CN208201091U - A kind of deep hole plated film injection molding barrel - Google Patents
A kind of deep hole plated film injection molding barrel Download PDFInfo
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- CN208201091U CN208201091U CN201820406084.2U CN201820406084U CN208201091U CN 208201091 U CN208201091 U CN 208201091U CN 201820406084 U CN201820406084 U CN 201820406084U CN 208201091 U CN208201091 U CN 208201091U
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- hole
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- deep hole
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Abstract
The utility model relates to a kind of deep hole plated films to be molded barrel, belong to technical field of surface, it solves the problems, such as that prior art medium-length hole coating film thickness is uneven.This deep hole plated film is molded barrel, including the ontology with deep hole, which is characterized in that hole depth/aperture of the ontology inner hole is more than or equal to 1.5, and the inner wall of the ontology inner hole forms film plating layer by ion film plating.This deep hole plated film is molded barrel and carries out plated film to deep hole inside workpiece using PVD technique, using AC bias power supply, charged particle is under the effect of workpiece AC field, it is attracted deposition for a moment, for a moment by repulsion campaign, control exchange change frequency and positive negative pulse stuffing ratio, the coating processing of different hole depths may be implemented, vacuum pressure control is between 0.1-2pa when plated film, purpose is to make ion free path sufficiently large, technique intermediate ion mean free path minimum 100cm, entire plated film space can be moved to, workpiece is submerged in plated film ion, realize that PVD is applied in deep-hole parts.
Description
Technical field
The utility model belongs to technical field of surface, is related to a kind of process for treating surface, especially a kind of deep hole plating
Film is molded barrel.
Background technique
PVD is a kind of very widely used surface treatment and film preparing technology, is widely applied in aerospace, doctor
Treatment, food, smart machine and mechanical manufacturing field are specifically divided into three kinds of technical approach and realize, evaporation, sputtering and ion film plating.
PVD with CVD, water power plating compared with, major defect be it is limited for plated film ability in hole, numerous studies and production practices prove, PVD
Orifice inner hole can be plated into 1-1.5 times that depth is aperture, which has limited PVD in the application for having plated film demand in hole.
During ion film plating, there are a large amount of charged ions around workpiece, these charged ions are in workpiece negative electric field
Under effect, workpiece surface deposition film forming is moved to.In coating process, the movement of gas is based on molecular flow, with viscous flow, hole
The interior quantity into ion is reduced, in addition the negative electricity field action of hole wall, and as hole depth increases, ion is fewer and fewer, this is to lead
Cause the reason of cannot carrying out effective plated film to deep hole.
Utility model content
The purpose of this utility model is the presence of the above problem in view of the prior art, is proposed a kind of for the progress of deep hole part
The method of ion film plating forms the injection molding barrel of internal coating.
The purpose of this utility model can be realized by the following technical scheme: a kind of deep hole plated film injection molding barrel, including tool
There is the ontology of deep hole, which is characterized in that hole depth/aperture of the ontology inner hole is more than or equal to 1.5, the ontology inner hole
Inner wall forms film plating layer by ion film plating.
After material tube inner wall forms film plating layer by ion film plating, the performances such as wearability, the hardness of barrel can be efficiently modified,
Effectively improve workpiece service life.
In above-mentioned deep hole plated film injection molding barrel, the film plating layer is titanium nitride coating.According to the different of workpiece
Performance requirement, also can be used not homoatomic and plating conditions form the film plating layer of different function.
In above-mentioned deep hole plated film injection molding barrel, the thicknesses of layers is 1-10 μm.
In above-mentioned deep hole plated film injection molding barrel, the film plating layer between inner hole front and rear end thickness difference≤
50%.
In above-mentioned deep hole plated film injection molding barrel, the ion film plating uses AC bias power supply, and frequency 1kHZ is arrived
40kHZ, positive negative pulse stuffing respectively account for 50% periodic width, voltage 10-500V.
In above-mentioned deep hole plated film injection molding barrel, when described ion film plating, is filled with process gas nitrogen, pressure control
In 0.1-1.0pa.
Compared with prior art, this deep hole plated film injection molding barrel carries out plated film to deep hole inside workpiece using PVD technique, adopts
With AC bias power supply, charged particle is attracted deposition under the effect of workpiece AC field for a moment, for a moment by repulsion campaign, control
System exchange change frequency and positive negative pulse stuffing ratio, may be implemented the coating processing of different hole depths, and vacuum pressure control exists when plated film
Between 0.1-1pa, it is therefore an objective to make ion free path sufficiently large, technique intermediate ion mean free path minimum 100cm can be moved to
Entire plated film space, workpiece are submerged in plated film ion, realize that PVD is applied in deep-hole parts.
Detailed description of the invention
Fig. 1 is that this deep hole plated film injection molding barrel ion film plating mode is compared with the prior art figure；
Fig. 2 is the schematic cross-sectional view of this deep hole plated film injection molding barrel.
In figure, 1, ontology；2, film plating layer.
Specific embodiment
It is specific embodiment of the utility model and in conjunction with attached drawing below, the technical solution of the utility model is made further
Description, but the utility model is not limited to these examples.
During ion film plating, there are a large amount of charged ions around workpiece, these charged ions are in workpiece negative electric field
Under effect, workpiece surface deposition film forming is moved to.In coating process, the movement of gas is based on molecular flow, with viscous flow, hole
The interior quantity into ion is reduced, in addition the negative electricity field action of hole wall, and as hole depth increases, ion is fewer and fewer, this is to lead
Cause the reason of cannot carrying out effective plated film to deep hole.The utility model is by changing the polarity of workpiece electric field and controlling vacuum range
To realize deep hole plated film.
The charged ion motion mode of ion film plating is carried out for different modes as shown in Figure 1, in which:
Mode a is DC negative bias voltage mode, and charged particle attracts deposition film forming by electric field quickly near aperture, leads to depth
The rear end in hole can not form effective deposition；
Mode b is direct current positively biased die pressing type, and charged particle is repelled thrust by positive electric field in hole, and persistent movement can not shape
At effective deposition, cause not form a film；
Mode c is the AC bias mode that the application uses, and charged particle is inhaled for a moment under the effect of workpiece AC field
Draw deposition, for a moment by repulsion campaign, control exchange change frequency and positive negative pulse stuffing ratio, the coating that different hole depths may be implemented add
Work.
It is illustrated in figure 2 this deep hole plated film injection molding barrel, including the ontology 1 with deep hole, hole depth/aperture of ontology inner hole
The inner wall of=90/19=4.737 > 1.5, the ontology inner hole form film plating layer 2 by ion film plating.It is right after completion plated film
Product is axially dissected, measured hole inner coating thickness, and following thickness comparison (thickness ball milling is obtained compared with normal mode
Instrument measurement).
| Depth mm in hole | 0 (outer end) | 10 | 30 | 40 | 60 | 80 |
| Routine/mode a | 4um | 2.7um | 0.5um | It does not measure | It does not measure | It does not measure |
| The application/mode c | 2.5um | 2um | 1.7um | 1.5um | 1.3um | 1.3um |
As seen from the above table, effective plated film (depth diameter ratio is greater than 1.5) to deep hole workpiece may be implemented in the utility model,
In addition, the thickness difference of hole Inner Front End and rear end film plating layer is also improved.
This deep hole plated film is molded barrel and carries out plated film to deep hole inside workpiece using PVD technique, using AC bias power supply,
Charged particle is attracted deposition under the effect of workpiece AC field for a moment, for a moment by repulsion campaign, control exchange change frequency with
The coating processing of different hole depths may be implemented in positive negative pulse stuffing ratio, and vacuum pressure control is between 0.1-1pa when plated film, purpose
It is to make ion free path sufficiently large, technique intermediate ion mean free path minimum 100cm can move to entire plated film space, work
Part is submerged in plated film ion；Realize that PVD is applied in deep-hole parts.
The specific embodiments described herein are merely examples of the spirit of the present invention.The utility model institute
Belonging to those skilled in the art can make various modifications or additions to the described embodiments or using similar
Mode substitute, but without departing from the spirit of the present application or beyond the scope of the appended claims.
Claims (6)
1. a kind of deep hole plated film is molded barrel, including the ontology with deep hole, which is characterized in that the hole of the ontology inner hole
Depth/aperture is more than or equal to 1.5, and the inner wall of the ontology inner hole forms film plating layer by ion film plating.
2. deep hole plated film according to claim 1 is molded barrel, which is characterized in that the film plating layer is titanium nitride painting
Layer.
3. deep hole plated film according to claim 1 is molded barrel, which is characterized in that the thicknesses of layers is 1-10 μm.
4. deep hole plated film according to claim 1 is molded barrel, which is characterized in that the film plating layer is located at inner hole front end
Thickness difference≤50% between rear end.
5. deep hole plated film according to claim 1 is molded barrel, which is characterized in that the ion film plating is inclined using exchange
Voltage source, frequency 1kHZ to 40kHZ, positive negative pulse stuffing respectively account for 50% periodic width, voltage 10-500V.
6. deep hole plated film according to claim 1 is molded barrel, which is characterized in that be filled with technique when the described ion film plating
Gas nitrogen, pressure are controlled in 0.1-1.0pa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820406084.2U CN208201091U (en) | 2018-03-23 | 2018-03-23 | A kind of deep hole plated film injection molding barrel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820406084.2U CN208201091U (en) | 2018-03-23 | 2018-03-23 | A kind of deep hole plated film injection molding barrel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208201091U true CN208201091U (en) | 2018-12-07 |
Family
ID=64527696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820406084.2U Active CN208201091U (en) | 2018-03-23 | 2018-03-23 | A kind of deep hole plated film injection molding barrel |
Country Status (1)
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| CN (1) | CN208201091U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114574829A (en) * | 2022-03-08 | 2022-06-03 | 松山湖材料实验室 | Micro-deep hole internal coating process and coating device |
-
2018
- 2018-03-23 CN CN201820406084.2U patent/CN208201091U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114574829A (en) * | 2022-03-08 | 2022-06-03 | 松山湖材料实验室 | Micro-deep hole internal coating process and coating device |
| CN114574829B (en) * | 2022-03-08 | 2023-10-27 | 松山湖材料实验室 | Micro deep hole inner coating process and coating device |
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