CN107334461A - A kind of capacitive MEMS sensor array - Google Patents
A kind of capacitive MEMS sensor array Download PDFInfo
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/22—Ergometry; Measuring muscular strength or the force of a muscular blow
- A61B5/221—Ergometry, e.g. by using bicycle type apparatus
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0247—Pressure sensors
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/028—Microscale sensors, e.g. electromechanical sensors [MEMS]
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Abstract
The present invention provides a kind of capacitive MEMS sensor array,The transversely arranged capacitive MEMS sensor of at least three is multiplied by including at least three longitudinal arrangement,The capacitive MEMS sensor includes focus layer,Top electrode,Top electrode lead-out wire,Top electrode end tab,The compound lead-in plate of Top electrode data,Shake film,Clearance cavity,Supporting layer,Insulating barrier,Bottom electrode,Bottom electrode lead-out wire,Bottom electrode end tab,The compound lead-in plate of bottom electrode data,Array substrate layer,Automatic switch unit,Imaging signal integral unit,Automatic switch unit control capacitive MEMS sensor switches between functional status and ultrasound functions state pressing,The sensor collection of control capacitive MEMS presses signal or ultrasonic signal,Imaging signal integral unit integrates above-mentioned data-signal,Export three-dimensional three-dimensional configuration data-signal.
Description
Technical field
The present invention relates to a kind of capacitive MEMS sensor array, for realizing that carrying out detection to the exception of tissue to be checked examines
Disconnected and treatment, belongs to medicine equipment manufacture technology field.
Background technology
The most popular method that the mankind are checked body surface and accessible tissue is palpation.Utilize array of pressure sensors
The meisner corpusculum tactus that simulation is arranged in human skin carries out bionical palpation, you can realizes and the exception of tissue to be checked is entered
Row screens the process of detection.
The static characteristics such as the long-term reliability of pressure sensor, humiture stability, repeatability, null offset, sensor
The mechanical property of thickness and its force-sensitive material, all it is an important factor for influenceing pressure sensor performance.Detect elastic pressure point
Cloth just needs the array that identical single pressure sensor is formed to complete, and the homogenieity and sensor of each pressure sensor
The factors such as the homogeneity of spacing, the laminate structures pretension of array can all influence the application effect of array of pressure sensors.For treating
Examine the profile of thing and the difference of modulus of elasticity, it is also necessary to handling flexibly is carried out to array of pressure sensors, and to realize pressure and pass
The flexibility of sensor array, the homogenieity of each pressure sensor, the homogeneity of sensor spacing, the laminate structures pretension of array
Etc. factor on conventional flex array of pressure sensors embody the problem of it is a lot.
Based on MEMS technology, proposed earliest by Stanford Univ USA Haller and Khuri Yakub research groups
CMUT（Capacitive micro-machined ultrasound transducer/ capacitive micromachined ultrasonic sensors）,
Mems thin film is prepared using micro fabrication, the transmitting and reception of ultrasonic wave are realized using meagre vibration of membrane and oar song.With
Traditional PZT ultrasonic probes are compared, and CMUT eliminates necessary matching layer and backing in structure, is more suitable for array；In work(
Can on can improve frequency bandwidth, FREQUENCY CONTROL are more flexible, sensitivity is higher, transmission power can be higher.But in actual clinical work,
For the lesion of accessible tissue, it is most convenient and effective method to carry out palpation.Using ultrasound to accessible lesion tissue, especially
It is entity tumor, and carrying out detection, to occur susceptibility bad, the problem of local ultrasound heat production.The lesion that pair can touch tissue is carried out
Diagnosis, ideal method is first to carry out palpation, wait to lay one's hand on and lump and needing further appreciate that its capsule, real property or
During the information such as the depth in tissue, then combined echocardiography is detected, and can obtain more diagnostic messages.Once it is determined that swollen in tissue
The information such as the hardness of block, size, profile, depth, then HIFU Treatment is carried out in time, can more efficiently solve effects of clinic diagnosis.By breast
Lesion lump is shown in three dimensions in room, for patient, can more directly perceived, clearly understand the healthy shape of diagnosis and treatment person
Condition, can also assist personnel progress condition assessment.
Fusion prepared by the present invention presses the capacitive MEMS sensor array of detection and ultrasound functions, and traditional pole span is become
Change type capacitance pressure transducer, replaces with CMUT/ capacitive micromachined ultrasonic sensors, can improve a pressure sensor
The laminate structures pretension of the homogeneity and display of homogeneity and sensor spacing.Using this sensor array, biasing is integrated
Voltage and driving voltage circuit, the warm MEMS sensor array for pressing detection function and ultrasound detection function can be built into.This
Array is in conjunction with the detection module and display module for pressing detection function and ultrasound detection function, you can is configured to integral type spy
Head, for detecting and treating the exception of accessible tissue.Fusion prepared by the present invention presses detection function and ultrasound detection function
Capacitive MEMS sensor array, the hardness of tumour in tissue, size, outer can only be detected by solving single pressure sensor
Shape, and the problems such as be difficult to judge the global shape of depth of the tumour in tissue, the capsule of tumour or entity property, tumour, also
High frequency ultrasound treatment function can be realized by the effect of focus lamp.
The array structure of preferably silicone base capacitance MEMS single axial flexibilities of the invention, it is secondary to select PDMS flexibility low frequencies CMUT
Array.The array can apply the detecting head surface, finger end surfaces, hand in any shape with backing formula, inserted, finger cot type method
On art apparatus, for detecting the lesion for the treatment of local organization.
The content of the invention
It is an object of the invention to provide a kind of capacitive MEMS sensor array, including at least three longitudinal arrangement to be multiplied by
The transversely arranged capacitive MEMS sensor of at least three, the capacitive MEMS sensor include focus layer, Top electrode, upper electricity
Pole lead-out wire, Top electrode end tab, the compound lead-in plate of Top electrode data, vibrations film, clearance cavity, supporting layer, insulating barrier, under
Electrode, bottom electrode lead-out wire, bottom electrode end tab, the compound lead-in plate of bottom electrode data, array substrate layer, the focus layer are located at
Top electrode upper strata, overall outer surface are in open and flat shape, and the Top electrode is vertical corresponding with bottom electrode, and the vibrations film is selected
Si/Si3N4/SiO2Composite membrane, ensure its spreading, the bottom electrode is brought into close contact with array substrate layer, the array substrate layer
Lateral surface is in integrally open and flat shape, and array substrate layer medial surface removes pinnacle Pyramid or ground in the inversion of discontinuous rule
Bowl shape.The capacitive MEMS sensor array also includes automatic switch unit and imaging signal integral unit, described automatic
Switch unit controls capacitive MEMS sensor to switch between functional status and ultrasound functions state pressing, and controls condenser type
MEMS sensor collection presses signal or ultrasonic signal；The imaging signal integral unit receives each capacitive MEMS sensing
Device output presses signal and/or ultrasonic signal, and cross section size, shape data signal and the ultrasound that will press signal acquisition
Being integrated apart from skin depth, capsule reality data-signal for signal acquisition, exports the three-dimensional configuration data-signal of solid.
For the thickness of the vibrations film between 0.5 micron to 5 microns, the bottom electrode is fitted tightly over array substrate
Layer, the bottom electrode are in different shape because array substrate layer shape is different, such as open and flat shape, mortar shape, are inverted and remove point
Push up Pyramid.The preferred flexible printed circuit board of array substrate layer, it is secondary to select the hard materials such as silicon, resin.The focusing
Layer can be built by synthetic resin and is made.The close docile of capacitive MEMS sensor array is in single axial hardness sizing backing
On, because sizing backing shape is different, upper surface is prepared into as plane, curved surface, the different arrays of annular.
The capacitive MEMS sensor array also includes ultrasound functions IC chip and presses detection ic core
Piece, electrode data composite cable, the electrode data composite cable includes Top electrode data composite cable and bottom electrode data are answered
Zygonema cable, the compound lead-in plate of the Top electrode data and the compound lead-in plate of bottom electrode data pass through automatic switch unit and ultrasonic work(
Energy IC chip connects with detection IC chip is pressed.The compound lead-in plate of Top electrode data and bottom electrode data are compound
Lead-in plate mainly by Top electrode data composite cable and bottom electrode data composite cable and ultrasound functions IC chip and
Detection IC chip connection is pressed, completes data signal transmission.
The capacitive MEMS sensor array can also set FPGA timing controllers, the FPGA SECO core
Piece controls ultrasound functions IC chip or presses detection IC chip respectively, realizes that capacitive MEMS senses respectively
The ultrasound functions detection of device array presses Function detection.The achievable diagnoses and treatment of ultrasound functions IC chip
Pattern includes mode A, M-mode, B-mode, 3D patterns, doppler mode, high frequency focusing therapy pattern.
The automatic switch unit is analyzed and condenser type is calculated according to the detection signal that presses of capacitive MEMS sensor
Need to switch to the part of ultrasound functions in MEMS sensor, and then open the partition capacitance formula MEMS sensor and realize ultrasonic work(
Can, after the completion of detection, the automatic switch unit makes capacitive MEMS sensor recover to pressing function.Above-mentioned automatic switchover list
The signal that presses that member gathers when being according to capacitive MEMS sensor and press functional status automatically selects partition capacitance formula MEMS
Sensor, the capacitive MEMS sensor of selection is then switched into ultrasound functions state, collection ultrasound from functional status is pressed
Signal.Because what capacitive MEMS sensor gathered when pressing functional status presses signal and can determine the horizontal stroke in lump region substantially
Cross-sectional sizes, but need the depth and lump depth direction of ultrasound functions state acquisition lump region located subcutaneously tissue
Length.Above-mentioned imaging signal integral unit obtains lump in breast according to the palpation signal data and ultrasonic signal data of acquisition
Three-dimensional configuration data message, specific practice are in for capacitive MEMS sensor array and pressed under mode of operation, will obtain breast
Middle lump corresponds to the data messages such as the size of array force direction cross section, shape.Array is under the super mode of operations of A, will
Obtain lump in breast and correspond to array force direction apart from data messages such as skin depth, capsule realities, as needed to breast
Surface is marked, more accurately to point out the position of lump.
The detection IC chip that presses includes small capacitance detection unit and analog-to-digital conversion control unit, described micro-
Small capacitances detection unit and analog-to-digital conversion control unit are by electrode data composite cable, by automatic switch unit, then via
The compound lead-in plate of Top electrode data and the compound lead-in plate of bottom electrode data are connected with the Top electrode and bottom electrode of array respectively.
The focus layer is provided with focus lamp.The focus lamp is in integrally reverse pyramid, and the focus lamp is according to Fresnel
Lens principle, thin sheet lens are formed by polyolefine material injection pressure, realize focusing function.The preferred PDMS of the focus lamp（Poly dimethyl
Siloxanes）、RTV（Room temperature vulcanized silicone rubber）, polyethylene, one or more solid polymers composition in polyimides, secondary choosing
The liquid polymerses such as glycerine, gel form.The focus layer outer layer is plane, and internal layer is the focus lamp of inverted pyramid shape, golden
The length and height of word bottom of towe are respectively 1/4 and 1/10 and its integer multiple of ultrasonic wavelength, by taking 15MHz ultrasound as an example,
The pyramid bottom length and pyramidal height of focus lamp are respectively 25 microns and 10 microns, and the focal length of formation is very short.It is although electric
Appearance formula MEMS pressure sensor, because of acoustic impedance 1.5 MRayls of its acoustic impedance and water and tissue, it is similar without
With layer, but the matching layer of conventional piezoelectric ultrasonic probe is substituted for the focus layer of CMUT arrays and realizes focusing function, binding number
The focusing of individual CMUT arrays, available for nearly burnt HIFU Treatment.
The capacitive MEMS sensor also includes pressure distribution diaphragm, and the pressure distribution diaphragm is located at focus layer
Upper strata or lower floor, the focus layer and pressure distribution diaphragm combine together, common docile is in array surface.The pressure
Distribute diaphragm and select the material similar to being detected organism acoustic impedance, such as Parylene, TPU, polyimides, polyurethane, ring
One or more compounds composition in oxygen tree fat.
Top electrode lead-out wire, the bottom electrode lead-out wire of the capacitive MEMS sensor outwards lead to adjacent sensors
Centre, and the part along longitudinally, laterally traveling between adjacent rows sensor.Top electrode lead-out wire is in sensor array
Side forms Top electrode end tab, and Top electrode end tab is connected with the compound lead-in plate of Top electrode data.Bottom electrode lead-out wire exists
The side of sensor array forms bottom electrode end tab, and bottom electrode end tab is connected with the compound lead-in plate of bottom electrode data.
The Top electrode, Top electrode lead-out wire, Top electrode end tab, the compound lead-in plate of Top electrode data, bottom electrode, lower electricity
Pole lead-out wire, bottom electrode end tab, the Graphic Design that the compound lead-in plate of bottom electrode data is deposited or prepared by etching, material
Select one kind in gold, silver, copper, graphene.
The capacitive MEMS sensor array can be multiplied by the capacitive MEMS that at least three arranges in length and breadth by least three and be passed
Sensor cluster composition presses detection unit, and wherein any one capacitive MEMS sensor can complete ultrasound functions, described
Press detection unit and ultrasound functions unit is fused to form array together completely.The detection unit that presses is to realize to press inspection
The base unit of brake, this presses detection unit and can be multiplied by least three by capacitive MEMS sensor with least three arranges in length and breadth
The form cluster of row is into being connected and be integrated in Top electrode lead-out wire, bottom electrode lead-out wire by electrode data composite cable
In one circuit board.When pressing detection, automatic switch unit makes capacitive MEMS sensor be touched in functional status, collection is pressed
Press signal；Then, partition capacitance formula MEMS sensor progress ultrasound works are automatically selected according to the signal that presses of collection, it is described super
Sound function includes transmitting ultrasound and receives ultrasound, and chronologically controls the transmitting of adjacent capacitor formula MEMS sensor and receive journey
Sequence, it can also launch according to a column capacitance formula MEMS sensor, the program that adjacent capacitor formula MEMS sensor receives is carried out.
Certainly, the capacitive MEMS sensor array can also be divided into two regions, and first area is set in two regions
It is set to and presses detection unit, realization presses detection, and second area is arranged to ultrasound functions unit, realizes ultrasound functions.It is described to melt
Conjunction, which presses detection unit and the capacitive MEMS sensor array of ultrasound functions unit, to form full fusion type according to function needs
Array and semi-fusion formula array.The physical arrangement of so-called full fusion type array is just the same, each electricity in full fusion type array
Appearance formula MEMS sensor has identical physical arrangement, shape, centre frequency and bandwidth；Each electric capacity in semi-fusion formula array
Formula MEMS sensor can have different structures, centre frequency and bandwidth.Certainly, semi-fusion formula array, which may be designed in, presses
Array and supersonic array are integrated on an array, if planar array, press array and supersonic array each Fen Zhanyige areas
Domain；If curved array, the mutual back-to-back arrangement on curved surface of array and supersonic array is pressed.This fusion presses detection and ultrasound
The capacitive MEMS sensor array of function, preferable full fusion type array are secondary to select semi-fusion formula array.
Brief description of the drawings
Fig. 1：For capacitive MEMS sensor array cutting structural representation of the present invention；
Fig. 2：For capacitive MEMS sensor array overlooking the structure diagram of the present invention；
Fig. 3：For capacitive MEMS sensor array programme-control schematic diagram 1 of the present invention；
Fig. 4：For capacitive MEMS sensor array programme-control schematic diagram 2 of the present invention；
Fig. 5：For the first arrangement mode structural representation of capacitive MEMS sensor array of the present invention；
Fig. 6：For second of arrangement mode structural representation of capacitive MEMS sensor array of the present invention；
Fig. 7：For capacitive MEMS sensor array experimental principle figure of the present invention；
Fig. 8：For capacitive MEMS sensor array dimensional structure diagram of the present invention.
Embodiment
Embodiment：
As shown in Fig. 1,2,8, a kind of capacitive MEMS sensor array, including at least three longitudinal arrangement are multiplied by least three transverse direction
The capacitive MEMS sensor 6 of arrangement, the capacitive MEMS sensor 6 include focus layer 4, Top electrode 1, Top electrode lead-out wire
11, Top electrode end tab 12, the compound lead-in plate 14 of Top electrode data, shake film 31, clearance cavity 32, supporting layer 33, insulation
Layer 34, bottom electrode 2, bottom electrode lead-out wire 21, bottom electrode end tab 22, the compound lead-in plate 24 of bottom electrode data, array substrate layer
35, the focus layer 4 is located at the upper strata of Top electrode 1, and overall outer surface is in open and flat shape, and the Top electrode 1 is vertical with bottom electrode 2 right
Should, the vibrations film 31 selects Si/Si3N4/SiO2Composite membrane, ensures its spreading, and the bottom electrode 2 is fitted tightly over battle array
Row basalis 35, the lateral surface of array substrate layer 35 are in integrally open and flat shape, and the medial surface of array substrate layer 35 is advised in discontinuous
Pinnacle Pyramid or mortar shape are removed in the inversion of rule.To ensure, the conversion of function and ultrasound functions, the electric capacity are pressed
Formula MEMS sensor array also includes automatic switch unit 71 and imaging signal integral unit 72, and the automatic switch unit 71 is controlled
Capacitive MEMS sensor 6 processed switches between functional status and ultrasound functions state pressing, control capacitive MEMS sensor 6
Collection presses signal or ultrasonic signal；The imaging signal integral unit 72 receives each capacitive MEMS sensor 6 and exported
Press signal and/or ultrasonic signal, and the cross section size for pressing signal acquisition, shape data signal and ultrasonic signal are adopted
Being integrated apart from skin depth, capsule reality data-signal for collection, exports the three-dimensional configuration data-signal of solid.
The main fabrication processing of capacitive MEMS sensor array is：
The first step, top crown wafer1 selection thickness is 300um, 4 cun of SOI twin polishing silicon wafer to manufacture top crowns parts.
1st, reverse side gluing, photoetching, develop figure, by deep silicon etching technique, be etched through whole silicon chip, form bonding
The alignment mark that top crown is bonded during technique.
Second step, bottom crown wafer2 selection thickness is 300um, 4 cun of twin polishing silicon wafer to manufacture bottom crown parts.
1st, front is by special gluing, photoetching, development and silicon etching process, formed inversion go pinnacle Pyramid or
Person's mortar shape, to increase bottom electrode plate suqare, A/F 100um.
2nd, deposited metal Al, thickness 0.5um, then by gluing, photoetching, development and Al etching technics, form inversion and remove point
Push up bottom electrode 2, bottom electrode lead 21, the bottom electrode end tab 22 of Pyramid or mortar shape.
3rd, by oxidation technology, SiO is deposited, thickness 1um, this oxide layer is insulating barrier 12, can both play vibrations film
The effect of 31 isolation can be used as bonding layer again.
4th, reverse side gluing, photoetching, develop figure, by silicon etching process, bottom crown bonding when forming bonding technology
Alignment mark.
5th, reverse side deposited metal Al, thickness 0.5um, then by gluing, photoetching, development and Al etching technics, formed compound
Cable.
3rd step, upper bottom crown bonding, using the alignment mark of upper bottom crown, by anode linkage technique, complete
Wafer1 reverse side and the positive bondings of wafer2.
4th step, remove technique.
1st, the front side silicon layer of wafer1 after bonding is removed using TMAH solution.
2nd, wafer1 oxygen buried layer is removed using BOE solution.
3rd, silica and silicon nitride composite membrane are successively deposited using PECVD device, thickness be respectively 0.2um and
0.3um, form compound vibrations film 31.
4th, in front deposited metal Al, the thickness 0.5um of upper and lower bonding pad, then gluing, photoetching, development and Al etching are passed through
Technique, form Top electrode 1, Top electrode lead 11, the end tab 12 of Top electrode.
5th, using through-silicon-via technology or side electrode process, respectively by Top electrode end tab, bottom electrode end tab with
Composite cable establishes electrical connection.
5th step, the making of integrated chip unit
1st, automatic switch unit 71, imaging signal integral unit 72 are respectively completed using ic manufacturing process, press detection
The making of integrated circuit and ultrasound functions integrated circuit.
6th step, the fitting of integrated unit
1st, using insulating cement by automatic switch unit 71, imaging signal integral unit 72, press detection integrated circuit and ultrasonic work(
Energy integrated circuit is attached to the reverse side of upper and lower bonding pad.
2nd, using lead key closing process by automatic switch unit 71, imaging signal integral unit 72, press the integrated electricity of detection
Road and ultrasound functions integrated circuit are established with composite cable to be electrically connected, as shown in Figure 2.
7th step, docile focus layer 4, cutting, routing.
The Top electrode 1, Top electrode lead-out wire 11, Top electrode end tab 12, the compound lead-in plate 14 of Top electrode data, lower electricity
Pole 2, bottom electrode lead-out wire 21, bottom electrode end tab 22, the compound lead-in plate 24 of bottom electrode data is deposited or prepared by etching
Graphic Design, material can select one kind in gold, silver, copper, aluminium, graphene.
As shown in figure 1, the focus layer 4 is provided with focus lamp 42, it is in reverse pyramid that the focus lamp 42 is overall, pyramid
Bottom lengths are 1/4 or the multiple that capacitive MEMS sensor 6 produces ultrasonic wavelength, and pyramidal height is condenser type
MEMS sensor 6 produces 1/10 or multiple of ultrasonic wavelength.The capacitive MEMS sensor 6, which also includes pressure distribution, to be protected
Cuticula 41, the pressure distribution diaphragm 41 are located at the lower floor of focus layer 4, and the focus layer 4 is melted with pressure distribution diaphragm 41
It is integrated, common docile is in array surface.
Experiment one：Experimental study is carried out to the performance of the capacitive MEMS sensor array, is used for analyzing the structure
The feasibility of palpation.
Experiment method：The probe stress summation being made up of 192 functional units is about 2000 grams, average each function
10 grams or so of unit stress, it is contemplated that probe puts on each functional unit during skin and non-stress is just the same, through consideration, takes and applies
Force value is 30 grams（0.3N）.Based on single functional unit, being applicable for palpation is used for by experiment discussion CMUT functional units
Property, experimental provision as shown in fig. 7, comprises：Pressure test workbench 8, pressure adjustment knob 81, pressure ball 82, PCap02 are assessed
External member 83, PC84, testing sample 9.
As shown in fig. 7,0 N is applied to the functional unit of testing sample 9（Light Condition）, 0.06 N, 0.12 N, 0.18 N,
0.24 N, external member 83 is assessed to capacitive MEMS sensor array to be measured by PCap02（Size 2mm × 2mm）Basis electricity
Capacitance and capacitance variations value are measured and analyzed.
| Apply pressure/N | 0.06 | 0.12 | 0.18 | 0.24 | 0.3 |
| Capacitance change/PF | 0.205 | 0.403 | 0.709 | 1.001 | 1.428 |
Experimental result:When applying the pressure that palpation is adapted, capacitive MEMS sensor array has good sensitivity
With it is linear, while there is good anti-interference and stability.
As shown in Fig. 2 the Top electrode lead-out wire 11 of the capacitive MEMS sensor 6, bottom electrode lead-out wire 21 are laterally
Lead to the centre of adjacent sensors, and the part along longitudinally, laterally traveling between adjacent rows sensor.
As shown in figure 3, the array press part by least three be multiplied by 3 capacitive MEMS sensor groups into, it is described from
Dynamic switch unit 71 is analyzed and capacitive MEMS sensor 6 is calculated according to the detection signal that presses of capacitive MEMS sensor 6
The middle part for needing to switch to ultrasound functions, and then open capacitive MEMS sensor 6 and realize ultrasound functions, after the completion of detection,
The automatic switch unit 71 makes capacitive MEMS sensor 6 recover to pressing function.As shown in figure 3, functionally it is used as super
Sound unit, for launching and receiving ultrasonic signal, available for detection lump depth or identification lump capsule reality and depth direction
Length, the ultrasound functions unit can also use ripe PMUT/ piezoelectric supersonics unit to substitute.Ultrasound unit is also used for specific feelings
Ultrasonic therapy under condition.What the imaging signal integral unit 72 received that each capacitive MEMS sensor 6 exports presses signal
And/or ultrasonic signal, and by press the cross section size of signal acquisition, shape data signal and ultrasonic signal acquisition apart from skin
Skin depth, capsule reality data-signal are integrated, and export the three-dimensional configuration data-signal of solid.
As shown in figure 4, the capacitive MEMS sensor array also includes ultrasound functions IC chip 51 and pressed
IC chip 52, electrode data composite cable 36 are detected, the electrode data composite cable 36 is answered including Top electrode data
Zygonema cable 361 and bottom electrode data composite cable 362, the compound lead-in plate 14 of the Top electrode data and bottom electrode data are compound draws
Enter plate 24 by electrode data composite cable 36 respectively with ultrasound functions IC chip 51 and pressing detection ic core
Piece 52 connects.The capacitive MEMS sensor array also includes FPGA timing controllers 53, the FPGA SECO core
Piece 53 controls ultrasound functions IC chip 51 or presses detection IC chip 52 respectively, realizes ultrasound functions respectively
Or press detection.
As shown in figure 1, the detection IC chip 52 that presses includes small capacitance detection unit and analog-to-digital conversion control
Unit processed, the small capacitance detection unit and analog-to-digital conversion control unit are by automatic switch unit, then pass through electrode data
Composite cable 36, then it is upper with array respectively via the compound lead-in plate 14 of Top electrode data and the compound lead-in plate 24 of bottom electrode data
Electrode 1 and bottom electrode 2 connect.
As shown in figure 5, the capacitive MEMS sensor array, which shows 6, is multiplied by 6 capacitive MEMSs arranged in length and breadth biographies
The cluster of sensor 6 composition presses detection unit 61, wherein any one column capacitance formula MEMS sensor 6 is formed ultrasonic work(with longitudinal arrangement
Can unit 62, it is described to press detection unit 61 and ultrasound functions unit 62 is fused to form array together completely.As shown in fig. 6,
The capacitive MEMS sensor array can also be divided into two regions 63, and first area 631 is arranged to press in two regions 63
Detection unit 61, realization press detection, and second area 632 is arranged to ultrasound functions unit 62, realizes ultrasound functions.
The implementation method of automatic switch unit：Common single-chip microcomputer can be selected（IC）As hardware support, it is multiplied by using at least 3
3 two-dimensional array, the array can be used for storage and press the pressure signal data gathered under pattern.Data are analyzed, counted
Calculate, obtain pressure value in array and be more than line number and row number corresponding to the functional unit of certain threshold value, and using line number and row number as
The output of automatic switch unit is used to control the part that will be needed in array from pattern switching is pressed to ultrasound mode.The threshold value
It can be set according to being actually needed.Other feasible modes can be selected to realize IC making.Of course, will can also cut automatically
Change unit to be integrated on a silicon chip with array, can be integrated in top crown can also be integrated on bottom crown.Can also root
According to needing to be divided into two parts, a part is integrated in top crown and another part is integrated in bottom crown, then passes through lead and establishes letter
Number connection.It can also be placed between bottom crown.
Imaging signal integral unit：Common single-chip microcomputer can be selected（IC）As hardware support, it is multiplied by 3 using at least 3 and is multiplied by 3
Three-dimensional array, the array can be used for storage and presses the pressure signal data that are gathered under pattern（Include two dimension）And ultrasound mode
The depth data of lower collection（Comprising one-dimensional）.2-D data is analyzed, calculated, pressure value in array is obtained and is more than certain threshold
Line number and row number corresponding to the functional unit of value, the area corresponding to these functional units is added and can obtain lump cross section
Preliminary size.Preliminary size corrected by being multiplied by certain coefficient after sectional area size, acquire under ultrasound mode and hold
Lump is from the length data on the depth data and lump depth direction of skin surface at the functional unit of row ultrasound functions.Will be upper
State cross-sectional data, depth data and depth direction length data to integrate, the data after integration can be used for three-dimensional imaging.The threshold
Value can be set according to being actually needed.Other feasible modes can be selected to realize IC making.Of course, will can also be imaged
Signal integration unit is integrated on a silicon chip with array, and can be integrated in top crown can also be integrated on bottom crown.
Two parts can be divided into as needed, a part is integrated in top crown and another part is integrated in bottom crown, then passes through lead
Establish signal connection.It can also be placed between bottom crown.
Claims (8)
1. a kind of capacitive MEMS sensor array, including at least three longitudinal arrangement are multiplied by the transversely arranged condenser type of at least three
MEMS sensor（6）, the capacitive MEMS sensor（6）Including focus layer（4）, Top electrode（1）, Top electrode lead-out wire
（11）, Top electrode end tab（12）, the compound lead-in plate of Top electrode data（14）, shake film（31）, clearance cavity（32）, support
Layer（33）, insulating barrier（34）, bottom electrode（2）, bottom electrode lead-out wire（21）, bottom electrode end tab（22）, bottom electrode data are compound
Lead-in plate（24）, array substrate layer（35）, the focus layer（4）Positioned at Top electrode（1）Upper strata, overall outer surface are in open and flat shape
Shape, the Top electrode（1）With bottom electrode（2）It is vertical corresponding, the vibrations film（31）From SiN and SiO composite membranes, ensure not
Film is shaken when applying bias voltage（31）Spreading, the bottom electrode（2）With array substrate layer（35）It is brought into close contact, it is described
Array substrate layer（35）Lateral surface is in integrally open and flat shape, array substrate layer（35）Medial surface removes point in the inversion of discontinuous rule
Push up Pyramid or mortar shape, it is characterised in that also including automatic switch unit（71）Integrated with imaging signal single
Member（72）, the automatic switch unit（71）Control capacitive MEMS sensor（6）Pressing functional status and ultrasound functions shape
Switch between state, control capacitive MEMS sensor（6）Collection presses signal or ultrasonic signal；The imaging signal is integrated single
Member（72）Receive each capacitive MEMS sensor（6）Output presses signal and/or ultrasonic signal, and will press signal acquisition
Cross section size, shape data signal and ultrasonic signal acquisition integrate apart from skin depth, capsule reality data-signal, output
Three-dimensional three-dimensional configuration data-signal.
2. the capacitive MEMS sensor array described in claim 1, it is characterised in that also including ultrasound functions integrated circuit
Chip（51）With press detection IC chip（52）, electrode data composite cable（36）, the electrode data composite cable
（36）Including Top electrode data composite cable（361）With bottom electrode data composite cable（362）, the Top electrode data are compound to draw
Enter plate（14）With the compound lead-in plate of bottom electrode data（24）With ultrasound functions IC chip（51）It is integrated electric with detection is pressed
Road chip（52）Connection.
3. the capacitive MEMS sensor array described in claim 2, it is characterised in that the automatic switch unit（71）According to
Capacitive MEMS sensor（6）Press detection signal, capacitive MEMS sensor is calculated in analysis（6）Middle needs switch to
The part of ultrasound functions, and then open capacitive MEMS sensor（6）Ultrasound functions are realized, it is described to cut automatically after the completion of detection
Change unit（71）Make capacitive MEMS sensor（6）Recover to pressing function.
4. capacitive MEMS sensor array according to claim 3, it is characterised in that described to press detection integrated circuit
Chip（52）Including small capacitance detection unit and analog-to-digital conversion control unit, the small capacitance detection unit and analog-to-digital conversion
Control unit passes through electrode data composite cable（36）, then via the compound lead-in plate of Top electrode data（14）Answered with bottom electrode data
Close lead-in plate（24）Respectively with the Top electrode of array（1）And bottom electrode（2）Connection.
5. any described capacitive MEMS sensor arrays of claim 1-4, it is characterised in that the focus layer（4）On set
There is focus lamp（42）.
6. capacitive MEMS sensor array according to claim 5, it is characterised in that the capacitive MEMS sensor
（6）Also include pressure distribution diaphragm（41）, the pressure distribution diaphragm（41）Positioned at focus layer（4）Lower floor, it is described poly-
Focus layer（4）Diaphragm is distributed with pressure（41）Combine together, common docile is in array surface.
7. capacitive MEMS sensor array according to claim 1, it is characterised in that the capacitive MEMS sensor
（6）Top electrode lead-out wire（11）, bottom electrode lead-out wire（21）Outwards lead to the centres of adjacent sensors, and along longitudinal direction,
Part of the horizontal traveling between adjacent rows sensor.
8. capacitive MEMS sensor array according to claim 1, it is characterised in that the Top electrode（1）, upper electricity
Pole lead-out wire（11）, Top electrode end tab（12）, the compound lead-in plate of Top electrode data（14）, bottom electrode（2）, bottom electrode lead-out wire
（21）, bottom electrode end tab（22）, the compound lead-in plate of bottom electrode data（24）It is Graphic Design that is deposited or etching preparation,
One kind in material selection gold, silver, copper, graphene.
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| CN107957273A (en) * | 2018-01-16 | 2018-04-24 | 北京先通康桥医药科技有限公司 | With the sensor pressed with ultrasound functions |
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Application publication date: 20171110 |
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