CN208271931U - Slicing apparatus for silicon wafer one texture-etching side - Google Patents
Slicing apparatus for silicon wafer one texture-etching side Download PDFInfo
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- CN208271931U CN208271931U CN201820925759.4U CN201820925759U CN208271931U CN 208271931 U CN208271931 U CN 208271931U CN 201820925759 U CN201820925759 U CN 201820925759U CN 208271931 U CN208271931 U CN 208271931U
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- silicon wafer
- attracted
- actuation
- cabinet
- mould group
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a kind of slicing apparatus for silicon wafer one texture-etching side, the slicing apparatus includes cabinet, the feeding guide among cabinet and discharge guide, the first actuation mould group on cabinet and the second actuation mould group, the discharge guide is located at the lower section of feeding guide, and the first actuation mould group and the second actuation Mo Zu are installed on respectively on the cabinet of feeding guide two sides.The slicing apparatus structure of the utility model is simple, easy to control, and cost is low compared with the manipulator of equal accuracy, substantially increases fragment efficiency；Separate the silicon wafer being stacked two-by-two by way of adsorbing silicon wafer, when fragment will not damage the suede structure of silicon chip surface.
Description
Technical field
The utility model relates to silicon wafer wool making technical fields, fill more particularly to a kind of fragment for silicon wafer one texture-etching side
It sets.
Background technique
Photovoltaic power generation is the important composition of new energy, is developed rapidly in recent years.Current commercialized solar cell
In product, the market share of crystalline silicon (monocrystalline and polycrystalline) solar cell is maximum, is always maintained at the occupation rate of market close to ninety percent.
Currently, the purpose of flannelette technique is the surface reflectivity for reducing solar cell in the production technology of crystal-silicon solar cell, from
And improve the photoelectric conversion efficiency of solar cell.
Silicon chip flower basket be in solar battery manufacturing field for accommodating silicon wafer, with to silicon wafer carry out making herbs into wool, etching, clearly
The techniques such as wash, convert, printing.It when carrying out silicon wafer one texture-etching side, needs for silicon wafer to be stacked two-by-two in insertion silicon chip flower basket, complete single
Needing to carry out the silicon wafer being stacked fragment after the process for etching of face two-by-two, fragment, which usually passes through manual or existing manipulator, to be completed,
Manual fragment considerably increases human cost, takes a long time, existing manipulator higher cost, and is easily destroyed suede structure.
Therefore, in view of the above technical problems, it is necessary to which a kind of slicing apparatus for silicon wafer one texture-etching side is provided.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of slicing apparatus for silicon wafer one texture-etching side.
To achieve the goals above, the technical solution that an embodiment of the present invention provides is as follows:
A kind of slicing apparatus for silicon wafer one texture-etching side, the slicing apparatus include cabinet, sending among cabinet
Expect that guide rail and discharge guide, the first actuation mould group and second on cabinet are attracted mould group, the discharge guide is located at feeding
The lower section of guide rail, the first actuation mould group and the second actuation Mo Zu are installed on respectively on the cabinet of feeding guide two sides.
The cabinet includes separately positioned the first cabinet and the second cabinet as a further improvement of the utility model,
Between the first cabinet and the second cabinet, described first, which is attracted mould group and second, is attracted mould splits for feeding guide and discharge guide
It is not installed on the first cabinet and the second cabinet.
The first actuation mould group includes being attracted for being attracted the first of silicon wafer as a further improvement of the utility model,
The first gear unit that unit and the first actuation unit of control are moved along the first direction perpendicular to feeding guide；Described second
Being attracted mould group includes being attracted unit and control second is attracted unit along the perpendicular to feeding guide for being attracted the second of silicon wafer
The second gear unit that one direction and the second direction for being parallel to feeding guide move.
First gear unit includes being fixedly installed in case along first direction as a further improvement of the utility model,
The first guide rail on body, the first sliding part being slidably mounted on the first guide rail, the first actuation unit are fixedly installed in the
On one sliding part.
Second gear unit includes being fixedly installed in case in a second direction as a further improvement of the utility model,
The second guide rail on body, the second sliding part being slidably mounted on the second guide rail, second sliding part are distributed in a second direction,
It is slidably fitted with third sliding part along first direction on second sliding part, the second actuation unit is fixedly installed in third sliding
On part.
The first actuation unit includes several first actuations disposed in parallel as a further improvement of the utility model,
Piece, a side surface of the first actuation piece are equipped with several for adsorbing the first air entry of silicon wafer.
The second actuation unit includes several second actuations disposed in parallel as a further improvement of the utility model,
Piece, a side surface of the second actuation piece are equipped with several for adsorbing the second air entry of silicon wafer, first air entry
It is disposed opposite to each other with the second air entry in the side of the second actuation piece in the side of the first actuation piece.
First gear unit further includes for driving the first sliding part edge as a further improvement of the utility model,
The first servo motor of first direction movement.
Second gear unit further includes for driving the second sliding part edge as a further improvement of the utility model,
The second servo motor that first direction moves and the third servo electricity for driving third sliding part to move in a second direction
Machine.
The first actuation mould group includes being attracted for being attracted the first of silicon wafer as a further improvement of the utility model,
The first gear unit that unit and the first actuation unit of control are moved along the first direction perpendicular to feeding guide；Described second
Being attracted mould group includes being attracted unit and control second is attracted unit along the perpendicular to feeding guide for being attracted the second of silicon wafer
Second gear unit of one direction movement.
The beneficial effects of the utility model are:
Slicing apparatus structure is simple, easy to control, and cost is low compared with the manipulator of equal accuracy, substantially increases fragment effect
Rate；
Separate the silicon wafer being stacked two-by-two by way of adsorbing silicon wafer, when fragment will not damage the flannelette knot of silicon chip surface
Structure；
Pass through Serve Motor Control when being attracted the work of mould group, it is ensured that high precision.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments recorded in the utility model, for those of ordinary skill in the art, is not making the creative labor
Under the premise of, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the schematic perspective view of slicing apparatus in one specific embodiment of the utility model；
Fig. 2 is that the partial structurtes of the first actuation mould group and the second actuation mould group are put in one specific embodiment of the utility model
Big schematic diagram.
Specific embodiment
In order to make those skilled in the art more fully understand the technical solution in the utility model, below in conjunction with this reality
With the attached drawing in new embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that
The described embodiments are only a part of the embodiments of the utility model, instead of all the embodiments.Based on the utility model
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
The range of the utility model protection all should belong in example.
The utility model discloses a kind of slicing apparatus for silicon wafer one texture-etching side, which includes cabinet, sets
Feeding guide and discharge guide among cabinet, first on cabinet are attracted mould group and second and are attracted mould group, and discharging is led
Rail is located at the lower section of feeding guide, and the first actuation mould group and the second actuation Mo Zu are installed on the cabinet of feeding guide two sides respectively
On.
Silicon chip flower basket is sent to the first actuation mould group and second by feeding guide and is attracted between mould group, is attracted by first
Mould group and the second actuation Mo Zu are adsorbed on are stacked above and below silicon wafer two-by-two respectively, are then attracted mould group and the by first
The relative motion of two actuation mould groups separates the silicon wafer being stacked two-by-two, finally sends out silicon chip flower basket by discharge guide.
Join shown in Fig. 1, Fig. 2, in a specific embodiment of the utility model, cabinet includes the first separately positioned case
Between the first cabinet 11 and the second cabinet 12, discharging is led for body 11 and the second cabinet 12, feeding guide 21 and discharge guide 22
Rail 22 is located at the lower section of feeding guide 21, and the first actuation mould group and the second actuation Mo Zu are installed on the first cabinet 11 and second respectively
12 top of cabinet, and the first actuation mould group and the second actuation Mo Zu are installed on the two sides of feeding guide 21 respectively.
First direction in the utility model refers to the direction in cabinet top surface plane perpendicular to discharge guide, second
Direction refers to the direction that discharge guide is parallel in cabinet upper surface, and first direction and second direction are mutually perpendicular to.
Specifically, the first actuation mould group in the present embodiment includes being attracted unit 31 and control for being attracted the first of silicon wafer
The first gear unit 32 that system the first actuation unit is moved along first direction；First gear unit 32 includes fixing along first direction
The first guide rail 321 being installed on cabinet, the first sliding part 322 being slidably mounted on the first guide rail, first is attracted unit 31
It is fixedly installed on the first sliding part 322.
Second actuation mould group includes being attracted unit 41 and control the second actuation unit along first for being attracted the second of silicon wafer
Second gear unit 42 in direction and second direction movement；Second gear unit 42 includes being fixedly installed in cabinet in a second direction
On the second guide rail 421, the second sliding part 422 for being slidably mounted on the second guide rail, the second sliding part is distributed in a second direction,
It is slidably fitted with third sliding part 423 along first direction on second sliding part, it is sliding that the second actuation unit 41 is fixedly installed in third
On moving part 423.
Further, the first actuation unit 31 includes several first actuations pieces 311 disposed in parallel, and first is attracted piece 311
A side surface be equipped with it is several for adsorbing the first air entries (not shown) of silicon wafer；Second is attracted unit 41 including several flat
The second of row setting is attracted piece 411, and a side surface of the second actuation piece is equipped with several for adsorbing the second air entry of silicon wafer
(not shown), the first air entry are disposed opposite to each other with the second air entry in the side of the second actuation piece in the side of the first actuation piece.
In addition, the first gear unit 32 in present embodiment further includes for driving the first sliding part to transport along first direction
Dynamic first servo motor 323；Second gear unit 42 further includes for driving that the second sliding part moves along first direction
Two servo motors 424 and third servo motor 425 for driving third sliding part to move in a second direction.
The course of work of slicing apparatus is specific as follows in present embodiment:
The silicon chip flower basket that one is stuck with silicon wafer (being stacked two-by-two) is individually placed on feeding guide, operation to fragment position；
First, which is attracted mould group and second, is attracted Mo Zu respectively in the drive of first servo motor 323 and the second servo motor 424
Under dynamic from two sides insertion silicon chip flower basket, the first actuation piece 311 and the second actuation piece 411 are inserted into are stacked under silicon wafer two-by-two respectively
Side and top, then open two admission air valves being attracted in mould group, and silicon wafer is sucked in the air entry by being respectively attracted on piece；
It keeps the first actuation mould group motionless and dragging second is attracted mould group backward, separate the silicon wafer being stacked two-by-two；
The second of mobile carrying silicon wafers is attracted mould group to empty silicon chip flower basket position under the effect of third servo motor 425；
The second of carrying silicon wafers is attracted in the empty silicon chip flower basket of mould group insertion；
Admission air valve is closed, silicon wafer is made to be detached from the actuation mould group respectively adsorbed, extraction first is attracted mould group and second and is attracted
Mould group；
Two silicon chip flower baskets for filling silicon wafer are removed by discharge guide, complete fragment.
The silicon chip flower basket and empty silicon chip flower basket that silicon wafer is stuck in above embodiment divide along the second direction of discharge guide
Cloth can also will stick with the silicon chip flower basket and empty silicon chip flower basket of silicon wafer in another specific embodiment of the utility model
Along perpendicular to discharge guide first direction be distributed, when carrying out fragment, two silicon chip flower baskets be respectively positioned on the first actuation mould group with
Second is attracted between mould group.
The embodiment, the first actuation mould group include being attracted the first actuation of unit and control for being attracted the first of silicon wafer
The first gear unit that unit is moved along the first direction perpendicular to feeding guide；Second actuation mould group includes for being attracted silicon wafer
The second actuation unit and the second transmission that is moved along the first direction perpendicular to feeding guide of the second actuation unit of control it is single
Member.
When specific works, first, which is attracted mould group and second, is attracted Mo Zu respectively under the driving of corresponding servo motor from two
Side is stuck in the silicon chip flower basket of silicon wafer, and the first actuation piece in the first actuation mould group is inserted directly into the silicon wafer flower for sticking with silicon wafer
In basket, from the silicon chip flower basket for sticking with silicon wafer in empty silicon chip flower basket, first inhales the second actuation piece in the second actuation mould
It closes piece and the second actuation piece is inserted into the following above and for being stacked silicon wafer two-by-two respectively, then open two air-breathings being attracted in mould group
Silicon wafer is sucked in valve, the air entry by being respectively attracted on piece；
It keeps the first actuation mould group motionless and dragging second is attracted mould group backward, separate the silicon wafer being stacked two-by-two；
Continue to drag the second actuation mould group backward after separation, the silicon wafer for being attracted the second actuation piece moves to empty silicon wafer flower
In basket；
Admission air valve is finally closed, silicon wafer is made to be detached from the actuation mould group respectively adsorbed, extraction first is attracted mould group and second
It is attracted mould group, the silicon wafer being attracted in the first actuation mould group is maintained in the original silicon chip gaily decorated basket, the silicon being attracted in the second actuation mould group
Piece is located in empty silicon chip flower basket；
Two silicon chip flower baskets for filling silicon wafer are removed by discharge guide, complete fragment.
Preferably, in this embodiment, a transfer gaily decorated basket, transfer flower can also be increased between two silicon chip flower baskets
Transition apparatus of the basket as two silicon chip flower baskets, can be to avoid the silicon wafer obscission in Slicing procedure
As can be seen from the above technical solutions, the utility model has the following beneficial effects:
Slicing apparatus structure is simple, easy to control, and cost is low compared with the manipulator of equal accuracy, substantially increases fragment effect
Rate；
Separate the silicon wafer being stacked two-by-two by way of adsorbing silicon wafer, when fragment will not damage the flannelette knot of silicon chip surface
Structure；
Pass through Serve Motor Control when being attracted the work of mould group, it is ensured that high precision.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (10)
1. a kind of slicing apparatus for silicon wafer one texture-etching side, which is characterized in that the slicing apparatus includes cabinet, is set to cabinet
Intermediate feeding guide and discharge guide, first on cabinet are attracted mould group and second and are attracted mould group, the discharge guide
Positioned at the lower section of feeding guide, the first actuation mould group and the second actuation Mo Zu are installed on respectively on the cabinet of feeding guide two sides.
2. the slicing apparatus according to claim 1 for silicon wafer one texture-etching side, which is characterized in that the cabinet includes point
The first cabinet and the second cabinet from setting, feeding guide and discharge guide are described between the first cabinet and the second cabinet
First actuation mould group and the second actuation Mo Zu are installed on respectively on the first cabinet and the second cabinet.
3. the slicing apparatus according to claim 1 for silicon wafer one texture-etching side, which is characterized in that described first is attracted mould
Group includes being attracted unit and the first actuation unit of control along the first direction perpendicular to feeding guide for being attracted the first of silicon wafer
First gear unit of movement；The second actuation mould group includes being attracted unit and control second for being attracted the second of silicon wafer
It is single to be attracted the second transmission that unit is moved along the first direction perpendicular to feeding guide with the second direction for being parallel to feeding guide
Member.
4. the slicing apparatus according to claim 3 for silicon wafer one texture-etching side, which is characterized in that first transmission is single
Member includes the first guide rail being fixedly installed on cabinet along first direction, the first sliding part being slidably mounted on the first guide rail,
The first actuation unit is fixedly installed on the first sliding part.
5. the slicing apparatus according to claim 3 for silicon wafer one texture-etching side, which is characterized in that second transmission is single
Member includes the second guide rail being fixedly installed on cabinet in a second direction, the second sliding part being slidably mounted on the second guide rail,
Second sliding part is distributed in a second direction, is slidably fitted with third sliding part along first direction on the second sliding part, described
Second actuation unit is fixedly installed on third sliding part.
6. the slicing apparatus according to claim 3 for silicon wafer one texture-etching side, which is characterized in that described first is attracted list
Member includes several first actuations pieces disposed in parallel, and a side surface of the first actuation piece is equipped with several for adsorbing silicon wafer
The first air entry.
7. the slicing apparatus according to claim 6 for silicon wafer one texture-etching side, which is characterized in that described second is attracted list
Member includes several second actuations pieces disposed in parallel, and a side surface of the second actuation piece is equipped with several for adsorbing silicon wafer
The second air entry, first air entry first be attracted piece side and the second air entry in second actuation piece side phase
Back setting.
8. the slicing apparatus according to claim 4 for silicon wafer one texture-etching side, which is characterized in that first transmission is single
Member further includes the first servo motor for driving the first sliding part to move along first direction.
9. the slicing apparatus according to claim 5 for silicon wafer one texture-etching side, which is characterized in that second transmission is single
Member further includes the second servo motor for driving the second sliding part to move along first direction and for driving third sliding part
The third servo motor moved in a second direction.
10. the slicing apparatus according to claim 1 for silicon wafer one texture-etching side, which is characterized in that described first is attracted
Mould group includes being attracted unit and the first actuation unit of control along the first party perpendicular to feeding guide for being attracted the first of silicon wafer
To the first gear unit of movement；The second actuation mould group includes being attracted unit and control for being attracted the second of silicon wafer
The second gear unit that two actuation units are moved along the first direction perpendicular to feeding guide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820925759.4U CN208271931U (en) | 2018-06-14 | 2018-06-14 | Slicing apparatus for silicon wafer one texture-etching side |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820925759.4U CN208271931U (en) | 2018-06-14 | 2018-06-14 | Slicing apparatus for silicon wafer one texture-etching side |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208271931U true CN208271931U (en) | 2018-12-21 |
Family
ID=64690458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820925759.4U Active CN208271931U (en) | 2018-06-14 | 2018-06-14 | Slicing apparatus for silicon wafer one texture-etching side |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208271931U (en) |
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2018
- 2018-06-14 CN CN201820925759.4U patent/CN208271931U/en active Active
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