CN208074639U - LED luminous lamp strips made of luminescence chip directly encapsulates - Google Patents
LED luminous lamp strips made of luminescence chip directly encapsulates Download PDFInfo
- Publication number
- CN208074639U CN208074639U CN201820195284.8U CN201820195284U CN208074639U CN 208074639 U CN208074639 U CN 208074639U CN 201820195284 U CN201820195284 U CN 201820195284U CN 208074639 U CN208074639 U CN 208074639U
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- CN
- China
- Prior art keywords
- circuit board
- luminescence chip
- pcb circuit
- insulating lacquer
- lacquer layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
LED luminous lamp strips made of directly being encapsulated the utility model is related to a kind of luminescence chip, including multiple luminescence chips, PCB circuit board and multiple driving IC integrated packages, luminescence chip is directly welded at by conducting wire in PCB circuit board, luminescence chip is equidistantly arranged in front, reverse side or the side of PCB circuit board, driving IC integrated packages be fixed on PCB circuit board front or side and with luminescence chip correspond, PCB circuit board surface be equipped with coat；Coat includes the first insulating lacquer layer, the second insulating lacquer layer, high temperature resistant protection film layer and waterproof coating, and PCB circuit board surface coats the first insulating lacquer layer, the second insulating lacquer layer, high temperature resistant protection film layer and waterproof coating successively.The lamp bar illumination effect is good, clarity is high, and lamp bar is simple in structure, light-weight, and the various moulding of variation can be customized as unit of lamp bar.
Description
Technical field
The utility model belongs to LED field, and in particular to LED luminous lamp strips made of a kind of luminescence chip directly encapsulates.
Background technology
LED is English light emitting diode（Light emitting diode）Abbreviation, its basic structure is one block of electricity
The semi-conducting material of photoluminescence is placed on a leaded shelf, and then surrounding is sealed with epoxy resin, and it is internal to play protection
The effect of core wire.The feature that LED is high with luminous efficiency, service life is long, safe and reliable, environmentally protective is in widespread attention, most
Closely these years, country greatly develops City complex, both beautiful big to concentrate the functions such as entertainment, shopping, tourism, business
Gas, and one-stop service can be provided.City complex is high to the requirement beautified to appearance, while a large amount of of glass curtain wall draw
With proposing new requirement to building body daylighting, there are mainly two types of traditional displays：1-LED display screens, 2- city lightings are all
Assembled by LED light, existing LED light is still defective, needs to improve.
Utility model content
The purpose of this utility model is to provide LED luminous lamp strips made of a kind of directly encapsulation of luminescence chip, lamp bar hair
Light effect is good, clarity is high, and lamp bar is simple in structure, light-weight, and the various moulding of variation can be customized as unit of lamp bar.
Technical solution used by the utility model is：LED luminous lamp strips made of a kind of luminescence chip directly encapsulates, packet
Include multiple luminescence chips, PCB circuit board and multiple driving IC integrated packages, the pin feet of the PCB circuit board and luminescence chip
Pin feet are identical, and PCB circuit board is in a strip shape, and luminescence chip is directly welded at by conducting wire in PCB circuit board, between luminescence chip etc.
Away from front, reverse side or the side for being arranged in PCB circuit board, driving IC integrated packages be fixed on PCB circuit board front or side simultaneously
It is corresponded with luminescence chip, PCB circuit board surface is equipped with coat；
The coat includes the first insulating lacquer layer, the second insulating lacquer layer, high temperature resistant protection film layer and waterproof coating, described
PCB circuit board surface coats the first insulating lacquer layer, the second insulating lacquer layer is coated on first insulating lacquer layer, described second
High temperature resistant protection film layer is coated on insulating lacquer layer, and waterproof coating, the luminescence chip and driving are coated in high temperature resistant protection film layer
IC integrated packages are between high temperature resistant protection film layer and waterproof coating；The luminescence chip passes through high temperature resistant protective film by conducting wire
Layer, the second insulating lacquer layer and the first insulating lacquer layer are welded in PCB circuit board.
Preferably, in LED luminous lamp strips made of the luminescence chip directly encapsulates, the luminescence chip is monochromatic sends out
Optical chip or multicolor luminous chip portfolio.
Preferably, in LED luminous lamp strips made of the luminescence chip directly encapsulates, the luminescence chip is located at PCB
In the surface of circuit board or embedded PCB circuit board.
Preferably, in LED luminous lamp strips made of the luminescence chip directly encapsulates, the driving IC integrated packages are located at
In the surface of PCB circuit board or embedded PCB circuit board.
Preferably, in LED luminous lamp strips made of the luminescence chip directly encapsulates, the high temperature resistant protection film layer is
Perfluoroethylene-propylene or polytetrafluoroethylene film layer.
Preferably, in LED luminous lamp strips made of the luminescence chip directly encapsulates, first insulating lacquer layer and
The overall thickness of two insulating lacquer layers is not less than 0.4 MM；
The thickness of the high temperature resistant protection film layer is in 0.2-0.5MM.
Preferably, further include waterproof connector in LED luminous lamp strips made of the luminescence chip directly encapsulates, it is described
Waterproof connector includes bottom case, middle shell, upper casing, the first rubber sleeve, the second rubber sleeve and rubber stopper, is symmetrically offered on the bottom case
Two rubber sleeve mounting grooves, two rubber sleeve mounting grooves are interconnected, and first rubber sleeve and the second rubber sleeve insert respectively
In rubber sleeve mounting groove, empty slot is provided at the top of the bottom case, the middle shell is mounted at the top of bottom case, and the middle shell bottom is equipped with
Protrusion is inserted into the empty slot at the top of bottom case, and rubber stopper mounting groove is provided on the middle shell, and the rubber stopper is inserted into rubber stopper
In mounting groove, the upper clamshell sets that there are two the lamp bars for connecting both ends to connect above bottom case and middle shell in the bottom case
Contact pin.
The utility model has the beneficial effects that：
1. luminescence chip connects on being directly welded on PCB by conducting wire without holder, without being packaged, send out
Light effect is good, clarity is high, and lamp bar is simple in structure, light-weight, and the various moulding of variation can be customized as unit of lamp bar.
2. being designed according to specific light color, monochromatic or polychromatic combination luminescence chip is designed on demand.
3. luminescence chip is located at PCB circuit board surface, it is fixed conveniently, luminescence chip is embedded in PCB circuit board, is saved empty
Between, it is fixed reliable.
4. driving IC integrated packages are located at PCB circuit board surface, it is fixed conveniently, in driving IC integrated packages insertion PCB circuit board,
Space is saved, it is fixed reliable.
Description of the drawings
Fig. 1 is the schematic diagram on the positive/negative face surface that luminescence chip is located at PCB circuit board in the utility model embodiment；
Fig. 2 is the schematic diagram for the side surface that luminescence chip is located at PCB circuit board in the utility model embodiment；
Fig. 3 is the schematic diagram in the positive/negative face of luminescence chip insertion PCB circuit board in the utility model embodiment；
Fig. 4 is the signal on the positive/negative face surface that driving IC integrated packages are located at PCB circuit board in the utility model embodiment
Figure；
Fig. 5 is the schematic diagram in the positive/negative face that IC integrated packages insertion PCB circuit board is driven in the utility model embodiment；
In figure：1- luminescence chips；2-PCB circuit boards；3- drives IC integrated packages.
Specific implementation mode
For the ease of understanding the utility model, in the following with reference to the drawings and specific embodiments, the utility model is carried out more detailed
Thin explanation.The preferred embodiment of the utility model is given in attached drawing.But the utility model can be with many different
Form is realized, however it is not limited to this specification described embodiment.Make to this on the contrary, purpose of providing these embodiments is
The understanding of the disclosure of utility model is more thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term used in this specification " one-to-one correspondence ", " welding ",
" coating " and similar statement are for illustrative purposes only.
Unless otherwise defined, technical and scientific term all used in this specification and the skill for belonging to the utility model
The normally understood meaning of technical staff in art field is identical.Art used in the description of the utility model in this specification
Language, which is only for the purpose of describing specific embodiments, is not intended to limitation the utility model.
LED luminous lamp strips made of the luminescence chip 1 directly encapsulates, including luminescence chip 1, PCB circuit board 2 and driving IC
The pin feet of integrated package 3, PCB circuit board 2 are identical as the pin feet of luminescence chip 1, and as shown in Figures 1 to 5, PCB circuit board 2 is in item
Shape, luminescence chip 1 are directly welded at by conducting wire in PCB circuit board 2, and as shown in Figure 1 to Figure 3, luminescence chip 1 is equidistantly arranged
In the front of PCB circuit board 2, reverse side or side（The size of luminescence chip 1 is using MIL as unit, that is, 0.0254 millimeter of work
It is for unit, different according to the brightness needed, to select various sizes of luminescence chip 1, to form different pixels, thus come
Design spacing）, as shown in Fig. 4 Fig. 5, driving IC integrated packages 3 be fixed on PCB circuit board 2 front or side and with luminous core
Piece 1 corresponds, and 2 surface of PCB circuit board is equipped with transparent coat, and luminescence chip 1 and driving IC integrated packages 3 are located at coat
It is interior.Luminescence chip 1 connects on being directly welded on PCB by conducting wire without holder, without being packaged, illumination effect
Good, clarity height, lamp bar is simple in structure, light-weight, and the various moulding of variation can be customized as unit of lamp bar.
In the present invention, luminescence chip 1 is that monochromatic luminescence chip 1 or multicolor luminous chip 1 combine.According to specific
Light color designs, and monochromatic or polychromatic combination luminescence chip 1 is designed on demand.
As shown in Figure 1 to Figure 3, luminescence chip 1 is located in the surface or embedded PCB circuit board 2 of PCB circuit board 2.It shines
Chip 1 is located at 2 surface of PCB circuit board, is fixed conveniently, and luminescence chip 1 is embedded in PCB circuit board 2, saves space, fixed reliable.
As shown in Figure 4 and Figure 5, driving IC integrated packages 3 are located in the surface or embedded PCB circuit board 2 of PCB circuit board 2.
Driving IC integrated packages 3 are located at 2 surface of PCB circuit board, are fixed conveniently, and driving IC integrated packages 3 are embedded in PCB circuit board 2, save empty
Between, it is fixed reliable.
LED luminous lamp strips made of the luminescence chip directly encapsulates, including multiple luminescence chips, PCB circuit board and multiple
IC integrated packages are driven, the pin feet of the PCB circuit board are identical as the pin feet of luminescence chip, and PCB circuit board is in a strip shape, and shine core
Piece is directly welded at by conducting wire in PCB circuit board, and luminescence chip is equidistantly arranged in front, reverse side or the side of PCB circuit board
Face, driving IC integrated packages be fixed on PCB circuit board front or side and with luminescence chip correspond, PCB circuit board surface
Equipped with coat；
The coat includes the first insulating lacquer layer, the second insulating lacquer layer, high temperature resistant protection film layer and waterproof coating, described
PCB circuit board surface coats the first insulating lacquer layer, the second insulating lacquer layer is coated on first insulating lacquer layer, described second
High temperature resistant protection film layer is coated on insulating lacquer layer, and waterproof coating, the luminescence chip and driving are coated in high temperature resistant protection film layer
IC integrated packages are between high temperature resistant protection film layer and waterproof coating；The luminescence chip passes through high temperature resistant protective film by conducting wire
Layer, the second insulating lacquer layer and the first insulating lacquer layer are welded in PCB circuit board.
Preferably, the luminescence chip is monochromatic luminescence chip or multicolor luminous chip portfolio.Preferably, the luminous core
Piece is located in the surface or embedded PCB circuit board of PCB circuit board.Preferably, the driving IC integrated packages are located at PCB circuit board
Surface or embedded PCB circuit board in.
Preferably, the high temperature resistant protection film layer is perfluoroethylene-propylene or polytetrafluoroethylene film layer.Further, institute
The overall thickness for stating the first insulating lacquer layer and the second insulating lacquer layer is not less than 0.4 MM；The thickness of the high temperature resistant protection film layer exists
0.2-0.5MM。
Preferably, LED luminous lamp strips made of the luminescence chip directly encapsulation further include waterproof connector, the waterproof
Connector includes bottom case, middle shell, upper casing, the first rubber sleeve, the second rubber sleeve and rubber stopper, symmetrically opened up on the bottom case there are two
Rubber sleeve mounting groove, two rubber sleeve mounting grooves are interconnected, and first rubber sleeve and the second rubber sleeve are inserted into rubber respectively
In gum cover mounting groove, empty slot is provided at the top of the bottom case, the middle shell is mounted at the top of bottom case, and the middle shell bottom is equipped with convex
It rises, is inserted into the empty slot at the top of bottom case, rubber stopper mounting groove is provided on the middle shell, the rubber stopper is inserted into rubber stopper peace
In tankage, the upper clamshell sets that there are two the lamp bar connections for connecting both ends above bottom case and middle shell in the bottom case
Piece.The connector size at lamp bar both ends matches with the first rubber sleeve and the second rubber sleeve internal cavities size, can reach waterproof
Effect.Simple in structure, realization facilitates the connection, it can be achieved that multistage lamp bar unit, and the item of its mechanical strength connected in satisfaction
Under part, reach the requirement of waterproof.
Preferably, LED luminous lamp strips made of the luminescence chip directly encapsulation further include brightness regulating apparatus, described
Brightness regulating apparatus includes environmental light brightness detection unit and environmental light brightness signal conversion unit, environmental light brightness detection unit
It detects extraneous environmental light brightness and is converted into the output of environmental light brightness sampled signal；Environmental light brightness signal conversion unit
The environmental light brightness sampled signal is received to be converted into brightness Regulate signal and be delivered to driving IC integrated packages；Drive IC integrated
Block receives the brightness that the brightness Regulate signal adjusts LED luminescence chips.Preferably, the environmental light brightness detection unit packet
The photo resistance of multiple detection external environment brightness is included, the surrounding in lamp bar is set up in multiple photo resistance separately.
It should be understood that for those of ordinary skills, it can be modified or changed according to the above description,
And all these modifications and variations should all belong to the protection domain of the appended claims for the utility model.
Claims (7)
- LED luminous lamp strips made of 1. a kind of luminescence chip directly encapsulates, it is characterised in that：Including multiple luminescence chips, PCB electricity Road plate and multiple driving IC integrated packages, the pin feet of the PCB circuit board are identical as the pin feet of luminescence chip, and PCB circuit board is in Strip, luminescence chip are directly welded at by conducting wire in PCB circuit board, and luminescence chip is equidistantly being arranged in PCB circuit board just Face, reverse side or side, driving IC integrated packages be fixed on PCB circuit board front or side and with luminescence chip correspond, PCB Circuit board surface is equipped with coat；The coat includes the first insulating lacquer layer, the second insulating lacquer layer, high temperature resistant protection film layer and waterproof coating, the PCB Circuit board surface coats the first insulating lacquer layer, and the second insulating lacquer layer is coated on first insulating lacquer layer, absolutely described second High temperature resistant protection film layer is coated on edge enamelled coating, and waterproof coating, the luminescence chip and driving IC are coated in high temperature resistant protection film layer Integrated package is between high temperature resistant protection film layer and waterproof coating；The luminescence chip passes through high temperature resistant protective film by conducting wire Layer, the second insulating lacquer layer and the first insulating lacquer layer are welded in PCB circuit board.
- LED luminous lamp strips made of 2. luminescence chip according to claim 1 directly encapsulates, it is characterised in that：The hair Optical chip is monochromatic luminescence chip or multicolor luminous chip portfolio.
- LED luminous lamp strips made of 3. luminescence chip according to claim 1 directly encapsulates, it is characterised in that：The hair Optical chip is located in the surface or embedded PCB circuit board of PCB circuit board.
- LED luminous lamp strips made of 4. luminescence chip according to claim 1 directly encapsulates, it is characterised in that：The drive Dynamic IC integrated packages are located in the surface or embedded PCB circuit board of PCB circuit board.
- LED luminous lamp strips made of 5. luminescence chip according to claim 1 directly encapsulates, it is characterised in that：It is described resistance to High temperature protection film layer is perfluoroethylene-propylene or polytetrafluoroethylene film layer.
- LED luminous lamp strips made of 6. luminescence chip according to claim 5 directly encapsulates, it is characterised in that：Described The overall thickness of one insulating lacquer layer and the second insulating lacquer layer is not less than 0.4 MM；The thickness of the high temperature resistant protection film layer is in 0.2-0.5MM.
- LED luminous lamp strips made of 7. luminescence chip according to claim 1 directly encapsulates, it is characterised in that：Further include Waterproof connector, the waterproof connector include bottom case, middle shell, upper casing, the first rubber sleeve, the second rubber sleeve and rubber stopper, the bottom It is symmetrically opened up on shell there are two rubber sleeve mounting groove, two rubber sleeve mounting grooves are interconnected, first rubber sleeve and second Rubber sleeve is inserted into respectively in rubber sleeve mounting groove, and empty slot is provided at the top of the bottom case, and the middle shell is mounted at the top of bottom case, institute It states middle shell bottom and is equipped with protrusion, be inserted into the empty slot at the top of bottom case, rubber stopper mounting groove, the rubber are provided on the middle shell Plug is inserted into rubber stopper mounting groove, and the upper clamshell sets that there are two for connecting above bottom case and middle shell in the bottom case Connect the lamp bar connection sheet at both ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820195284.8U CN208074639U (en) | 2018-02-05 | 2018-02-05 | LED luminous lamp strips made of luminescence chip directly encapsulates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820195284.8U CN208074639U (en) | 2018-02-05 | 2018-02-05 | LED luminous lamp strips made of luminescence chip directly encapsulates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208074639U true CN208074639U (en) | 2018-11-09 |
Family
ID=64037127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820195284.8U Expired - Fee Related CN208074639U (en) | 2018-02-05 | 2018-02-05 | LED luminous lamp strips made of luminescence chip directly encapsulates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208074639U (en) |
-
2018
- 2018-02-05 CN CN201820195284.8U patent/CN208074639U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190603 Address after: 518000 Huayixiong Complex Building 303 (Building A, 3rd Floor), No. 5, Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Mao Yuan Hong Photoelectric Technology Co., Ltd. Address before: 518100 Jinxiang Metropolitan Garden, No. 1168 Honggang Road, Qingshuihe Street, Luohu District, Shenzhen City, Guangdong Province, 4 blocks, 4 units 408 Patentee before: Shenzhen Keyi Design Service Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181109 Termination date: 20210205 |