CN208142147U - Carrier suitable for thin substrate encapsulation volume production - Google Patents
Carrier suitable for thin substrate encapsulation volume production Download PDFInfo
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- CN208142147U CN208142147U CN201820558182.8U CN201820558182U CN208142147U CN 208142147 U CN208142147 U CN 208142147U CN 201820558182 U CN201820558182 U CN 201820558182U CN 208142147 U CN208142147 U CN 208142147U
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- support plate
- substrate
- plate frame
- frame
- volume production
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Abstract
A kind of carrier suitable for thin substrate encapsulation volume production of the utility model, including cover board frame, PCB substrate, support plate frame, left track and right track, the support plate frame two side ends are respectively embedded into left track and the respective groove of right track, the cover board frame, the respective centre of support plate frame are vacancy section, the PCB substrate is between cover board frame, support plate frame, one work cushion block is located at the support plate frame side opposite with PCB substrate, and the work cushion block is contacted with the opposite surface of support plate frame with a heat block.The utility model effectively avoids substrate from moving caused get stuck that have some setbacks track suitable for the carrier of thin substrate encapsulation volume production, avoiding heating warpage because of substrate makes vacuum on cushion block can not good sorbing substrate, substrate temperature and flatness consistency are strong, improve the yield of product.
Description
Technical field
The utility model relates to a kind of semiconductor encapsulation device more particularly to a kind of loads suitable for thin substrate encapsulation volume production
Tool.
Background technique
Present electronic product becomes small, becomes thin, for the package thickness of electronic component also require increasingly
Thin, product is thinning mainly can be by reducing loop height, reducing chip thickness and reducing substrate thickness and replacement encapsulation side
Formula etc..
The thickness change of substrate has very large space, our usually used substrate thickness will be greater than 0.15mm, this kind of
Substrate generally can directly be run in die bond and wire bond equipment rail, but if there is substrate to stick up in the process
Song such as also gets stuck at the risks.
More serious after meeting warpage after substrate thinner, the especially substrate warp after heating, the substrate of warpage is in equipment rail
Be easy to cause and get stuck when middle walking, vacuum suction is incomplete the problems such as point.Therefore, above-mentioned technical problem how to be overcome to become ability
The direction that field technique personnel make great efforts.
Summary of the invention
The utility model aim is to provide a kind of carrier suitable for thin substrate encapsulation volume production, should be suitable for thin substrate and encapsulate
The carrier of volume production effectively avoid substrate moved in track have some setbacks caused by get stuck, avoid because substrate heat warpage make cushion block
On vacuum can not good sorbing substrate, substrate temperature and flatness consistency are strong, improve the yield of product.
In order to achieve the above objectives, the technical solution adopted in the utility model is：It is a kind of to encapsulate volume production suitable for thin substrate
Carrier, including cover board frame, PCB substrate, support plate frame, left track and right track, the support plate frame two side ends are respectively embedded into left track
In the respective groove of right track, the cover board frame, the respective centre of support plate frame are vacancy section, and the PCB substrate is located at
Between cover board frame, support plate frame, a work cushion block is located at the support plate frame side opposite with PCB substrate, the work cushion block and support plate
The opposite surface of frame is contacted with a heat block.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in above scheme, the edge of support plate frame lower surface has a lug boss.
2. in above scheme, in the lug boss of the work cushion block insertion support plate frame.
Since above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
The utility model is suitable for the carrier of thin substrate encapsulation volume production, effectively substrate can be avoided to move in track
Get stuck caused by having some setbacks, avoid heating because of substrate warpage make vacuum on cushion block can not good sorbing substrate, substrate temperature
It is strong with flatness consistency, the yield of product is improved, the workability of product and the operability of operator are improved, is improved
The working efficiency of operator.
Detailed description of the invention
Attached drawing 1 is the carrier structure schematic diagram that the utility model is suitable for that thin substrate encapsulates volume production；
Attached drawing 2 is the carrier schematic perspective view that the utility model is suitable for that thin substrate encapsulates volume production；
Attached drawing 3 is the utility model carrier local overlooking structural schematic diagram.
In the figures above：1, cover board；2, PCB substrate；3, support plate；31, lug boss；4, left track；5, right track；6, recessed
Slot；7, vacancy section；8, work cushion block；9, heat block.
Specific embodiment
The utility model is further described with reference to the accompanying drawings and embodiments：
Embodiment 1：It is a kind of suitable for thin substrate encapsulation volume production carrier, including cover board frame 1, PCB substrate 2, support plate frame 3,
Left track 4 and right track 5,3 two side ends of support plate frame are respectively embedded into left track 4 and the respective groove 6 of right track 5, described
Cover board frame 1, the respective centre of support plate frame 3 are vacancy section 7, and the PCB substrate 2 is between cover board frame 1, support plate frame 3, and one
Work cushion block 8 is located at the side opposite with PCB substrate 2 of support plate frame 3, the work cushion block 8 surface and one opposite with support plate frame 3
Heat block 9 contacts.
The edge of above-mentioned 3 lower surface of support plate frame has a lug boss 31.
Above-mentioned work cushion block 8 is embedded in the lug boss 31 of support plate frame 3.
Embodiment 2：It is a kind of suitable for thin substrate encapsulation volume production carrier, including cover board frame 1, PCB substrate 2, support plate frame 3,
Left track 4 and right track 5,3 two side ends of support plate frame are respectively embedded into left track 4 and the respective groove 6 of right track 5, described
Cover board frame 1, the respective centre of support plate frame 3 are vacancy section 7, and the PCB substrate 2 is between cover board frame 1, support plate frame 3, and one
Work cushion block 8 is located at the side opposite with PCB substrate 2 of support plate frame 3, the work cushion block 8 surface and one opposite with support plate frame 3
Heat block 9 contacts.
The edge of above-mentioned 3 lower surface of support plate frame has a lug boss 31.
Suitable for the carrier of thin substrate encapsulation volume production, thin PCB substrate is fixed by support plate, is transported in track by support plate
It is dynamic, improve the operability of product.
When using the above-mentioned carrier suitable for thin substrate encapsulation volume production, effectively substrate can be avoided to move in track
Get stuck caused by having some setbacks, avoid heating because of substrate warpage make vacuum on cushion block can not good sorbing substrate, substrate temperature
It is strong with flatness consistency.The yield for improving product improves the workability of product and the operability of operator, improves
The working efficiency of operator.
The above embodiments are only for explaining the technical ideas and features of the present invention, and its object is to allow be familiar with technique
Personage can understand the content of the utility model and implement accordingly, do not limit the protection scope of the present invention.
All equivalent change or modifications according to made by the spirit of the present invention essence, should all cover the protection scope of the utility model it
It is interior.
Claims (3)
1. a kind of carrier suitable for thin substrate encapsulation volume production, it is characterised in that：Including cover board frame（1）, PCB substrate（2）, support plate
Frame（3）, left track（4）And right track（5）, the support plate frame（3）Two side ends are respectively embedded into left track（4）And right track（5）Respectively
From groove（6）It is interior, the cover board frame（1）, support plate frame（3）Respective centre is vacancy section（7）, the PCB substrate（2）
Positioned at cover board frame（1）, support plate frame（3）Between, a work cushion block（8）Positioned at support plate frame（3）With PCB substrate（2）Opposite side,
The work cushion block（8）With support plate frame（3）Opposite surface and a heat block（9）Contact.
2. the carrier according to claim 1 suitable for thin substrate encapsulation volume production, it is characterised in that：The support plate frame（3）
The edge of lower surface has a lug boss（31）.
3. the carrier according to claim 2 suitable for thin substrate encapsulation volume production, it is characterised in that：The work cushion block
（8）It is embedded in support plate frame（3）Lug boss（31）It is interior.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820558182.8U CN208142147U (en) | 2018-04-19 | 2018-04-19 | Carrier suitable for thin substrate encapsulation volume production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820558182.8U CN208142147U (en) | 2018-04-19 | 2018-04-19 | Carrier suitable for thin substrate encapsulation volume production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208142147U true CN208142147U (en) | 2018-11-23 |
Family
ID=64293928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820558182.8U Active CN208142147U (en) | 2018-04-19 | 2018-04-19 | Carrier suitable for thin substrate encapsulation volume production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208142147U (en) |
-
2018
- 2018-04-19 CN CN201820558182.8U patent/CN208142147U/en active Active
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