CN208258191U - A kind of device for from printed circuit board separation integrated circuit - Google Patents
A kind of device for from printed circuit board separation integrated circuit Download PDFInfo
- Publication number
- CN208258191U CN208258191U CN201820898975.4U CN201820898975U CN208258191U CN 208258191 U CN208258191 U CN 208258191U CN 201820898975 U CN201820898975 U CN 201820898975U CN 208258191 U CN208258191 U CN 208258191U
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- Prior art keywords
- integrated circuit
- printed circuit
- circuit board
- separated
- binding part
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Abstract
The utility model discloses a kind of devices for from printed circuit board separation integrated circuit, the device includes cover board, adhesive layer and pry, the cover board includes binding part and connect forced section with the binding part, the adhesive layer has opposite upper and lower surfaces, the upper surface is Nian Jie with the binding part of the cover board, the lower surface is for Nian Jie with integrated circuit to be separated, there is between the forced section and the printed circuit board gap when the lower surface bonds are on the integrated circuit to be separated, the pry is used to stretch to when on the integrated circuit to be separated in the gap in the lower surface bonds and applies active force to the printed circuit board and the forced section respectively when by external force.The device can solve integrated circuit in existing dye test, especially for those small-sized encapsulated type integrated circuits, such as CSPBGA packing forms, it is difficult to which the problem of being pried away from from printed circuit board helps us by integrated circuit from the lossless quick separation of printed circuit board.
Description
Technical field
The utility model relates to field of electronic element detection, and in particular to one kind is for separating integrated electricity from printed circuit board
The device on road.
Background technique
As electronic product is fast-developing towards light, thin, short, small direction, and " heart " as electronic product, integrate electricity
Road is also with having carried out fast development；In the time more than 40 years of past, integrated circuit is substantially according to Moore's Law (Moore's
Law trend development), i.e., when price is constant, the number of open ended component on integrated circuit, about every 18-24 months
It will double, performance will also promote one times.And with the promotion of performance of integrated circuits, but its geometric dimension is smaller and smaller
Simultaneously because its function is perfect, the I/O pin number demand in lsi unit area is but greatly increased, so that collection
Sharply shorten at circuit pin spacing, according to the prediction of IPC (international printed circuit), integrated circuit
Pin spacing will be down to 0.3mm even 0.25mm by current 0.4mm in the year two thousand twenty.As the pin spacing of integrated circuit is more next
Smaller, welding procedure difficulty also increases as, and the integrated circuit welding spot quality problems caused by welding also increase therewith.
In integrated circuit weld failure analytic process, Coloration experiment is that one kind can quickly determine solder joint failure phenomenon as welded
The method of the defects of point cracking, pillow effect.During traditional Coloration experiment, increasingly due to integrated antenna package size
Small, the gap between integrated circuit and printed circuit board is smaller and smaller, protrudes into gap using pry and is directly pried away from integrated circuit
The more difficult that the method for printed circuit board becomes；Meanwhile with the development of integrated circuit package types, especially wafer-level package
The extensive use of (CSP:Chip scale package) packing forms, the method that pry directly acts on integrated circuit is easy
Integrated circuit is destroyed, Coloration experiment is caused to fail.
Utility model content
Technical problem to be solved in the utility model is, for the above problem in the prior art, to provide one kind and be used for
From the device of printed circuit board separation integrated circuit, integrated circuit in existing dye test can be solved, especially for those
Small-sized encapsulated type integrated circuit, such as CSPBGA packing forms, it is difficult to which the problem of being pried away from from printed circuit board helps me
By integrated circuit from the lossless quick separation of printed circuit board.
The technical scheme adopted by the utility model to solve the technical problem is as follows:
There is provided it is a kind of for from printed circuit board separation integrated circuit device, described device include cover board, adhesive layer and
Pry, the cover board include binding part and connect forced section with the binding part, the adhesive layer have opposite upper surface and
Lower surface, the upper surface is Nian Jie with the binding part of the cover board, the lower surface for Nian Jie with integrated circuit to be separated,
Have between the forced section and the printed circuit board when the lower surface bonds are on the integrated circuit to be separated
Gap, the pry in the lower surface bonds when on the integrated circuit to be separated for stretching in the gap simultaneously
Active force is applied to the printed circuit board and the forced section respectively when by external force.
Provided by the utility model to be used for from the device of printed circuit board separation integrated circuit, the cover board is epoxy glass
Glass fiberboard.
It is provided by the utility model for from printed circuit board separation integrated circuit device in, the cover board with a thickness of
0.8mm to 1.4mm.
Provided by the utility model to be used for from the device of printed circuit board separation integrated circuit, the cover board is in two phases
Size mutually in vertical dimension is 3mm bigger than the size of the integrated circuit to be separated to 5mm.
Provided by the utility model to be used for from the device of printed circuit board separation integrated circuit, the adhesive layer is by cyano
Acrylates adhesive is made.
It is provided by the utility model to be used for from the device of printed circuit board separation integrated circuit, when the lower surface bonds
The geometric center of the geometric center of the cover board and the integrated circuit to be separated when on the integrated circuit to be separated
Positive alignment.
Provided by the utility model to be used for from the device of printed circuit board separation integrated circuit, the adhesive layer is at two
Size in orthogonal dimension is identical as the integrated circuit to be separated.
It is provided by the utility model to be used for from the device of printed circuit board separation integrated circuit, the upper table of the adhesive layer
Face is only Nian Jie with the binding part of the cover board.
Provided by the utility model to be used for from the device of printed circuit board separation integrated circuit, the forced section is described in
The surrounding horizontal extension of binding part is formed.
Implement the device provided by the utility model for from printed circuit board separation integrated circuit, can achieve following has
Beneficial effect: described device includes cover board, adhesive layer and pry, and the cover board includes binding part and connect stress with the binding part
Portion, the adhesive layer have opposite upper and lower surfaces, and the upper surface is Nian Jie with the binding part of the cover board, under described
Surface for Nian Jie with integrated circuit to be separated, when the lower surface bonds are on the integrated circuit to be separated described in
There is gap, the pry is used in the lower surface bonds described to be separated between forced section and the printed circuit board
It is stretched to when on integrated circuit in the gap and when by external force respectively to the printed circuit board and the stress
Portion applies active force.It can solve integrated circuit in existing dye test, integrated especially for those small-sized encapsulated types
Circuit, such as CSPBGA packing forms, it is difficult to which the problem of being pried away from from printed circuit board helps us by integrated circuit from printing
The lossless quick separation of circuit board.
Detailed description of the invention
Fig. 1 is the usage state diagram of the utility model preferred embodiment.
The drawing reference numeral of specific embodiment illustrates:
| Cover board | 1 | Adhesive layer | 2 |
| Pry | 3 | Binding part | 11 |
| Forced section | 12 | Integrated circuit | 4 |
| Printed circuit board | 5 | Press handle | 31 |
| Prize foot | 32 | Supporting surface | 321 |
| Pushing tow face | 322 |
Specific embodiment
For a clearer understanding of the technical features, objectives and effects of the utility model, now control attached drawing is detailed
Illustrate specific embodiment of the present utility model.Obviously, the described embodiments are only a part of the embodiments of the utility model,
Instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creation
Property labour under the premise of every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figure 1, for it is provided by the utility model for from printed circuit board 5 separate integrated circuit 4 device compared with
Good embodiment, described device include cover board 1, adhesive layer 2 and pry 3.The cover board 1 include binding part 11 and with the binding part
11 connection forced sections 12, the adhesive layer 2 have opposite upper and lower surfaces, and the upper surface is viscous with the cover board 1
Knot 11 is bonded, and the lower surface is for Nian Jie with integrated circuit 4 to be separated, when the lower surface bonds are described to be separated
Integrated circuit 4 on when the forced section 12 and the printed circuit board 5 between there is gap, the pry 3 is used for described
Lower surface bonds stretch in the gap and right respectively when by external force when on the integrated circuit 4 to be separated
The printed circuit board 5 and the forced section 12 apply active force.
In the present embodiment, the cover board 1 is using epoxy glass fiber plate, square sheet, the thickness of the cover board 1
Degree is 0.8mm.Certainly, in other embodiments, the thickness of the cover board 1 can also be 0.9mm, 1.0mm, 1.1mm, 1.2mm,
1.3mm or 1.4mm.The binding part 11 is located at the centre of the cover board 1, and the binding part 11 is square, the stress
Portion 12 surround and is connected to the surrounding of the binding part 11, and the binding part 11 and the forced section 12 are integrated.The lid
The big 3mm of side length of the side ratio of plate 1 integrated circuit 4 to be separated is also possible to be greater than 4mm or 5mm in other embodiments.
In the present embodiment, the adhesive layer 2 is made of cyanoacrylate adhesive.Specifically, by the cyano
Acrylates adhesive is only applied on the binding part 11 of the cover board 1, forms an adhesive layer 2 having a rectangular shape.
The side length of the adhesive layer 2 is consistent with the side length of the binding part 11, meanwhile, the side length of the adhesive layer 2 is also with described wait divide
From integrated circuit 4 side length it is identical.
In the present embodiment, pry 3 includes the sled foot 32 for pressing handle 31 and connecting with the pressing handle 31.The sled foot
32 have opposite supporting surface 321 and pushing tow face 322, and the supporting surface 321 is used to support on the printed circuit board 5, institute
Pushing tow face 322 is stated for abutting the cover board 1.
The process for being pried away from the integrated circuit 4 to be separated from the printed circuit board 5 using described device is as follows:
The lower surface of the adhesive layer 2 is directed at the integrated circuit 4 to be separated and makes the adhesive layer 2 and the collection to be separated
It is bonded to the integrated circuit 4 to be separated at the geometric center of circuit 4, and by the lower surface of the adhesive layer 2, it is described at this time
Cover board 1 is linked together by the adhesive layer 2 with the printed circuit board 5, moreover, the forced section 12 of the cover board 1
There is certain interval between the printed circuit board 5, the sled foot 32 of the pry 3 is inserted into the gap, is made
The supporting surface 321 for obtaining the sled foot 32 is abutted with the printed circuit board 5, while the pushing tow face 322 and the forced section 12
It abuts, as long as at this point, upward power, institute can be applied to the cover board 1 by the sled foot 32 by pushing the pressing handle 31
Stating after cover board 1 receives upward power can drive the integrated circuit 4 to be separated to be upwardly separated from the printed circuit board 5.
During this, the pry 3 will not be contacted directly with the integrated circuit 4 to be separated, so that we can be with
Quickly, lossless to be pried away from the integrated circuit 4 to be separated from the printed circuit board 5.
The embodiments of the present invention are described above in conjunction with attached drawing, but the utility model is not limited to
The specific embodiment stated, the above mentioned embodiment is only schematical, rather than restrictive, this field it is common
Technical staff is not departing from the utility model aims and scope of the claimed protection situation under the enlightenment of the utility model
Under, many forms can be also made, these are belonged within the protection of the utility model.
Claims (9)
1. a kind of device for from printed circuit board separation integrated circuit, which is characterized in that described device includes cover board, bonding
Layer and pry, the cover board include binding part and connect forced section with the binding part, and the adhesive layer has opposite upper table
Face and lower surface, the upper surface is Nian Jie with the binding part of the cover board, and the lower surface is used for and integrated circuit to be separated
Bonding, when the lower surface bonds are on the integrated circuit to be separated between the forced section and the printed circuit board
With gap, the pry is used to stretch to the gap when on the integrated circuit to be separated in the lower surface bonds
It is interior and active force is applied to the printed circuit board and the forced section respectively when by external force.
2. the device according to claim 1 for from printed circuit board separation integrated circuit, which is characterized in that the lid
Plate is epoxy glass fiber plate.
3. the device according to claim 1 for from printed circuit board separation integrated circuit, which is characterized in that the lid
Plate with a thickness of 0.8mm to 1.4mm.
4. the device according to claim 1 for from printed circuit board separation integrated circuit, which is characterized in that the lid
Size of the plate in two orthogonal dimensions is 3mm bigger than the size of the integrated circuit to be separated to 5mm.
5. the device according to claim 1 for from printed circuit board separation integrated circuit, which is characterized in that described viscous
Knot layer is made of cyanoacrylate adhesive.
6. the device according to claim 1 for from printed circuit board separation integrated circuit, which is characterized in that when described
The lower surface bonds geometric center of the cover board and integrated circuit to be separated when on the integrated circuit to be separated
Geometric center be just aligned.
7. the device according to claim 1 for from printed circuit board separation integrated circuit, which is characterized in that described viscous
It is identical as the integrated circuit to be separated to tie size of the layer in two orthogonal dimensions.
8. the device according to claim 1 for from printed circuit board separation integrated circuit, which is characterized in that described viscous
The upper surface for tying layer is only Nian Jie with the binding part of the cover board.
9. it is according to claim 8 for from printed circuit board separation integrated circuit device, which is characterized in that it is described by
Power portion is formed from the surrounding horizontal extension of the binding part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820898975.4U CN208258191U (en) | 2018-06-11 | 2018-06-11 | A kind of device for from printed circuit board separation integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820898975.4U CN208258191U (en) | 2018-06-11 | 2018-06-11 | A kind of device for from printed circuit board separation integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208258191U true CN208258191U (en) | 2018-12-18 |
Family
ID=64654173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820898975.4U Active CN208258191U (en) | 2018-06-11 | 2018-06-11 | A kind of device for from printed circuit board separation integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208258191U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110582165A (en) * | 2018-06-11 | 2019-12-17 | 深圳长城开发科技股份有限公司 | device for separating integrated circuit from printed circuit board |
| CN114279953A (en) * | 2021-11-29 | 2022-04-05 | 苏州浪潮智能科技有限公司 | Separation method for dyeing test of surface mounting device |
-
2018
- 2018-06-11 CN CN201820898975.4U patent/CN208258191U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110582165A (en) * | 2018-06-11 | 2019-12-17 | 深圳长城开发科技股份有限公司 | device for separating integrated circuit from printed circuit board |
| CN110582165B (en) * | 2018-06-11 | 2024-05-28 | 深圳长城开发科技股份有限公司 | Device for separating integrated circuit from printed circuit board |
| CN114279953A (en) * | 2021-11-29 | 2022-04-05 | 苏州浪潮智能科技有限公司 | Separation method for dyeing test of surface mounting device |
| CN114279953B (en) * | 2021-11-29 | 2024-01-19 | 苏州浪潮智能科技有限公司 | Separation method for surface mount device dyeing test |
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