CN208212011U - A kind of capacitive MEMS sensor array - Google Patents
A kind of capacitive MEMS sensor array Download PDFInfo
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- CN208212011U CN208212011U CN201721027103.2U CN201721027103U CN208212011U CN 208212011 U CN208212011 U CN 208212011U CN 201721027103 U CN201721027103 U CN 201721027103U CN 208212011 U CN208212011 U CN 208212011U
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
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- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/22—Ergometry; Measuring muscular strength or the force of a muscular blow
- A61B5/221—Ergometry, e.g. by using bicycle type apparatus
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
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- A—HUMAN NECESSITIES
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- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
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- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0247—Pressure sensors
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/028—Microscale sensors, e.g. electromechanical sensors [MEMS]
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Abstract
The utility model provides a kind of capacitive MEMS sensor array, including at least three longitudinal arrangement capacitive MEMS sensor transversely arranged multiplied by least three, the capacitive MEMS sensor includes focus layer, top electrode, top electrode lead-out wire, top electrode end tab, the compound lead-in plate of top electrode data, shake film, clearance cavity, supporting layer, insulating layer, lower electrode, lower electrode outlet line, lower electrode end tab, the lower compound lead-in plate of electrode data, array substrate layer, automatic switch unit, imaging signal integral unit, automatic switch unit control capacitive MEMS sensor switches between functional status and ultrasound functions state pressing, control capacitive MEMS sensor acquisition presses signal or ultrasonic signal, imaging signal integral unit integrates above-mentioned data-signal, output solid Three-dimensional configuration data-signal.
Description
Technical field
The utility model relates to a kind of capacitive MEMS sensor arrays, examine for realizing the exception to tissue to be checked
Diagnosing and treating is surveyed, medical instrument manufacture technology field is belonged to.
Background technique
The most popular method that the mankind check body surface and accessible tissue is palpation.Utilize array of pressure sensors
Simulate the meisner corpusculum tactus that is arranged in human skin and carry out bionical palpation, can be realized to tissue to be checked it is abnormal into
Row screens the process of detection.
The static characteristics such as long-term reliability, temperature and humidity stability, repeatability, the null offset of pressure sensor, sensor
The mechanical property of thickness and its force-sensitive material is all an important factor for influencing pressure sensor performance.Detect elastic pressure point
Cloth just needs the array of identical single pressure sensor composition to complete, and the homogenieity and sensor of each pressure sensor
The homogeneity of spacing, array laminate structures the factors such as pre-tighten and can all influence the application effect of array of pressure sensors.For to
Examine the shape of object and the difference of elasticity modulus, it is also necessary to handling flexibly be carried out to array of pressure sensors, and to realize pressure and pass
The flexibility of sensor array, the laminate structures preload of the homogenieity of each pressure sensor, the homogeneity of sensor spacing, array
Etc. factors on conventional flex array of pressure sensors embody the problem of it is very much.
Based on MEMS technology, proposed earliest by Stanford Univ USA Haller and Khuri Yakub research group
CMUT(Capacitive micro-machined ultrasound transducer/ capacitive micromachined ultrasonic sensor),
Mems thin film is prepared using micro fabrication, the transmitting and reception of ultrasonic wave are realized using meagre vibration of membrane and oar song.With
Traditional PZT ultrasonic probe is compared, and CMUT eliminates necessary matching layer and backing, the array that is more suitable in structure；In function
Can on can be improved frequency bandwidth, frequency control it is more flexible, sensitivity is higher, transmission power can be higher.But in actual clinical work,
For the lesion of accessible tissue, carrying out palpation is most convenient and effective method.Using ultrasound to accessible lesion tissue, especially
The problem of it is entity tumor, and carrying out detection, to occur susceptibility bad, local ultrasound heat production.The lesion that tissue can be touched is carried out
Diagnosis, ideal method is first to carry out palpation, wait lay one's hand on and lump and need to further appreciate that its capsule, real property or
When the information such as the depth in tissue, then combined echocardiography is detected, and can obtain more diagnostic messages.Once it is determined that swollen in tissue
The information such as hardness, size, shape, the depth of block, then HIFU Treatment is carried out in time, it can more efficiently solve effects of clinic diagnosis.It will be newborn
Lesion lump is shown in three dimensions in room, for the patient, can more intuitive, clearly understand the healthy shape of diagnosis and treatment person
Condition can also carry out condition assessment with assist personnel.
The fusion of the utility model preparation presses the capacitive MEMS sensor array of detection and ultrasound functions, by traditional pole
CMUT/ capacitive micromachined ultrasonic sensor is replaced with away from change type capacitance pressure transducer, a pressure sensing body can be improved
The laminate structures of the homogeneity of device and the homogeneity of sensor spacing and display pre-tighten.Utilize this sensor array, integration
Bias voltage and driving voltage circuit can be built into the warm MEMS sensor battle array for pressing detection function and ultrasound detection function
Column.This array can be configured such that one in conjunction with the detection module and display module that press detection function and ultrasound detection function
Formula probe, for detecting and treating the exception of accessible tissue.The fusion of the utility model preparation presses detection function and ultrasound
The capacitive MEMS sensor array of detection function, solve single pressure sensor can only detect the hardness of tumour in tissue,
Size, shape, and it is difficult to the depth judged tumour within the organization, the capsule of tumour or entity property, the global shape of tumour etc.
Problem can also realize that high frequency ultrasound treats function by the effect of focus lamp.
The array structure of the preferred silicone base capacitance MEMS single axial flexibility of the utility model, it is secondary to select PDMS flexibility low frequency
CMUT array.The array can apply detecting head surface, the finger end table in any shape with backing formula, inserted, finger cot type method
On face, surgical instrument, for detecting the lesion for the treatment of local organization.
Summary of the invention
The purpose of this utility model is to provide a kind of capacitive MEMS sensor arrays, including at least three longitudinal arrangement
Multiplied by the transversely arranged capacitive MEMS sensor of at least three, the capacitive MEMS sensor includes focus layer, top electrode,
Top electrode lead-out wire, top electrode end tab, the compound lead-in plate of top electrode data shake film, clearance cavity, supporting layer, insulation
Layer, lower electrode, lower electrode outlet line, lower electrode end tab, the lower compound lead-in plate of electrode data, array substrate layer, the focusing
Layer is located at top electrode upper layer, and whole outer surface is in open and flat shape, and the top electrode and lower electrode are vertical corresponding, the vibration film
Select Si/Si3N4/SiO2Composite membrane guarantees that its spreading, the lower electrode are fitted closely with array substrate layer, the array base
Bottom lateral surface is integrally in open and flat shape, array substrate layer medial surface in the inversion of discontinuous rule go pinnacle Pyramid or
Person's mortar shape.The capacitive MEMS sensor array further includes automatic switch unit and imaging signal integral unit, described
Automatic switch unit controls capacitive MEMS sensor and switches between functional status and ultrasound functions state pressing, and controls capacitor
The acquisition of formula MEMS sensor presses signal or ultrasonic signal；The imaging signal integral unit receives each capacitive MEMS and passes
Sensor output presses signal and/or ultrasonic signal, and by the cross section size for pressing signal acquisition, shape data signal and surpasses
Integrating apart from skin depth, capsule reality data-signal for acoustical signal acquisition, exports three-dimensional three-dimensional configuration data-signal.
For the thickness of the vibration film between 0.5 micron to 5 microns, the lower electrode seal is fitted in array substrate
Layer, the lower electrode are in different shape because array substrate layer shape is different, and such as open and flat shape, mortar shape are inverted and remove point
Push up Pyramid.The preferred flexible printed circuit board of array substrate layer, it is secondary to select the hard materials such as silicon, resin.The focusing
Layer can be constructed by synthetic resin and is made.The close docile of capacitive MEMS sensor array is in single axial hardness sizing backing
On, because sizing backing shape is different, it is prepared into the different arrays that upper surface is plane, curved surface, annular.
The capacitive MEMS sensor array further includes ultrasound functions IC chip and presses detection ic core
Piece, electrode data composite cable, the electrode data composite cable include that top electrode data composite cable and lower electrode data are multiple
Zygonema cable, the compound lead-in plate of top electrode data and the lower compound lead-in plate of electrode data pass through automatic switch unit and ultrasonic function
Energy IC chip is connected with detection IC chip is pressed.The compound lead-in plate of top electrode data and lower electrode data are compound
Lead-in plate mainly pass through top electrode data composite cable and lower electrode data composite cable and ultrasound functions IC chip and
Detection IC chip connection is pressed, data signal transmission is completed.
FPGA timing controller, the FPGA timing control core can also be arranged in the capacitive MEMS sensor array
Piece controls ultrasound functions IC chip respectively or presses detection IC chip, realizes capacitive MEMS sensing respectively
The ultrasound functions of device array detect or press Function detection.The achievable diagnoses and treatment of ultrasound functions IC chip
Mode includes mode A, M-mode, B-mode, 3D mode, doppler mode, high frequency focusing therapy mode.
The automatic switch unit presses detection signal according to capacitive MEMS sensor, and analytical calculation obtains condenser type
It needs to switch to the part of ultrasound functions in MEMS sensor, and then opens the partition capacitance formula MEMS sensor and realize ultrasonic function
Can, after the completion of detection, the automatic switch unit restores capacitive MEMS sensor to pressing function.Above-mentioned automatic switchover list
The signal that presses that member acquires when being according to capacitive MEMS sensor and press functional status automatically selects partition capacitance formula MEMS
Then the capacitive MEMS sensor of selection is switched to ultrasound functions state, acquisition ultrasound from functional status is pressed by sensor
Signal.Because what capacitive MEMS sensor was acquired when pressing functional status presses signal substantially and can determine the cross in lump region
Cross-sectional sizes, but need the depth and lump depth direction of ultrasound functions state acquisition lump region located subcutaneously tissue
Length.Above-mentioned imaging signal integral unit obtains lump in breast according to the palpation signal data and ultrasonic signal data of acquisition
Three-dimensional configuration data information, specific practice are capacitive MEMS sensor array in pressing under operating mode, will obtain breast
Middle lump corresponds to the data informations such as size, the shape of array force direction cross section.Array is under the super operating mode of A, will
It obtains lump in breast and corresponds to array force direction apart from data informations such as skin depth, capsule realities, as needed to breast
Surface is marked, more accurately to point out the position of lump.
The detection IC chip that presses includes small capacitance detection unit and analog-to-digital conversion control unit, described micro-
Small capacitances detection unit and analog-to-digital conversion control unit are by electrode data composite cable, by automatic switch unit, then via
The compound lead-in plate of top electrode data and the lower compound lead-in plate of electrode data are connect with the top electrode of array and lower electrode respectively.
The focus layer is equipped with focus lamp.The focus lamp is integrally in reverse pyramid, and the focus lamp is according to Fresnel
Lens principle forms thin sheet lens by polyolefine material injection pressure, realizes focusing function.The preferred PDMS(poly dimethyl of the focus lamp
Siloxanes), RTV(room temperature vulcanized silicone rubber), polyethylene, one of polyimides or many kinds of solids polymer composition, secondary choosing
The liquid polymers such as glycerol, gel composition.The focus layer outer layer is plane, and internal layer is the focus lamp of inverted pyramid shape, gold
The length and height of word tower bottom are respectively 1/4 and 1/10 and its integer multiple of ultrasonic wavelength, by taking the ultrasound of 15MHz as an example,
The pyramid bottom length and pyramidal height of focus lamp are respectively 25 microns and 10 microns, and the focal length of formation is very short.Although electric
Appearance formula MEMS pressure sensor, because of acoustic impedance 1.5 MRayls of its acoustic impedance and water and tissue, it is similar without
With layer, but the matching layer of conventional piezoelectric ultrasonic probe is substituted for the focus layer of CMUT array and realizes focusing function, in conjunction with number
The focusing of a CMUT array can be used for nearly burnt HIFU Treatment.
The capacitive MEMS sensor further includes pressure distribution protective film, and the pressure distribution protective film is located at focus layer
Upper layer or lower layer, the focus layer and pressure distribution protective film combine together, common docile is in array surface.The pressure
It distributes protective film and selects material similar with tested organism acoustic impedance, such as Parylene, TPU, polyimides, polyurethane, ring
One of oxygen resin or a variety of compounds composition.
Top electrode lead-out wire, the lower electrode outlet line of the capacitive MEMS sensor lead to adjacent sensors outward
Centre, and the part along longitudinally, laterally traveling between adjacent rows sensor.Top electrode lead-out wire is in sensor array
Side forms top electrode end tab, and top electrode end tab is connected with the compound lead-in plate of top electrode data.Lower electrode outlet line exists
The side of sensor array forms lower electrode end tab, and lower electrode end tab is connected with the lower compound lead-in plate of electrode data.
The top electrode, top electrode lead-out wire, top electrode end tab, the compound lead-in plate of top electrode data, lower electrode, lower electricity
Pole lead-out wire, lower electrode end tab, the lower compound lead-in plate of electrode data are deposited or the Graphic Design of etching preparation, material
Select one of gold, silver, copper, graphene.
The capacitive MEMS sensor array can be passed by least three multiplied by least three capacitive MEMS arranged vertically and horizontally
Sensor cluster composition presses detection unit, and wherein any one capacitive MEMS sensor can complete ultrasound functions, described
It presses detection unit and ultrasound functions unit is fused to form array together completely.The detection unit that presses is to realize to press inspection
The basic unit of brake, this is pressed detection unit and can be arranged in length and breadth at least three multiplied by least three by capacitive MEMS sensor
The form cluster of column is into connecting and be integrated in top electrode lead-out wire, lower electrode outlet line by electrode data composite cable
In one circuit board.When pressing detection, automatic switch unit touches capacitive MEMS sensor in functional status, acquisition is pressed
Press signal；Then, partition capacitance formula MEMS sensor progress ultrasound works are automatically selected according to the signal that presses of acquisition, it is described super
Sound function includes transmitting ultrasound and receives ultrasound, and chronologically controls the transmitting of adjacent capacitor formula MEMS sensor and receive journey
Sequence can also emit according to a column capacitance formula MEMS sensor, and the received program of adjacent capacitor formula MEMS sensor carries out.
Certainly, the capacitive MEMS sensor array can also be divided into two regions, and first area is set in two regions
It is set to and presses detection unit, realization presses detection, and second area is set as ultrasound functions unit, realizes ultrasound functions.It is described to melt
Conjunction, which presses detection unit and the capacitive MEMS sensor array of ultrasound functions unit, to form full fusion type according to function needs
Array and semi-fusion formula array.The physical structure of so-called full fusion type array is just the same, each electricity in full fusion type array
Appearance formula MEMS sensor physical structure having the same, shape, centre frequency and bandwidth；Each capacitor in semi-fusion formula array
Formula MEMS sensor can have different structures, centre frequency and bandwidth.Certainly, semi-fusion formula array, which may be designed in, presses
Array and supersonic array are integrated on an array, if planar array, press array and the supersonic array respectively area Fen Zhanyige
Domain；If curved array, the mutual back-to-back arrangement on curved surface of array and supersonic array is pressed.This fusion presses detection and ultrasound
The capacitive MEMS sensor array of function, preferred full fusion type array are secondary to select semi-fusion formula array.
Detailed description of the invention
Fig. 1: for the utility model capacitive MEMS sensor array cutting structural schematic diagram；
Fig. 2: for the utility model capacitive MEMS sensor array overlooking structure diagram；
Fig. 3: for the utility model capacitive MEMS sensor array process control schematic diagram 1；
Fig. 4: for the utility model capacitive MEMS sensor array process control schematic diagram 2；
Fig. 5: for the first arrangement mode structural schematic diagram of the utility model capacitive MEMS sensor array；
Fig. 6: for second of arrangement mode structural schematic diagram of the utility model capacitive MEMS sensor array；
Fig. 7: for the utility model capacitive MEMS sensor array experimental principle figure；
Fig. 8: for the utility model capacitive MEMS sensor array schematic perspective view.
Specific embodiment
Embodiment:
As shown in Fig. 1,2,8, a kind of capacitive MEMS sensor array, including at least three longitudinal arrangement is multiplied by least three
Transversely arranged capacitive MEMS sensor 6, the capacitive MEMS sensor 6 include focus layer 4, and top electrode 1, top electrode is drawn
Outlet 11, top electrode end tab 12, the compound lead-in plate 14 of top electrode data, vibration film 31, clearance cavity 32, supporting layer 33,
Insulating layer 34, lower electrode 2, lower electrode outlet line 21, lower electrode end tab 22, the lower compound lead-in plate 24 of electrode data, array base
Bottom 35, the focus layer 4 are located at 1 upper layer of top electrode, and whole outer surface is in open and flat shape, and the top electrode 1 is hung down with lower electrode 2
Straight corresponding, the vibration film 31 selects Si/Si3N4/SiO2Composite membrane guarantees that its spreading, the lower electrode 2 fit closely
In array substrate layer 35,35 lateral surface of array substrate layer is integrally in open and flat shape, and 35 medial surface of array substrate layer is in interruption
Pinnacle Pyramid or mortar shape are removed in the inversion of formula rule.To guarantee, the conversion of function and ultrasound functions is pressed, is somebody's turn to do
Capacitive MEMS sensor array further includes automatic switch unit 71 and imaging signal integral unit 72, the automatic switch unit
71 control capacitive MEMS sensors 6 switch between functional status and ultrasound functions state pressing, and control capacitive MEMS passes
The acquisition of sensor 6 presses signal or ultrasonic signal；The imaging signal integral unit 72 receives each capacitive MEMS sensor 6
Output presses signal and/or ultrasonic signal, and the cross section size for pressing signal acquisition, shape data signal and ultrasound are believed
Integrating apart from skin depth, capsule reality data-signal for number acquisition, exports three-dimensional three-dimensional configuration data-signal.
The main fabrication processing of capacitive MEMS sensor array are as follows:
The first step, top crown wafer1 select with a thickness of 300um, 4 cun of SOI twin polishing silicon wafer to manufacture top crown parts.
1, reverse side gluing, photoetching, develop figure out, by deep silicon etching technique, be etched through entire silicon wafer, form bonding
The alignment mark that top crown is bonded when technique.
Second step, bottom crown wafer2 select with a thickness of 300um, 4 cun of twin polishing silicon wafer to manufacture bottom crown parts.
1, front is by special gluing, photoetching, development and silicon etching process, formed be inverted go pinnacle Pyramid or
Person's mortar shape, to increase lower electrode plate suqare, opening width 100um.
2, deposited metal Al, thickness 0.5um, then by gluing, photoetching, development and Al etching technics, formed to be inverted and remove point
Push up lower electrode 2, lower contact conductor 21, the lower electrode end tab 22 of Pyramid or mortar shape.
3, by oxidation technology, SiO, thickness 1um are deposited, this oxide layer is insulating layer 12, can both play vibration film
The effect of 31 isolation can be used as bonding layer again.
4, reverse side gluing, photoetching, develop figure out, by silicon etching process, bottom crown bonding when forming bonding technology
Alignment mark.
5, reverse side deposited metal Al, thickness 0.5um, then by gluing, photoetching, development and Al etching technics, formed compound
Cable.
Third step, upper bottom crown bonding are completed using the alignment mark of upper bottom crown by anode linkage technique
Wafer1 reverse side and the positive bonding of wafer2.
4th step, removal technique.
1, the front side silicon layer of wafer1 after TMAH solution removal bonding is utilized.
2, the buried oxide layer of BOE solution removal wafer1 is utilized.
3, silica and silicon nitride composite membrane are successively deposited using PECVD device, thickness be respectively 0.2um and
0.3um forms compound vibration film 31.
4, in front deposited metal Al, the thickness 0.5um of upper and lower bonding pad, then pass through gluing, photoetching, development and Al etching
Technique forms the end tab 12 of top electrode 1, top electrode lead 11, top electrode.
5, using through-silicon-via technology or side electrode process, respectively by top electrode end tab, lower electrode end tab with
Composite cable establishes electrical connection.
5th step, the production of integrated chip unit
1, automatic switch unit 71 is respectively completed using ic manufacturing process, imaging signal integral unit 72, pressed
Detect the production of integrated circuit and ultrasound functions integrated circuit.
6th step, the fitting of integrated unit
1, using insulating cement by automatic switch unit 71, imaging signal integral unit 72, press detection integrated circuit and super
Sound functional integrated circuit is attached to the reverse side of upper and lower bonding pad.
2, using lead key closing process by automatic switch unit 71, imaging signal integral unit 72, press the integrated electricity of detection
Road and ultrasound functions integrated circuit and composite cable, which are established, to be electrically connected, as shown in Figure 2.
7th step, docile focus layer 4, cutting, routing.
The top electrode 1, top electrode lead-out wire 11, top electrode end tab 12, the compound lead-in plate 14 of top electrode data, lower electricity
Pole 2, lower electrode outlet line 21, lower electrode end tab 22, the lower compound lead-in plate 24 of electrode data are deposited or etching preparation
Graphic Design, material can choose one of gold, silver, copper, aluminium, graphene.
As shown in Figure 1, the focus layer 4 is equipped with focus lamp 42, the whole focus lamp 42 is in reverse pyramid, pyramid
Bottom lengths are 1/4 or the multiple that capacitive MEMS sensor 6 generates ultrasonic wavelength, and pyramidal height is condenser type
1/10 or multiple of the generation ultrasonic wavelength of MEMS sensor 6.The capacitive MEMS sensor 6 further includes that pressure distribution is protected
Cuticula 41, the pressure distribution protective film 41 are located at the lower layer of focus layer 4, and the focus layer 4 is melted with pressure distribution protective film 41
It is integrated, common docile is in array surface.
Experiment one: experimental study is carried out to the performance of the capacitive MEMS sensor array, is used for analyzing the structure
The feasibility of palpation.
Experiment method: the probe stress summation being made of 192 functional units is about 2000 grams, average each function
10 grams of unit stress or so, it is contemplated that probe is applied to each functional unit when skin and non-stress is just the same, is considered, takes and apply
Force value is 30 grams (0.3N).Based on single functional unit, pass through experiment discussion CMUT functional unit being applicable in for palpation
Property, experimental provision as shown in fig. 7, comprises: pressure test workbench 8, pressure adjustment knob 81, pressure ball 82, PCap02 assessment
External member 83, PC84, sample to be tested 9.
As shown in fig. 7, applying 0 N(light condition to 9 functional unit of sample to be tested), 0.06 N, 0.12 N, 0.18 N,
0.24 N assesses external member 83 to the basis electricity of capacitive MEMS sensor array to be measured (size 2mm × 2mm) by PCap02
Capacitance and capacitance variations value are measured and analyze.
| Apply pressure/N | 0.06 | 0.12 | 0.18 | 0.24 | 0.3 |
| Capacitance change/PF | 0.205 | 0.403 | 0.709 | 1.001 | 1.428 |
Experimental result: when applying the pressure that palpation is adapted, capacitive MEMS sensor array has good sensitivity
With it is linear, while there is good anti-interference and stability.
As shown in Fig. 2, the top electrode lead-out wire 11 of the capacitive MEMS sensor 6, lower electrode outlet line 21 are outward
Lead to the centre of adjacent sensors, and the part along longitudinally, laterally traveling between adjacent rows sensor.
As shown in figure 3, the array press part be made of at least three multiplied by 3 capacitive MEMS sensors, it is described from
Dynamic switch unit 71 presses detection signal according to capacitive MEMS sensor 6, and analytical calculation obtains capacitive MEMS sensor 6
The middle part for needing to switch to ultrasound functions, and then open capacitive MEMS sensor 6 and realize ultrasound functions, after the completion of detection,
The automatic switch unit 71 restores capacitive MEMS sensor 6 to pressing function.As shown in figure 3, being functionally used as super
Sound unit can be used for detecting lump depth or identification lump capsule reality and depth direction for emitting and receiving ultrasonic signal
Length, which also can be used mature PMUT/ piezoelectric supersonic unit substitution.Ultrasound unit is also used for specific feelings
Ultrasonic therapy under condition.What the imaging signal integral unit 72 received that each capacitive MEMS sensor 6 exports presses signal
And/or ultrasonic signal, and cross section size, the shape data signal skin at a distance from ultrasonic signal acquisition that signal acquisition will be pressed
Skin depth, the integration of capsule reality data-signal, export three-dimensional three-dimensional configuration data-signal.
As shown in figure 4, the capacitive MEMS sensor array further includes ultrasound functions IC chip 51 and presses
IC chip 52, electrode data composite cable 36 are detected, the electrode data composite cable 36 is answered including top electrode data
Zygonema cable 361 and lower electrode data composite cable 362, the compound lead-in plate 14 of the top electrode data and lower electrode data is compound draws
Enter plate 24 by electrode data composite cable 36 respectively with ultrasound functions IC chip 51 and press detection ic core
Piece 52 connects.The capacitive MEMS sensor array further includes FPGA timing controller 53, the FPGA timing control core
Piece 53 controls ultrasound functions IC chip 51 respectively or presses detection IC chip 52, realizes ultrasound functions respectively
Or press detection.
As shown in Figure 1, the detection IC chip 52 that presses includes small capacitance detection unit and analog-to-digital conversion control
Unit processed, the small capacitance detection unit and analog-to-digital conversion control unit are by automatic switch unit, then pass through electrode data
Composite cable 36, then it is upper with array respectively via the compound lead-in plate 14 of top electrode data and the compound lead-in plate 24 of lower electrode data
Electrode 1 and the connection of lower electrode 2.
It is passed as shown in figure 5, the capacitive MEMS sensor array shows 6 multiplied by 6 capacitive MEMSs arranged vertically and horizontally
6 cluster of sensor composition presses detection unit 61, wherein any one column capacitance formula MEMS sensor 6 is constituted ultrasonic function with longitudinal arrangement
Can unit 62, it is described to press detection unit 61 and ultrasound functions unit 62 is fused to form array together completely.As shown in fig. 6,
The capacitive MEMS sensor array can also be divided into two regions 63, and first area 631 is set as pressing in two regions 63
Detection unit 61, realization press detection, and second area 632 is set as ultrasound functions unit 62, realize ultrasound functions.
The implementation method of automatic switch unit: can be selected common single-chip microcontroller (IC) as hardware support, using at least 3 multiplied by
3 two-dimensional array, which, which can be used for storing, presses the pressure signal data acquired under mode.Data are analyzed, are counted
Calculate, obtain the corresponding line number of functional unit and row number that pressure value in array is greater than certain threshold value, and using line number and row number as
The output of automatic switch unit is for controlling the part that will be needed in array from pattern switching is pressed to ultrasound mode.The threshold value
It can be set according to actual needs.Other feasible modes can be selected to realize the production of IC.It of courses, will can also cut automatically
It changes unit and array is integrated on a silicon wafer, can be integrated in top crown also can integrate on bottom crown.It can also root
According to needing to be divided into two parts, a part is integrated in top crown and another part is integrated in bottom crown, is then established and is believed by lead
Number connection.It can also be placed between bottom crown.
Imaging signal integral unit: can be selected common single-chip microcontroller (IC) as hardware support, using at least 3 multiplied by 3 multiplied by 3
Three-dimensional array, which can be used for storing the pressure signal data (comprising two dimension) and ultrasound mode for pressing and acquiring under mode
The depth data of lower acquisition (comprising one-dimensional).2-D data is analyzed, is calculated, pressure value in array is obtained and is greater than certain threshold
Lump cross section can be obtained in the addition of area corresponding to these functional units by the corresponding line number of the functional unit of value and row number
Preliminary size.Preliminary size is acquired under ultrasound mode and is held by the sectional area size after being corrected multiplied by certain coefficient
Length data at the functional unit of row ultrasound functions on depth data of the lump from skin surface and lump depth direction.It will be upper
Stating cross-sectional data, depth data and the integration of depth direction length data, the data after integration can be used for three-dimensional imaging.The threshold
Value can be set according to actual needs.Other feasible modes can be selected to realize the production of IC.It of courses, can also will be imaged
Signal integration unit and array are integrated on a silicon wafer, and can be integrated in top crown also can integrate on bottom crown.?
It can according to need and be divided into two parts, a part is integrated in top crown and another part is integrated in bottom crown, then passes through lead
Establish signal connection.It can also be placed between bottom crown.
Claims (8)
1. a kind of capacitive MEMS sensor array, including at least three longitudinal arrangement condenser type transversely arranged multiplied by least three
MEMS sensor (6), the capacitive MEMS sensor (6) include focus layer (4), top electrode (1), top electrode lead-out wire
(11), top electrode end tab (12), the compound lead-in plate of top electrode data (14) shake film (31), clearance cavity (32), support
Layer (33), insulating layer (34), lower electrode (2), lower electrode outlet line (21), lower electrode end tab (22), lower electrode data are compound
Lead-in plate (24), array substrate layer (35), the focus layer (4) are located at top electrode (1) upper layer, and whole outer surface is in open and flat shape
Shape, the top electrode (1) and lower electrode (2) are vertical corresponding, and the vibration film (31) selects SiN and SiO composite membrane, guarantee not
The spreading of film (31) is shaken when applying bias voltage, the lower electrode (2) fits closely with array substrate layer (35), described
Array substrate layer (35) lateral surface is integrally in open and flat shape, and array substrate layer (35) medial surface removes point in the inversion of discontinuous rule
Push up Pyramid or mortar shape, which is characterized in that further include that automatic switch unit (71) and imaging signal integration are single
First (72), automatic switch unit (71) control capacitive MEMS sensor (6) are pressing functional status and ultrasound functions shape
Switch between state, control capacitive MEMS sensor (6) acquisition presses signal or ultrasonic signal；The imaging signal integration is single
Each capacitive MEMS sensor (6) output of first (72) reception presses signal and/or ultrasonic signal, and will press signal acquisition
Cross section size, shape data signal at a distance from ultrasonic signal acquisition skin depth, capsule reality data-signal integration, output
Three-dimensional three-dimensional configuration data-signal.
2. capacitive MEMS sensor array described in claim 1, which is characterized in that further include ultrasound functions integrated circuit
Chip (51) and press detection IC chip (52), electrode data composite cable (36), the electrode data composite cable
It (36) include top electrode data composite cable (361) and lower electrode data composite cable (362), the top electrode data are compound to draw
Enter plate (14) and the lower compound lead-in plate of electrode data (24) and ultrasound functions IC chip (51) and presses the integrated electricity of detection
Road chip (52) connection.
3. capacitive MEMS sensor array as claimed in claim 2, which is characterized in that automatic switch unit (71) basis
Capacitive MEMS sensor (6) presses detection signal, and analytical calculation obtains needing to switch in capacitive MEMS sensor (6)
The part of ultrasound functions, and then open capacitive MEMS sensor (6) and realize ultrasound functions, it is described to cut automatically after the completion of detection
Changing unit (71) restores capacitive MEMS sensor (6) to pressing function.
4. capacitive MEMS sensor array according to claim 3, which is characterized in that described to press detection integrated circuit
Chip (52) includes small capacitance detection unit and analog-to-digital conversion control unit, the small capacitance detection unit and analog-to-digital conversion
Control unit is multiple by electrode data composite cable (36), then via the compound lead-in plate of top electrode data (14) and lower electrode data
Lead-in plate (24) are closed to connect with the top electrode of array (1) and lower electrode (2) respectively.
5. any capacitive MEMS sensor array of claim 1-4, which is characterized in that set on the focus layer (4)
There are focus lamp (42).
6. capacitive MEMS sensor array according to claim 5, which is characterized in that the capacitive MEMS sensor
It (6) further include pressure distribution protective film (41), pressure distribution protective film (41) is located at the lower layer of focus layer (4), described poly-
Focus layer (4) combines together with pressure distribution protective film (41), and common docile is in array surface.
7. capacitive MEMS sensor array according to claim 1, which is characterized in that the capacitive MEMS sensor
(6) top electrode lead-out wire (11), lower electrode outlet line (21) lead to the centre of adjacent sensors outward, and along it is longitudinal,
Part of the lateral traveling between adjacent rows sensor.
8. capacitive MEMS sensor array according to claim 1, which is characterized in that the top electrode (1) powers on
Pole lead-out wire (11), top electrode end tab (12), the compound lead-in plate of top electrode data (14), lower electrode (2), lower electrode outlet line
(21), lower electrode end tab (22), the lower compound lead-in plate of electrode data (24) are deposited or the Graphic Design of etching preparation,
Material selects one of gold, silver, copper, graphene.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107334461A (en) * | 2016-08-31 | 2017-11-10 | 北京先通康桥医药科技有限公司 | A kind of capacitive MEMS sensor array |
| CN110664486A (en) * | 2019-09-25 | 2020-01-10 | 中国科学院重庆绿色智能技术研究院 | Be applied to surgical robot's apparatus and equipment |
| CN111569252A (en) * | 2020-05-20 | 2020-08-25 | 重庆大学 | Integrated chip |
| CN113576408A (en) * | 2021-07-16 | 2021-11-02 | 重庆金山医疗技术研究院有限公司 | PH capsule, PH capsule wireless detection system and esophagus pH monitoring method |
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| CN107957273B (en) * | 2018-01-16 | 2024-05-03 | 北京先通康桥医药科技有限公司 | Sensor with touch-press and ultrasonic functions |
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Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4555953A (en) * | 1984-04-16 | 1985-12-03 | Paolo Dario | Composite, multifunctional tactile sensor |
| US4964302A (en) * | 1984-09-25 | 1990-10-23 | Grahn Allen R | Tactile sensor |
| JP5678670B2 (en) * | 2011-01-06 | 2015-03-04 | セイコーエプソン株式会社 | Ultrasonic sensor, tactile sensor, and gripping device |
| TWI461657B (en) * | 2011-12-26 | 2014-11-21 | Ind Tech Res Inst | Capacitive transducer, manufacturing method thereof, and multi-function device having the same |
| CN205083444U (en) * | 2015-05-22 | 2016-03-16 | 北京先通康桥医药科技有限公司 | Palpation probe |
| CN204863261U (en) * | 2015-07-23 | 2015-12-16 | 北京先通康桥医药科技有限公司 | Palpation probe protective sheath |
| CN105147332A (en) * | 2015-09-14 | 2015-12-16 | 电子科技大学 | Optoacoustic/ultrasonic dual mode endoscope based on miniature piezoelectric ultrasonic transducer arrays |
| CN105426024B (en) * | 2015-11-25 | 2018-03-27 | 吉林大学 | A kind of haptic feedback system and method based on focusing ultrasonic wave |
| CN205306997U (en) * | 2015-12-28 | 2016-06-15 | 中国科学院苏州生物医学工程技术研究所 | Diagnose integrated ultrasonic system based on capacitanc microfabrication ultrasonic transducer area array |
| CN208212011U (en) * | 2016-08-31 | 2018-12-11 | 北京先通康桥医药科技有限公司 | A kind of capacitive MEMS sensor array |
-
2017
- 2017-08-16 CN CN201721027103.2U patent/CN208212011U/en active Active
- 2017-08-16 CN CN201710703888.9A patent/CN107334461A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107334461A (en) * | 2016-08-31 | 2017-11-10 | 北京先通康桥医药科技有限公司 | A kind of capacitive MEMS sensor array |
| CN110664486A (en) * | 2019-09-25 | 2020-01-10 | 中国科学院重庆绿色智能技术研究院 | Be applied to surgical robot's apparatus and equipment |
| CN110664486B (en) * | 2019-09-25 | 2022-02-08 | 中国科学院重庆绿色智能技术研究院 | Be applied to surgical robot's apparatus and equipment |
| CN111569252A (en) * | 2020-05-20 | 2020-08-25 | 重庆大学 | Integrated chip |
| CN113576408A (en) * | 2021-07-16 | 2021-11-02 | 重庆金山医疗技术研究院有限公司 | PH capsule, PH capsule wireless detection system and esophagus pH monitoring method |
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