CN208225900U - A kind of silicon wafer side dressing mechanism - Google Patents
A kind of silicon wafer side dressing mechanism Download PDFInfo
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- CN208225900U CN208225900U CN201820916793.5U CN201820916793U CN208225900U CN 208225900 U CN208225900 U CN 208225900U CN 201820916793 U CN201820916793 U CN 201820916793U CN 208225900 U CN208225900 U CN 208225900U
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- silicon wafer
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- wheel stand
- stand
- dressing mechanism
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a kind of silicon wafer side dressing mechanisms, it is set to the lower section of silicon wafer conveyer belt, it reforms for carrying out position to the silicon wafer transported on the silicon wafer conveyer belt, including rack, supporting table and component of reforming, the component of reforming includes being relatively arranged on the first wheel stand at left and right sides of the supporting table, the second wheel stand and the elliptic cam being set between first wheel stand and the second wheel stand, and horizontal connection has extensible member between first wheel stand and the second wheel stand；The first guide wheel is installed at the top of first wheel stand, the second guide wheel is installed at the top of second wheel stand.The silicon wafer side dressing mechanism, drive described two wheel stands close to each other by elliptic cam rotation, first guide wheel and the first guide wheel are realized from sandwich silicon wafer reforms to position of silicon wafer on conveyer belt, high degree of automation, improves reform effect and the efficiency of silicon chip of solar cell.
Description
Technical field
The utility model relates to crystal silicon solar energy battery fields, and in particular to a kind of silicon wafer side dressing mechanism.
Background technique
In the processing of crystal silicon solar energy battery, silicon chip of solar cell is transported by conveyer belt from a station
When to another station, due to the out-of-flatness or the shaking of driven wheel etc. of feed belt plane, make the position of silicon wafer on feed belt
Generation laterally offset is set, silicon wafer is caused to deviate desired location when entering next station, silicon wafer is easy collision silicon wafer receiving mechanism
The side wall of (such as temporary storage mechanism, next section of transmission or the gaily decorated basket), occurs card, fragment phenomenon；The setting of part silicon wafer receiving mechanism
Have a side tooth, and side space width be it is fixed, the silicon wafer that laterally offset occurs, which can not be successfully, to be stored on the silicon wafer receiving mechanism.Cause
This, it is in the prior art, higher for status requirement of the silicon wafer before entering silicon wafer acceptance agencies.
Currently, have reformed using the fixed blend stop in position into silicon wafer receiving mechanism before position of silicon wafer dressing mechanism, but
Since position is fixed, the dressing mechanism is limited to the arrangement ability of silicon wafer, and the more silicon wafer of positional shift is not available the mechanism,
Even also card can occur in the mechanism.Also have and constantly clamped using cylinder driving side blend stop, unclamp silicon wafer come silicon wafer of reforming
The dressing mechanism of position, need to be used cooperatively solenoid valve, and clamping speed is controlled by manually adjusting the size of air pressure, it is difficult to accurate
Control, low efficiency of reforming；And the dressing mechanism vibration amplitude is larger, and position of silicon wafer is easily caused to deviate again, is unfavorable for the steady of silicon wafer
Fixed transmission, effect of reforming are poor.
Utility model content
The purpose of the utility model is to provide a kind of silicon wafer side arrangements in crystal silicon solar energy battery processing
Mechanism, to solve above-mentioned the shortcomings of the prior art.
In order to solve the above technical problems, the technical solution adopted in the utility model is: a kind of silicon wafer side dressing mechanism is provided,
It is set to the lower section of silicon wafer conveyer belt, is reformed for carrying out position to the silicon wafer transported on the silicon wafer conveyer belt, the silicon wafer side
Dressing mechanism includes rack, the supporting table being mounted on the rack and the component of reforming being set in the supporting table；
The component of reforming include be relatively arranged on the first wheel stand at left and right sides of the supporting table, the second wheel stand with
And it is set to the elliptic cam between first wheel stand and the second wheel stand, the right end of first wheel stand, described
The left end of two wheel stands and the wheel rim of the elliptic cam abut against；
The elliptic cam is rotated by being mounted on the servo motor driving below the rack；
Horizontal connection has extensible member between first wheel stand and the second wheel stand；
It is provided with guide rail on the supporting table, when elliptic cam rotation, first wheel stand and second is led
Wheel seat can be slided along described guide rail or so with close to each other or be located remotely from each other；
The first guide wheel is installed at the top of first wheel stand, is equipped with second at the top of second wheel stand and leads
Wheel, the horizontal plane where first guide wheel, the second guide wheel are concordant with the transmission plane of silicon wafer conveyer belt.
As the improvement to above scheme, it is connected with the first driven wheel in the right end of first wheel stand, described
The left end of two wheel stands is connected with the second driven wheel, and it is convex that first driven wheel, the second driven wheel are connected to the ellipse respectively
The left and right sides of wheel rim.
As the improvement to above scheme, first wheel stand include horizontally disposed first bottom plate, the first top plate with
And it is connected to the first side plate between first bottom plate and the first top plate vertically, second wheel stand includes horizontally disposed
Second bottom plate, the second top plate and the second side plate being connected between second bottom plate and the second top plate vertically.
As the improvement to above scheme, first driven wheel is connected to the right end of first bottom plate, and described second
Driven wheel is connected to the left end of second bottom plate.
As the improvement to above scheme, the both ends of the extensible member are connected to first side plate and the second side plate
On.
As the improvement to above scheme, there are two the first guide wheel settings, is separately mounted to first top plate
On rear and front end；There are two the second guide wheel settings, is separately mounted on the rear and front end of second top plate.
As the improvement to above scheme, position sensor is installed on first top plate and second top plate,
For detecting the location information of silicon wafer on the silicon wafer conveyer belt.
As the improvement to above scheme, silicon wafer side dressing mechanism further includes controller, and the controller is used for root
The start and stop of the servo motor are controlled according to position sensor location information detected.
Silicon wafer side provided by the utility model dressing mechanism drives elliptic cam rotation by servo motor, thus band
The dynamic wheel stand that conveyor belt two sides are arranged in is close to each other or separate, clamps the two of silicon wafer by the guide wheel being arranged on wheel stand
Side reforms to position of silicon wafer on conveyer belt to realize, high degree of automation, improves the effect of reforming of silicon chip of solar cell
And efficiency.
Detailed description of the invention
Fig. 1 is the setting position view of silicon wafer side dressing mechanism in the utility model embodiment；
Fig. 2 is the structural schematic diagram of silicon wafer side dressing mechanism in the utility model embodiment；
Fig. 3 is the enlarged drawing of elliptic cam in Fig. 2；
Fig. 4 is the control block diagram of silicon wafer side dressing mechanism in the utility model embodiment.
The components in the drawings are labeled as follows: 1- silicon wafer side dressing mechanism；2- silicon wafer conveyer belt；100- silicon wafer；10- machine
Frame；20- supporting table；21- guide rail；The first wheel stand of 31-；The first guide wheel of 310-；The first bottom plate of 311-；The first top plate of 312-；
The first side plate of 313-；The second wheel stand of 32-；The second guide wheel of 320-；The second bottom plate of 321-；The second top plate of 322-；323- second side
Plate；33- elliptic cam；331,332,333,334- elliptic cam wheel rim；34- servo motor；The first driven wheel of 35-；36- second
Driven wheel；37- extensible member；41,42- position sensor；50- controller.
Specific embodiment
In the description of the present invention, it should be understood that term " on ", "lower", "front", "rear", "left", "right",
The orientation or positional relationship of the instructions such as "vertical", "horizontal", "top", "bottom" is to be based on the orientation or positional relationship shown in the drawings,
It is merely for convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning must have
Specific orientation is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.In addition, term
" first ", " second " etc. are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicate institute
The quantity of the technical characteristic of instruction.The feature for defining " first ", " second " etc. as a result, can explicitly or implicitly include one
A or more this feature.In the description of the present invention, it should be noted that unless otherwise specific regulation and limit
Fixed, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to detachably connect
It connects, or is integrally connected；It can be mechanical connection, can be directly connected, can also indirectly connected through an intermediary, it can be with
It is the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood by concrete condition
The concrete meaning of language in the present invention.
The preferred embodiment of the utility model is described in detail with reference to the accompanying drawing, so that the advantages of the utility model
It can be easier to be readily appreciated by one skilled in the art with feature, to make the protection scope of the utility model apparent clear
Define.
Referring to Fig. 1, the utility model provides a kind of silicon wafer side dressing mechanism, Fig. 1 shows the utility model implementation
The setting position of silicon wafer side dressing mechanism 1 described in example, silicon wafer side dressing mechanism 1 are set to the lower section of silicon wafer conveyer belt 2,
It reforms for carrying out position to the silicon wafer 100 transported on the silicon wafer conveyer belt 2, the silicon wafer after reforming is transported to next work
Position, improves effect and efficiency that the silicon chip of solar cell 100 is transported to another station from a station.
Referring to Fig. 2, Fig. 2 shows the structure of silicon wafer side dressing mechanism described in the utility model embodiment 1, the silicon
Piece side dressing mechanism 1 includes rack 10, the supporting table 20 being mounted in the rack 10 and is set in the supporting table 20
Component of reforming.
Wherein, the component of reforming includes the first wheel stand 31 for being relatively arranged on 20 left and right sides of the supporting table, the
Two wheel stands 32 and the elliptic cam 33 being set between first wheel stand 31 and the second wheel stand 32, described first leads
The wheel rim of the right end of wheel seat 31, the left end of second wheel stand 32 and the elliptic cam 33 abuts against.
Guide rail 21 is provided in the supporting table 20, first wheel stand 31 and the second wheel stand 32 can be led along described
Rail 21 or so is slided with close to each other or be located remotely from each other, and in one embodiment, is led in first wheel stand 31 and second
The bottom of wheel seat 32 can be correspondingly arranged on guide groove, can opposite sliding between the guide groove and the guide rail 21.
The elliptic cam 33 is by being mounted on the driving rotation of servo motor 34 of 10 lower section of rack so that described first
Wheel stand 31 and the second wheel stand 32 are close to each other or be located remotely from each other.Between first wheel stand 31 and the second wheel stand 32
Horizontal connection has extensible member 37.Specifically, when the elliptic cam 33 rotation, first wheel stand 31 and the second wheel stand
32 are located remotely from each other under the promotion of 33 wheel rim of elliptic cam, and the extensible member 37 extends, when the extensible member 37 rebound is multiple
When position, first wheel stand 31 and the second wheel stand 32 are close to each other.Preferably, the extensible member 37 is spring.
First guide wheel 310 is installed at the top of first wheel stand 31, is equipped at the top of second wheel stand 32
Second guide wheel 320, the transmission plane of horizontal plane and the silicon wafer conveyer belt 2 where first guide wheel 310, the second guide wheel 320
Concordantly.First guide wheel 310, the second guide wheel 320 are used to clamp the silicon wafer 100 on the silicon wafer conveyer belt 2, from two sides to institute
It states silicon wafer 100 and applies thrust, make during the position of the silicon wafer 100 returns.
Further, it is connected with the first driven wheel 35 in the right end of first wheel stand 31, in second wheel stand
32 left end is connected with the second driven wheel 36, and first driven wheel 35, that the second driven wheel 36 is connected to the ellipse respectively is convex
Take turns the left and right sides of 33 wheel rims.The drive that first driven wheel 35, the second driven wheel 36 can be rotated in the elliptic cam 33
Lower rotation, can buffer the elliptic cam 33 in rotary course between first wheel stand 31 and the second wheel stand 32
It hits, reduces the vibration of the silicon wafer side dressing mechanism 1, extend the service life of the silicon wafer side dressing mechanism 1.
In one embodiment, first wheel stand 31 includes horizontally disposed first bottom plate 311, the first top plate
312 and the first side plate 313 for being connected between first bottom plate 311 and the first top plate 312 vertically, second wheel stand
32 include horizontally disposed second bottom plate 321, the second top plate 322 and are connected to second bottom plate 321 and the second top vertically
The second side plate 323 between plate 322.
Further, first driven wheel 35 is connected to the right end of first bottom plate 311, second driven wheel 36
It is connected to the left end of second bottom plate 321.The both ends of the extensible member 37 are connected to first side plate 313 and second
On side plate 323.There are two the settings of first guide wheel 310, is separately mounted on the rear and front end of first top plate 312；Institute
It states there are two the settings of the second guide wheel 320, is separately mounted on the rear and front end of second top plate 322, the conveyer belt 2 or so
Two side-by-side guide wheel is respectively set in two sides, can share guide wheel to the chucking power of silicon wafer, and improve the clamping to the silicon wafer 100
Stability.
It should be noted that front-rear direction described herein refers to the direction of transfer of silicon wafer 100 described in Fig. 1, the left side
Right direction refers to the width direction of silicon wafer conveyer belt described in Fig. 12.
Also referring to Fig. 1 and Fig. 4, in one embodiment, in first top plate 312 and second top plate
Position sensor 41,42 is installed on 322, for detecting the location information of silicon wafer 100 on the silicon wafer conveyer belt 2, and according to
Detected location information determines the start and stop state of the servo motor 34.
Further, silicon wafer side dressing mechanism 1 further includes controller 50, and the controller 50 is used for according to institute's rheme
Set sensor 41,42 location informations detected control the start and stop of the servo motor 34.The position sensor 41,42 is by institute
The location information of silicon wafer 100 is sent to the controller 50 on the silicon wafer conveyer belt 2 detected, when the location information with
(silicon wafer 100 transported on the silicon wafer conveyer belt 2 reaches first wheel stand 31 when the standard location information matching of setting
And second between wheel stand 32 when), the controller 50 sends control signal, starts the servo motor 34；In the silicon wafer
When the silicon wafer 100 transported on conveyer belt 2 is not reached between first wheel stand 31 and the second wheel stand 32, the servo motor
34 close.It is preferred that the servo motor 34 is variable-frequency motor.
Further, the controller 50 can be PLC(Programmable Logic Controller, may be programmed
Logic controller), FPGA(Field Programmable Gate Array, element programmable logic gate array) or CPU
One of (Central Processing Unit, central processing unit)；The position sensor 41,42 is that high-precision detects
The fiber position sensor of position of silicon wafer.
The enlarged structure of the elliptic cam 33 is shown also referring to Fig. 1-Fig. 3, Fig. 3, the utility model is provided
Silicon wafer side dressing mechanism 1, the upstream of silicon wafer receiving mechanism is set, and when original state, the elliptic cam 33 is along its long axis
The both ends wheel rim 331,332 in direction abuts first driven wheel 35, the second driven wheel 36,33 pairs of institutes of the elliptic cam respectively
It is maximum to state the thrust that the first wheel stand 31 and the second wheel stand 32 apply, at this point, first wheel stand 31 and the second wheel stand
The distance between 32 maximums, the extensible member 37 are in elongation state；The silicon wafer 100 transported on the silicon wafer conveyer belt 2 is in place
Afterwards, the servo motor 34 drives the elliptic cam 33 to rotate, and takes turns in the elliptic cam 33 along the both ends of its short-axis direction
During edge 333,334 gradually abuts first driven wheel 35, the second driven wheel 36, the elliptic cam 33 is to described
The thrust that one wheel stand 31 and the second wheel stand 32 apply is gradually reduced, and first wheel stand 31 and the second wheel stand 32 are in institute
State and moved closer under the rebound effect of extensible member 37, until the elliptic cam 33 along its short-axis direction both ends wheel rim 333,
334 abut first driven wheel 35 and the second driven wheel 36 respectively, at this point, first wheel stand 31 and the second wheel stand 32
The distance between minimum, described two first guide wheels 310 and two the second guide wheels 320 clamp the silicon wafer 100 and from two sides pair
The silicon wafer 100 applies thrust, makes during the position of the silicon wafer 100 returns, with the silicon wafer of reforming；The servo motor 34 drives
The elliptic cam 33 continues to rotate, and gradually abuts in the elliptic cam 33 along the both ends wheel rim 331,332 of its long axis direction
During first driven wheel 35, the second driven wheel 36, the elliptic cam 33 is to first wheel stand 31 and second
The thrust that wheel stand 32 applies is gradually increased, first wheel stand 31 and the second wheel stand 32 the elliptic cam 33 to the left
It is gradually distance under the thrust of right two sides, first guide wheel 310 and the second guide wheel 320 unclamp the silicon wafer 100, the silicon
The silicon wafer 100 for completing to reform is transported to the silicon wafer receiving mechanism in downstream by piece conveyer belt 2；The elliptic cam 33 is along its long axis side
To both ends wheel rim 331,332 abut respectively first driven wheel 35, the second driven wheel reset 36.
In the silicon wafer side dressing mechanism 1 reform silicon wafer during, first guide wheel 310 and the second guide wheel 320 exist
The lower rotation of the frictional force effect of the silicon wafer 100 moved on conveyer belt 2, reduces its resistance to silicon wafer 100, can avoid the silicon wafer
Side dressing mechanism 1 during reforming silicon wafer 100 to silicon wafer 100 generate additional friction and caused by 100 position of silicon wafer deviate again,
Improve the accuracy that position of silicon wafer is reformed；In addition, the rotation speed of the elliptic cam 33 can be by adjusting servo motor 34
Revolving speed be adjusted, reformed silicon wafer speed with achieving the purpose that adjust silicon wafer side dressing mechanism 1, keep the silicon wafer side whole
Reason mechanism 1 silicon wafer speed of reforming is matched with the travelling speed of silicon wafer 100 on silicon wafer conveyer belt 2, improves efficiency of reforming.
The above description is only the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all
Equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is applied directly or indirectly in
Other related technical areas are also included in the patent protection scope of the utility model.
Claims (8)
1. a kind of silicon wafer side dressing mechanism, is set to the lower section of silicon wafer conveyer belt, for being transported on the silicon wafer conveyer belt
Silicon wafer carries out position and reforms, which is characterized in that the silicon wafer side dressing mechanism includes rack, the supporting table being mounted on the rack
And it is set to the component of reforming in the supporting table；
The component of reforming includes being relatively arranged on the first wheel stand at left and right sides of the supporting table, the second wheel stand and setting
The elliptic cam being placed between first wheel stand and the second wheel stand, the right end of first wheel stand, described second are led
The left end of wheel seat and the wheel rim of the elliptic cam abut against；
The elliptic cam is rotated by being mounted on the servo motor driving below the rack；
Horizontal connection has extensible member between first wheel stand and the second wheel stand；
It is provided with guide rail on the supporting table, when elliptic cam rotation, first wheel stand and the second wheel stand
It can be slided along described guide rail or so with close to each other or be located remotely from each other；
The first guide wheel is installed at the top of first wheel stand, the second guide wheel, institute are installed at the top of second wheel stand
Horizontal plane where stating the first guide wheel, the second guide wheel is concordant with the transmission plane of silicon wafer conveyer belt.
2. silicon wafer side according to claim 1 dressing mechanism, which is characterized in that connected in the right end of first wheel stand
There is the first driven wheel, is connected with the second driven wheel, first driven wheel, the second driven wheel in the left end of second wheel stand
It is connected to the left and right sides of the elliptic cam wheel rim respectively.
3. silicon wafer side according to claim 2 dressing mechanism, which is characterized in that first wheel stand includes horizontally disposed
The first bottom plate, the first top plate and the first side plate being connected between first bottom plate and the first top plate vertically, described
Two wheel stands include horizontally disposed second bottom plate, the second top plate and be connected to vertically second bottom plate and the second top plate it
Between the second side plate.
4. silicon wafer side according to claim 3 dressing mechanism, which is characterized in that first driven wheel is connected to described
The right end of one bottom plate, second driven wheel are connected to the left end of second bottom plate.
5. silicon wafer side according to claim 3 dressing mechanism, which is characterized in that the both ends of the extensible member are connected to
On first side plate and the second side plate.
6. silicon wafer side according to claim 3 dressing mechanism, which is characterized in that there are two the first guide wheel settings, point
It is not mounted on the rear and front end of first top plate；There are two the second guide wheel settings, is separately mounted to second top
On the rear and front end of plate.
7. silicon wafer side according to claim 3 dressing mechanism, which is characterized in that in first top plate and second top
Position sensor is installed, for detecting the location information of silicon wafer on the silicon wafer conveyer belt on plate.
8. silicon wafer side according to claim 7 dressing mechanism, which is characterized in that silicon wafer side dressing mechanism further includes control
Device processed, the controller are used to control the start and stop of the servo motor according to position sensor location information detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820916793.5U CN208225900U (en) | 2018-06-13 | 2018-06-13 | A kind of silicon wafer side dressing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820916793.5U CN208225900U (en) | 2018-06-13 | 2018-06-13 | A kind of silicon wafer side dressing mechanism |
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| Publication Number | Publication Date |
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| CN208225900U true CN208225900U (en) | 2018-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820916793.5U Active CN208225900U (en) | 2018-06-13 | 2018-06-13 | A kind of silicon wafer side dressing mechanism |
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| Country | Link |
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| CN (1) | CN208225900U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111710638A (en) * | 2020-06-05 | 2020-09-25 | 苏州迈为科技股份有限公司 | Silicon wafer correcting mechanism |
-
2018
- 2018-06-13 CN CN201820916793.5U patent/CN208225900U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111710638A (en) * | 2020-06-05 | 2020-09-25 | 苏州迈为科技股份有限公司 | Silicon wafer correcting mechanism |
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