21 by adsorption hole 111.
Wafer when in use, is placed in groove 11 by test device first in the present embodiment, later the first vacuum pump 31
Starting, by the way that the air in vacuum chamber 21 to be discharged, so that there are certain pressure differences between vacuum chamber 21 and the external world, thus will
Wafer adsorption is fixed in groove 11.Then, test fluid is added into groove 11, by test fluid by wafer and air insulated.
Finally, traveling probe, carries out electric performance test for probe and wafer contacts.
After the completion of test, the vacuum state of vacuum chamber 21 is released, by wafer by taking out in groove 11.Test in groove 11
Liquid is entered in vacuum chamber 21 by adsorption hole 111.Second pipe 33 can be connect at this time with waste liquid bottle, start the first vacuum pump
31, the test fluid in vacuum chamber 21 is expelled in waste liquid bottle and is recycled.
In the present embodiment, wafer is fixed by vacuum suction, can guarantee the accurate of test result to avoid edge warping
Property.Wafer is immersed in test fluid during the test, can be to avoid testing abnormal problem because of caused by air breakdown.Pass through
Test fluid air-isolation can be to the wafer test of not set separation layer, and can prepare discovery early period wafer in semiconductor devices is
No there are problems, to greatly improve testing efficiency, have saved production cost.
Embodiment 2
A kind of test device is present embodiments provided, structure is roughly the same with the structure in embodiment 1, with embodiment 1
In unlike, as shown in figure 3, the bottom surface of groove 11 is additionally provided with drainage hole 112, drainage hole 112 is connected to vacuum chamber 21, arrange
The edge of 11 bottom surface of groove is arranged in fluid apertures 112, it is avoided to influence the fixed wafer of adsorption hole 111.First pipe 32 and the second pipe
Cooling device is also provided on road 33.
After wafer adsorption is fixed on the bottom surface of groove 11, add test fluid into groove 11, test fluid through drainage hole 112 into
Enter in vacuum chamber 21, is refilled through first pipe 32 and second pipe 33 to groove 11 under the action of the first vacuum pump 31
It is interior.Test fluid circulates in the present embodiment, can also not only absorb wafer and air insulated in wafer testing procedure
The heat of generation, so that test fluid remains certain temperature, is played the purpose of heat dissipation, kept away by the cooling of cooling device
Exempt from wafer to burn because temperature is excessively high.Optionally, the size of drainage hole 112 can need to guarantee first determine according to actual needs
Vacuum pump 31 by wafer adsorption in groove 11, can avoid the fixation of the circulating effect wafer of test fluid.
In order to guarantee that test fluid circulates and heat dissipation effect, the water absorption of the first vacuum pump 31 is larger, to vacuum pump
Demand it is higher.For this purpose, drainage hole 112 is connected to liquid storage chamber as shown in figure 4, being provided with liquid storage chamber in test platform.Wherein,
Liquid storage chamber can be set in objective table 1 or sinker 2, can also be arranged between objective table 1 and sinker 2, specific with true
The setting of cavity 21, details are not described herein again.Test platform further includes liquid storage chamber and recirculation assembly, and recirculation assembly includes the second vacuum
Pump 34, third pipeline 35, the 4th pipeline 36 and cooling device, liquid storage chamber, third pipeline 35, the second vacuum pump 34, the 4th pipeline
36 and groove 11 be sequentially communicated, cooling device can be set on third pipeline 35 or the 4th pipeline 36.
The above content is only the preferred embodiment of the utility model, for those of ordinary skill in the art, according to this reality
With novel thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as
Limitations of the present invention.
Claims (10)
1. a kind of test platform characterized by comprising
Objective table (1) is arranged fluted (11) on the objective table (1), and the groove (11) is described recessed for accommodating test fluid
The bottom surface of slot (11) is provided with multiple for fixing the adsorption hole (111) of workpiece, the absorption that multiple adsorption holes (111) are formed
The form and dimension in region is adapted with the form and dimension of the workpiece；And
Vacuumizing assembly, the vacuumizing assembly are connected to the adsorption hole (111).
2. test platform as described in claim 1, which is characterized in that the bottom surface of the groove (11) is provided with multiple suctions
Attached hole (111), and multiple adsorption holes (111) are distributed in rice font.
3. test platform as described in claim 1, which is characterized in that the test platform further include:
Sinker (2), the sinker (2) are fixed on the bottom of the objective table (1).
4. test platform as described in claim 1, which is characterized in that the vacuumizing assembly includes the first vacuum pump (31),
First vacuum pump (31) is connected to the adsorption hole (111).
5. test platform as claimed in claim 4, which is characterized in that be provided with vacuum chamber (21), institute in the test platform
Vacuum chamber (21) is stated to be connected to the adsorption hole (111) and the vacuumizing assembly respectively.
6. test platform as claimed in claim 5, which is characterized in that the vacuumizing assembly further include:
First pipe (32), the both ends of the first pipe (32) respectively with the vacuum chamber (21) and first vacuum pump
(31) it is connected to；And
Second pipe (33), one end of the second pipe (33) are connected to first vacuum pump (31), the other end with it is described
Groove (11) and/or waste liquid bottle connection.
7. test platform as claimed in claim 6, which is characterized in that the vacuumizing assembly further includes filter device.
8. test platform as claimed in claim 6, which is characterized in that the vacuumizing assembly further include:
Cooling device, the cooling device are set on the first pipe (32) or the second pipe (33)；
The edge of the bottom surface of the groove (11) is additionally provided with drainage hole (112), the drainage hole (112) and the vacuum chamber
(21) it is connected to.
9. test platform as claimed in claim 5, which is characterized in that the edge of the bottom surface of the groove (11) is additionally provided with row
Fluid apertures (112) is provided with liquid storage chamber in the test platform, and the liquid storage chamber is connected to the drainage hole (112)；
The test platform further include:
Recirculation assembly, the recirculation assembly include:
Second vacuum pump (34), second vacuum pump (34) are connected to the liquid storage chamber and the groove (11) respectively；
Third pipeline (35), the both ends of the third pipeline (35) connect with the liquid storage chamber and second vacuum pump (34) respectively
It is logical；
4th pipeline (36), the both ends of the 4th pipeline (36) connect with the second vacuum pump (34) and the groove (11) respectively
It is logical；And
Cooling device, the cooling device are set on the third pipeline (35) or the 4th pipeline (36).
10. a kind of test device, including test suite, which is characterized in that further include as claimed in any one of claims 1-9 wherein
Test platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821123966.4U CN208384071U (en) | 2018-07-16 | 2018-07-16 | A kind of test platform and test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821123966.4U CN208384071U (en) | 2018-07-16 | 2018-07-16 | A kind of test platform and test device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208384071U true CN208384071U (en) | 2019-01-15 |
Family
ID=64962817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821123966.4U Active CN208384071U (en) | 2018-07-16 | 2018-07-16 | A kind of test platform and test device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208384071U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112394202A (en) * | 2020-10-29 | 2021-02-23 | 西安微电子技术研究所 | Interconnection test fixture and interconnection test method for silicon adapter plate |
| CN113016776A (en) * | 2019-12-24 | 2021-06-25 | 上海明悦医疗科技有限公司 | Carrier, vacuumizing device and tissue cryopreservation system |
| CN113790658A (en) * | 2021-09-09 | 2021-12-14 | 东莞市卓高电子科技有限公司 | High-precision automatic detection device for thickness of diaphragm |
-
2018
- 2018-07-16 CN CN201821123966.4U patent/CN208384071U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113016776A (en) * | 2019-12-24 | 2021-06-25 | 上海明悦医疗科技有限公司 | Carrier, vacuumizing device and tissue cryopreservation system |
| CN112394202A (en) * | 2020-10-29 | 2021-02-23 | 西安微电子技术研究所 | Interconnection test fixture and interconnection test method for silicon adapter plate |
| CN112394202B (en) * | 2020-10-29 | 2023-06-27 | 珠海天成先进半导体科技有限公司 | Interconnection test fixture and interconnection test method for silicon adapter plate |
| CN113790658A (en) * | 2021-09-09 | 2021-12-14 | 东莞市卓高电子科技有限公司 | High-precision automatic detection device for thickness of diaphragm |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208384071U (en) | A kind of test platform and test device | |
| JP5506461B2 (en) | Supercritical processing apparatus and supercritical processing method | |
| JP6721026B2 (en) | Semiconductor laser device | |
| CN1289258C (en) | Cling table and basement machining apparatus | |
| JP6625423B2 (en) | Wafer inspection apparatus and its maintenance method | |
| CN1442881A (en) | Device and method for drying washed matter | |
| JP3695184B2 (en) | Plasma etching apparatus and plasma etching method | |
| TW202329240A (en) | Wet etching equipment and wet etching method | |
| CN104465373A (en) | Method for making gallium nitride high electron-mobility transistor on silicon slice | |
| CN208969198U (en) | The objective table of probe station | |
| WO2023035546A1 (en) | Wafer cleaning method and method for manufacturing semiconductor device | |
| CN217639396U (en) | Silicon carbide testing ignition prevention device | |
| CN102412192A (en) | Process method for metal interconnection sidewall mending | |
| CN108231655A (en) | The method of Electrostatic Absorption substrate | |
| CN206074358U (en) | A kind of multi- scenarios method loading experimental apparatus of piezoelectric semiconductor's fracture failure | |
| CN112596560B (en) | Temperature control device and test method for testing thermal admittance spectrum of perovskite solar cell | |
| EP1768173A1 (en) | Method for evaluating soi wafer | |
| CN103531535A (en) | Method for repairing side wall damage of ultralow dielectric constant film | |
| CN102279290B (en) | Sucking disc for tester table | |
| TWI840129B (en) | Preparation device and method for metal ion detection sample on wafer surface | |
| JP4640204B2 (en) | Evaluation method of SOI wafer | |
| KR100852577B1 (en) | Plasma processing apparatus, plasma processing method, and storage medium | |
| CN103178001B (en) | The method processing porous ultra-low dielectric constant layer | |
| JP5003288B2 (en) | Silicon wafer evaluation method and silicon wafer manufacturing method | |
| KR20090038726A (en) | Electrical measurement equipment for measuring characteristics of soi-wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |