CN208175103U - A kind of simplification bio-identification mould group - Google Patents
A kind of simplification bio-identification mould group Download PDFInfo
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- CN208175103U CN208175103U CN201820613363.6U CN201820613363U CN208175103U CN 208175103 U CN208175103 U CN 208175103U CN 201820613363 U CN201820613363 U CN 201820613363U CN 208175103 U CN208175103 U CN 208175103U
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Abstract
The utility model discloses a kind of simplification bio-identification mould groups, including decorative layer, encapsulated layer, chip unit, peripheral cell and circuit board；The upper surface of the circuit board is equipped with the accommodation groove of indent, and the chip unit is fixed in accommodation groove, and chip unit is connected by gold thread with circuit board；The peripheral cell is located at circuit board and connect and be connected with circuit board；The encapsulated layer is wrapped in the outside of chip unit, peripheral cell and gold thread；The decorative layer is located at the upper surface of encapsulated layer.A kind of simplification bio-identification mould group disclosed by the utility model, small in size, structure is simple, can be suitable for the smaller occasion of assembly space.
Description
Technical field
The utility model relates to technical field of touch control, specifically a kind of simplification bio-identification mould group.
Background technique
With the development of technology, bio-identification function is used widely on the electronic products such as mobile phone, intelligence wearing, respectively
The miniaturization of kind product and lightening designer trends require the occupied space of bio-identification mould group smaller, as shown in Figure 1, existing
The bio-identification mould group of technology includes decorative layer (a1), encapsulated layer (a2), chip (a3), circuit board (a4), scolding tin ((a5), bottom
Glue (a6), flexible circuit board (a7), conducting resinl (a8), stiffening plate (a9), peripheral cell (a10) and connector (a11) are filled by portion,
Structure is more complex, and volume is larger, is unable to satisfy the small occasion of some assembly spaces.
Utility model content
Technical problem to be solved in the utility model is：Overcome above-mentioned the deficiencies in the prior art, a kind of simplification is provided
Bio-identification mould group realizes bio-identification mould group small size, and bio-identification mould group is made to be suitable for smaller assembly space.
Technical solution adopted in the utility model is：A kind of simplification bio-identification mould group, including decorative layer, envelope are provided
Fill layer, chip unit, peripheral cell and circuit board；The upper surface of the circuit board is equipped with the accommodation groove of indent, the chip list
Member is fixed in accommodation groove, and chip unit is connected by gold thread with circuit board；The peripheral cell be located at circuit board and with
Circuit board is connected and is connected；The encapsulated layer is wrapped in the outside of chip unit, peripheral cell and gold thread；The decorative layer is located at
The upper surface of encapsulated layer.
The technical solution of the utility model has the following advantages that compared with prior art：
A kind of simplification bio-identification mould group of the utility model, eliminate flexible circuit board commonly used in the prior art,
Stiffening plate and connector component realize bio-identification mould group small size, so that bio-identification mould group is suitable for smaller assembly empty
Between.Specifically, it is provided with the accommodation groove of an indent in the top of circuit board in the structure, makes full use of this structure by chip
Unit is located in the accommodation groove of the indent, is effectively reduced the thickness of whole modular structure, is reduced volume.
Further, the decorative layer is spray coating, including the priming paint, middle paint and finishing coat successively sprayed from top to bottom.
Using spray coating structure, processing is more convenient, at low cost.
Further, alternatively, the decorative layer is panel construction, including transparent substrate and ink,
And the lower surface bonding of the transparent substrate fits in encapsulated layer upper surface, ink is painted on transparent substrate upper surface.Using this
Structural ornament better effect, stability are more preferable.
As an improvement, the two sides of the encapsulated layer are equipped with L-type step, and the vertical inner sidewall of L-type step and decoration
Layer outer end is concordant.It after step setting, position bio-identification mould group can well after loaded on application product, while
Be conducive to application product in the processing of dust and water protection structure.
Preferably, the encapsulation layer material is epoxy molding material, epoxy-plastic packaging material.
Further, the circuit board include set gradually from top to bottom upper insulating layer, upper circuit layer, circuit substrate,
Lower circuit layer and lower insulating layer；Upper circuit layer is two pieces, is respectively provided at the two sides of circuit substrate upper surface, upper insulating layer is also two
Block is respectively provided at the upper surface of two pieces of upper circuit layers；Position forms accommodation groove between two pieces of upper circuit layers；Peripheral cell is located at electricity
It the top of road plate and is electrically connected with upper circuit layer；Lower circuit layer is located at the lower surface of circuit substrate, and lower insulating layer is located at lower electricity
The lower surface of road floor.
Further, the chip unit include set gradually from top to bottom protective layer, sensor circuit matrix and
Silicon wafer；The lower surface fitting of the silicon wafer is located at the bottom position of accommodation groove on circuit substrate.Due to the accommodation groove on circuit board
The not upper circuit layer in position and upper insulation layer structure, so when setting chip unit, entire bio-identification mould group overall thickness not by
The influence of upper thickness of insulating layer and upper circuit thickness degree, this structure make overall thickness be thinned about 50um.
As an improvement, the lower insulating layer is equipped with openning, the openning position exposes lower circuit layer and is connect with being formed
Mouthful.
Preferably, the interface quantity is 10, be GND, RESET of combined in any order, INT, CS, CLK,
MOSI、MISO、VDD_1.8V、VDD_2.8V、GND。
Detailed description of the invention
Fig. 1 is the schematic diagram of prior art bio-identification mould group.
Fig. 2 is the schematic diagram of the utility model embodiment one.
Fig. 3 is the schematic diagram of the utility model embodiment two.
Fig. 4 is the circuit board bottom schematic view of the utility model embodiment one and embodiment two.
Wherein, 1- decorative layer, 11- priming paint paint in 12-, 13- finishing coat, 14- transparent substrate, 15- ink, 2- encapsulated layer, 3-
Chip unit, 31- protective layer, 32- sensor circuit matrix, 33- silicon wafer, 4- peripheral cell, 5- circuit board, the upper insulating layer of 51-,
The upper circuit layer of 52-, 53- circuit substrate, circuit layer under 54-, insulating layer under 55-, 551- windowing, 6- gold thread, 100- accommodation groove,
101- adhesive 102- scolding tin, 103- full bond glue, 104- intercommunicating pore, 201- interface, 202- direction signs
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawings and detailed description.
Embodiment one：
As shown in Figures 2 and 4, the utility model provides a kind of simplification bio-identification mould group, including decorative layer 1, encapsulation
Layer 2, chip unit 3, peripheral cell 4 and circuit board 5；
Specifically, being equipped with the accommodation groove 100 of indent in the upper surface middle position of circuit board 5, chip unit 3 is fixed on appearance
It sets in slot 100, the both ends of chip unit 3 pass through two gold threads 6 respectively and circuit board 5 is connected；Peripheral cell 4 is located at circuit board 5
It top and connect and is connected with circuit board 5, in the present embodiment, peripheral cell 4 connect conducting by scolding tin 102 with circuit board 5.
Encapsulated layer 2 is wrapped in the outside of chip unit 3, peripheral cell 4 and gold thread 6, in the present embodiment, the encapsulated layer 2
Material is epoxy molding material, epoxy-plastic packaging material.
Decorative layer 1 is located at the upper surface of encapsulated layer 2.In the present embodiment, which is spray coating, including from top to bottom
Priming paint 11, middle paint 12 and the finishing coat 13 successively sprayed.
In order to can preferably position when product use, L-type step 21, and the L-type platform are offered in the two sides of encapsulated layer 2
The vertical inner sidewall of rank 21 is concordant with 1 outer end of decorative layer.After being arranged in this way, make bio-identification mould group can after loaded on application product
To position well, while application product is also beneficial in the processing of dust and water protection structure.
Circuit board 5 includes upper insulating layer 51, upper circuit layer 52, circuit substrate 53, the lower circuit set gradually from top to bottom
Layer 54 and lower insulating layer 55.
For overall structure small size, so that identification mould group is suitable for smaller assembly space.In the present embodiment, power on
Road floor 52 is two pieces, is respectively provided at the two sides of 53 upper surface of circuit substrate, and upper insulating layer 51 is also two pieces, is respectively provided on two pieces
The upper surface of circuit layer 52；After being arranged in this way, position forms indent between the upper circuit layer 52 of two pieces of 53 two sides of circuit substrate
Accommodation groove 100, chip unit 3 just be arranged in this accommodation groove 100, thus reduce identification mould group integral thickness, this
The entire bio-identification mould group overall thickness of sample is not influenced by upper 51 thickness of insulating layer and 52 thickness of upper circuit layer.
Peripheral cell 4 is located at the top of circuit board 5 and is electrically connected with upper circuit layer 52.In the present embodiment, peripheral cell 4
It is located at the top position of any side in 5 two sides of circuit board, specifically, an intercommunicating pore 104 is equipped on upper insulating layer 51, through this
Intercommunicating pore 104 exposes the upper surface of upper circuit layer 52, so the lower surface of peripheral cell 4 is connected to intercommunicating pore by scolding tin 102
In 104, while realizing the conducting with upper circuit layer 52.
Lower circuit layer 54 is located at the lower surface of circuit substrate 53, and lower insulating layer 55 is located at the lower surface of lower circuit layer 54.
In the present embodiment, chip unit 3 includes protective layer 31, sensor circuit matrix 32 and the silicon set gradually from top to bottom
Piece 33；And the lower surface fitting of silicon wafer 33 is located at the bottom position of accommodation groove 100 on circuit substrate 53.
Lower insulating layer 55 is equipped with openning 551, and 551 position of openning exposes lower circuit layer 54 to form interface
201.Specifically, 201 quantity of interface is 10,10 interfaces 201 are GND, RESET of combined in any order, INT, CS, CLK,
MOSI、MISO、VDD_1.8V、VDD_2.8V、GND。
In the present embodiment, be additionally provided with a direction signs 202 in the bottom surface of circuit board 5, after direction mark setting
Bio-identification mould group determines assembly direction when being installed on product for identification.
The specific implementation steps of bio-identification mould group of the present embodiment are as follows：
Sensor circuit matrix 32 is integrated on silicon wafer 33 by S1 first, is arranged one layer in 32 upper surface of sensor circuit matrix
Protective layer 31；
Peripheral cell 4 is welded on circuit board 5 by scolding tin 102, and it is connected with upper circuit layer 52 by S2；
The bottom surface of silicon wafer 33 is connected with 5 upper surface of circuit board using adhesive, is particularly bonded in circuit base by S3
The upper surface of plate 53；
S4, using two gold threads 6 respectively by the both ends of sensor circuit matrix 32 in chip unit 3 and 5 two sides of circuit board
The upper connection of circuit layer 52 conducting；
S5 is packaged all components of 5 upper surface of circuit board setting, and encapsulated layer 2 is wrapped in chip unit 3, periphery
The outside of element 4 and gold thread 6.
S6, in 2 surface spraying and decorating layer 1 of encapsulated layer, successively spray-applied primer 11, middle paint 12 and finishing coat 13 from bottom to top.
S7 is finally cut into the L-type step 21 of encapsulated layer 2 using CNC, and modifies to whole mould group external form, this step
In rapid, L-type step 21 can also be formed directly by specific encapsulating mould.
In above-mentioned steps, two steps of S6 and S7 can mutually adjust sequence.
Embodiment two：
As shown in Figure 3,4, in addition to the structure of decorative layer 1 is different from structure in embodiment one in the present embodiment, other structures
Part is all the same.
Specifically, the structure of decorative layer 1 is panel construction, including transparent substrate 14 and ink 15, this is thoroughly in the present embodiment
Bright substrate 14 can be glass, ceramics or sapphire.
The lower surface of transparent substrate 14 is pasted onto 2 upper surface of encapsulated layer by full bond glue 103, and the brushing of ink 15 takes shape in
14 upper surface of transparent substrate.
In the present embodiment, from the step in embodiment one in addition to step S6 is different, other are walked integrally-built implementation steps
It is rapid all the same.Specifically, specific step S6 is by transparent substrate 14 since decorative layer 1 is panel construction in this embodiment
Lower surface is adhesively fixed in the upper surface of encapsulated layer 2 by full bond glue 103, then the upper surface of transparent substrate 14 brush at
One layer of ink 15 of type.
The utility model preferred embodiment is described above, but is not to be construed as limiting the scope of the invention.
The utility model is not only limited to above embodiments, and specific structure is allowed to vary, all in the utility model demand for independence
Made various change is within the protection scope of the present utility model in protection scope.
Claims (9)
1. a kind of simplification bio-identification mould group, it is characterised in that：Including decorative layer (1), encapsulated layer (2), chip unit (3),
Peripheral cell (4) and circuit board (5)；
The upper surface of the circuit board (5) is equipped with the accommodation groove (100) of indent, and the chip unit (3) is fixed on accommodation groove
(100) in, chip unit (3) is connected by gold thread (6) and circuit board (5)；The peripheral cell (4) is located on circuit board (5)
Just and it connect and is connected with circuit board (5)；The encapsulated layer (2) is wrapped in chip unit (3), peripheral cell (4) and gold thread (6)
Outside；The decorative layer (1) is located at the upper surface of encapsulated layer (2).
2. a kind of simplification bio-identification mould group according to claim 1, it is characterised in that：The decorative layer (1) is
Spray coating, including priming paint (11), middle paint (12) and the finishing coat (13) successively sprayed from top to bottom.
3. a kind of simplification bio-identification mould group according to claim 1, it is characterised in that：The decorative layer (1) is
The lower surface bonding of panel construction, including transparent substrate (14) and ink (15), the transparent substrate (14) fits in encapsulated layer
(2) upper surface, ink (15) are painted on transparent substrate (14) upper surface.
4. a kind of simplification bio-identification mould group according to claim 1, it is characterised in that：The two of the encapsulated layer (2)
Side is equipped with L-type step (21), and the vertical inner sidewall of the L-type step (21) is concordant with decorative layer (1) outer end.
5. a kind of simplification bio-identification mould group according to claim 1 or 4, it is characterised in that：The encapsulated layer (2)
Material is epoxy molding material, epoxy-plastic packaging material.
6. a kind of simplification bio-identification mould group according to claim 1, it is characterised in that：The circuit board (5) includes
Upper insulating layer (51), upper circuit layer (52), circuit substrate (53), lower circuit layer (54) and the lower insulation set gradually from top to bottom
Layer (55)；Upper circuit layer (52) is two pieces, is respectively provided at the two sides of circuit substrate (53) upper surface, and upper insulating layer (51) is also two
Block is respectively provided at the upper surface of two pieces upper circuit layer (52)；Position forms accommodation groove (100) between two pieces upper circuit layer (52)；
Peripheral cell (4) is located at the top of circuit board (5) and is electrically connected with upper circuit layer (52)；Lower circuit layer (54) is located at circuit base
The lower surface of plate (53), lower insulating layer (55) are located at the lower surface of lower circuit layer (54).
7. a kind of simplification bio-identification mould group according to claim 6, it is characterised in that：The chip unit (3)
Include the protective layer (31), sensor circuit matrix (32) and silicon wafer (33) set gradually from top to bottom；Under the silicon wafer (33)
Surface is bonded the bottom position for being located at accommodation groove (100) on circuit substrate (53).
8. a kind of simplification bio-identification mould group according to claim 6 or 7, it is characterised in that：The lower insulating layer
(55) openning (551) are equipped with, openning (551) position exposes lower circuit layer (54) to form interface (201).
9. a kind of simplification bio-identification mould group according to claim 8, it is characterised in that：Interface (201) quantity
It is 10, is GND, RESET, INT, CS, CLK, MOSI, MISO, VDD_1.8V, VDD_2.8V, GND of combined in any order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820613363.6U CN208175103U (en) | 2018-04-26 | 2018-04-26 | A kind of simplification bio-identification mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820613363.6U CN208175103U (en) | 2018-04-26 | 2018-04-26 | A kind of simplification bio-identification mould group |
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| Publication Number | Publication Date |
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| CN208175103U true CN208175103U (en) | 2018-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820613363.6U Active CN208175103U (en) | 2018-04-26 | 2018-04-26 | A kind of simplification bio-identification mould group |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110032943A (en) * | 2019-03-18 | 2019-07-19 | 江西合力泰科技有限公司 | Bio-identification mould group and its manufacturing method |
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2018
- 2018-04-26 CN CN201820613363.6U patent/CN208175103U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110032943A (en) * | 2019-03-18 | 2019-07-19 | 江西合力泰科技有限公司 | Bio-identification mould group and its manufacturing method |
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