CN208195884U - Thermocompression bonding pressure head - Google Patents
Thermocompression bonding pressure head Download PDFInfo
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- CN208195884U CN208195884U CN201820584623.1U CN201820584623U CN208195884U CN 208195884 U CN208195884 U CN 208195884U CN 201820584623 U CN201820584623 U CN 201820584623U CN 208195884 U CN208195884 U CN 208195884U
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- limit
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- height portion
- height
- pressure head
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Abstract
The utility model relates to a kind of thermocompression bonding pressure heads, it include: pressure head ontology, limit for height portion and compressed part, pressure head ontology has pressure welding face, limit for height portion and compressed part are convexly equipped in pressure welding face, limit for height portion and compressed part interval are arranged, and groove is formed between limit for height portion and compressed part, the width in limit for height portion is less than the width in pressure welding face, and the width of compressed part is less than the width in pressure welding face.By spaced limit for height portion and compressed part, so that during the welding process, molten tin is emerged by tin hole, so that the fixation of backlight FPC and main FPC is more firm.Compressed part can be to avoid the warpage of the copper sheet on backlight FPC, and, molten tin is fluted due to being formed between limit for height portion, compressed part and pressure head ontology after crossing tin hole, the bottom of groove is concordant, so that the thickness of molten tin is not too high, it is effectively managed so that the product of thermocompression bonding emits tin effect with pad thickness, reduces manufacturing cost.
Description
Technical field
The utility model relates to welding technology fields, more particularly to a kind of thermocompression bonding pressure head.
Background technique
At present there are mainly two types of the display module backlight terminal welding manners of mobile phone industry: dragging weldering and pulse thermocompression bonding.It drags
Weldering is mainly completed by manually operation, and weld appearance uniformity is poor, and waste of manpower；Pulse thermocompression bonding is also referred to as hot pressing
Weldering, is that work is completed by equipment, not only improves welding yield and consistency, also achieves welding post automation.
But the structure that thermocompression bonding pressure head uses in industry at present is " I " type, in the welding process, due to the effect of pressure
Make backlight FPC (Flexible Printed Circuit, flexible circuit board) warpage, to easily lead to two kinds of failure weldings: 1,
Molten tin can not emerge from tin hole is crossed, and cause " few tin ", " not emitting tin " bad, welding effect is unable to satisfy quality requirements；2, tin is melted
It is cooled and solidified between backlight FPC and main FPC, causes entire pad thickness exceeded.Tin is emitted using the pressure welding product of such pressure head
Effect and pad thickness are unable to get effective control, therefore lack the control for fraction defective；And fraction defective height directly affects production
Line yield, and do over again and consume manpower and material resources, improve manufacturing cost.
Utility model content
Based on this, it is necessary to provide a kind of thermocompression bonding for controlling reduction product defect rate and cost of manufacture that emit tin effect
Pressure head.
A kind of thermocompression bonding pressure head, comprising: pressure head ontology, limit for height portion and compressed part, the pressure head ontology have pressure welding face,
The limit for height portion and the compressed part are all set in the pressure welding face, and the limit for height portion and the compressed part interval are arranged, and
Groove is formed between the limit for height portion and the compressed part, the width in the limit for height portion is less than the width in the pressure welding face, described
The width of compressed part is less than the width in the pressure welding face.
The height that the limit for height portion is raised in the pressure welding face in one of the embodiments, is greater than the compressed part protrusion
Height in the pressure welding face.
It is 0.08~0.12mm, institute that the limit for height portion, which is raised in the height in the pressure welding face, in one of the embodiments,
Stating compressed part and being raised in the height in the pressure welding face is 0.03~0.07mm.
The limit for height portion is the first raised line in one of the embodiments, and the compressed part is opposite with first raised line
Setting.
The compressed part is the second raised line in one of the embodiments, and the limit for height portion is opposite with second raised line
Setting.
In one of the embodiments, the limit for height portion be the first raised line, the compressed part be the second raised line, described first
Raised line and second tab parallel are arranged.
The pressure head ontology includes hot pressing portion and two electrode columns in one of the embodiments, the hot pressing portion
Both ends are connect with two electrode columns respectively, and the limit for height portion and the compressed part are set to the hot pressing portion far from described
The one side of electrode column.
The hot pressing portion is integrally formed with two electrode columns in one of the embodiments,.
The compressed part is set to the edge in the hot pressing portion in one of the embodiments, and the limit for height portion is set to
The position of the hot pressing portion far from the compressed part.
The width of the groove is greater than the limit for height portion and the hot pressing portion far from the pressure in one of the embodiments,
The distance between the edge in tight portion.
Above-mentioned thermocompression bonding pressure head, by spaced limit for height portion and compressed part, so that during the welding process, melting tin
It emerges by tin hole, so that the fixation of backlight FPC and main FPC is more firm.Compressed part can be to avoid the copper sheet on backlight FPC
Warpage, moreover, molten tin is behind the tin hole excessively due to forming fluted, groove between limit for height portion, compressed part and pressure head ontology
Bottom it is concordant so that the thickness of molten tin is not too high, obtained so that the product of thermocompression bonding emits tin effect with pad thickness
Effectively control, reduces the fraction defective of product, without doing over again, thereby reduces cost of goods manufactured.
Detailed description of the invention
Fig. 1 is a direction structure schematic diagram of the thermocompression bonding pressure head of an embodiment；
Fig. 2 is the other direction structural schematic diagram of the thermocompression bonding pressure head of an embodiment；
Fig. 3 is the side-looking direction structural schematic diagram of the thermocompression bonding pressure head of an embodiment；
Fig. 4 is the structural schematic diagram of the thermocompression bonding pressure head of another embodiment.
Specific embodiment
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The better embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms
It realizes, however it is not limited to embodiments described herein.On the contrary, the purpose of providing these embodiments is that making practical new to this
The disclosure of type understands more thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being set to " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein packet
Include any and all combinations of one or more related listed items.
For example, a kind of thermocompression bonding pressure head, comprising: pressure head ontology, limit for height portion and compressed part, the pressure head ontology have pressure
The face of weld, the limit for height portion and the compressed part are convexly equipped in the pressure welding face, and the limit for height portion is set with the compressed part interval
It sets, and forms groove between the limit for height portion and the compressed part, the width in the limit for height portion is less than the width in the pressure welding face,
The width of the compressed part is less than the width in the pressure welding face.
Fig. 1 and Fig. 2 is please referred to, is the thermocompression bonding pressure head 10 of an embodiment, comprising: pressure head ontology 11, limit for height portion 12
And compressed part 13, the pressure head ontology 11 have pressure welding face 14, the limit for height portion 12 and the compressed part 13 are convexly equipped in
The pressure welding face 14, the limit for height portion 12 is arranged with the compressed part 13 interval, and the limit for height portion 12 and the compressed part 13
Between form groove, the width in the limit for height portion 12 is less than the width in the pressure welding face 14, and the width of the compressed part 13 is less than
The width in the pressure welding face 14, so that in thermal compression welding, the copper sheet of main flexible circuit board and backlight flexible circuit board weld
It is connected firmly, the compressed part 13 can reduce the angularity of copper sheet, so that main flexible circuit board and backlight flexible circuit
The thickness of plate weld reduces.
For the ease of welding flexible circuit board, the height that the limit for height portion 12 is raised in the pressure welding face 14 is greater than the pressure
Tight portion 13 is raised in the height in the pressure welding face 14.Since the limit for height portion 12 and the compressed part 13 are convexly equipped in the pressure welding
Face 14 deviates from the one side of the pressure head ontology 11, i.e., the described limit for height portion 12 is set on the pressure head ontology 11, the compressed part
13 are also disposed on the pressure head ontology 11, when the limit for height portion 12 and the compressed part 13 are pressed on copper sheet simultaneously, if
The limit for height portion 12 is concordant with the compressed part 13, and it will cause the position of flexible circuit board corresponding with the compressed part 13 pressures
Trace is too deep, will also be easy so that slight crack occurs in flexible circuit board.The limit for height portion 12 is higher than the compressed part 13, so that described
Limit for height portion 12 can be contacted with the copper sheet of flexible circuit board, and the compressed part 13 is detached from the copper sheet of flexible circuit board, in this way,
After the limit for height is heated, so that there was only the limit for height portion 12 and the copper sheet on flexible circuit board on the thermocompression bonding pressure head
Contact, and the tin cream of 12 corresponding position of limit for height portion is heated, that is, realize the pressure head ontology 11 and flexible circuit
The point contact of copper sheet on plate.The height in the limit for height portion 12 is the distance that the limit for height portion 12 protrudes from the pressure welding face 14,
The height of the compressed part 13 is that the compressed part 13 protrudes from the distance in the pressure welding face 14, the height in the limit for height portion 12 with
The height of compressed part 13 is determined according to the material of flexible circuit board, for example, the compressive property of flexible circuit board is higher, the limit for height
The height in portion 12 is 0.08~0.12mm, then the height of the compressed part 13 is 0.05~0.07mm；For another example, flexible circuit board
Flexibility is higher, and the height in the limit for height portion 12 is 0.08~0.12mm, then the height of the compressed part 13 be 0.03~
0.05mm；For another example, in another embodiment, the height in the limit for height portion 12 is 0.10mm, and the height in the limit for height portion 12 is
0.05mm.In addition, the heat of the pressure head ontology 11 concentrates in the limit for height portion 12, the compressed part 13 is detached from flexibility again
The copper sheet of circuit board avoids so that can contact to avoid the compressed part 13 with the copper sheet on flexible circuit board in welding
The compressed part 13 breaks the copper sheet on flexible circuit board when welding, consequently facilitating main flexible circuit board and backlight flexible circuit
The welding of plate.
For the ease of welding simultaneously to the copper sheet on multiple flexible circuit boards, the limit for height portion 12 is the first raised line, described
Compressed part 13 is oppositely arranged with first raised line.The limit for height portion 12 is set on the pressure head ontology 11, the pressure head sheet
Body 11 is the thermal energy when limit for height portion 12 provides welding, i.e., heats the limit for height portion 12.On flexible circuit board
Multiple copper sheets disposed in parallel can be set, the longitudinal direction of the limit for height portion 12 towards the pressure head ontology 11 extends, i.e. institute
The first tab parallel is stated in the long side of the pressure head ontology 11 namely first tab parallel in the length in the pressure welding face 14
Side, in this way, the long side in the limit for height portion 12 is parallel with the long side in the pressure welding face 14, whole limit for height portion 12 is equal when soldered
Extending direction for heated condition, the limit for height portion 12 is vertical with the copper sheet on flexible circuit board, so that the limit for height portion 12 is same
When contacted with multiple copper sheets on flexible circuit board, i.e., the limit for height portion 12 simultaneously carries out multiple copper sheets on flexible circuit board
Heat treatment melts the tin cream on winner's flexible circuit board and the main flexible circuit board of backlight, so that the limit for height portion 12
Multiple copper sheets on flexible circuit board can be welded simultaneously.
Warpage when in order to avoid welding, the compressed part 13 are the second raised line, the limit for height portion 12 and described second convex
Item is oppositely arranged.When carrying out thermocompression bonding, the effect of the tin cream of flexible circuit board and 12 corresponding position of limit for height portion in pressure
Under, the both ends of copper sheet of the tin cream on flexible circuit board under peptization state are assembled, and copper is be easy to cause when the tin cream of aggregation is excessive
The end of the warpage of piece end, i.e. copper sheet upwarps, and is easy so that the end thickness of copper sheet is excessive.By the compressed part 13 and institute
State limit for height portion 12 interval setting, and the compressed part 13 protrude from the pressure welding face 14 height be less than the limit for height portion 12 it is convex
For the height in the pressure welding face 14, in the case where not causing the damage of copper sheet, the compressed part 13 by copper sheet due to tin
Warped portion caused by cream is assembled is pressed against, i.e., the part that copper sheet is lifted up by the described compressed part 13 is subdued namely described
Compressed part 13 reduces the warped portion angularity on copper sheet, so that main flexible circuit board and backlight flexible circuit board
The thickness of weld reduces.In order to avoid the warpage of the copper sheet on multiple flexible circuit boards, the compressed part 13 is towards the pressure
The raised line of the long side extending direction of head ontology 11, i.e., the described compressed part 13 are towards the convex of the long side extending direction in the pressure welding face 14
Item, in this way, the compressed part 13 is abutted with the warped portion of multiple copper sheets on flexible circuit board when carrying out thermal compression welding,
So that the warped portion on copper sheet is pressed under the compressed part 13, so that multiple copper sheet angularities on flexible circuit board
Decline, reduces the thickness between main flexible circuit board and backlight flexible circuit board.
In another embodiment, in order to realize welding to multiple copper sheets simultaneously and reduce angularity, the limit for height portion
12 be the first raised line, and the compressed part 13 is the second raised line, and first raised line and second tab parallel are arranged.It will be described
Limit for height portion 12 and the compressed part 13 are both designed as raised line, and the extending direction of the raised line is parallel with the long side in the pressure welding face 14,
In this way, the limit for height portion 12 can simultaneously weld multiple copper sheets in thermal weld, the compressed part 13 can also be reduced
The warpage of multiple copper sheets reduces the angularity of the copper sheet on multiple flexible circuit boards, namely drop that is, while guaranteeing welding
The low thickness of main flexible circuit board and backlight circuit plate weld.
In one embodiment, 3 and Fig. 4 is please referred to, the pressure head ontology 11 includes hot pressing portion 111 and two electrode columns
112, the both ends in the hot pressing portion 111 are connect with two electrode columns 112 respectively, the limit for height portion 12 and the compressed part
13 are set to one side of the hot pressing portion 111 far from the electrode column 112.The material in the hot pressing portion 111 is red copper, the heat
Splenium 111 is electrically connected with the electrode column 112, and the electrode column 112 is also used to connect to power supply, i.e., the described electrode column 112
One end is connect with the hot pressing portion 111, and the other end of the electrode column 112 is used to connect to power supply namely the electrode column 112
Voltage is provided for the hot pressing portion 111 and is heated, so that the temperature in hot pressing portion 111 reaches temperature required for thermocompression bonding
Degree, and the limit for height portion 12 is set in the hot pressing portion 111, so that tin cream is melted in the limit for height portion 12, realizes master
The welding of flexible circuit board and backlight circuit plate.
In another embodiment, the hot pressing portion 111 and two electrode columns 112 are integrally formed, i.e., the described hot pressing portion
111 with the electrode column 112 be that same material namely the hot pressing portion 111 are connected to the electrode column 112, act on it is upper
One embodiment is identical, is the heating limit for height portion 12, details are not described herein again.
Tin is emitted when for the ease of welding, the compressed part 13 is set to the edge in the hot pressing portion 111, the limit for height portion
12 are set to position of the hot pressing portion 111 far from the compressed part 13.Tin hole was offered on the copper sheet of flexible circuit board, it is main
Tin cream between flexible circuit board and backlight flexible circuit board crosses tin hole by this and emerges, and the compressed part 13 is set to described
The edge in hot pressing portion 111, so that reserve an end spaces between the compressed part 13 and the limit for height portion 12, i.e., the described compressed part
Formed between 13 and the limit for height portion 12 it is fluted, according to the size and distribution situation for crossing tin hole, determine the compressed part 13 with
The distance between described limit for height portion 12, for example, only one crosses tin hole, the limit for height portion 12 and the compression on each copper sheet
Portion 13 is oppositely arranged, i.e., the described limit for height portion 12 is set to edge of the hot pressing portion 111 far from the compressed part 13；For another example, it is
Not only enhance the firm welding degree between main flexible circuit board and backlight flexible circuit board, but also can guarantee the bonding area of copper sheet,
It being opened up on copper sheet there are two tin hole is crossed, the limit for height portion 12 is set to two and crosses in the corresponding hot pressing portion 111 in tin hole, this
Sample was convenient for tin hole so that the tin cream between the limit for height portion 12 and the compressed part 13 is easy to emerge from tin hole excessively
Tin cream rapid Cover is on copper sheet, namely keeps the welding between winner's flexible circuit board and backlight flexible circuit board more convenient.
In order to further convenient for welding when emit tin, referring to Fig. 3, the width of the groove be greater than the limit for height portion 12 with
Edge the distance between of the hot pressing portion far from the compressed part 13, the width of the groove are the first spacing distance L1, institute
Stating the distance between the edge of hot pressing portion far from the compressed part 13 is the second spacing distance L2, the length of first spacing distance
Spend the length L2 that L1 is greater than second spacing distance.The first spacing distance L1 corresponds to the limit for height portion 12 and the pressure
Groove between tight portion 13, the bottom surface of groove are a part in the pressure welding face 14, when tin cream is emerged from tin hole excessively, groove
Bottom surface portions by tin cream control in certain height, avoid tin cream excessive height after cooling, that is, reduce main flexible circuit
Thickness between plate and backlight flexible circuit board.The second spacing distance L2 corresponds to the limit for height portion 12 and the hot pressing portion
The groove of 111 other edge, since the length of the second spacing distance L2 is less than the length of the first interval L1, tin cream gathers
Collection degree is to apart from directly proportional, and when tin cream is from after crossing tin hole and emerge, the tin cream aggregation extent at the second spacing distance L2 is small, thus
So that the angularity of the angularity of copper sheet copper sheet corresponding compared to the first spacing distance L1 is lower herein.First spacing distance L1
It can be determined according to the practical distribution situation for crossing tin hole with the second spacing distance L2, for example, the width when the hot pressing portion 111 is
When 2.78~2.82mm, the length of the first spacing distance L1 is 1.08~1.22mm, the length of the second spacing distance L2
Degree is 0.78~0.82mm.For another example, the length of the first spacing distance L1 is 1.20mm, the length of the second spacing distance L2
Degree is 0.80mm, and the corresponding limit for height portion 12 and the compressed part 13 is then arranged in other parts.In this way, first interval distance
Tin cream corresponding from L1 can sufficiently pass through tin hole, realize the effect for sufficiently emitting tin.
Above-mentioned thermocompression bonding pressure head and the hot pressing welder for using above-mentioned thermocompression bonding pressure head, pass through spaced limit for height portion
And compressed part, so that during the welding process, molten tin is emerged by tin hole, so that backlight flexible circuit board and main flexible circuit
The fixation of plate is more firm.Compressed part can be to avoid the warpage of the copper sheet on backlight flexible circuit board, moreover, described in molten tin process
Cross fluted due to being formed between limit for height portion, compressed part and pressure head ontology behind tin hole, the bottom of groove is concordant, so that the thickness of molten tin
It spends not too high, so that weldering product emits tin effect and effectively managed with pad thickness, reduces the fraction defective of product, nothing
It need to do over again, thereby reduce cost of goods manufactured.
The utility model also provides a kind of hot pressing welder comprising thermocompression bonding pressure head described in any of the above-described embodiment.
The thermocompression bonding pressure head is set on the plumb joint of hot welding press, using above-mentioned hot pressing welder, passes through thermocompression bonding
The unique shape structure of pressure head, i.e., described limit for height portion this feature different from the height of the compressed part, so that after tin cream is cooling
Thickness it is not too big so that weldering product emits tin effect and effectively managed with pad thickness, reduce the bad of product
Rate, wherein the exceeded average fraction defective of the pad thickness of flexible circuit board does not emit tin, few tin is averaged fraction defective from 3.33% near 0
It reduces from 2.18% to 0.14%, high finished product rate makes product without doing over again, to reduce the manufacturing cost of product.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of thermocompression bonding pressure head characterized by comprising pressure head ontology, limit for height portion and compressed part, the pressure head ontology tool
There is pressure welding face, the limit for height portion and the compressed part are convexly equipped in the pressure welding face, between the limit for height portion and the compressed part
Every setting, and groove is formed between the limit for height portion and the compressed part, the width in the limit for height portion is less than the pressure welding face
Width, the width of the compressed part are less than the width in the pressure welding face.
2. thermocompression bonding pressure head according to claim 1, which is characterized in that the limit for height portion is raised in the height in the pressure welding face
Greater than the height that the compressed part is raised in the pressure welding face.
3. thermocompression bonding pressure head according to claim 1, which is characterized in that the limit for height portion is raised in the height in the pressure welding face
For 0.08~0.12mm, the height that the compressed part is raised in the pressure welding face is 0.03~0.07mm.
4. thermocompression bonding pressure head according to claim 1, which is characterized in that the limit for height portion is the first raised line, the compressed part
It is oppositely arranged with first raised line.
5. thermocompression bonding pressure head according to claim 1, which is characterized in that the compressed part is the second raised line, the limit for height portion
It is oppositely arranged with second raised line.
6. thermocompression bonding pressure head according to claim 1, which is characterized in that the limit for height portion is the first raised line, the compressed part
For the second raised line, first raised line and second tab parallel are arranged.
7. thermocompression bonding pressure head according to claim 1, which is characterized in that the pressure head ontology includes hot pressing portion and two electricity
Pole, the both ends in the hot pressing portion are connect with two electrode columns respectively, and the limit for height portion and the compressed part are set to
The one side of the hot pressing portion far from the electrode column.
8. thermocompression bonding pressure head according to claim 7, which is characterized in that the hot pressing portion and two electrode columns one at
Type.
9. thermocompression bonding pressure head according to claim 8, which is characterized in that the compressed part is set to the side in the hot pressing portion
Edge, the limit for height portion are set to the position of the hot pressing portion far from the compressed part.
10. thermocompression bonding pressure head according to claim 9, which is characterized in that the width of the groove be greater than the limit for height portion with
Edge the distance between of the hot pressing portion far from the compressed part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820584623.1U CN208195884U (en) | 2018-04-23 | 2018-04-23 | Thermocompression bonding pressure head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820584623.1U CN208195884U (en) | 2018-04-23 | 2018-04-23 | Thermocompression bonding pressure head |
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| Publication Number | Publication Date |
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| CN208195884U true CN208195884U (en) | 2018-12-07 |
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ID=64524148
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| CN201820584623.1U Active CN208195884U (en) | 2018-04-23 | 2018-04-23 | Thermocompression bonding pressure head |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110609404A (en) * | 2019-08-22 | 2019-12-24 | 武汉华星光电技术有限公司 | Hot-pressing head of flexible printed circuit board |
| CN112247307A (en) * | 2020-10-09 | 2021-01-22 | 昆山联滔电子有限公司 | Hot-press welding device and hot-press welding process |
-
2018
- 2018-04-23 CN CN201820584623.1U patent/CN208195884U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110609404A (en) * | 2019-08-22 | 2019-12-24 | 武汉华星光电技术有限公司 | Hot-pressing head of flexible printed circuit board |
| CN112247307A (en) * | 2020-10-09 | 2021-01-22 | 昆山联滔电子有限公司 | Hot-press welding device and hot-press welding process |
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