CN208315512U - A kind of producing device of low warpage multi-wafer - Google Patents
A kind of producing device of low warpage multi-wafer Download PDFInfo
- Publication number
- CN208315512U CN208315512U CN201820647514.XU CN201820647514U CN208315512U CN 208315512 U CN208315512 U CN 208315512U CN 201820647514 U CN201820647514 U CN 201820647514U CN 208315512 U CN208315512 U CN 208315512U
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- China
- Prior art keywords
- chip
- pedestal
- bracket
- wafer
- runner
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- Expired - Fee Related
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to technical field of semiconductor device, particularly relate to a kind of producing device of low warpage multi-wafer, including pedestal, bracket, fixed frame, lifting platform, the pedestal is equipped with two fixed frames, heater is equipped with inside the fixed frame, chip is placed between the fixed frame, the pedestal upper left side is equipped with bracket, the bracket is inverted L shape, the bracket is equipped with hydraulic stem, the hydraulic stem lower end is equipped with pressing plate, the pressing plate can be pushed into two fixed frames, the front-back of the pedestal is equipped with lifting platform, the lifting platform is equipped with elevating lever, runner is equipped at the top of the elevating lever, the runner is equipped with sucker.Compared with prior art, the beneficial effects of the utility model are: the angularity of silicon carbide wafer, curvature is effectively reduced in the utility model, angularity, the curvature of silicon carbide wafer, effectively increase the performance of chip, ensure that the subsequent production quality of chip especially after reduction grinding and polishing.
Description
Technical field
The utility model relates to technical field of semiconductor device, particularly relate to a kind of production dress of low warpage multi-wafer
It sets.
Background technique
Silicon carbide SiC is widely used in solar photovoltaic industry, semiconductor industry, the processing of piezo-electric crystal industry engineering
Material etc..Application requirement wafer surface ultra-smooth, low warpage, the low curvature of silicon carbide.The surface quality of silicon carbide wafer
With the superiority and inferiority of precision, the performance of device is directly influenced.Since the Mohs' hardness of SiC is 9.2, it is only second to diamond, crystal
Cutting and grinding and polishing difficulty are quite big.Also, it is relatively thin to process chip, and thickness is usually between 250um-500um, bending resistance
Bent, buckling deformation ability is greatly reduced, therefore, after grinding and polishing chip face shape it is difficult to ensure that.
For these reasons, SiC wafer has high angularity, curvature after conventional grinding, polishing." angularity "
(Warp) it is defined as the minimum value for the wafer surface surveyed from reference planes and the difference of maximum value, difference includes the variation of convex-concave.
" curvature " (Bow) is the chip bumps or deformation surveyed from the center of chip, more unrelated than variation with thickness.This high sticks up
Curvature, curvature bring big inconvenience to entire subsequently epitaxial growing；Even in device fabrication processes, chip is being attracted on
Very big stress can be generated when on vacuum chuck, lead to wafer breakage.
Therefore, it is intended that developing angularity, the curvature of a kind of method to reduce silicon carbide wafer, especially reduces and grind
The angularity, curvature of silicon carbide wafer after grinding and polishing light.
Utility model content
The utility model discloses a kind of producing devices of low warpage multi-wafer, and the warpage of silicon carbide wafer is effectively reduced
Angularity, the curvature of silicon carbide wafer, effectively increase the performance of chip after degree, curvature, especially reduction grinding and polishing,
It ensure that the subsequent production quality of chip.
The utility model is achieved through the following technical solutions:
A kind of producing device of low warpage multi-wafer, including pedestal, bracket, fixed frame, lifting platform are set on the pedestal
There are two fixed frames, heater is equipped with inside the fixed frame, places chip between the fixed frame, the pedestal upper left side is equipped with
Bracket, the bracket are inverted L shape, and the bracket is equipped with hydraulic stem, and the hydraulic stem lower end is equipped with pressing plate, the pressing plate
It can be pushed into two fixed frames, the front-back of the pedestal is equipped with lifting platform, and the lifting platform is equipped with elevating lever, the lifting
Runner is equipped at the top of bar, the runner is equipped with sucker.
Preferably, the runner is equipped with respective drive motor.
Preferably, the length of the pressing plate is equal to the length of chip, and the distance between described fixed frame is also equal to chip
Length.
Preferably, the base interior is equipped with controller, and the controller and hydraulic stem, heater, runner, elevating lever are equal
Electrical connection.
Compared with prior art, the utility model has the beneficial effects that
The utility model effectively reduces the angularity of silicon carbide wafer, curvature, especially carbon after reduction grinding and polishing
Angularity, the curvature of SiClx chip, effectively increase the performance of chip, ensure that the subsequent production quality of chip.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the partial structure diagram of the utility model right view.
In figure: 1, pedestal；2, bracket；3, hydraulic stem；4, pressing plate；5, fixed frame；6, heater；7, chip；8, runner；
9, elevating lever；10, lifting platform；11, sucker.
Specific embodiment
The present invention will be further described with reference to the accompanying drawing:
A kind of producing device of low warpage multi-wafer, including pedestal 1, bracket 2, fixed frame 5, lifting platform 10, the base
Seat 1 is equipped with two fixed frames 5, and heater 6 is equipped with inside the fixed frame 5, places chip 7, the base between the fixed frame 5
1 upper left side of seat is equipped with bracket 2, and the bracket 2 is inverted L shape, and the bracket 2 is equipped with hydraulic stem 3, and 3 lower end of hydraulic stem is set
There is pressing plate 4, the pressing plate 4 can be pushed into two fixed frames 5, and the front-back of the pedestal 1 is equipped with lifting platform 10, the liter
It drops platform 10 and is equipped with elevating lever 9, runner 8 is equipped at the top of the elevating lever 9, the runner 8 is equipped with sucker 11.
The runner 8 is equipped with respective drive motor.
The length of the pressing plate 4 is equal to the length of chip 7, and the distance between described fixed frame 5 is also equal to the length of chip 7
Degree.
Controller, the controller and hydraulic stem 3, heater 6, runner 8, elevating lever 9 electricity are equipped with inside the pedestal 1
Connection.
Principle: it the chip 7 will be placed among fixed frame 5, open in the fixed frame 5 at this time after grinding, polishing
Heater 6, the chip 7 is heated, while controlling the hydraulic stem 3 of 5 upper end of fixed frame, so that the pressing plate
4 press chip 7 down, after the completion of pressing, control the elevating lever 9 on 1 both sides of pedestal, the sucker 11 on the runner 8 is inhaled
Firmly chip 7, then control the runner 8 and rotate, make 7 turn-over of chip, then unclamps the sucker 11 on the runner 8, again
The pressing plate 4 controlled on the hydraulic stem 3 presses chip 7, guarantees the flatness of the chip 7, leads in material deformation
Domain studies have shown that the reduction reason of wafer flatness be mainly chip produced under high temperature and long-time stress it is compacted
Become, lattice has occurred sliding, resets, to make the reduction for realizing wafer flatness.
The above only expresses the embodiments of the present invention, and the description thereof is more specific and detailed, but can not be because
This and be interpreted as that a limitation on the scope of the patent of the present invention, within the spirit and principle of the utility model, made
What modification, equivalent replacement, improvement etc., should be included within the scope of protection of this utility model, the guarantor of the utility model patent
Shield range should be determined by the appended claims.
Claims (4)
1. a kind of producing device of low warpage multi-wafer, it is characterised in that: including pedestal (1), bracket (2), fixed frame (5),
Lifting platform (10), the pedestal (1) are equipped with two fixed frames (5), are equipped with heater (6) inside the fixed frame (5), described solid
Determine to place chip (7) between frame (5), pedestal (1) upper left side is equipped with bracket (2), and the bracket (2) is inverted L shape, the branch
Frame (2) is equipped with hydraulic stem (3), and hydraulic stem (3) lower end is equipped with pressing plate (4), and it is fixed that the pressing plate (4) can be pushed into two
In frame (5), the front-back of the pedestal (1) is equipped with lifting platform (10), and the lifting platform (10) is equipped with elevating lever (9), institute
It states and is equipped with runner (8) at the top of elevating lever (9), the runner (8) is equipped with sucker (11).
2. a kind of producing device of low warpage multi-wafer according to claim 1, it is characterised in that: the runner (8)
Equipped with respective drive motor.
3. a kind of producing device of low warpage multi-wafer according to claim 1, it is characterised in that: the pressing plate
(4) length is equal to the length of chip (7), and the distance between described fixed frame (5) is also equal to the length of chip (7).
4. a kind of producing device of low warpage multi-wafer according to claim 1, it is characterised in that: the pedestal (1)
Inside is equipped with controller, and the controller is electrically connected with hydraulic stem (3), heater (6), runner (8), elevating lever (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820647514.XU CN208315512U (en) | 2018-05-02 | 2018-05-02 | A kind of producing device of low warpage multi-wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820647514.XU CN208315512U (en) | 2018-05-02 | 2018-05-02 | A kind of producing device of low warpage multi-wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208315512U true CN208315512U (en) | 2019-01-01 |
Family
ID=64713073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820647514.XU Expired - Fee Related CN208315512U (en) | 2018-05-02 | 2018-05-02 | A kind of producing device of low warpage multi-wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208315512U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115547897A (en) * | 2022-11-30 | 2022-12-30 | 长电集成电路(绍兴)有限公司 | Wafer leveling device and method |
-
2018
- 2018-05-02 CN CN201820647514.XU patent/CN208315512U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115547897A (en) * | 2022-11-30 | 2022-12-30 | 长电集成电路(绍兴)有限公司 | Wafer leveling device and method |
| CN115547897B (en) * | 2022-11-30 | 2023-04-07 | 长电集成电路(绍兴)有限公司 | Wafer leveling device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190101 Termination date: 20210502 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |