CN207976618U - A kind of light emission component of high-speed coarse wavelength division multiplexing - Google Patents
A kind of light emission component of high-speed coarse wavelength division multiplexing Download PDFInfo
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- CN207976618U CN207976618U CN201820359226.4U CN201820359226U CN207976618U CN 207976618 U CN207976618 U CN 207976618U CN 201820359226 U CN201820359226 U CN 201820359226U CN 207976618 U CN207976618 U CN 207976618U
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- laser
- tube socket
- division multiplexing
- wavelength division
- soldering
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Abstract
The utility model is related to optic communication device technical fields, more particularly to a kind of light emission component of high-speed coarse wavelength division multiplexing, including adapter, regulation ring, soldering and sealing tube body, pipe cap and tube socket, pipe cap is packaged into laser by resistance welding and tube socket welding, soldering and sealing tube body and laser sealing welding, regulation ring is set between soldering and sealing tube body and adapter, tube socket is vertically arranged with the gold-plated ceramic gasket of a single side, ceramic gasket is installed with photodetection chip, it is heat sink that tube socket is horizontally arranged with adding thermal resistance, adding thermal resistance is heat sink to be installed with chip of laser, tube socket is additionally provided with several pin connecting pins, adding thermal resistance is heat sink to be connected between pin connecting pin by gold thread.The utility model improves laser. operating temperature stability, reduce the drift of laser works wavelength, the transmission rate of improving laser device, the industrial shelves application for realizing transmission 10Gbit/s and the inexpensive coarse wavelength division multiplexing laser of the above rate wavelength signals, meets growing data traffic process demand.
Description
Technical field
The utility model is related to optic communication device technical field more particularly to a kind of light emittings of high-speed coarse wavelength division multiplexing
Component.
Background technology
It grows at top speed with the IP data services of Internet, people are to more matchmakers such as optic communication band data, voice, image
The demand of body communication is increasingly vigorous, and wavelength-division multiplex technique becomes current optical fiber with the transparency of its huge bandwidth and transmission data
The one preferred technique of application field includes mainly dense wave division multipurpose（DWDM: Dense WDM）And coarse wavelength division multiplexing（CWDM:
Coarse WDM）, coarse wavelength division multiplexing technology with low cost, topology flexibly, the features such as access service types are more, short haul becomes
A kind of low cost solution of metropolitan area and edge access layer, while coarse wavelength division multiplexing and PON（Passive optical-fiber network）Collocation
It uses, the broadband data transmission of Centroid and multiple distribution nodes may be implemented, meet operator to a certain extent to broadband
The demand of Metropolitan Area Network (MAN) low cost construction is got more and more applications in fields such as telecommunications, broadcasting and TV, enterprise network, campus networks.
Traditional commerce shelves coarse wavelength division multiplexing laser mostly uses greatly TEC temperature controls and is encapsulated with er-doped, since laser is to temperature
Compare sensitive, and the range of temperature of TEC is small, and wavelength is difficult to stability contorting, keeps the wavelength offset of laser at work high
Up to ± 2~3nm, wavelength division multiplexing system carrying client rate is caused in 2.5Gbit/s and following rate, can not generally to transmit
The wavelength signals of 10Gbit/s and the above rate, TEC is with laser simultaneously using TO encapsulation sometimes, and this requires the volumes of TEC
It is very small, it is difficult to meet real work demand, make troubles to use, increase packaging cost, therefore limit wavelength signals
Flank speed, the reusable number of wavelengths of transmission distance discrete system, and increase dilatation cost etc. in the future.
Invention content
The purpose of this utility model is that in view of the deficiencies of the prior art, providing a kind of light hair of high-speed coarse wavelength division multiplexing
Component is penetrated, laser. operating temperature stability is improved, reduces the drift of laser works wavelength, the transmission speed of improving laser device
Rate realizes the industrial shelves application of transmission 10Gbit/s and the inexpensive coarse wavelength division multiplexing laser of the above rate wavelength signals, full
The growing data traffic process demand of foot.
To achieve the above object, the light emission component of a kind of high-speed coarse wavelength division multiplexing of the utility model, including adaptation
Device, regulation ring, soldering and sealing tube body, pipe cap and tube socket, the pipe cap is packaged into laser by resistance welding and tube socket welding, described
Soldering and sealing tube body and laser sealing welding, the regulation ring are set between soldering and sealing tube body and adapter, and the tube socket is longitudinally set
It is equipped with the gold-plated ceramic gasket of a single side, the ceramic gasket is installed with photodetection chip, and the tube socket, which is horizontally arranged with, to be added
Thermal resistance is heat sink, and the adding thermal resistance is heat sink to be installed with chip of laser, and the tube socket is additionally provided with several pin connecting pins,
The adding thermal resistance is heat sink to be connected between pin connecting pin by gold thread.
Preferably, it is provided with optoisolator in the adapter.
Preferably, it is pasted by elargol between the photodetection chip and ceramic gasket, between ceramic gasket and tube socket
Piece is bonded.
Preferably, the photodetection chip is connect by gold thread with tube socket.
Preferably, the ceramic gasket is connect by gold thread with pin connecting pin.
The beneficial effects of the utility model：A kind of light emission component of high-speed coarse wavelength division multiplexing of the utility model, packet
Adapter, regulation ring, soldering and sealing tube body, pipe cap and tube socket are included, the pipe cap is packaged into laser by resistance welding and tube socket welding
Device, the soldering and sealing tube body and laser sealing welding, the regulation ring are set between soldering and sealing tube body and adapter, the tube socket
It is vertically arranged with the gold-plated ceramic gasket of a single side, the ceramic gasket is installed with photodetection chip, and the tube socket is laterally set
It is heat sink to be equipped with adding thermal resistance, the adding thermal resistance is heat sink to be installed with chip of laser, and the tube socket is additionally provided with several pins
Connecting pin, the adding thermal resistance is heat sink to be connected between pin connecting pin by gold thread.
Photodetection chip is Nian Jie with the ceramic gasket that a single side is gold-plated by elargol patch, and ceramic gasket passes through elargol again
Patch is adhered on tube socket, and is cured under 175 DEG C of high temperature, ensures the reliability of product configurations；Chip of laser
It is adhered to that adding thermal resistance is heat sink, and adding thermal resistance is heat sink again by solder and tube socket strong bond by solder, adding thermal resistance is heat sink
Generated heat when chip of laser running can not only be contributed to disperse, but also be capable of providing chip of laser low temperature work
Temperature-compensating when making, it is ensured that the stability of laser works wavelength meets laser in -40 DEG C ~+85 DEG C temperature ranges just
It often operates, laser positive and negative two-stage is reduced while realizing chip of laser rapid cooling and connects impedance, effectively realization pair
The transmission of 10Gbit/s and the above rate wavelength signals；Chip of laser is heat sink mutual by gold thread ball bonding mode with adding thermal resistance
Conducting, adding thermal resistance is heat sink to be connected between pin connecting pin by gold thread ball bonding mode, is realized using advanced production technology
Longitudinal surface takes gold thread technology, reduces material cost；Pipe cap is combined and packaged into laser in nitrogen environment by electric resistance welding with tube socket
Device realizes that high reliability is encapsulated with high-air-tightness；Soldering and sealing tube body passes through Resistance Welding again with the laser for completing air-tight packaging
It is connected together, best power position is found by way of active coupling, OSA couplings are completed in radium-shine welding.The utility model carries
High laser. operating temperature stability, reduces the drift of laser works wavelength, and the transmission rate of improving laser device realizes transmission
The industrial shelves application of 10Gbit/s and the inexpensive coarse wavelength division multiplexing laser of the above rate wavelength signals, meet growing
Data traffic process demand.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the configuration schematic diagram of the utility model.
Fig. 3 is the internal sectional structure schematic diagram of the utility model.
Fig. 4 is the structural schematic diagram of the utility model tube socket.
Reference numeral includes：
1 --- adapter 2 --- regulation ring 3 --- soldering and sealing tube body
4 --- pipe cap 5 --- tube socket 51 --- ceramic gaskets
52 --- --- adding thermal resistance the is heat sink 54 --- chip of laser of photodetection chip 53
55 --- pin connecting pin 56 --- gold thread 6 --- lasers
7 --- optoisolator 8 --- elargol patches.
Specific implementation mode
The utility model is described in detail below in conjunction with attached drawing.
As shown in Figures 1 to 4, the light emission component of a kind of high-speed coarse wavelength division multiplexing of the utility model, including adaptation
Device 1, regulation ring 2, soldering and sealing tube body 3, pipe cap 4 and tube socket 5, the pipe cap 4 are packaged into laser by resistance welding and the welding of tube socket 5
Device 6, the soldering and sealing tube body 3 and 6 sealing welding of laser, the regulation ring 2 are set between soldering and sealing tube body 3 and adapter 1, institute
It states tube socket 5 and is vertically arranged with the gold-plated ceramic gasket 51 of a single side, the ceramic gasket 51 is installed with photodetection chip 52, institute
It states tube socket 5 and is horizontally arranged with adding thermal resistance heat sink 53, the adding thermal resistance heat sink 53 is installed with chip of laser 54, the tube socket
5 are additionally provided with several pin connecting pins 55, are connected by gold thread 56 between the adding thermal resistance heat sink 53 and pin connecting pin 55
It connects.
Photodetection chip 52 is Nian Jie with the ceramic gasket 51 that a single side is gold-plated by elargol patch 8, and ceramic gasket 51 is again
It is adhered on tube socket 5 by elargol patch 8, and is cured under 175 DEG C of high temperature, ensure the reliability of product configurations；
Chip of laser 54 is adhered to adding thermal resistance heat sink 53 by solder, and it is 53 secured by solder and tube socket 5 again that adding thermal resistance is heat sink
Bonding, adding thermal resistance is heat sink 53 can not only to contribute to disperse generated heat when chip of laser 54 operates, and can also
Enough provide temperature-compensating when 54 low-temperature working of chip of laser, it is ensured that the stability of 6 operation wavelength of laser meets laser
6 normal operations in -40 DEG C ~+85 DEG C temperature ranges are reducing laser 6 just while realizing 54 rapid cooling of chip of laser
Negative two-stage connects impedance, effectively realizes the transmission to 10Gbit/s and the above rate wavelength signals；Chip of laser 54 and heating
Resistance is heat sink 53 by 56 ball bonding mode mutual conduction of gold thread, and adding thermal resistance is heat sink to pass through gold thread between 53 and pin connecting pin 55
56 ball bonding modes connect, and realize that longitudinal surface takes 56 technology of gold thread using advanced production technology, reduce material cost；Pipe cap 4 is logical
It crosses electric resistance welding and is combined and packaged into laser 6 with tube socket 5 in nitrogen environment, realize that high reliability is encapsulated with high-air-tightness；Soldering and sealing
Tube body 3 is connected together by Resistance Welding again with the laser 6 for completing air-tight packaging, is found most by way of active coupling
OSA couplings are completed in good power location, radium-shine welding.The utility model improves 6 service temperature stability of laser, reduces laser
The drift of 6 operation wavelengths, the transmission rate of improving laser device 6, realize transmission 10Gbit/s and the above rate wavelength signals it is low
The industrial shelves application of cost coarse wavelength division multiplexing laser 6, meets growing data traffic process demand.
As shown in figure 3, being provided with optoisolator 7 in the adapter 1 of the present embodiment.Specifically, in high-speed, long range
It needs to use optoisolator 7 in optical fiber transmission, optically-active device and light splitting device is equipped in optoisolator 7, when there is strong reflection
When light returns, make light can not be along backtracking to laser 6 by optically-active device and light splitting device
In, make light that can only unidirectionally pass through, reflected light can be effectively prevent to be back in system and influence the steady operation of laser 6,
Even destroy the internal component of laser 6.
As shown in Figure 3 and Figure 4, between the photodetection chip 52 and ceramic gasket 51 of the present embodiment, ceramic gasket 51 with
It is bonded by elargol patch 8 between tube socket 5.Specifically, the gold-plated ceramics of a single side are fixedly installed on the end face of tube socket 5
Gasket 51, the gold-plated one side of ceramic gasket 51 are connected with photodetection chip 52, and elargol patch 8 is as the ideal choosing being conductively connected
It selects, good conductivity, anti-impact force are excellent, and elargol patch 8 also has operation at high temperature, can effectively avoid due to ambient temperature
Change and leads to harmful effect.
As shown in Figure 3 and Figure 4, the photodetection chip 52 of the present embodiment is connect by gold thread 56 with tube socket 5, ceramic gasket
51 are connect by gold thread 56 with pin connecting pin 55.Specifically, other conductions can be greatly reduced even in the electric conductivity based on gold thread 56
The error and interference that the mode of connecing is brought, but also avoid interference of the electrostatic to photodetection chip 52, by ceramic gasket 51 into
Row isolation installation, and the gilding of ceramic gasket 51 can guarantee the electrical power contact to photodetection chip 52, in optical communication technique
In optical fiber transmission sending and receiving end, complete the conversion between optical signal and electric signal, photodetection usually using photodetector
Device is the device for converting light signals into real-time electric signal, and the optical signal of chip of laser 54 passes through the light in photodetector
Electric detection chip 52 is converted into electric signal and is conducted again by pin.
In summary known to the utility model have above-described good characteristic, be able to enable it in use, promote with
The efficiency that does not have into technology and there is practicability, become a kind of product of great practical value.The above content is only this reality
With novel preferred embodiment, for those of ordinary skill in the art, the thought of foundation the utility model, in specific embodiment party
There will be changes in formula and application range, the content of the present specification should not be construed as a limitation of the present invention.
Claims (5)
1. a kind of light emission component of high-speed coarse wavelength division multiplexing, it is characterised in that：Including adapter, regulation ring, soldering and sealing tube body,
Pipe cap and tube socket, the pipe cap are packaged into laser by resistance welding and tube socket welding, and the soldering and sealing tube body and laser are close
Soldering and sealing connects, and the regulation ring is set between soldering and sealing tube body and adapter, and the tube socket is vertically arranged with the gold-plated pottery of a single side
Porcelain gasket, the ceramic gasket are installed with photodetection chip, and it is heat sink that the tube socket is horizontally arranged with adding thermal resistance, the heating
Resistance is heat sink to be installed with chip of laser, and the tube socket is additionally provided with several pin connecting pins, the adding thermal resistance is heat sink with
Pin is connected between connecting pin by gold thread.
2. a kind of light emission component of high-speed coarse wavelength division multiplexing according to claim 1, it is characterised in that：The adaptation
Optoisolator is provided in device.
3. a kind of light emission component of high-speed coarse wavelength division multiplexing according to claim 1, it is characterised in that：The photoelectricity
Between detection chip and ceramic gasket, it is be bonded by elargol patch between ceramic gasket and tube socket.
4. a kind of light emission component of high-speed coarse wavelength division multiplexing according to claim 1, it is characterised in that：The photoelectricity
Detection chip is connect by gold thread with tube socket.
5. a kind of light emission component of high-speed coarse wavelength division multiplexing according to claim 1, it is characterised in that：The ceramics
Gasket is connect by gold thread with pin connecting pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820359226.4U CN207976618U (en) | 2018-03-16 | 2018-03-16 | A kind of light emission component of high-speed coarse wavelength division multiplexing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820359226.4U CN207976618U (en) | 2018-03-16 | 2018-03-16 | A kind of light emission component of high-speed coarse wavelength division multiplexing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207976618U true CN207976618U (en) | 2018-10-16 |
Family
ID=63765731
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820359226.4U Active CN207976618U (en) | 2018-03-16 | 2018-03-16 | A kind of light emission component of high-speed coarse wavelength division multiplexing |
Country Status (1)
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109473866A (en) * | 2018-11-23 | 2019-03-15 | 武汉电信器件有限公司 | A kind of TO-CAN emitting module with heating function |
| CN109491026A (en) * | 2018-12-28 | 2019-03-19 | 东莞光智通讯科技有限公司 | Multichannel light emitting devices and optical communication apparatus |
| CN112147744A (en) * | 2020-09-30 | 2020-12-29 | 广东瑞谷光网通信股份有限公司 | Novel adjusting ring, light emitting assembly and assembling method thereof |
| CN113960727A (en) * | 2021-09-13 | 2022-01-21 | 江苏奥雷光电有限公司 | Optical device with temperature rising function |
-
2018
- 2018-03-16 CN CN201820359226.4U patent/CN207976618U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109473866A (en) * | 2018-11-23 | 2019-03-15 | 武汉电信器件有限公司 | A kind of TO-CAN emitting module with heating function |
| CN109491026A (en) * | 2018-12-28 | 2019-03-19 | 东莞光智通讯科技有限公司 | Multichannel light emitting devices and optical communication apparatus |
| CN112147744A (en) * | 2020-09-30 | 2020-12-29 | 广东瑞谷光网通信股份有限公司 | Novel adjusting ring, light emitting assembly and assembling method thereof |
| CN112147744B (en) * | 2020-09-30 | 2022-04-15 | 广东瑞谷光网通信股份有限公司 | Novel adjusting ring and assembling method of light emitting assembly |
| CN113960727A (en) * | 2021-09-13 | 2022-01-21 | 江苏奥雷光电有限公司 | Optical device with temperature rising function |
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