CN208126643U - Infrared optical receiver apparatus and infrared remote control equipment - Google Patents

Infrared optical receiver apparatus and infrared remote control equipment Download PDF

Info

Publication number
CN208126643U
CN208126643U CN201820622774.1U CN201820622774U CN208126643U CN 208126643 U CN208126643 U CN 208126643U CN 201820622774 U CN201820622774 U CN 201820622774U CN 208126643 U CN208126643 U CN 208126643U
Authority
CN
China
Prior art keywords
infrared
shell
optical receiver
receiver apparatus
sensitive chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201820622774.1U
Other languages
Chinese (zh)
Inventor
葛浩明
韩瑞
杨敏琪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Everlight Electronics China Co Ltd
Original Assignee
Everlight Electronics China Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Everlight Electronics China Co Ltd filed Critical Everlight Electronics China Co Ltd
Priority to CN201820622774.1U priority Critical patent/CN208126643U/en
Application granted granted Critical
Publication of CN208126643U publication Critical patent/CN208126643U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Optical Communication System (AREA)
  • Light Receiving Elements (AREA)

Abstract

The utility model provides a kind of infrared optical receiver apparatus and infrared remote control equipment, is related to remote control infrared light technical field, for improving anti-interference ability and the sensitivity of infrared optical receiver apparatus.The infrared optical receiver apparatus includes shell, bracket, sensitive chip, signal processing chip and lid, wherein shell is provided with collector lens, and bracket includes being set to the intracorporal electrical connection area of shell and extending output pin outside shell, ground pin, power pin;Sensitive chip and signal processing chip are located in shell, and are mounted in electrical connection area;Lid is located in shell, and lid cover is buckled on sensitive chip and signal processing chip, and is connected with area is electrically connected;Lid has the opening with the photosurface face of collector lens and sensitive chip respectively, and the glazed area of opening is greater than or equal to the area of photosurface.Infrared optical receiver apparatus provided by the utility model is for control instruction needed for receiving infrared signal and being converted into executive device.

Description

Infrared optical receiver apparatus and infrared remote control equipment
Technical field
The utility model relates to remote control infrared light technical field more particularly to a kind of infrared optical receiver apparatus and infrared remote controls Equipment.
Background technique
Remote control infrared light technology is a kind of communication more commonly used at present and control technology, due to it is simple with structure, Low in energy consumption, strong antijamming capability, high reliablity and it is at low cost the advantages that, therefore be widely used in colour TV, video recorder, sky It adjusts in mechanical, electrical table machine, sweeper and parking lot automatic railing.
Infrared light emission device and red is generally included according to remote control infrared light system made of remote control infrared light technical principle Outer optical receiver apparatus, wherein infrared optical receiver apparatus be used for receives to infrared light emission device emit infrared signal, and It is exported after handling the infrared signal.At present common infrared optical receiver apparatus include shell, bracket, sensitive chip and Signal processing chip, wherein shell is provided with collector lens, bracket include be set to the intracorporal electrical connection area of shell, and with electricity Bonding pad is connected and stretches out the output pin outside shell, ground pin, power pin;Sensitive chip and signal processing chip are located at It in shell and is mounted in electrical connection area, and the photosurface of sensitive chip is oppositely arranged with condenser lens.Sensitive chip is for connecing The infrared signal of infrared light emission device transmitting is received, and sends it to signal processing chip and handles and exports.
However, since signal processing chip is also mounted in electrical connection area, and it is also closer at a distance from sensitive chip, Cause to enter the intracorporal part infrared signal of shell by collector lens and be irradiated on signal processing chip, influences signal processing chip Performance, keeps the anti-interference ability of infrared optical receiver apparatus poor, furthermore can also interfere with signal processing chip and accurately handles it and is connect The signal of receipts makes the sensitivity decrease of infrared optical receiver apparatus.
Utility model content
It is infrared for improving the purpose of this utility model is to provide a kind of infrared optical receiver apparatus and infrared remote control equipment The anti-interference ability of optical receiver apparatus and sensitivity.
To achieve the goals above, infrared optical receiver apparatus provided by the utility model includes:Infrared optical receiver apparatus packet Include shell, bracket, sensitive chip, signal processing chip and lid, wherein the shell is provided with collector lens, the bracket Including being set to the intracorporal electrical connection area of the shell and extending output pin outside the shell, ground pin, power pin; The sensitive chip and signal processing chip are located in the shell, and are mounted in the electrical connection area;The lid is located at In the shell, the lid cover is buckled on the sensitive chip and signal processing chip, and is connected with the area that is electrically connected; The lid has the opening with the photosurface face of the collector lens and the sensitive chip respectively, the light transmission of the opening Area is greater than or equal to the area of the photosurface.
Compared with prior art, infrared optical receiver apparatus provided by the utility model has the following advantages that:
In infrared optical receiver apparatus provided by the utility model, due to being provide with outside sensitive chip and signal processing chip One has the lid of opening, and the photosurface face with sensitive chip that is open, therefore, only into the intracorporal infrared signal of shell It can be irradiated to the sensitive chip of exposure in the opening, and signal processing chip cannot be irradiated to, therefore, compared with prior art, It can reduce or even avoid infrared signal to influence on the performance of signal processing chip, so as to improve infrared optical receiver apparatus Anti-interference ability and sensitivity.
As a kind of above-mentioned infrared improvement of optical receiver apparatus, the collector lens is hemispherical convex lenses.
As the further improvement of above-mentioned infrared optical receiver apparatus, the radius of curvature of the collector lens is 2mm~3mm.
As a kind of above-mentioned infrared improvement of optical receiver apparatus, the lid is structure as a whole with the bracket.
As a kind of above-mentioned infrared improvement of optical receiver apparatus, the shell includes upper housing and lower case, the upper housing Cross sectional shape with the lower case is trapezoidal;The big end of the upper housing is connected with the big end of the lower case, described The small end of upper housing is provided with collector lens, and the distance between the big end of the upper housing and small end are 2.5mm~3mm.
As the further improvement of above-mentioned infrared optical receiver apparatus, the side of the upper housing and perpendicular to the upper housing Big end straight line between angle be 4 °~8 °, the side of the lower case with perpendicular to the lower case big end straight line Between angle be 4 °~8 °.
As the further improvement of above-mentioned infrared optical receiver apparatus, the shell is to be less than or equal to by that can filter out wavelength Optical filtering shell made of the filter of 820nm.
As the further improvement of above-mentioned infrared optical receiver apparatus, the collector lens is to be less than or waited by that can filter out wavelength The filter lens made of the filter of 820nm.
As a kind of above-mentioned infrared improvement of optical receiver apparatus, the sensitive chip be can receive wave-length coverage 880nm~ Infrared light sensitive chip between 1080nm.
As a kind of above-mentioned infrared improvement of optical receiver apparatus, the output pin, ground pin and power pin are successively arranged Column, the output pin and power pin all have bending part towards one another.
The utility model additionally provides a kind of infrared remote control equipment, including infrared optical receiver apparatus as described above.It is infrared Remote control equipment have the advantages that it is identical with above-mentioned infrared optical receiver apparatus, so not repeating.
Preferably, the infrared remote control equipment is ammeter machine, sweeper or parking lot automatic railing.
In addition to the utility model described above solve the technical issues of, constitute technical solution technical characteristic and by Outside beneficial effect brought by the technical characteristic of these technical solutions, infrared optical receiver apparatus provided by the utility model and infrared The other technical characteristics for including in other technologies problem that remote control equipment can solve, technical solution and these technical characteristic bands The beneficial effect come, will make further details of explanation in a specific embodiment.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be practical to this New embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below Attached drawing be only that a part of the embodiment of the utility model is not paying creation for those of ordinary skill in the art Property labour under the premise of, can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the main view of infrared optical receiver apparatus provided by the embodiment of the utility model;
Fig. 2 is the side view of infrared optical receiver apparatus provided by the embodiment of the utility model;
Fig. 3 is the cross-sectional view of infrared optical receiver apparatus provided by the embodiment of the utility model;
Fig. 4 is the top view of infrared optical receiver apparatus provided by the embodiment of the utility model;
Fig. 5 is the relative position relation figure of bracket and lid in Fig. 1;
Fig. 6 is the annexation figure of signal processing chip and sensitive chip in Fig. 1;
Fig. 7 is the curve relation figure between the responsiveness and wavelength of infrared optical receiver apparatus described in Fig. 1;
Fig. 8 is the curve relation figure between the susceptibility and angle of sweeper provided by the embodiment of the utility model;
Fig. 9 is the structural block diagram of ammeter machine provided by the embodiment of the utility model.
Description of symbols:
The first area B-,
C- second area, 1- bracket,
10- shell, 11- upper housing,
12- lower case, 20- collector lens,
30- is electrically connected area, and 30a- first is electrically connected area,
30b- second is electrically connected area, and 30c- third is electrically connected area,
31- output pin, 31a, 33a- bending part,
32- ground pin, 33- power pin,
40- sensitive chip, 50- signal processing chip,
60- lid, 61- opening,
70- infrared light emission device, 80- electricity consumption numerical generation device,
90- electricity consumption numeric display,
50a, 50b, 50c, 50d- conducting wire.
Specific embodiment
In order to improve anti-interference ability and the sensitivity of infrared optical receiver apparatus, the utility model embodiment provides one kind Improved infrared optical receiver apparatus and infrared remote control equipment, mid-infrared light reception device includes shell and to be set to shell intracorporal Sensitive chip, signal processing chip and lid, which is located at sensitive chip, on signal processing chip, and lid is provided with Respectively with the opening of the photosurface face of collector lens and sensitive chip on shell, and be open glazed area be greater than or equal to The area of the photosurface of sensitive chip.It is designed in this way, enters the intracorporal infrared signal of shell via collector lens and irradiated from opening To sensitive chip, the acquisition of infrared signal is completed;And can be prevented on Infrared irradiation to signal processing chip using lid, So as to improve anti-interference ability and the sensitivity of infrared optical receiver apparatus.
It, below will knot in order to keep the above objects, features, and advantages of the utility model embodiment more obvious and easy to understand The attached drawing in the utility model embodiment is closed, the technical scheme in the utility model embodiment is clearly and completely described. Obviously, described embodiment is only a part of the embodiment of the utility model, instead of all the embodiments.Based on this reality With the embodiment in novel, those of ordinary skill in the art without creative labor it is obtained it is all its Its embodiment belongs to the range of the utility model protection.
FIG. 1 to FIG. 6 is please referred to, infrared optical receiver apparatus provided by the embodiment of the utility model includes:Shell 10, bracket 1, Sensitive chip 40, signal processing chip 50 and lid 60, shell 10 are provided with collector lens 20, and bracket 1 includes being set to shell Electrical connection area 30 in 10, as shown in figure 5, electrical connection area 30 include first electrical connection area 30a, second electrical connection area 30b and Third is electrically connected area 30c, wherein the first electrical connection area 30a has the ground pin (GND) 32 extended outside shell 10, the second electricity Bonding pad 30b has the output pin (OUT) 31 extended outside shell 10, and third electrical connection area 30c, which has, extends shell 10 Outer power pin (VCC) 33;Sensitive chip 40 and signal processing chip 50 are located in shell 10, and are separately positioned on the first electricity On the first area (area B in Fig. 5) and second area (area C in Fig. 5) of bonding pad 30b.Wherein, as shown in fig. 6, photosensitive core Piece 40 is electrically connected by a conducting wire 50a and signal processing chip 50, and transmission signal is to signal processing chip 50;Signal processing Chip 50 is more further electrically connected area 30b with second by a conducting wire 50c and is electrically connected with output signal, by a conducting wire 50d It is connect with the first electrical connection area 30a to connect electric current and import ground, then is electrically connected third by a conducting wire 50b and is electrically connected area 30c To receive power supply.
Lid 60 is located in shell 10, and lid 60 is arranged on sensitive chip 40 and signal processing chip 50, and with first Electrical connection area 30a is connected, and in a preferred embodiment, as shown in Fig. 5, the first electrical connection area 30a is integrated with lid 60 Molding structure, by making to be set on sensitive chip 40 and signal processing chip 50 bending of lid 60.Lid 60 has difference With the opening 61 of the photosurface face of collector lens 20 and sensitive chip 40, be open 61 glazed area be greater than or equal to photosensitive core The area of 40 photosurface of piece, therefore, can only be irradiated into the infrared signal in shell 10 be exposed to opening 61 in it is photosensitive Chip 40, and it cannot be irradiated to signal processing chip 50, therefore, compared with prior art, it can reduce or even avoid infrared light Signal influences the performance of signal processing chip 50, so as to improve the anti-interference ability of infrared optical receiver apparatus and sensitive Degree, and promote the protection effect of electromagnetic interference (EMI).
In a preferred embodiment, lid 60 can be metal material or nonmetallic materials.Wherein, lid 60 can be metal Coating, using plating or sputtering way be formed in signal processing chip 50, first be electrically connected area 30a on and sensitive chip On 40 region other than its photosurface, and its thickness is about 10nm-20nm.
When it is implemented, shell 10 is electrically connected area for coating the first electrical connection area 30a, the second electrical connection area 30b, third The devices such as 30c, sensitive chip 40, signal processing chip 50 and lid 60.As shown in Fig. 2, shell 10 includes upper housing 11 under Shell 12.Upper housing 11 or lower case 12 can be metal shell, or plastic casing, for example, utilizing press machine and punching Compression mould, upper housing 11 and lower case 12 made of stamped metal thin material;Or, passing through injection molding using injection molding process Machine and mold mold integrally formed upper housing 11 and lower case 12.In an embodiment, shell 10 is in solid cladding Portion's device, to seal the moisture outside isolation.Wherein, signal processing chip 50 can be Complex Programmable Logic Devices (ASIC), field programmable gate array (FPGA) or complexity can program logic devices (CPLD).
Upper housing 11 and the cross sectional shape of lower case 12 can be rectangle, trapezoidal or other polygons, such as Fig. 2 or Fig. 3 institute Show, upper housing 11 and the cross sectional shape of lower case 12 are trapezoidal in the present embodiment, and the small end of upper housing 11 is that trapezoidal upper bottom is (short Side) where face, the big end of upper housing 11 is the face where trapezoidal bottom (long side), and the side of upper housing 11 is trapezoidal waist edge institute Face, with reference to orientation shown in Fig. 2, the small end of upper housing 11 is the left end of upper housing 11, and the big end of upper housing 11 is upper casing The right end of body 11.The structure of lower case 12 and the structure of upper housing 11 are essentially identical, therefore repeat no more.
The small end of upper housing 11 is provided with collector lens 20, and in a preferred embodiment, collector lens 20 is with shell 10 Plastics are integrally formed to be formed.For example, molding integrally formed gather by injection moulding machine and mold using injection molding process Optical lens 20, upper housing 11 and lower case 12.When the infrared signal of infrared light emitting devices transmitting is irradiated to collector lens 20 When upper, using the focus characteristics of collector lens 20, converge to infrared light through collector lens 20 on the photosurface of sensitive chip 40.
Bracket 1 generally includes two parts, and as shown in Figure 2 and Figure 5, a portion is electrically connected for first in shell 10 Meet area 30a, the second electrical connection area 30b, third electrical connection area 30c;Another part is that the second electrical connection area 30b extends shell 10 The outer electrical connection of output pin (OUT) 31, first area 30a extends ground pin (GND) 32 and third electricity outside shell 10 Bonding pad 30c extends the power pin (VCC) 33 outside shell 10.
Sensitive chip 40 is also referred to as optical diode/photistor (PD/PT) chip, is mounted on the first electrical connection area On the first area (area B in Fig. 5) of 30a, for infrared signal to be changed into infrared remote control electric signal.Sensitive chip 40 Core is the photosurface for receiving infrared signal and the conversion for infrared signal to be converted to infrared remote control electric signal Circuit, wherein the photosurface of sensitive chip 40 is usually the PN junction made of special material, and PN junction usually benefit is with the following method It is formed:Using doping process, P-type semiconductor and N-type semiconductor are produced on same semiconductor chip (such as silicon chip or germanium base Piece) on, it is known as PN junction in the space-charge region that the interface of P-type semiconductor and N-type semiconductor is formed, PN junction has unilateal conduction Property.You need to add is that usually the photosurface of sensitive chip 40 is done bigger in order to more receive infrared light.
Signal processing chip 50 is also referred to as IC chip, is mounted on the second area (C in Fig. 5 of the first electrical connection area 30a Area) on, it is ipsilateral with sensitive chip 40, and connect with 40 signal of sensitive chip.Signal processing chip 50 generally comprises signal amplification Circuit, filter circuit and instruction decoding circuit, for receiving the infrared remote control electric signal of the output of sensitive chip 40, and it is infrared to this Remote control electric signal amplifies, filtering clutter and decoding, instruction needed for finally exporting executive device control signal.Wherein, IR light source emits infrared signal, receives the infrared signal by the photosurface of sensitive chip 40 and is translated into current signal After export to signal processing chip 50, current signal is converted voltage by 50 transfer impedance amplifier (TIA) of signal processing chip to be believed Number, it controls gain amplifier (CGA) function amplification or reduces voltage multiplying power and (just amplify voltage multiplying power without noise, have noise just Reduce voltage multiplying power), then other clutters are filtered via bandpass filter (BP), such as leave the frequency wave of 35~40kHz (if making an uproar Sound is too many, then returns to CGA and adjust voltage multiplying power and reduce noise), finally by demodulation processor (DEM/INT) by the undaform of script Wave be converted to square wave output.
Lid 60 is generally made of metal material or lighttight nonmetallic materials, that is to say, that lid 60 can be gold Belong to lid, pottery lid or plastic cover.Opening 61 is provided on lid 60, lid 60 is located at sensitive chip, signal processing After on chip, the photosurface of sensitive chip 40 is exposed in opening 61.Opening 61 shape can be rectangle, circle, ellipse, Can specifically be designed according to the shape of the photosurface of sensitive chip 40, for example, sensitive chip 40 photosurface shape be circle, The shape of opening 61 is circle.For another example, as shown in Figure 5 and Figure 6, the shape of the photosurface of sensitive chip 40 is rectangle, opening 61 Shape be rectangle.Wherein, opening 61 can be transparent area.
In addition, the glazed area of opening 61 is generally higher than the area of the photosurface of sensitive chip 40, or, the light transmission of opening 61 Area is equal to the area of the photosurface of sensitive chip 40, is designed in this way, and can make to converge in by the infrared signal of opening 61 In the photosurface of sensitive chip 40, prevent from entering on the Infrared irradiation to signal processing chip 50 in shell 10, and can be improved The utilization rate of infrared signal, to improve the sensitivity of infrared light emission device.
Above-mentioned infrared optical receiver apparatus working principle is as follows:The infrared signal of infrared light emission device transmitting irradiates first To collector lens 20, enter in shell 10 after the focusing of collector lens 20, and converges to sensitive chip from the opening of lid 60 61 On 40 photosurface, to itself and conversion after the reception infrared signal of sensitive chip 40, it is converted into infrared remote control electric signal, and export To signal processing chip 50, the processing such as signal processing chip 50 amplifies infrared remote control electric signal, filters, decoding, finally Control instruction needed for exporting executive device.
In infrared optical receiver apparatus provided by the above embodiment, due to outside sensitive chip 40 and signal processing chip 50 It is provide with a lid 60 with opening, the photosurface face of opening 61 and sensitive chip 40, and the glazed area of opening 61 is big Therefore it can only be irradiated to and be exposed into the infrared signal in shell 10 in or equal to the area of 40 photosurface of sensitive chip Sensitive chip 40 in opening 61, and it cannot be irradiated to signal processing chip 50, therefore, compared with prior art, it can reduce Infrared signal is avoided to influence the performance of signal processing chip 50, even so as to improve the anti-dry of infrared optical receiver apparatus Disturb ability and sensitivity.
In above-mentioned infrared optical receiver apparatus, collector lens 20 is one of the Primary Component for realizing above-mentioned function, and optically focused is saturating Mirror 20 is usually convex lens, is specifically as follows spherical convex lens and aspherical convex lens, excellent for the ease of installing and reducing cost Selection of land, collector lens 20 are hemispherical convex lenses.
In above-mentioned infrared optical receiver apparatus, radius of curvature of the light receiving efficiency of sensitive chip 40 usually with collector lens 20 The photosurface distance dependent of sensitive chip is arrived with collector lens 20.By a large amount of verification experimental verification and consider infrared light-receiving dress The radius of curvature r of the miniaturization trend set, collector lens 20 is chosen as between 2mm~3mm, preferably, collector lens 20 Radius of curvature r be 2.5mm.In addition, the photosurface distance d of collector lens 20 to sensitive chip is regarded as the big of upper housing 11 The distance between end and small end, the distance between the big end of upper housing and small end are 2.5mm~3mm, preferably, upper housing is big The distance between end and small end are 2.7mm.
Mention in the above-described embodiments, the cross sectional shape of upper housing 11 and lower case 12 can for rectangle, it is trapezoidal or other Polygon, and can be molded by injection moulding machine and mold.Referring to Fig. 4, in a preferred embodiment, upper housing 11 It is trapezoidal, and the side of upper housing 11 and perpendicular between the straight line of the big end of upper housing 11 with the cross sectional shape of lower case 12 Angle is 4 °~8 °, the side of lower case 12 and be 4 °~8 ° perpendicular to the angle between the straight line of the big end of lower case 12.Such as This design, can facilitate when injection molding goes out upper housing 11 and lower case 12 by the smooth break away from moulds of molded product.
As shown in fig. 7, sensitive chip 40 usually receivable infrared light wave-length coverage between 600nm~1100nm, but If sensitive chip 40 receives wavelength between 600nm~880nm or when the infrared light of 1060nm or more, responsiveness is lower (to ring Response is lower than 0.6).Therefore, in order to make 40 responsiveness of sensitive chip 0.6 or more, usually sensitive chip 40 is designed to connect Receive the infrared light between 880nm~1060nm, that is, sensitive chip is that can receive wave-length coverage between 880nm~1080nm Infrared light sensitive chip.Preferably, sensitive chip 40 is the infrared light sensitive chip of a length of 940nm of received infrared waves, this The responsiveness of sensitive chip 40 can reach or close to 1 in the case of kind.
In the above-described embodiments, shell 10 can be plastic casing, and plastic casing may be clear, colorless, i.e., transparent The translucency of colourless plastic casing is relatively good, therefore when infrared optical receiver apparatus is using the sun-drenched place of lamp outdoors When, other than the infrared signal entered in shell 10 from collector lens 20, other light are also had other than collector lens 20 Housing parts enter in shell 10, and the photosurface of sensitive chip 40 is entered through opening 61, so that sensitive chip receives Noise.In order to avoid such case appearance, while reception of the sensitive chip 40 to infrared light is not influenced again, it is preferable that shell 10 For the shell that filters made of filter of the wavelength less than or equal to 820nm can be filtered out.For example, shell 10 can be by ring Oxygen class wrapper glue, organic silicon packaging plastic, polyurethane packaging plastic, heat curing type packaging plastic, thermoplastics type's packaging plastic or ultraviolet light solidification The materials such as packaging plastic mold, and need to utilize doped with the filter that can filter out wavelength less than or equal to 820nm in shell 10 Filter in shell 10 filters out the light that wavelength is less than or equal to 820nm, reduces the received noise amount of sensitive chip 40.
In a preferred embodiment, collector lens 20 is one of the forming with shell 10.Its material can seal for epoxies It fills glue, organic silicon packaging plastic, polyurethane packaging plastic, heat curing type packaging plastic, thermoplastics type's packaging plastic or ultraviolet light and solidifies packaging plastic Equal materials mold integrally formed collector lens 20, upper housing by injection moulding machine and mold using injection molding process 11 and lower case 12.It needs to utilize shell 10 doped with the filter that can filter out wavelength less than or equal to 820nm in its material Interior filter filters out the light that wavelength is less than or equal to 820nm, reduces the received noise amount of sensitive chip 40.Extend shell There are many output pins 31, ground pin 32 outside 10 and the arrangement mode of power pin 33, as shown in Figure 1, more commonly used A kind of arrangement mode:Output pin 31, ground pin 32 and power pin 33 are arranged successively from left to right, i.e. ground pin 32 In centre, output pin 31 and power pin 33 are located at outside.Due to the development trend of infrared optical receiver apparatus miniaturization, usually By the shell small volume of infrared optical receiver apparatus, lead to the output pin 31 and power pin 33 and shell 10 positioned at outside Junction leak adhesive, in order to prevent leak adhesive, it is preferable that output pin 31 and power pin 33 all have bending towards one another Portion 31a, 33a, wherein the bending part 31a of output pin 31 is close to the junction of output pin 31 and shell 10, power pin 33 Bending part 33a close to the junction of power pin 33 and shell 10.
The utility model embodiment additionally provides a kind of infrared remote control equipment comprising infrared light described in above-described embodiment Reception device, infrared remote control equipment can be ammeter machine, sweeper, parking lot automatic railing, can also be colour TV, refrigerator and sky Tune machine.Since the working principle of these infrared remote control equipments is essentially identical or similar, only it is with infrared remote control equipment herein It is illustrated for ammeter machine, sweeper, parking lot automatic railing, the working principle of other infrared remote control equipments that do not say can With reference to the working principle of ammeter machine, sweeper, parking lot automatic railing.
As shown in figure 9, infrared remote control equipment in the present embodiment is ammeter machine comprising infrared optical receiver apparatus, infrared Light emitting devices 70, electricity consumption numerical generation device 80 and electricity consumption numeric display 90.Wherein, the infrared light-receiving dress in the present embodiment Set identical as above-described embodiment mid-infrared light reception device, therefore, description will be omitted or simplified in the two same technique content.It is infrared Light emitting devices 70 and the collector lens 20 of infrared optical receiver apparatus are oppositely arranged, infrared optical receiver apparatus and electricity consumption numerical generation The connection of 80 signal of device, electricity consumption numeric display 90 are connect with 80 signal of electricity consumption numerical generation device.
Infrared light emission device 70 includes IR light source, which can be according to the difference of voltage, and continuous transmitting is different strong The infrared light of degree.The infrared signal of the transmitting of infrared light emission device 70 enters in shell 10 after the focusing of collector lens 20, And pass through opening and 61 be irradiated on the photosurface of sensitive chip 40, sensitive chip 40 receives after infrared signal to itself and conversion, Be converted into infrared remote control electric signal, and export to signal processing chip 50, signal processing chip 50 to infrared remote control electric signal into Output is converted to specifically to electricity consumption numerical generation device 80 by electricity consumption numerical generation device 80 after the processing such as row amplification, filtering, decoding Electricity consumption numerical value, and the electricity consumption numerical value is shown by electricity consumption numeric display 90.
The ammeter machine also has other than having the advantages that above-mentioned infrared optical receiver apparatus and is suitable for multiple types ammeter Machine can remotely confirm ammeter machine numerical value and relevent information, can keep ammeter cleverness sensitivity and identification height for a long time, can effectively prevent Only light interference is on the advantages that the received influence of ammeter machine.
Infrared remote control equipment can also be sweeper, which includes infrared optical receiver apparatus and infrared light emission dress It sets, wherein infrared light emission device has the advantages that infrared light emission device described in the various embodiments described above, and therefore, this is swept the floor Machine also has the advantages that such as strong antijamming capability and high sensitivity, even if so that the sweeper in the room full of sunlight still It can be used normally, not will cause dysfunction.Further, it is also possible to remotely receive the charging letter of sweeper cradle transmitting Number, accurately return to specified electric seat charging.In addition, different Code decoded modes can be used, it is suitable for different product.
As shown in figure 8, in order to further increase the accuracy of sweeper, it is preferable that the infrared signal device in sweeper Compared with wide-angle.The angular range that infrared signal device receives infrared signal under normal conditions is swept generally between -40 °~+40 ° The angular range that infrared signal device in ground machine receives infrared signal is designed in this way generally between -50 °~+50 °, can Infrared signal is missed with the infrared optical receiver apparatus reduced in sweeper, the accuracy of sweeper is improved, keeps sweeper accurate Ground returns to specified cradle and charges.
Infrared remote control equipment can also be parking lot automatic railing, which includes infrared optical receiver apparatus With infrared light emission device, wherein infrared light emission device has the excellent of infrared optical receiver apparatus described in the various embodiments described above Point, therefore, the parking lot automatic railing also have the advantages that such as strong antijamming capability and high sensitivity, so that the parking lot is automatic Railing can be used normally under sunny environment, not will cause dysfunction.Further, it is also possible to remotely receive To infrared signal, realization parking lot automatic railing lifts or lowering function.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation The description of mode ", " example ", " specific example " or " some examples " etc. means embodiment or example is combined to describe specific Feature, structure, material or feature are contained at least one embodiment or example of the utility model.In this specification In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
Finally it should be noted that:The above various embodiments is only to illustrate the technical solution of the utility model, rather than limits it System;Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should Understand:It is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of Technical characteristic is equivalently replaced;And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new The range of each embodiment technical solution of type.

Claims (12)

1. a kind of infrared optical receiver apparatus, which is characterized in that including shell, bracket, sensitive chip, signal processing chip and lid Body, wherein
The shell is provided with collector lens, and the bracket includes being set to the intracorporal electrical connection area of the shell and extending described Output pin, ground pin outside shell, power pin;
The sensitive chip and signal processing chip are located in the shell, and are mounted in the electrical connection area;
The lid is located in the shell, and the lid cover is buckled on the sensitive chip and signal processing chip, and with institute Electrical connection area is stated to be connected;The lid has to be opened with the photosurface face of the collector lens and the sensitive chip respectively Mouthful, the glazed area of the opening is greater than or equal to the area of the photosurface.
2. infrared optical receiver apparatus according to claim 1, which is characterized in that the collector lens is hemispherical convex lens Mirror.
3. infrared optical receiver apparatus according to claim 2, which is characterized in that the radius of curvature of the collector lens is 2mm~3mm.
4. infrared optical receiver apparatus according to claim 1, which is characterized in that the lid and the bracket are integrated knot Structure.
5. infrared optical receiver apparatus according to claim 1, which is characterized in that the shell includes upper housing and lower casing The cross sectional shape of body, the upper housing and the lower case is trapezoidal;The big end of the upper housing and the lower case it is big End is connected, and the small end of the upper housing is provided with collector lens, and the distance between the big end of the upper housing and small end are 2.5mm~3mm.
6. infrared optical receiver apparatus according to claim 5, which is characterized in that the side of the upper housing with perpendicular to institute Stating the angle between the straight line of the big end of upper housing is 4 °~8 °, the side of the lower case with perpendicular to the big of the lower case Angle between the straight line at end is 4 °~8 °.
7. according to claim 1, the described in any item infrared optical receiver apparatuses of 5-6, which is characterized in that the shell is by that can filter Except the shell that filters made of filter of the wavelength less than or equal to 820nm.
8. infrared optical receiver apparatus according to claim 1-3, which is characterized in that the collector lens is by can Filter out filter lens made of filter of the wavelength less than or equal to 820nm.
9. infrared optical receiver apparatus according to claim 1, which is characterized in that the sensitive chip is that can receive wavelength model The infrared light sensitive chip being trapped among between 880nm~1080nm.
10. infrared optical receiver apparatus according to claim 1, which is characterized in that the output pin, ground pin and electricity Source capsule foot is arranged successively, and the output pin and power pin all have bending part towards one another.
11. a kind of infrared remote control equipment, which is characterized in that including the described in any item infrared light-receiving dresses of such as claim 1-10 It sets.
12. infrared remote control equipment according to claim 11, which is characterized in that the infrared remote control equipment be ammeter machine, Sweeper or parking lot automatic railing.
CN201820622774.1U 2018-04-27 2018-04-27 Infrared optical receiver apparatus and infrared remote control equipment Active CN208126643U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820622774.1U CN208126643U (en) 2018-04-27 2018-04-27 Infrared optical receiver apparatus and infrared remote control equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820622774.1U CN208126643U (en) 2018-04-27 2018-04-27 Infrared optical receiver apparatus and infrared remote control equipment

Publications (1)

Publication Number Publication Date
CN208126643U true CN208126643U (en) 2018-11-20

Family

ID=64186722

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820622774.1U Active CN208126643U (en) 2018-04-27 2018-04-27 Infrared optical receiver apparatus and infrared remote control equipment

Country Status (1)

Country Link
CN (1) CN208126643U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110415507A (en) * 2018-04-27 2019-11-05 亿光电子(中国)有限公司 Infrared optical receiver apparatus and infrared remote control equipment
WO2022226826A1 (en) * 2021-04-28 2022-11-03 京东方科技集团股份有限公司 Flat panel detector and display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110415507A (en) * 2018-04-27 2019-11-05 亿光电子(中国)有限公司 Infrared optical receiver apparatus and infrared remote control equipment
WO2022226826A1 (en) * 2021-04-28 2022-11-03 京东方科技集团股份有限公司 Flat panel detector and display device

Similar Documents

Publication Publication Date Title
CN208126643U (en) Infrared optical receiver apparatus and infrared remote control equipment
US7348551B2 (en) Remote-control light receiving unit and electronic apparatus using the same
CN101123036A (en) Compound encapsulation infrared receiver
CN105048647A (en) Wireless charging device employing laser
JPH10154825A (en) Light emitting/receiving device
CN113363242A (en) Paster infrared receiving head and manufacturing method thereof
CN110415507A (en) Infrared optical receiver apparatus and infrared remote control equipment
CN206098450U (en) Optical chip's integrated morphology
CN211061739U (en) Optical detector receiving assembly
CN201018466Y (en) Photoelectric sensor
CN110880954A (en) Optical detector receiving assembly
CN109270640A (en) A kind of APD light-receiving component
CN101582420B (en) Focusing infrared receiver with built-in reflective cup
CN212058814U (en) Infrared proximity and ambient light brightness sensor with novel structure
US20230275659A1 (en) Insulation device incorporated in an optical wireless communication equipment
CN201549509U (en) Focusing infrared receiver with internal reflective cup
CN205263365U (en) Light path structure of optical receiver
CN113421859A (en) Transmitting and receiving integrated infrared module and packaging process thereof
CN113686820B (en) Intelligent sensor for crop growth information
CN208156254U (en) Tunable receiving end shell and receiving end component based on NGPON2 technology
CN206156743U (en) Optical chip's packaging structure
KR100538763B1 (en) Covered structure of remote control receipt module
CN215834520U (en) Paster infrared receiving head
CN207182348U (en) Optical finger print identifies module and electronic installation
CN207367368U (en) Collect infrared emission and be received in integral potted element

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant