KR100538763B1 - Covered structure of remote control receipt module - Google Patents
Covered structure of remote control receipt module Download PDFInfo
- Publication number
- KR100538763B1 KR100538763B1 KR10-2003-0041659A KR20030041659A KR100538763B1 KR 100538763 B1 KR100538763 B1 KR 100538763B1 KR 20030041659 A KR20030041659 A KR 20030041659A KR 100538763 B1 KR100538763 B1 KR 100538763B1
- Authority
- KR
- South Korea
- Prior art keywords
- remote control
- receiving module
- shielding
- control receiving
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Light Receiving Elements (AREA)
Abstract
본 발명은 리모콘 수신모듈의 차폐구조에 관한 것으로, 특히 반도체 프리엠프 I/C 표면을 알루미늄 코팅으로 형성하거나 반도체 프리엠프 I/C의 외부에 몰드 수지로 형성하여 외부환경에서 발생하는 전자파 노이즈 및 불필요한 광노이즈를 차폐하여 수신모듈을 오작동을 방지하며 생산 공정을 단순화하여 생산성을 향상시킬 수 있는 리모콘 수신모듈 및 그 제조방법에 관한 것이다.The present invention relates to a shielding structure of a remote control receiving module, and in particular, the surface of the semiconductor preamplifier I / C is formed of an aluminum coating or formed of a mold resin on the outside of the semiconductor preamplifier I / C. The present invention relates to a remote control receiving module and a method of manufacturing the same, which can improve productivity by shielding optical noise to prevent malfunction of the receiving module and simplifying a production process.
상기의 본 발명은 다수의 접지단자와 리드프레임이 하측으로 연결 형성된 스트립에 접지되는 리모콘 수신모듈의 상측으로 차폐부를 형성하는 리모콘 수신모듈의 차폐구조에 있어서, 상기 차폐부는 반도체 프리엠프 I/C의 상측표면을 알루미늄 코팅으로 차폐부를 형성하거나 프리엠프 I/C의 외부를 전자파 차폐용 몰드수지로 몰딩부에 차폐막을 형성한 것을 특징으로 한다.According to the present invention, in the shielding structure of the remote control receiving module to form a shield on the upper side of the remote control receiving module is grounded to a strip formed by connecting a plurality of ground terminals and the lead frame to the lower side, the shielding portion of the semiconductor preamp I / C The shielding part may be formed on the upper surface by forming a shielding part with an aluminum coating or by molding the outer part of the preamplifier I / C with a molding resin for shielding electromagnetic waves.
Description
본 발명은 리모콘 수신모듈의 차폐구조에 관한 것으로, 특히 리모콘 수신모듈의 구성품중 반도체 프리엠프 I/C를 이중 차폐하거나 표면을 알루미늄 코팅으로 형성하여 외부기기에서 발생하는 전자파 노이즈 및 불필요한 광노이즈를 차폐하여 수신모듈을 오작동을 방지하며 생산공정을 단순화하여 생산성을 향상시킬 수 있는 리모콘 수신모듈 및 그 제조방법에 관한 것이다.The present invention relates to a shielding structure of a remote control receiving module, and particularly, to shield electromagnetic precipitating noise and unnecessary optical noise generated from an external device by double shielding a semiconductor preamplifier I / C or forming an aluminum coating on a surface of a remote control receiving module. The present invention relates to a remote control receiving module and a method of manufacturing the same, which can prevent a malfunction of the receiving module and improve productivity by simplifying a production process.
일반적으로 리모콘을 사용하는 전자기기는 리모콘 송신기에서 송신된 적외선 신호를 세트 본체에 내장된 리모콘 수신모듈이 수신을 하여 전자기기를 작동하여 왔다.In general, an electronic device using a remote controller has operated an electronic device by receiving a remote control receiving module built into the main body of the infrared signal transmitted from the remote control transmitter.
이러한 리모콘의 수신모듈은 전구, 형광등에서 발생하는 전자파 및 적외선 등을 방사하게 되는 기기에 의해 오작동이 되는 것을 방지하기 위하여 전도성의 재질로 이루어진 프라스틱하우징, 판금하우징, 선격자하우징으로 이루어진 적외선 차폐막을 형성하여 사용하여 왔다. The receiving module of the remote control forms an infrared shielding film made of a plastic housing made of a conductive material, a sheet metal housing, and a grid housing in order to prevent malfunctions caused by a device that radiates electromagnetic waves and infrared rays generated from a light bulb or a fluorescent lamp. It has been used.
이러한 전자기파 차폐막은 리모콘의 송신기에서 송신되는 원격신호를 수신해야 되기 때문에 페키지에 렌즈를 둔 개방부를 형성하게 된다. Since the electromagnetic shielding film needs to receive a remote signal transmitted from the transmitter of the remote controller, the electromagnetic wave shielding film forms an opening having a lens on the package.
따라서 전자기파 차폐막의 구성과 위치는 리모콘의 수신감도를 고려해서 설계되어야 하고, 이에 대한 제조공정이 증가되므로 리모콘 수신모듈의 공정과정중에서 큰 비중을 차지하게 된다.Therefore, the configuration and position of the electromagnetic wave shielding membrane should be designed in consideration of the reception sensitivity of the remote controller, and the manufacturing process thereof is increased, and therefore, it takes a large part in the process of the remote controller receiving module.
상기와 같은 리모콘 수신모듈의 전형적인 일예가 도 1 내지 도4에 도시되어 있다.A typical example of such a remote control receiving module is shown in FIGS. 1 to 4.
도 1내지 도4에서 부재번호 T는 캐리어부, V는 차폐부, HL은 반도체 소자, U1, U2는 연결부, E는 종단부, S1, S2는 측면부, VG는 몰딩부, P1 ~ P5는 리드단자, M은 접지단자, F는 윈도우, 1은 접지부, 2는 렌즈부, 3은 측부, 4는 고정부를 각각 가리킨다.1 to 4, reference numeral T denotes a carrier portion, V denotes a shielding portion, HL denotes a semiconductor element, U1 and U2 denote a connecting portion, E denotes a termination portion, S1 and S2 denotes a side portion, VG denotes a molding portion, and P1-P5 denotes a lead. Terminal, M is a ground terminal, F is a window, 1 is a ground part, 2 is a lens part, 3 is a side part, 4 is a fixed part, respectively.
도 1및 도 2에 도시된 바와같이 종래의 리모콘 수신모듈은 국내특허등록 제207856호에 의해 제시된 것으로서 리드프레임의 접지단자(M)에 연장형성되어 모든 구성요소가 에폭시등의 수지물로 몰딩되도록 형성한 것으로서 즉, 연결부(U1, U2)가 절곡되므로서 차폐부가 캐리어부(T)의 상측으로 이동되어 외부의 전자기를 차폐하게 되고, 종단부(E)와 측면부(U1, U2)는 차폐부(V)가 캐리어부(T)의 상측으로 위치되면 다시 절곡되어 패키지의 측면에서 발생되는 전자기를 차폐하며 상기 캐리어부(T)와 차폐부(V)가 패키지 내부에 위치하도록 에폭시 등의 수지를 이용하여 몰딩하게 된다.As shown in FIGS. 1 and 2, the conventional remote control receiving module is provided by Korean Patent Registration No. 207856, and is extended to the ground terminal M of the lead frame so that all components are molded with resin such as epoxy. That is, as the formed portion, that is, the connecting portion (U1, U2) is bent and the shield is moved to the upper side of the carrier portion (T) to shield the external electromagnetic, the terminal portion (E) and the side portions (U1, U2) are shielded portion When (V) is positioned above the carrier portion (T) is bent again to shield the electromagnetic generated from the side of the package and the resin such as epoxy so that the carrier portion (T) and the shielding portion (V) is located inside the package. Molding.
이러한 리모콘 수신모듈은 리모콘 송신모듈에서 전달되는 신호를 패키지의 렌즈에서 집광하게 되고, 상기 집광된 수신신호는 차폐부(V)의 윈도우(F)를 통하여 수신모듈의 수광소자에 전달되므로서 상기 수신모듈이 장착되는 전자기기 등을 원격제어하게 된다.The remote control receiving module collects the signal transmitted from the remote control transmitting module in the lens of the package, and the received receiving signal is transmitted to the light receiving element of the receiving module through the window (F) of the shielding unit (V). Remote control of electronic devices, etc. on which the module is mounted.
또한 도 3 및 도 4에 도시된 바와같이 종래 다른 예의 리모콘 수신모듈은 리드프레임과 분리형성됨을 특징으로 하고 있는 것으로 차폐장치의 상단에는 접지부(1)가 연장형성되고, 그 중앙부에 절곡홈이 형성되어 상기의 차폐장치가 전자기파를 차폐하므로서 발생되는 정전기를 외부로 접지시켜주며, 렌즈부(2)는 일정폭의 양 프레임이 중앙부에 접점을 이루므로서 만곡면으로 돌출형성되어 리모콘 수신모듈의 렌즈가 안착되며, 측부(3)는 차폐장치의 중앙부에서 연장형성되어 리모콘 수신모듈의 측면에 밀착되므로서 측면에 가해지는 전자기파를 차폐하고, 고정부(4)는 측부(3)에서 연장되어 리모콘 수신모듈의 후면에 밀착되어 고정되므로서 차폐장치를 리모콘 수신모듈에 고정시킨다.In addition, as shown in FIGS. 3 and 4, the remote control receiving module according to another example of the present invention is characterized in that the lead frame is separated from the lead frame, and the grounding portion 1 is extended at the upper end of the shielding device, and a bent groove is formed at the center thereof. Formed to ground the static electricity generated by the shielding device to shield the electromagnetic wave to the outside, the lens unit 2 is formed by protruding to the curved surface of the frame of the predetermined width at the center portion of the remote control receiving module The lens is seated, and the side part 3 extends from the center part of the shielding device to be in close contact with the side of the remote control receiving module to shield electromagnetic waves applied to the side part, and the fixing part 4 extends from the side part 3 to remote control. Fix the shield to the remote control receiver module by being fixed close to the rear of the receiver module.
상기의 리모콘 수신모듈은 리드프레임과 차폐장치가 상호 분리되어, 리모콘 수신모듈의 패키지 형성 공정이 완료되면, 먼저 차폐장치에 형성된 렌즈부(2)에 수신모듈의 렌즈를 안착하고, 상단부의 접지부(1)와 측부(3)를 절곡하여 차폐장치를 수신모듈에 밀착시킨 후 상기 측부(3)에 연장형성된 고정부(4)를 측부(3)가 수신모듈의 측면에 밀착절곡하여 다시 고정부(4)를 절곡하여 수신모듈의 후면에 밀착시킨다.When the lead frame and the shielding device are separated from each other, and the package forming process of the remote control receiving module is completed, the remote controller receiving module first seats the lens of the receiving module on the lens part 2 formed on the shielding device, and then grounds the upper part. (1) and the side (3) is bent to close the shielding device to the receiving module, and then the fixing part (4) formed on the side (3) is bent close to the side of the receiving module (3) is fixed again Bend (4) and close it to the back of receiving module.
그러나 종래의 국내특허등록 제207856호의 리모콘 수신모듈은 차폐부가 내측에 형성되어 패키지의 렌즈에서 집광된 수신신호가 모듈의 수광소자에 전달될 수 있는 입사각을 제한하게 되므로 수신효율이 떨어지게 되며 수신효율을 높이기 위하여 차폐부에 수광소자의 넓이보다 크게 윈도우를 형성하게 되면 전자기 차폐효율이 저하되어 오작동이 빈번하게 발생하였으며 차폐부가 패키지 내부에 형성되므로서 몰딩시 액상의 수지가 이동하는 과정중에서 수지의 유동성 저항이 크게 발생되므로 수지의 미충진 불량(VOID)이 발생하게 되는 문제점이 있었다.However, the conventional remote control reception module of Korean Patent No. 207856 has a shielding portion formed therein, thereby limiting an incidence angle at which a received signal collected from a lens of a package can be transmitted to a light receiving element of the module, thereby reducing reception efficiency and improving reception efficiency. If the window is formed larger than the width of the light receiving element to increase the shielding efficiency, electromagnetic shielding efficiency is lowered and malfunction occurs frequently. Since the shield is formed inside the package, the flow resistance of the resin during the process of moving the liquid resin during molding This greatly occurs, there was a problem that the unfilled defect (VOID) of the resin occurs.
또한, 도 3 및 도 4에 도시된 종래 다른 실시예의 리모콘 수신모듈은 리드프레임과 차폐장치가 분리형성된 리모콘 수신모듈은 수신모듈의 패키지 형성공정이 완료된 후 다시, 차폐장치와 리모콘 수신모듈을 결합시키는 공정이 추가하게 되므로서 생산성이 저하되고 제조원가가 상승되는 문제점이 있다.In addition, the remote control receiving module of another conventional embodiment shown in FIGS. 3 and 4 is a remote control receiving module in which the lead frame and the shielding device are formed separately, after the package forming process of the receiving module is completed, the shielding device and the remote control receiving module are combined. As the process is added, there is a problem that the productivity is lowered and the manufacturing cost is increased.
이에 본 발명은 상기와 같은 종래 기술의 문제점을 감안하여 안출한 것으로 별도의 스트립 구조에 차폐부를 형성하거나 차폐장치를 형성하지 않아도 이중 몰딩이나 반도체 프리엠프 I/C 표면에 본딩패드를 제외한 부문에 알루미늄 코팅을 하여 차폐구조를 형성하여 리모콘 수신신호의 수신율을 향상시키고 오작동을 방지하며 생산 공정을 단순화하여 생산성을 향상시킬 수 있는 리모콘 수심모듈의 차폐구조를 제공하는데 그 목적이 있다.Accordingly, the present invention has been made in view of the above-described problems of the prior art, and aluminium is used in a sector except a bonding pad on a double molding or a semiconductor preamplifier I / C surface without forming a shield or a shield in a separate strip structure. The purpose of the present invention is to provide a shielding structure of a remote control depth module that forms a shielding structure by coating to improve reception rate of a remote control reception signal, prevents malfunction, and simplifies the production process to improve productivity.
상기와 같은 목적을 달성하고자 본 발명은 다수의 접지단자와 리드프레임이 하측으로 연결 형성된 스트립의 상측에 접지되는 반도체 소자의 상측으로 차폐부를 형성하는 리모콘 수신모듈의 차폐구조에 있어서, 상기 차폐부는 반도체 소자를 감쌀 수 있도록 수지로된 1차 몰딩부를 형성하고 상기 1차 몰딩부의 외측면으로 2차 차폐막을 형성하거나 또는 반도체 소자의 상측면을 알루미늄 코팅으로 형성한 것을 특징으로 하는 리모콘 수신모듈의 차폐구조를 제공한다.In order to achieve the above object, the present invention provides a shield structure of a remote control receiving module that forms a shield on an upper side of a semiconductor device which is grounded on an upper side of a strip in which a plurality of ground terminals and a lead frame are connected to the lower side, wherein the shield is a semiconductor. Shielding structure of the remote control receiving module, characterized in that the primary molding part made of resin so as to wrap the device and the secondary shielding film is formed on the outer surface of the primary molding part or the upper side of the semiconductor device is formed of aluminum coating. To provide.
이하 상기한 바와 같은 본 발명의 바람직한 실시예를 첨부도면을 참고하여 상세히 설명하면 다음과 같다.Hereinafter, a preferred embodiment of the present invention as described above with reference to the accompanying drawings in detail as follows.
첨부된 도 5는 본 발명에 따른 리모콘 수신모듈의 차폐구조를 나타낸 단면도이고 도 6은 본 발명에 따른 리모콘 수신모듈의 차폐구조의 다른 예를 나타낸 단면도이다.5 is a cross-sectional view showing a shielding structure of the remote control receiving module according to the present invention, and FIG. 6 is a cross-sectional view showing another example of the shielding structure of the remote control receiving module according to the present invention.
이에 도시된 바와같이 본 발명의 리모콘 수신모듈의 차폐구조는 다수의 접지단자(10)와 리드프레임(11)이 하측으로 연결 형성된 스트립(12)의 상측에 접지되는 반도체 프리엠프 I/C(13)의 상측으로 차폐부(14)를 형성하는 리모콘 수신모듈의 차폐구조에 있어서, 상기 차폐부(14)는 반도체 소자(13)를 감쌀 수 있도록 수지로된 엑폭시 수지로 형성되는 1차 몰딩부(20)를 형성하고 상기 1차 몰딩부(20)의 외측면으로 차폐용 페인트를 도포하여 서로 다른 물질에 의해 입사되는 광선의 굴절율이 틀리고 전자파 및 광노이즈 등을 반사하도록 2차 차폐막(30)을 형성한다.As shown therein, the shielding structure of the remote control receiving module of the present invention is a semiconductor preamplifier I / C 13 which is grounded on the upper side of the strip 12 in which the plurality of ground terminals 10 and the lead frame 11 are connected to the lower side. In the shielding structure of the remote control receiving module to form the shielding portion 14 on the upper side of), the shielding portion 14 is the primary molding portion formed of epoxy resin made of resin so as to surround the semiconductor element 13 A secondary shielding film 30 is formed so that the shielding paint is applied to the outer surface of the primary molding part 20 so that the refractive index of light incident by different materials is different and reflects electromagnetic waves and optical noise. To form.
또한 도 6에 도시된 바와같이 상기 반도체 소자(13)의 상측면에 알루미늄으로 코팅면(40)을 형성하여 상기 코팅된 알루미늄에 의해 전자파나 적외선이 반사되도록 하여도 바람직하다.In addition, as illustrated in FIG. 6, the coating surface 40 may be formed of aluminum on the upper surface of the semiconductor device 13 so that electromagnetic waves or infrared rays may be reflected by the coated aluminum.
이상에서와 같이 본 발명은 스트립 구조에 차폐부를 형성하거나 차폐장치를 형성하지 않아도 이중 몰딩이나 알류미늄 코팅으로 반도체 소자에 차폐구조를 형성하여 리모콘 수신신호의 수신율을 향상시키고 오작동을 방지하여 제품의 신뢰감 및 효율성을 높일 수 있다.As described above, in the present invention, the shielding structure is formed on the semiconductor device by double molding or aluminum coating without forming the shielding part or the shielding device, thereby improving the reception rate of the remote control signal and preventing malfunction, thereby improving the reliability of the product and It can increase efficiency.
이상에서는 본 발명을 특정의 바람직한 실시예를 예를들어 도시하고 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며 본 발명의 정신을 벗어나지 않는 범위내에서 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 다양한 변경과 수정이 가능할 것이다.In the above, the present invention has been illustrated and described with reference to specific preferred embodiments, but the present invention is not limited to the above-described embodiments and is not limited to the spirit of the present invention. Various changes and modifications will be possible by those who have the same.
도 1은 종래 리모콘 수신모듈의 스트립 구조를 나타낸 평면도,1 is a plan view showing a strip structure of a conventional remote control receiving module;
도 2는 종래 리모콘 수신모듈을 나타낸 단면도,2 is a cross-sectional view showing a conventional remote control receiving module;
도 3은 종래 리모콘 수신모듈의 차폐구조의 다른 예를 나타낸 전개도,3 is an exploded view showing another example of a shielding structure of a conventional remote control receiving module;
도 4는 종래 리모콘 수신모듈의 차폐구조의 다른 예를 나타낸 평면도,4 is a plan view showing another example of a shielding structure of a conventional remote control receiving module;
도 5는 본 발명에 따른 리모콘 수신모듈의 차폐구조를 나타낸 단면도,5 is a cross-sectional view showing a shielding structure of a remote control receiving module according to the present invention;
도 6은 본 발명에 따른 리모콘 수신모듈의 차폐구조의 다른 예를 나타낸 단면도이다. 6 is a cross-sectional view showing another example of the shielding structure of the remote control receiving module according to the present invention.
< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>
10 : 접지단자 11 : 리드프레임10: ground terminal 11: lead frame
12 : 스트립 13 : 반도체 프리엠프 I/C12: strip 13: semiconductor preamplifier I / C
14 : 1차 차폐부 20 : 몰딩부14: primary shield 20: molding
30 : 2차 차폐막 40 : 알루미늄 코팅면30: secondary shielding film 40: aluminum coating surface
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0041659A KR100538763B1 (en) | 2003-06-25 | 2003-06-25 | Covered structure of remote control receipt module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0041659A KR100538763B1 (en) | 2003-06-25 | 2003-06-25 | Covered structure of remote control receipt module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050001485A KR20050001485A (en) | 2005-01-07 |
| KR100538763B1 true KR100538763B1 (en) | 2005-12-23 |
Family
ID=37217138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-0041659A KR100538763B1 (en) | 2003-06-25 | 2003-06-25 | Covered structure of remote control receipt module |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100538763B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200454520Y1 (en) | 2010-03-18 | 2011-07-08 | 광전자 주식회사 | Remote control receiver module with inner shield |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100737098B1 (en) * | 2006-03-16 | 2007-07-06 | 엘지이노텍 주식회사 | Shield device of electromagnetic inteference and production progress thereof |
| KR100691629B1 (en) * | 2006-04-21 | 2007-03-12 | 삼성전기주식회사 | High frequency module using metal-wall and method of manufacturing the same |
| KR100844791B1 (en) * | 2006-11-29 | 2008-07-07 | 엘지이노텍 주식회사 | Electromagnetic wave shielding apparatus, high-frequency module with thereof and manufacturing method thereof |
-
2003
- 2003-06-25 KR KR10-2003-0041659A patent/KR100538763B1/en active IP Right Grant
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200454520Y1 (en) | 2010-03-18 | 2011-07-08 | 광전자 주식회사 | Remote control receiver module with inner shield |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20050001485A (en) | 2005-01-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4335851B2 (en) | Gas sensor module for spectroscopically measuring gas concentration | |
| US9671490B2 (en) | Reduced stray radiation optoelectronic device | |
| US4792685A (en) | Photoelectric sensor | |
| US7348551B2 (en) | Remote-control light receiving unit and electronic apparatus using the same | |
| US20110057104A1 (en) | Miniaturized Optical Proximity Sensor | |
| JP4542042B2 (en) | Receiver module | |
| JPH08330608A (en) | Light reception sensor and light reception optical sensor | |
| JP3637809B2 (en) | Infrared data communication module | |
| KR20050013505A (en) | Semiconductor modules | |
| CN110648980A (en) | Chip packaging structure and camera device | |
| KR100538763B1 (en) | Covered structure of remote control receipt module | |
| KR100735380B1 (en) | A Camera Module | |
| US20070194339A1 (en) | Optical data communication module | |
| KR100432212B1 (en) | A remocon reception modul and manufacutring method | |
| KR200326827Y1 (en) | Stripped structure of remote control receipt module | |
| JP3807430B2 (en) | Infrared data communication module manufacturing method | |
| US6807326B2 (en) | Optical module for suppressing optical and electrical crosstalk simultaneously | |
| JPH0984162A (en) | Remote control light receiving unit | |
| KR100801010B1 (en) | Remote controller receive module and manufacturing method thereof | |
| KR100608107B1 (en) | A receiving module for remote control signal of infrared rays | |
| KR102554474B1 (en) | Blood hear sensor | |
| KR20050005099A (en) | Remote control receipt module | |
| KR101080170B1 (en) | Infrared receiver module shielding case | |
| CN221150032U (en) | Sensing package and electronic device | |
| CN115513304A (en) | Photosensitive module and packaging method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20121210 Year of fee payment: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20131120 Year of fee payment: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20141128 Year of fee payment: 10 |
|
| FPAY | Annual fee payment |
Payment date: 20181120 Year of fee payment: 14 |