CN208077102U - A kind of overclocking EMS memory radiation structure and memory device - Google Patents
A kind of overclocking EMS memory radiation structure and memory device Download PDFInfo
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- CN208077102U CN208077102U CN201820390411.XU CN201820390411U CN208077102U CN 208077102 U CN208077102 U CN 208077102U CN 201820390411 U CN201820390411 U CN 201820390411U CN 208077102 U CN208077102 U CN 208077102U
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- heat dissipation
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- memory
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Abstract
The utility model discloses a kind of overclocking EMS memory radiation structure and memory devices, a kind of overclocking EMS memory radiation structure, it is characterized by comprising heat dissipation upper casings and heat dissipation lower casing, heat dissipation upper casing and heat dissipation lower casing are stuck by the buckle of two sides, centre is formed and the matched cavity of memory bar, memory bar setting is between heat dissipation upper casing and heat dissipation lower casing, and cavity is stretched out in the golden finger connectivity port of memory bar, and memory bar two sides is all connected by heat-conducting glue with heat dissipation upper casing and heat dissipation lower casing；Heat dissipation upper casing and heat dissipation lower casing are designed with comb shape fluting in the offside of the golden finger of memory bar.It sticks up using heat conductive pad band double faced adhesive tape between memory particle surface and heat-dissipating casing.In the ventilation opening of the top design discontinuous of heat-dissipating casing, the ambient air of particle is set to flow accessible, in the channel of the frontal design discontinuous of radiation shell, air can pass through each heat-dissipating casing from these channels, take away the heat for gathering case surface.
Description
Technical field
The utility model is related to memory device, more particularly to a kind of overclocking EMS memory radiation structure and memory device.
Background technology
Memory is component most commonly seen in electronic product, and performance is the central factor of decision systems performance, therefore all
Achieve the purpose that improving performance by constantly making great efforts to promote its working frequency.With the promotion of working frequency, work
Heat dissipation problem is also especially prominent, limits the promotion of its frequency to a certain extent.Especially under overclocking operating mode, design
The radiator structure of excellent heat dispersion performance is particularly important.Existing memory part has the heat dissipation knot that part has had setting special
Structure, general way are exactly transmitted to by double faced adhesive tape or foam rubber on heat-dissipating casing on memory chip surface, or simple
The structure size of increasing radiator structure improve heat dissipation effect, thus necessarily increase the structure size of memory part, such as
The too small heat dissipation effect of fruit is undesirable.
Utility model content
How technical problem to be solved in the utility model is in the preferable heat dissipation effect of small scale structures realization.
In order to solve the above-mentioned technical problem, the utility model devises a kind of overclocking EMS memory radiation structure, it is characterised in that
Including heat dissipation upper casing and heat dissipation lower casing, heat dissipation upper casing and heat dissipation lower casing be stuck by the buckle of two sides, centre formed with
The matched cavity of memory bar, between heat dissipation upper casing and heat dissipation lower casing, the golden finger connectivity port of memory bar is stretched for memory bar setting
Go out cavity, memory bar two sides is all connected by heat-conducting glue with heat dissipation upper casing and heat dissipation lower casing；Heat dissipation upper casing and heat dissipation lower casing exist
The offside of the golden finger of memory bar is designed with comb shape fluting.
The overclocking EMS memory radiation structure, it is characterised in that heat dissipation upper casing and heat dissipation lower casing are all including heat-conducting part and heat dissipation
Sliver, heat-conducting part are integrated heat-conducting planar, and the storage chip on memory bar is completely covered；Heat dissipation upper casing is dissipated with the lower casing that radiates
The aperture position of hot sliver is identical, and after heat dissipation upper casing is stuck with heat dissipation lower casing, the opening between the sliver that radiates forms scattered
The passage of heat.
A kind of memory device, including memory bar and overclocking EMS memory radiation structure, it is characterised in that overclocking EMS memory radiation structure
Including heat dissipation upper casing and heat dissipation lower casing, heat dissipation upper casing and heat dissipation lower casing be stuck by the buckle of two sides, centre formed with
The matched cavity of memory bar, between heat dissipation upper casing and heat dissipation lower casing, the golden finger connectivity port of memory bar is stretched for memory bar setting
Go out cavity, memory bar two sides is all connected by heat-conducting glue with heat dissipation upper casing and heat dissipation lower casing；Heat dissipation upper casing and heat dissipation lower casing exist
The offside of the golden finger of memory bar is designed with comb shape fluting.
The memory device, it is characterised in that heat dissipation upper casing and heat dissipation lower casing are led all including heat-conducting part and heat dissipation sliver
Hot portion is integrated heat-conducting planar, and the storage chip on memory bar is completely covered；The heat dissipation sliver of heat dissipation upper casing and the lower casing that radiates
Aperture position it is identical, heat dissipation upper casing and heat dissipation lower casing be stuck after, heat dissipation sliver between opening form heat dissipation channel.
Implement the utility model to have the advantages that：In memory grain (storage chip) between surface and heat-dissipating casing
It sticks up using heat conductive pad band double faced adhesive tape.In the ventilation opening of the top design discontinuous of heat-dissipating casing, make the ambient air of particle
Flow it is accessible, while consider when platform fan work, air quantity can pass through each root memory radiation shell, radiating
The channel of the frontal design discontinuous of shell, air can pass through each heat-dissipating casing from these channels, take away and gather shell
The heat on surface.High as possible at the top of radiation shell, higher heat dissipation area is bigger.
Description of the drawings
Fig. 1 is overclocking EMS memory radiation structure decomposition diagram；
Fig. 2 is overall schematic after memory bar installation overclocking EMS memory radiation structure；
Fig. 3 is heat dissipation 1 schematic diagram of upper casing；
Fig. 4 is heat dissipation 1 schematic diagram of lower casing.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
The every other embodiment obtained, shall fall within the protection scope of the present invention.
Fig. 1 is overclocking EMS memory radiation structure decomposition diagram；Fig. 2 is entirety after memory bar installation overclocking EMS memory radiation structure
Schematic diagram；Fig. 3 is heat dissipation 1 schematic diagram of upper casing；Fig. 4 is heat dissipation 1 schematic diagram of lower casing.Overclocking EMS memory radiation structure includes heat dissipation upper casing
1 is stuck with heat dissipation lower casing 5, heat dissipation upper casing 1 and heat dissipation lower casing 5 by the buckle 6 of two sides, and buckling 6 can be by dissipating
Setting connection convex block 81 and setting and the composition of link slot 82 for connecting convex block 81 on heat dissipation upper casing 5 on hot upper casing 1；Centre is formed
With 3 matched cavity of memory bar, the setting of memory bar 3 is between heat dissipation upper casing and heat dissipation lower casing, the golden finger connecting pin of memory bar
Mouth stretches out cavity, and memory bar two sides is all connected by heat-conducting glue 2,4 with heat dissipation upper casing and heat dissipation lower casing；Heat dissipation upper casing and heat dissipation
Lower casing is designed with comb shape fluting 7 in the offside of the golden finger of memory bar.Heat dissipation upper casing 1 and heat dissipation lower casing 5 all include heat-conducting part
With heat dissipation sliver, heat-conducting part is integrated heat-conducting planar, the storage chip on memory bar is completely covered；It radiates under upper casing and heat dissipation
The aperture position of the heat dissipation sliver of shell is identical, after heat dissipation upper casing is stuck with heat dissipation lower casing, the opening between the sliver that radiates
Form heat dissipation channel.The top of the heat dissipation sliver of heat dissipation upper casing and the lower casing that radiates is bent in opposite directions.
By loading onto heat-dissipating casing in memory both sides, by the design to heat-dissipating casing moulding, dissipated by what shell had
The heat that memory work generates is transmitted on shell by hot area and heat conductive pad, while being transported using the system fan inside type
Turn, the heat that will accumulate in heat-dissipating casing surface is taken away by air flowing, to achieve the purpose that cool down to memory.
During test, by temp probe actual measurement it is no dress heat-dissipating casing when memory grain surface temperature with
Memory grain surface temperature when having filled heat-dissipating casing compares, hence it is evident that has filled after heat-dissipating casing memory particle surface at work
Temperature be substantially reduced, it was demonstrated that heat-dissipating casing plays the role of cooling.
It is measured after memory has filled heat-dissipating casing by temp probe, in the temperature of particle surface and heat-dissipating casing surface
Comparison, internal-external temperature difference difference prove that the heat sink conception of this patent is effectively reliable within 1 DEG C, and internal-external temperature difference compares smaller card
The thermal resistance of bright heat sink conception is small, and heat can be efficiently transmitted on shell.
Above disclosed is only a kind of the utility model embodiment, cannot limit the utility model with this certainly
Interest field, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and according to this reality
The equivalent variations made by novel claim, still fall within the scope of the utility model.
Claims (4)
1. a kind of overclocking EMS memory radiation structure, it is characterised in that including heat dissipation upper casing and heat dissipation lower casing, radiate under upper casing and heat dissipation
Shell is stuck by the buckle of two sides, centre formed with the matched cavity of memory bar, memory bar setting heat dissipation upper casing and
It radiates between lower casing, cavity, memory bar two sides and heat dissipation upper casing and heat dissipation lower casing are stretched out all in the golden finger connectivity port of memory bar
It is connected by heat-conducting glue；Heat dissipation upper casing and heat dissipation lower casing are designed with comb shape fluting in the offside of the golden finger of memory bar.
2. overclocking EMS memory radiation structure according to claim 1, it is characterised in that heat dissipation upper casing and heat dissipation lower casing all include
Heat-conducting part and heat dissipation sliver, heat-conducting part are integrated heat-conducting planar, the storage chip on memory bar are completely covered；Radiate upper casing and
The aperture position of the heat dissipation sliver of heat dissipation lower casing is identical, after heat dissipation upper casing is stuck with heat dissipation lower casing, between heat dissipation sliver
Opening form heat dissipation channel.
3. a kind of memory device, including memory bar and overclocking EMS memory radiation structure, it is characterised in that overclocking EMS memory radiation structure packet
Include heat dissipation upper casing and heat dissipation lower casing, heat dissipation upper casing and heat dissipation lower casing be stuck by the buckle of two sides, centre formed with it is interior
The matched cavity of item is deposited, between heat dissipation upper casing and heat dissipation lower casing, the golden finger connectivity port of memory bar is stretched out for memory bar setting
Cavity, memory bar two sides are all connected by heat-conducting glue with heat dissipation upper casing and heat dissipation lower casing；Including heat dissipation upper casing and heat dissipation lower casing
The offside for depositing the golden finger of item is designed with comb shape fluting.
4. memory device according to claim 3, it is characterised in that heat dissipation upper casing and heat dissipation lower casing all include heat-conducting part and
Radiate sliver, and heat-conducting part is integrated heat-conducting planar, the storage chip on memory bar is completely covered；Radiate upper casing and heat dissipation lower casing
Heat dissipation sliver aperture position it is identical, heat dissipation upper casing and heat dissipation lower casing be stuck after, heat dissipation sliver between opening shape
At heat dissipation channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820390411.XU CN208077102U (en) | 2018-03-22 | 2018-03-22 | A kind of overclocking EMS memory radiation structure and memory device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820390411.XU CN208077102U (en) | 2018-03-22 | 2018-03-22 | A kind of overclocking EMS memory radiation structure and memory device |
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| Publication Number | Publication Date |
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| CN208077102U true CN208077102U (en) | 2018-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820390411.XU Active CN208077102U (en) | 2018-03-22 | 2018-03-22 | A kind of overclocking EMS memory radiation structure and memory device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109768017A (en) * | 2019-01-21 | 2019-05-17 | 东莞记忆存储科技有限公司 | A kind of memory card radiator structure and its processing technology |
-
2018
- 2018-03-22 CN CN201820390411.XU patent/CN208077102U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109768017A (en) * | 2019-01-21 | 2019-05-17 | 东莞记忆存储科技有限公司 | A kind of memory card radiator structure and its processing technology |
| CN109768017B (en) * | 2019-01-21 | 2020-04-21 | 东莞记忆存储科技有限公司 | Memory card heat dissipation structure and processing method thereof |
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