CN102349143B - Probe card for testing film package - Google Patents
Probe card for testing film package Download PDFInfo
- Publication number
- CN102349143B CN102349143B CN201080011883.6A CN201080011883A CN102349143B CN 102349143 B CN102349143 B CN 102349143B CN 201080011883 A CN201080011883 A CN 201080011883A CN 102349143 B CN102349143 B CN 102349143B
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- China
- Prior art keywords
- pcb
- main body
- membrane probe
- body block
- probe
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- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
There is provided a probe card for testing a film package. The probe card for testing a film package includes a body block and a film probe. The body block is mounted on a printed circuit board (PCB). The film probe is mounted on the body block, the film probe on which there are leads having the same pitch as that of out lead bonding (OLB) pads of the film package. The leads of the film probe are in contact with corresponding OLB pads of the film package and test the film package.
Description
Technical field
The present invention relates to a kind of detecting card, and especially, relate to a kind of detecting card of improvement structure with test membrane encapsulation that have.
Background technology
Generally, film encapsulation or film semiconductor encapsulation such as chip on film (COF) will be sent to display floater from the signal of display driver output.
In film package fabrication process, need to carry out several tests.After test signal being applied to the input of film encapsulation, carry out test by the signal of the output pin output via film encapsulation completing in packaging technology.That is to say, whether test is applied to the test signal of film encapsulation with identical from the signal of film encapsulation output.
Fig. 1 is the figure illustrating for the general detecting card 100 of test membrane encapsulation.
Fig. 2 is the enlarged drawing that the part A of Fig. 1 is shown.
With reference to Fig. 1 and 2, detecting card 100 comprises the probe PRB that is connected to PCB P by being arranged on main body block (body block) B on printed circuit board (PCB) (PCB) P.Film encapsulation FPKG is arranged on the below of probe PRB to be tested, and this probe contacts with the lead-in wire of the input of film encapsulation FPKG and the detection welding pad TP of film encapsulation FPKG output, thereby test membrane encapsulates FPKG.
With reference to the amplifier section A of figure 2, semiconductor chip is placed on to weld pad and the lead-in wire that film encapsulates the center of FPKG and is provided with the semiconductor chip on input and the output that is connected to film encapsulation FPKG.Particularly, the weld pad being arranged on output comprises output lead bonding (OLB) the weld pad OLBP and the detection welding pad TP that is connected to OLB weld pad OLBP and contacts with the probe PRB of detecting card 100 that while installation, are connected to panel.In the time directly testing OLB weld pad OLBP by use probe PRB, because the tip of probe PB causes, in OLB weld pad OLBP, cut occurs.Therefore, form the detection welding pad TP that is connected to OLB weld pad OLBP, and by using probe PRB test detection welding pad TP.After test, cut off detection welding pad TP and it is separated with film encapsulation FPKG.
Fig. 3 is the enlarged drawing that the TP of detection welding pad shown in Fig. 2 is shown.
With reference to figure 3, detection welding pad TP is set as shown in Figure 3 effectively to use the space of little film encapsulation FPKG and a large amount of as far as possible detection welding pad TP is set.
But, when the part that is provided with detection welding pad TP being separated with film encapsulation after test, because foreign body causes being short-circuited between OLB weld pad OLBP such as the lead-in wire particle producing in the time separating.
And, the part that is provided with detection welding pad TP occupied the whole film of film encapsulation FPKG length approximately 10%.But, because the film of film encapsulation FPKG is more expensive than other elements, therefore its increased cost that film encapsulates FPKG make this film approximately 10% for being only arranged to part for testing and by its removal.
Therefore, need to develop a kind of can addressing the aforementioned drawbacks and can not cause the method for testing of any problem in test.
Summary of the invention
Technical problem
The invention provides a kind of can test membrane encapsulation and do not need the detecting card of the detection welding pad that uses film encapsulation.
The scheme of dealing with problems
According to the solution of the present invention, a kind of detecting card for test membrane encapsulation is provided, this detecting card comprises main body block and membrane probe.
This main body block is arranged on printed circuit board (PCB) (PCB).Membrane probe is arranged in main body block, on this membrane probe, forms lead-in wire with the pitch identical with film encapsulation output lead bonding (OLB) weld pad.
The lead-in wire of membrane probe contacts and test membrane encapsulation with the corresponding OLB weld pad of film encapsulation.
Membrane probe is arranged on the bottom of main body block and contacts with OLB weld pad by rolling the circular portion that its end forms, thereby provide elasticity for membrane probe.
Non-conductive bolster is inserted in the inner space in the round nose of membrane probe.This bolster is formed by the one in rubber and silicones.
Membrane probe comprise ground floor, the second layer and be formed on ground floor and the second layer between lead-in wire, wherein first and second layers is nonconducting, and the second layer is removed and goes between and exposed.
Membrane probe comprise ground floor, the second layer and be formed on ground floor and the second layer between lead-in wire, wherein first and second layers is nonconducting, and first and second layers of lead-in wire that is removed and only exposes the part place contacting with OLB weld pad.
According to another embodiment of the present invention, provide a kind of detecting card for test membrane encapsulation, this detecting card comprises main body block and membrane probe.This main body block is arranged on PCB.Except the partial outer membrane probe contacting with PCB surrounds main body block, on membrane probe, form lead-in wire with the pitch identical with the OLB weld pad of film encapsulation.
The lead-in wire that surrounds the membrane probe at the edge of main body block contacts and test membrane encapsulation with the corresponding OLB weld pad of film encapsulation.To provide flexible mode to membrane probe in the time that membrane probe contacts with OLB weld pad, the edge and the membrane probe that non-conductive bolster are attached to main body block surround its outer surface.Bolster is formed by the one in rubber and silicones.
Membrane probe comprise ground floor, the second layer and be formed on ground floor and the second layer between lead-in wire, wherein ground floor and the second layer are nonconducting, and ground floor contacts and be mounted thereon with main body block, and the second layer is removed, thereby expose lead-in wire.
According to another embodiment of the present invention, provide a kind of detecting card for test membrane encapsulation, this detecting card comprises PCB and main body block.
The main body block being arranged on PCB comprises membrane probe, is formed with the lead-in wire directly contacting with the OLB weld pad of tested film encapsulation on it, and membrane probe autonomous agent piece bottom is connected to the circuitous pattern forming on PCB top.
Membrane probe adopts the film identical with the film of tested film encapsulation.
The bottom of main body block is downward-sloping, and the insertion groove that has wherein inserted buffer stopper is formed on the end of main body block, and this end contact with the encapsulation of tested film, presses buffer stopper and is inserted into and insert in groove and its end is outwards given prominence to from inserting groove.
From insert groove outwards the end of outstanding buffer stopper come to a point and be equal with the bottom of main body block.
Membrane probe is mounted to than the end of buffer stopper and is more outwards given prominence to, aim to facilitate with the OLB weld pad of tested film encapsulation.
PCB comprises centre bore, and wherein the support of supportive body piece is inserted into the center of centre bore, and is propped up the both sides of top of the trellis and be fixed to PCB by the first plate setting.
Membrane probe is inserted between the first plate and PCB and is connected to PCB circuitous pattern.Detecting card comprises the second plate being arranged between the first plate and membrane probe, and in the stable mode that is connected to circuitous pattern of membrane probe, the first plate and PCB is pressed to the assembling element external force is applied to the second plate each other.
Advantage of the present invention
As mentioned above, can use the lead-in wire of size and the measure-alike film of the film for the encapsulation of tested film according to the detecting card of the embodiment of the present invention, replace the probe pin directly contacting with output lead bonding (OLB) weld pad of tested film encapsulation, do not need the detection welding pad in film encapsulation thereby test membrane encapsulates.
Therefore, can prevent the short circuit occurring and can reduce the quantity for the film of film encapsulation in the time that detection welding pad is separated with film encapsulation, thereby reducing film packaging cost.
And, although the pitch between the OLB weld pad of film encapsulation is less, there is the membrane probe identical with the pitch of OLB weld pad owing to having used, therefore accurately test membrane encapsulation.Owing to playing the film lead-in wire of probe pin effect and the OLB weld pad Surface Contact of tested film encapsulation, therefore can not destroy OLB weld pad at test period.
Brief description of the drawings
Fig. 1 is the view illustrating for the general detecting card of test membrane encapsulation;
Fig. 2 is the enlarged drawing that the part A shown in Fig. 1 is shown;
Fig. 3 is the enlarged drawing that the detection welding pad shown in Fig. 2 is shown;
Fig. 4 is the view illustrating according to the detecting card structure of the embodiment of the present invention;
Fig. 5 is the enlarged drawing that the part C shown in Fig. 4 is shown;
Fig. 6 is the figure that membrane probe structure is shown;
Fig. 7 illustrates the view of the probe block of detecting card (probe block) according to another embodiment of the present invention;
Fig. 8 is the view that detecting card structure is according to yet another embodiment of the invention shown;
Fig. 9 is the view that is shown in further detail the structure of Fig. 8;
Figure 10 is the end view illustrating according to the detecting card structure of further embodiment of this invention; With
Figure 11 is the sectional stereogram that the detecting card of Figure 10 is shown.
Embodiment
For the advantage of complete understanding the present invention operation and the object obtaining by the embodiment of the present invention, need with reference to content shown in the accompanying drawing of the preferred embodiment of the present invention and figure is shown.
Below, with detailed reference to accompanying drawing, the preferred embodiments of the present invention are described.Same numeral shown in every width figure is all indicated similar elements.
Fig. 4 is the view illustrating according to the structure of the detecting card 300 of the embodiment of the present invention.
Fig. 5 is the enlarged drawing that the part C of Fig. 4 is shown.
Particularly, the right side of Fig. 5 shows the front view of part C and the left side of Fig. 5 and shows the left view of part C.
With reference to Figure 4 and 5, detecting card 300 comprises main body block B and membrane probe FPRB.
It is upper that main body block is arranged on printed circuit board (PCB) P, and membrane probe FPRB to be arranged on main body block B upper, on membrane probe FPRB, form lead-in wire LD with the pitch identical with the pitch of output lead bonding (OLB) the weld pad OLBP of film encapsulation FPKG.
The lead-in wire LD of membrane probe FPRB contacts and test membrane encapsulation FPKG with the corresponding OLB weld pad OLBP of film encapsulation FPKG.
In this case, membrane probe FPRB adopts the film identical with the film of tested film encapsulation FPKG.This identical film refers to the film with same pitch.Therefore, as shown in the left side of Fig. 5, membrane probe FPRB comprises having the lead-in wire LD that encapsulates the OLB weld pad OLBP same pitch of FPRB with film, and lead-in wire LD directly contacts successively with the OLB weld pad OLBP of film encapsulation FPKG.
Particularly, general cantilever probe is very sharp-pointed, can on tested weld pad, form cut.But, according to the present invention, because the lead-in wire LD forming is for the corresponding OLB weld pad OLBP of test membrane encapsulation FPKG, therefore do not damage the danger of OLB weld pad OLBP on film.That is to say lead-in wire LD and OLB weld pad OLBP Surface Contact.
In Fig. 4, but membrane probe FPRB is arranged on the bottom of main body block B is not limited to this.Membrane probe FPRB can surround whole main body block B, will be described this, and it can be various other shapes.
For the shape of membrane probe FPRB, membrane probe FPRB can be arranged on the bottom of main body block B and its end of rollable to form circle, as shown in Figures 4 and 5.In the time that circular portion contacts with OLB weld pad OLBP, to membrane probe, FPRB provides elasticity.Can will bond by the end of rolling formation and be fixed to the bottom of the main body of membrane probe FPRB.
Bolster 310 is inserted in the inner space of circular distal of membrane probe FPRB.Bolster 310 is formed by the one in rubber and silicones.And non-conductive product can be used for bolster 310 such as plastic resin part.And, the inner space of the circular distal of membrane probe FPRB can be remained to sky and do not need bolster 310.
Fig. 6 is the view that the structure of membrane probe FPRB is shown.
With reference to Fig. 6, membrane probe FPRB comprise ground floor L1, second layer L2 and be formed on ground floor L1 and second layer L2 between lead-in wire LD, wherein first and second layers of L1 and L2 are nonconducting.Generally, ground floor L1 is formed by polyimides, and second layer L2 is formed by scolder anti-flux (solder resister).As shown in Figures 4 and 5, the lead-in wire LD of a part of circular distal of membrane probe FPRB, with the part that film encapsulation OLB weld pad OLBP contact, by the removal second layer, L2 is come out.With reference to the left side of Fig. 5, remove second layer L2 and expose lead-in wire LD, and lead-in wire LD contacts with OLB weld pad OLBP.Therefore, in the structure shown in Fig. 5, although second layer L2, for the layer being formed by the anti-solvent of scolder contacts with main body block B, can remove the second layer L2 in the part contacting with the OLB weld pad OLBP of film encapsulation and expose lead-in wire LD.
Membrane probe FPRB can have ground floor L1 wherein and be both removed and only expose with the second layer L2 structure of the lead-in wire LD in the part contacting with OLB weld pad OLBP.As shown in Figure 6, ground floor L1 and second layer L2 are both removed, and the exposed portions serve of lead-in wire LD contacts with corresponding OLB weld pad OLBP.In this case, bolster 310 can be inserted in inner space.
Fig. 7 illustrates the view of the probe block of detecting card (probe block) according to another embodiment of the present invention.
Also comprise main body block B and membrane probe FPRB for the detecting card (not shown) of test membrane encapsulation FPKG according to another embodiment of the present invention.In Fig. 7, not shown whole detecting card.For convenience of description, only show main body block B and membrane probe FPRB.
Main body block B is arranged on printed circuit board (PCB) (PCB).Membrane probe FPRB surrounds the main body block B except the part contacting with PCB, and upper formation of this membrane probe FPRB has the lead-in wire LD that encapsulates the OLB weld pad same pitch of FPKG with film.。
The lead-in wire LD that surrounds the membrane probe FPRB at the edge of main body block B contacts and test membrane encapsulation FPKG with the corresponding OLB weld pad of film encapsulation FPKG.
As shown in Figure 7, membrane probe FPRB surrounds lower surface, and the edge that is formed on the main body block B on marginal portion contacts with OLB weld pad OLBP with lead-in wire LD.Non-conductive bolster 310 attaches to the edge of main body block B, and membrane probe FPRB surrounds its outer surface, thereby provides elasticity to membrane probe FPRB in the time that membrane probe FPRB contacts with OLB weld pad OLBP.
Bolster 310 is formed by the one in rubber and silicones.Non-conductive product can be used as bolster 310 such as elastic resin part.And in the situation that there is no bolster 310, membrane probe FPRB can contact with main body block B edge is perfect.
Similar to the membrane probe FPRB shown in Fig. 6, the membrane probe FPRB shown in Fig. 7 comprise a L1, second layer L2 and be formed on ground floor L1 and second layer L2 between lead-in wire LD, wherein ground floor L1 and second layer L2 are nonconducting.In the case of the membrane probe FPRB shown in Fig. 7, ground floor L1 contacts and is mounted thereon with main body block, and removes second layer L2 to expose lead-in wire LD.
The bottom at the edge of main body block B can be formed as more outstanding than the top at edge, thereby in the time of test membrane encapsulation FPKG, be convenient to aim at corresponding OLB weld pad OLBP.
Fig. 8 is the view that the structure of detecting card 600 is according to yet another embodiment of the invention shown.
Fig. 9 is the view that is shown in further detail structure shown in Fig. 8.
Particularly, the right side of Fig. 9 shows the front view of main body block B of Fig. 8 and the left side of Fig. 9 and shows the left view of main body block B.
Different from the membrane probe FPRB of detecting card 300 that is arranged on the Fig. 4 on the bottom of main body block B, the membrane probe FPRB of Fig. 8 surrounds main body block B.Main body block B is arranged on the top of PCB P of detecting card 600.
Except this structural difference, the characteristic of the shape of the bolster 310 being inserted into and the structure of membrane probe FPRB is identical with detecting card 300.Therefore, will omit its detailed description.
Figure 10 is the end view illustrating according to the structure of the detecting card 700 of further embodiment of this invention.
Figure 11 is the sectional stereogram that the detecting card 700 of Figure 10 is shown.
With reference to Figure 10 and 11, comprise PCB and main body block B for the detecting card 700 of test membrane encapsulation FPKG.
Main body block B is arranged on PCB.Accurately, the bottom BTM of main body block B is inserted in the centre bore 821 of PCB, is fixed to support 720 simultaneously.To describe this after a while.Main body block B comprises membrane probe FPRB, on membrane probe FPRB, be formed with the lead-in wire directly contacting with the OLB weld pad (not shown) of tested film encapsulation FPKG, the bottom BTM of this membrane probe autonomous agent piece B is connected to the circuitous pattern (not shown) on the top that is formed on PCB.
Membrane probe FPRB adopts the film identical with the film of tested film encapsulation FPKG.This identical film refers to the film with same pitch.
That is to say, replace and use general sharp-pointed probe pin test membrane encapsulation FPKG, the upper probe pin that replaces of main body block B that is arranged on detecting card 700 with the film of the pitch same pitch of film encapsulation FPKG will be there is, this film encapsulation FPKG is called membrane probe, and contacts that with film encapsulation FPKG it is tested.Due to the encapsulation of membrane probe FPRB and film, FPKG both has identical structure, when therefore carrying out test lead-in wire be formed on successively the OLB weld pad that film encapsulates on FPKG and directly contact.
The bottom BTM of main body block B is downward-sloping, the insertion groove 740 that is inserted with buffer stopper 710 is formed on the end contacting with tested film encapsulation FPKG, and press buffer stopper 710 and be inserted into and insert in groove 740, its end is outwards outstanding from inserting groove 740 simultaneously.Make come to a point and make it equal with the bottom BTM of main body block B from inserting the outside outstanding buffer stopper end of groove 740.
The mode easily contacting with tested film encapsulation FPKG with the end of membrane probe FPRB, makes the bottom BTM of this main body block B have an incline structure.
Press buffer stopper 710 and be inserted into and insert in groove 740.But screw hole can be formed in a side of main body block B, and itself and assembling element insert groove 740 such as the coupling of assembling screw so that buffer stopper 710 is fixed to.In this case, screw hole also can be formed on buffer stopper 710, and assembling element is through this screw hole.
Buffer stopper 710 can be formed such as rubber and silicones by elastomeric material, and this allows membrane probe FPRB and film encapsulation FPKG not to be produced to impact.
As shown in figure 11, buffer stopper 710 is formed as square shape, and what its length equaled membrane probe FPRB is configured to go between the width of (not shown), or larger, and its end is sharp-pointed.Therefore, the tilting bottom BTM of main body block B is equal with the end of buffer stopper 710, contacts thereby allow membrane probe FPRB to be beneficial to the bottom BTM of main body block B.The angle of inserting groove 740 can be various values.
Membrane probe FPRB is more outstanding to easily aim at the OLB weld pad of tested film encapsulation FPKG than the end of buffer stopper 710.
Because the end of membrane probe FPRB is more outstanding than the end of buffer stopper 710, be therefore easy to make the OLB weld pad of membrane probe FPRB to aim at OLB weld pad, to make successively its mutual Surface Contact.
By adhesive, membrane probe FPRB is adhered to and is fixed to bottom BTM and the side of main body block B.But, except adhesive, can form screw hole to be coupled membrane probe FPRB is fixed to main body block B by screw.
PCB center, is formed with centre bore 821, and the support 720 of supportive body piece B can insert wherein.Arrange by the first plate PL1 support 720 top both sides and secure it to PCB.In support 720, be formed centrally through hole 831, membrane probe FPRB contacts with film encapsulation FPKG via this through hole.Be arranged on membrane probe FPRB on the bottom BTM of main body block B by this side of main body block B and be connected to the circuitous pattern of PCB via the centre bore of PCB.
That is to say, membrane probe FPRB is inserted between the first plate PL1 and PCB and is connected to the circuitous pattern of PCB.
By assembling element 725, main body block B is fixed to support 720.Assembling element 725 can be screw, and forms screw hole on support 720 and main body block B, and assembling element 725 can be inserted into and be fixed in wherein.
By assembling element 730, the first plate PL1 and support 720 are fitted together.Not by assembling element 730 with assembling element 725 is arranged to overlap each other and assembling element 730 and assembling element 725 can be multiple.By assembling element 811, the first plate PL1 is fixed to PCB.That is to say, assembling element 811 passes through membrane probe FPRB from the bottom of PCB, arrives the first plate PL1, and the first plate PL1 and membrane probe FPRB are fixed to PCB.Certainly, on PCB, the first plate PL1 and membrane probe FPRB, form the screw hole that inserts wherein assembling element 811.
Between the first plate PL1 and membrane probe FPRB, form the second plate PL2.The second plate PL2 can be formed such as rubber and silicones by elastomeric material.When only using the first plate PL1 compressive films probe FPRB, because efflux or the impact that is applied to it cause coming in contact defect between membrane probe FPRB and circuitous pattern.Because can not equably the external force of pressing membrane probe FPRB be sent to membrane probe FPRB due to what the uneven surface of the bottom of the first plate PL1 caused, therefore can not guarantee the contact between membrane probe FPRB and circuitous pattern.
In order to prevent this contact deficiency, use and there is flexible the second plate PL2.By using assembling element 811 that the first plate PL1 and PCB are compressed each other, thereby in the stable mode that is connected to circuitous pattern of membrane probe FPRB, external force is applied to the second plate PL2.That is to say, the second plate PL2 can be formed by thin elastic rubber slab.When the second plate PL2 is arranged between the first plate PL1 and membrane probe FPRB and while the first plate PL1 being compressed to PCB strongly by use assembling element 811, because the first plate PL1 is with the whole surface of even pressed by external force the second plate PL2, therefore by compression the second plate PL2, membrane probe FPRB is definite to be contacted with the circuitous pattern of PCB.
The detecting card 700 with this structure can not damage the OLB weld pad of tested film encapsulation FPKG, directly contacts with OLB weld pad simultaneously.
As mentioned above, illustrated and described example embodiment.Although used particular term herein, it is the disclosed meaning of the present invention of unrestricted claim and scope for describing the present invention just.Therefore, it will be understood by those skilled in the art that and can make change and not depart from the spirit and scope of the present invention these embodiment.Therefore, technical scope of the present invention limits by claim and equivalent thereof.
Claims (5)
1. for a detecting card for test membrane encapsulation, this detecting card comprises:
PCB; With
Main body block, it is arranged on PCB, this main body block comprises membrane probe, on this membrane probe, form the lead-in wire directly contacting with the OLB weld pad of tested film encapsulation, the bottom of this membrane probe autonomous agent piece is connected to the circuitous pattern on the top that is formed on PCB, wherein this membrane probe adopts the film identical with the film of tested film encapsulation
Wherein the bottom of this main body block is downward-sloping, the insertion groove that is wherein inserted with buffer stopper is formed on the end of this main body block, this end contacts with tested film encapsulation, wherein press this buffer stopper and be inserted into this insertion groove, and its end is outwards outstanding from this insertion groove.
2. detecting card as claimed in claim 1, this buffer stopper end of wherein outwards giving prominence to from this insertion groove is sharp-pointed and equal with the bottom of this main body block.
3. detecting card as claimed in claim 2, is wherein mounted to this membrane probe than the end of this buffer stopper and more outwards gives prominence to and be beneficial to aim at tested film encapsulation OLB weld pad.
4. detecting card as claimed in claim 1, wherein this PCB comprises centre bore, the support that supports this main body block is inserted into the center of this centre bore; And wherein by the first plate arrange this support top both sides and be fixed to this PCB.
5. detecting card as claimed in claim 4, wherein this membrane probe is inserted between the first plate and PCB and is connected to the circuitous pattern of this PCB, and this detecting card comprises: be arranged on the second plate between the first plate and this membrane probe; And assembling element, thereby it presses in the stable mode that is connected to this circuitous pattern of this membrane probe the first plate and PCB external force is applied to the second plate mutually.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20090021139 | 2009-03-12 | ||
| KR10-2009-0021139 | 2009-03-12 | ||
| KR1020090120905A KR101003078B1 (en) | 2009-03-12 | 2009-12-08 | Probe card for testing film package |
| KR10-2009-0120905 | 2009-12-08 | ||
| PCT/KR2010/001517 WO2010104337A2 (en) | 2009-03-12 | 2010-03-11 | Probe card for testing film package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102349143A CN102349143A (en) | 2012-02-08 |
| CN102349143B true CN102349143B (en) | 2014-07-09 |
Family
ID=43008125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080011883.6A Expired - Fee Related CN102349143B (en) | 2009-03-12 | 2010-03-11 | Probe card for testing film package |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2012519869A (en) |
| KR (1) | KR101003078B1 (en) |
| CN (1) | CN102349143B (en) |
| TW (1) | TWI472770B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI428607B (en) * | 2011-07-12 | 2014-03-01 | Chipmos Technologies Inc | Probe card |
| IT201800006903A1 (en) * | 2018-07-04 | 2020-01-04 | Measurement board for high frequency applications | |
| TWI718938B (en) * | 2020-04-20 | 2021-02-11 | 中華精測科技股份有限公司 | Split thin-film probe card and elastic module thereof |
| KR102309675B1 (en) * | 2021-07-30 | 2021-10-07 | 김재길 | Probe card in film type |
| KR102399195B1 (en) * | 2022-01-06 | 2022-05-18 | 주식회사 프로이천 | Probe card for testing wafer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW510971B (en) * | 1999-01-26 | 2002-11-21 | Nihon Micronics Kabushiki Kais | Probe device for testing |
| JP2006023265A (en) * | 2004-07-06 | 2006-01-26 | Hirun:Kk | Inspection probe |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63260145A (en) * | 1987-04-17 | 1988-10-27 | Nec Corp | Semiconductor integrated circuit |
| JP2853045B2 (en) * | 1989-05-08 | 1999-02-03 | 株式会社日本マイクロニクス | PCB prober |
| JP3076600B2 (en) * | 1990-11-20 | 2000-08-14 | 株式会社日本マイクロニクス | Display panel prober |
| JP2668653B2 (en) * | 1994-05-17 | 1997-10-27 | 日東精工株式会社 | Conductive contact terminal |
| JPH10221137A (en) * | 1997-02-10 | 1998-08-21 | Tokimec Inc | Jig for fitting probe of cryogenic ultrasonic flowmeter |
| JPH11201989A (en) * | 1998-01-19 | 1999-07-30 | Fujikura Ltd | Contact probe for electric inspection and inspection system |
| JP2001153888A (en) * | 1999-11-24 | 2001-06-08 | Micronics Japan Co Ltd | Probe card, and method of manufacturing same |
| JP2001289875A (en) * | 2000-04-05 | 2001-10-19 | Mitsubishi Materials Corp | Contact probe |
| JP2002286756A (en) * | 2001-03-27 | 2002-10-03 | Mitsubishi Materials Corp | Probe device |
| TW548409B (en) * | 2001-12-31 | 2003-08-21 | Internat Technology Co Ltd | Prober for testing TFT-LCD |
| JP2003287553A (en) * | 2002-03-28 | 2003-10-10 | Fujitsu Ltd | Probe card and substrate for manufacturing the probe card |
| JP2004309441A (en) * | 2003-02-18 | 2004-11-04 | Yamaha Corp | Probe head, its assembling method, and probe card |
| TWM273726U (en) * | 2004-12-17 | 2005-08-21 | Innotest Inc | Thin film probe for testing |
-
2009
- 2009-12-08 KR KR1020090120905A patent/KR101003078B1/en active IP Right Grant
-
2010
- 2010-03-11 JP JP2011553953A patent/JP2012519869A/en active Pending
- 2010-03-11 TW TW99107167A patent/TWI472770B/en not_active IP Right Cessation
- 2010-03-11 CN CN201080011883.6A patent/CN102349143B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW510971B (en) * | 1999-01-26 | 2002-11-21 | Nihon Micronics Kabushiki Kais | Probe device for testing |
| JP2006023265A (en) * | 2004-07-06 | 2006-01-26 | Hirun:Kk | Inspection probe |
Non-Patent Citations (1)
| Title |
|---|
| JP平2-293671A 1990.12.04 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101003078B1 (en) | 2010-12-21 |
| KR20100103332A (en) | 2010-09-27 |
| JP2012519869A (en) | 2012-08-30 |
| TWI472770B (en) | 2015-02-11 |
| TW201043966A (en) | 2010-12-16 |
| CN102349143A (en) | 2012-02-08 |
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