WO2020187149A1

WO2020187149A1 - Optical module

Info

Publication number: WO2020187149A1
Application number: PCT/CN2020/079180
Authority: WO
Inventors: 吴涛; 慕建伟; 刘维伟; 邵乾
Original assignee: 青岛海信宽带多媒体技术有限公司
Priority date: 2019-03-20
Filing date: 2020-03-13
Publication date: 2020-09-24
Also published as: CN111722325A

Abstract

The present application relates to an optical module. The optical module comprises an optical component housing, a circuit board, a first filter, a second filter, an optical fiber adapter, a transmitter, a first receiver, and a second receiver. The circuit board partly extends into the optical component housing. The transmitter is arranged on the bottom surface of the optical component housing. The first receiver and the second receiver are arranged on a sidewall of the optical component housing. The optical fiber adapter is connected to the optical component housing. The optical fiber adapter and the transmitter respectively are arranged at opposite ends of the optical component housing. A light transmitted by the transmitter is shone into the optical fiber adapter via the first filter and the second filter. A light of the optical fiber adapter is reflected into the first receiver via the first filter. The light of the optical fiber adapter is reflected into the second receiver via the second filter. The optical module provided in the present application reduces the manufacturing costs of a data transmitting port, and, the optical module has a small overall footprint.

Description

Optical module

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office, the application number is 201910214540.2, and the invention name is "optical module" on March 20, 2019, the entire content of which is incorporated into this application by reference.

Technical field

This application relates to the field of optical communication technology, and in particular to an optical module.

Background technique

Passive Optical Network (PON) refers to the Optical Distribution Network (ODN) between the Optical Line Terminal (OLT) and the Optical Network Unit (ONU). There is any kind of active electronic device access network. The OLT client equipment in the central computer room is ONU. ODN is connected to ONU or OLT by one or several optical splitters, responsible for centralizing upstream data and distributing downstream data, and completing functions such as wavelength multiplexing and optical signal power distribution. OLT is not only a multi-service providing platform but also a router or switch, and the optical fiber interface provided is PON-oriented. The OLT can also allocate bandwidth and perform management configuration and network security according to the different requirements of user service level agreements. The passive optical network avoids electromagnetic interference and lightning effects of external equipment, reduces the failure rate of lines and external equipment, improves system reliability, and saves maintenance costs. Passive optical networks include passive optical networks APON, EPON, GPON and CPON.

CPON integrates the original two optical modules of different speeds, which need to use the same optical fiber to realize two-way transmission and two-way reception; specifically, it can integrate 1 pair of GPON data receiving port and transmitting port and 1 pair of XG-PON1 data receiving port and transmitting port Optical module. This integration puts forward higher requirements for the design and packaging of the optical module.

Summary of the invention

The present application provides an optical module, which realizes that the same optical fiber is used in one optical module to realize multiple optical transceivers.

An embodiment of the present application provides an optical module, including a circuit board; an optical component housing, the circuit board extends into the optical component housing; an optical fiber adapter connected to the optical component housing; a first receiver embedded in the optical component housing The second receiver is embedded on the side wall of the optical component housing and is electrically connected to the circuit board; wherein the optical component housing includes: a transmitter located in the optical component housing On the bottom surface, the optical fiber adapter is located at the opposite end of the optical component housing; the first filter is set to receive and transmit the light from the transmitter, and is set to receive and reflect the light from the optical fiber adapter; the second filter is A sheet is configured to receive and transmit transmitted light from the first filter, and is configured to receive and reflect light from the optical fiber adapter; the first receiver is also configured to receive reflected light from the first filter; The second receiver is also configured to receive the reflected light from the second filter; the optical fiber adapter is also configured to receive the transmitted light from the second filter.

Description of the drawings

In order to explain the technical solution of the present application more clearly, the following will briefly introduce the drawings needed in the embodiments. Obviously, for those of ordinary skill in the art, without paying creative labor, Other drawings can be obtained from these drawings.

FIG. 1 is a schematic structural diagram of an optical module provided by an embodiment of the application;

FIG. 2 is an exploded view of an optical module provided by an embodiment of the application;

FIG. 3 is a schematic diagram of the internal structure of an optical module and optical component housing provided by an embodiment of the application;

4 is an exploded view of the inside of a housing of an optical module and optical component provided by an embodiment of the application;

FIG. 5 is a schematic structural diagram of an optical module and optical component housing with the upper cover removed from the inside of the optical module and optical component housing provided by an embodiment of the application;

Fig. 6 is a schematic diagram of the transmitter structure in Fig. 4;

FIG. 7 is a schematic diagram of the internal structure of a lower cover in an optical module according to an embodiment of the application;

FIG. 8 is a cross-sectional view of the inside of a housing of an optical module and optical component provided by an embodiment of the application, taken along the light emitting direction of the emitter;

FIG. 9 is a cross-sectional view of a first receiver in an optical module provided by an embodiment of this application;

FIG. 10 is an exploded view of a first receiver in an optical module provided by an embodiment of this application;

FIG. 11 is a schematic diagram of installation of a first receiver and a housing in an optical module according to an embodiment of the application;

FIG. 12 is a diagram of an optical path in an optical module provided by an embodiment of this application;

FIG. 13 is a diagram of another optical path in an optical module provided by an embodiment of the application.

detailed description

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

Figure 1 is a schematic structural diagram of an optical module provided by an embodiment of this application, and Figure 2 is an exploded view of an optical module provided by an embodiment of this application; as shown in Figure 1 and Figure 2, the embodiments of this application provide The optical module includes an upper housing 101, a lower housing 102, an optical component housing 103, an unlocking handle 108, an optical fiber adapter 50 and a circuit board 20. Wherein, the upper housing 101 and the lower housing 102 can be assembled and connected to each other to form a receiving cavity for accommodating the optical component housing 103. The upper housing 101 and the lower housing 102 may be assembled with each other and then connected by buckles, or they may be connected with each other after being assembled by screws. The manner in which the upper housing 101 and the lower housing 102 are assembled and connected to each other is not limited in this embodiment.

The upper housing 101 and the lower housing 102 jointly enclose a containing cavity, and the optical component housing 103 is located in the containing cavity. The upper shell and the lower shell are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation; the assembly method of the upper shell and the lower shell is used to facilitate the installation of circuit boards and other components into the shell. Generally, the optical module will not be installed. The shell is made into an integral structure, so that when assembling circuit boards and other devices, positioning components, heat dissipation and electromagnetic shielding structures cannot be installed, and it is not conducive to production automation.

One end of the unlocking handle 108 is provided with a handle 109, and the other end of the unlocking handle 108 has two connecting legs 1010. The two connecting legs 1010 respectively cover the two sides of the lower housing 102, and are connected to the two sides of the lower housing 102 and can follow The side of the lower housing 102 is moved, and the unlocking handle 108 can be moved relatively on the outer wall surface of the lower housing 102 by pulling the unlocking handle 108 by the handle 109; when the optical module is inserted into the upper computer, the unlocking handle 108 fixes the optical module in the cage of the upper computer , By pulling the unlocking handle 108 to release the engagement relationship between the optical module and the host computer, so that the optical module can be withdrawn from the cage of the host computer.

The circuit board is located in the enveloping cavity formed by the upper and the shell. The end surface of the electric board has golden fingers. The golden fingers are composed of independent pins. The circuit board is inserted into the electrical connector in the cage. The finger is conductively connected with the snap-fit spring piece in the electrical connector.

The optical fiber adapter 50 is connected to the optical component housing 103, and the optical fiber outside the optical module is inserted into the optical fiber adapter to realize the optical connection between the optical module and the external optical fiber.

FIG. 3 is a schematic diagram of the structure of the inside of an optical module and optical assembly housing provided by an embodiment of the application; FIG. 4 is an exploded view of the inside of the optical module and optical assembly housing provided by an embodiment of the application; FIG. An embodiment of the application provides a schematic structural diagram of an optical module and an optical component housing with the upper cover removed; as shown in FIG. 3, FIG. 4, and FIG. 5, the optical module provided by the embodiment of the application includes the optical component housing 103. Circuit board 20, fiber optic adapter 50, transmitter 60, first receiver 70 and second receiver 80. The circuit board 20 partially extends into the optical component housing 103, and the transmitter 60 is located on the bottom surface of the optical component housing 103 Above, the first receiver 70 and the second receiver 80 are located on the side wall of the optical component housing 103, the optical fiber adapter 50 is connected to the optical component housing 103, and the optical fiber adapter 50 and the transmitter 60 are respectively located in the optical component housing 103 Opposite end.

The upper shell and the lower shell form the outer shell of the optical module. The optical component is located between the upper and lower shells. The optical component shell 103 includes a lower cover 107 and an upper cover 106. The lower cover 107 is a accommodating cavity 104 with an opening. , The upper cover 106 covers the opening. In this way, when the optical module is packaged, the transmitter 60 and other devices can be conveniently placed into the accommodating cavity 104 through the opening. Through holes are provided at different positions on the lower cover 107, for example, a first through hole 105 and a third through hole 1012 are provided on the side of the lower cover 107, and the first receiver 70 passes through the first through hole 105 and the lower cover 107 Connected, the second receiver 80 is connected to the lower cover 107 through the third through hole 1012; a second through hole 1015 is provided on the end of the lower cover 107, and the optical fiber adapter 50 is connected to the lower cover 107 through the second through hole 1015 The specific positions of the through holes are set according to the positions of the first receiver 70, the second receiver 80, and the optical fiber adapter 50, which are not limited in this embodiment.

In an embodiment provided by the present application, an opening 1013 is opened at one end of the lower cover 107, and the circuit board 20 is inserted into the lower cover 107 through the opening 1013 to realize a short-distance electrical connection with the transmitter. Specifically, the circuit board 20 is inserted into the opening 1013 along the length direction, and the width of the main body of the circuit board 20 may be greater than or equal to the width of the opening 1013.

The upper cover 106 and the lower cover 107 are split and assembled together to facilitate the installation of the transmitter 60, the circuit board 20, and the optical fiber adapter 50 into the accommodating cavity 104 of the optical component housing 103.

In an embodiment provided by the present application, the circuit board 20 and the opening 1013 are bonded to connect the circuit board 20 and the opening 1013, so that the inside of the housing 10 can achieve a non-air-tight but water-proof performance.

In an embodiment provided in this application, the first receiver 70 and the second receiver 80 are bonded to the optical component housing 103, and the optical fiber adapter 50 is bonded to the housing 10, so that the inside of the optical component housing 103 is Dense but water vapor sealing performance.

The above-mentioned bonding can be done by using a COB sealer. The COB sealer is an automatic machine that automatically coats the black epoxy resin on the IC according to a certain height rule or shape rule and other standards for protection Gold wire, or aluminum wire, solder joints and chips are protected from mechanical damage, oxidation and corrosion.

In an embodiment provided in the present application, the optical component housing 103 may use a tungsten copper alloy substrate or Kovar (Fe-Ni-Co hard glass sealing alloy) to provide overall structural support.

6 is a schematic diagram of the structure of the transmitter in FIG. 4, as shown in FIG. 4 and FIG. 6, the optical module provided by this embodiment, the transmitter 60 includes a first laser chip 601 and a second laser chip 602, the first laser chip 601 and The forward lights emitted by the second laser chip 602 are parallel to each other. Among them, the first laser chip 601 and the second laser chip 602 can generate laser light, and the single wavelength characteristics of the laser light are better, and the wavelength tuning characteristics are better. In an embodiment provided in this application, the optical module provided in this embodiment further includes a displacement prism 500, which is used to adjust the height of the light emitted by the emitter 60. That is, the height of the light emitted by the first laser chip 601 and the second laser chip 602 is adjusted by the displacement prism 500.

The optical module provided in this embodiment further includes a semiconductor refrigerator 1000 and a conductive substrate 900. The semiconductor refrigerator 1000 is located in the optical component housing 103, and the first lens 100, the second lens 200 and the conductive substrate 900 are located on the semiconductor refrigerator 1000. ; The first laser chip 601 and the second laser chip 602 are located on the surface of the conductive substrate 900,

A backing plate 800 can be placed between the semiconductor refrigerator 1000 and the conductive substrate to adjust the height of the conductive substrate. The material of the conductive substrate 900 can be metalized ceramic, and the backing plate can also be made of ceramic materials to increase the thermal conductivity. The dimensional accuracy is not limited in this embodiment.

The first laser chip 601 and the second laser chip 602 generate heat when they work, and the semiconductor refrigerator 1000 cools the heat generated when the first laser chip 601 and the second laser chip 602 work.

In some embodiments, it further includes a substrate, the substrate is located on the inner bottom wall of the lower cover 107, and the semiconductor refrigerator 1000 is located on the substrate.

In some embodiments, as shown in FIG. 4, the optical module further includes two backlight detection components 90, and the two backlight detection components 90 are respectively used for receiving the back light emitted by the first laser chip 601 and the second laser chip 602.

Among them, the first laser chip 601 and the second laser chip 602 respectively emit two beams of light forward and backward, which are forward light and back light, and the two backlight detection components 90 are used to receive the first laser chip 601 and the second laser chip 601 respectively. The back light emitted by the two laser chips 602 is monitored by the backlight detecting component 90 to monitor the luminous power of the first laser chip 601 and the second laser chip 60. The forward light emitted by the first laser chip 601 and the second laser chip 602 are finally emitted through the fiber optic adapter 50 for data transmission.

In a specific implementation, the backlight detection component 90 is mounted on the circuit board 20 and is located on the circuit board 20 inserted into the housing 10, and the backlight detection component 90 is glued to the circuit board 20 by glue to reduce assembly difficulty.

In an embodiment provided in this application, in the optical module provided in this embodiment, the backlight detection component 90 is located behind the laser chip 3011 emitting light. In this way, without affecting the forward light of the first laser chip 601 and the second laser chip 602, it is convenient to receive the backward light emitted by the first laser chip 601 and the second laser chip 602. When the backlight detection component 90 is installed, the backlight detection component 90 may have a fixed angle with the first laser chip 601 and the second laser chip 602. The specific angle is set according to the specific installation position, which is not limited in this embodiment. The backlight detection element 90 can also be arranged in parallel with the back of the first laser chip 601 and the second laser chip 602 (that is, the position opposite to the light output direction of the first laser chip 601 and the second laser chip 602), as long as the backlight detection element 90 can monitor the The light emitting state of one laser chip 601 and the second laser chip 602 is sufficient.

In an embodiment provided by this application, FIG. 7 is a schematic diagram of the internal structure of the lower cover in an optical module provided by an embodiment of the application; as shown in FIGS. 6 and 7, the optical module provided by this application also It includes a first lens 100, a second lens 200, a third lens 300, a first filter 30, a second filter 40, a first reflector 400 and a third filter 110. The first lens 100 is located in the first Between the laser chip 601 and the third filter 110, the light emitted by the first laser chip 601 is condensed to the third filter 110, and the second lens 200 is located between the second laser chip 602 and the first reflector 400 In between, it is used to condense the light emitted by the second laser chip 602 to the first reflector 400, and then is reflected by the first reflector 400 to the third filter 110. The third filter 110 is located on the first filter 30. And the first lens 100; thus, the light emitted by the first laser chip enters the light incident surface of the third filter 110 through the first lens, and is transmitted out of the third filter 110; the second laser chip emits After collimated and converged by the second lens, the light is reflected by the first reflector to the reflective surface of the third filter 110. At the third filter 110, the light emitted by the first laser chip and the second laser chip The emitted light is combined into a beam of light, which is the light emitted by the emitter.

The third lens 300 is located between the second filter 40 and the optical fiber adapter 50, and the third lens 300 is used for condensing the light that enters the optical fiber adapter 50 through the second filter 40.

The function of the first lens 100, the second lens 200 and the third lens 300 is to converge the light. The common convergence is to converge divergent light into parallel light, and converge divergent light and parallel light into convergent light. The light emitted from the first laser chip 601 and the second laser chip 602 is in a divergent state. In order to facilitate subsequent optical path design and light coupling into the optical fiber, collimation and convergence processing are required. The first lens 100 and the first lens 200 can be As a collimating lens, the second filter 30 and the second filter 40 may be semi-reflective and semi-transmissive, a specific wavelength may pass through the filter, and a specific wavelength may be reflected by the filter.

The light emitted by the transmitter 60 enters the optical fiber adapter 50 through the first filter 30 and the second filter 40, and the light transmitted through the optical fiber adapter 50 is reflected by the first filter 30 and enters the first receiver 70. The incoming light from the fiber optic adapter 50 is reflected by the second filter 40 toward the second receiver 80.

Among them, the transmitter 60 is used to emit light, the first receiver 70 and the second receiver 80 are used to receive light, and the first filter 30 and the second filter 40 are used to transmit the light emitted by the transmitter 60 to In the optical fiber adapter 50, the incoming light through the optical fiber adapter 50 is reflected into the first receiver 70 through the first optical filter 30, and the light transmitted through the optical fiber adapter 50 is reflected into the second receiver 80 through the second optical filter 40. The fiber optic adapter 50 is used to couple the light emitted by the transmitter 60 to the optical fiber connected to the fiber optic adapter 50 to the maximum, and minimize the impact on the system due to its intervention in the optical link. In the optical module provided in this embodiment, the transmitter 60 is arranged on the bottom surface of the optical module housing 103, the first receiver 70 and the second receiver 80 are located on the side walls of the optical module housing 103, and the optical fiber adapter 50 is connected to the The housing 10 is connected, and the fiber optic adapter 50 and the transmitter 60 are respectively located at opposite ends of the optical component housing 103. The light emitted by the transmitter 60 passes through the first filter 30 and the second filter 40 and enters the fiber adapter 50. The light passed through the optical fiber adapter 50 is reflected into the first receiver 70 through the first filter 30, and the light passed through the optical fiber adapter 50 is reflected into the second receiver 80 through the second filter 40. That is, the transmitter 60 is set in the optical module housing 103, and the first receiver 70 and the second receiver 80 are located on the side wall of the optical module housing 103. The optical transmitter, the first receiver 70 and the second receiver 80 are Sharing an optical fiber adapter 50, in this way, reduces the manufacturing cost of the data transmission port, and the optical module takes up space as a whole.

In an embodiment provided in the present application, as shown in FIG. 7, the optical module provided in this embodiment further includes a second reflector 600, and the light transmitted through the optical fiber adapter 50 passes through the second filter 40 It is reflected into the second reflective sheet 600 and reflected to the second receiver 80 through the second reflective sheet 600. When the second receiver 80 and the second filter 40 are staggered, and the light transmitted through the optical fiber adapter 50 cannot be directly reflected into the second receiver 80 through the second filter 40, the second reflector 600 is provided. , The light passing through the second reflector 600 and the second filter 40 is reflected to the second receiver 80. Similarly, when the first receiver 70 and the first filter 30 are staggered, the light reflected by the first filter 30 can also be reflected to the first receiver 70 by arranging a reflector. In a specific implementation, the first receiver 70 and the second receiver 80 may be located on the same side surface of the optical module housing 103, or may be located on opposite sides of the optical module housing 103.

The light incident surface of the second filter 40 forms an angle less than 45° with respect to the propagation direction of the light from the optical fiber adapter; in order to transmit light from the second filter to the second receiver at this angle In 80, a second reflector is added. The light reflected on the light incident surface of the second filter is reflected to the second reflector, and the second reflector reflects the light to the second receiver to realize the second filter The light from the fiber optic adapter is reflected toward the second receiver. The second light filter 40 and the second light reflector 600 are assembled at a small angle. Compared with the 45° included angle used in the prior art, the light loss caused when light is reflected at the light filter can be reduced.

In an embodiment provided in this application, the optical module provided in this embodiment further includes an isolator 700 located between the first filter 30 and the third filter 110. The isolator 700 is used to prevent the incoming light from being reflected to the first laser chip 601 and the second laser chip 602 through the fiber optic adapter 50.

When assembling the optical module, in order to facilitate the installation of the first filter 30, the second filter 40, the second lens 200, the first reflector 400, the third filter 110, the second reflector 600 and the isolator 700 , The bracket 1014 can be set at different positions in the lower cover 107, the bracket 1014 is provided with a limiting portion 1011, and the first filter 30 and the second filter are respectively supported and positioned by the limiting portion 1011 on the different brackets 1014 40. The second lens 200, the first reflector 400, the third filter 110, the second reflector 600, and the isolator 700.

FIG. 8 is a cross-sectional view of the inside of a housing of an optical module and an optical component provided by an embodiment of the application, taken along the light emitting direction of the emitter.

9 is a cross-sectional view of the first receiver in an optical module provided by an embodiment of the application; FIG. 10 is an exploded view of the first receiver in an optical module provided by an embodiment of the application; FIG. 11 is an application An embodiment provides a schematic diagram of installation of a first receiver and a housing in an optical module. 9 to 11, the first receiver 70 is taken as an example for description. The receiver includes a cap 701, a base 704, a lens 702, and a receiving chip 703. The cap 701 is placed on the base 704, and the lens 702 is located On the outside of the cap 701, the inside of the base 704 has a depression, the receiving chip 703 is located in the depression, and the lens 702 is opposite to the receiving chip 703. In further implementation, the cap 701 is inserted into the first through hole 105, the lens 702 extends into the lower cover 107, and the light transmitted through the optical fiber adapter 50 is reflected into the lens 702 through the first filter 30, and passes through the lens 702. Converged and transmitted to the receiving chip 703.

It should be noted that the structure and principle of the first receiver 70 and the first receiver 80 are the same, and this embodiment will not be repeated here.

FIG. 12 is a diagram of an optical path in an optical module provided by an embodiment of the application. FIG. 12 shows an optical path diagram of the light emitted by the transmitter 60 in the optical module provided in this embodiment. See Figure 12,

The light emitted by the first laser chip 601 is condensed by the first lens 100 and then directed to the third filter 110, then passes through the first filter 30 and the second filter 40, and is condensed by the third lens 300 and then exits the optical fiber adapter 50;

The light emitted by the second laser chip 602 is collected by the second lens 200 to the first reflector 400, is reflected by the first reflector 400 to the third filter 110, and then passes through the first filter 30 and the second filter 40. The fiber optic adapter 50 is emitted after being converged by the third lens 300.

FIG. 13 is a diagram of another optical path in an optical module provided by an embodiment of the application. FIG. 13 shows an optical path diagram of light received by the first receiver 70 and the second receiver 80 in the optical module provided in this embodiment. As shown in FIG. 13, the light path of the first receiver 70 receiving light is: the light transmitted through the optical fiber adapter 50 is reflected to the first receiver 70 through the second filter 40 and the first filter 30, and the light is transmitted through The second filter 40 is directed toward the first filter 30 and is reflected by the first filter 30 toward the first receiver 70. The optical path of the second receiver 80 receiving light is as follows: the light transmitted through the optical fiber adapter 50 is reflected into the second reflector 600 through the second filter 40, and the light is reflected by the second filter 40 to the second reflector. The second reflective sheet 600 reflects to the second receiver 80. The reflection or transmission of light at the second filter depends on the wavelength of the light and the filtering characteristics of the second filter. The filtering characteristics of the second filter enable it to reflect light of a certain range of wavelengths and transmit another Range of wavelengths of light. It can be seen from the above transmission path and receiving path that part of the optical paths in the transmitter 60 and the first receiver 70 and the second receiver 80 are the same, which reduces the coupling time during packaging. Only one coupling station is required. Simple and easy to repair.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the application, not to limit them; although the application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions recorded in the foregoing embodiments are modified, or some of the technical features are equivalently replaced; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

An optical module, characterized in that it comprises

Circuit board

Optical component housing, the circuit board extends into the optical component housing;

An optical fiber adapter connected to the optical component housing;

The first receiver is embedded on the side wall of the optical component housing and is electrically connected to the circuit board;

The second receiver is embedded on the side wall of the optical component housing and is electrically connected to the circuit board;

Wherein, the optical component housing includes:

The transmitter is located on the bottom surface of the optical component housing, and is located at the opposite end of the optical component housing from the optical fiber adapter;

The first filter is configured to receive and transmit light from the transmitter, and is configured to receive and reflect light from the fiber optic adapter;

The second filter is configured to receive and transmit the transmitted light from the first filter, and is configured to receive and reflect the light from the optical fiber adapter;

The first receiver is further configured to receive the reflected light from the first filter;

The second receiver is further configured to receive the reflected light from the second filter;

The fiber optic adapter is also configured to receive transmitted light from the second filter.
The optical module according to claim 1, wherein the transmitter comprises a first laser chip and a second laser chip, and the forward light emitted by the first laser chip and the second laser chip are parallel to each other ；

It also includes at least two backlight detection components, the backlight detection components are respectively used to receive the backward light emitted by the first laser chip and the second laser chip, the backlight detection component is arranged in the light assembly housing The circuit board in the body.
The optical module according to claim 2, further comprising a first lens, a second lens, a third lens, a first reflector and a third filter; the first lens is located in the first laser Between the chip and the third filter, it is used to converge the light emitted by the first laser chip to the third filter; the second lens is located between the second laser chip and the first laser chip. Between a reflective sheet, it is used to converge the light emitted by the second laser chip to the first reflective sheet, and then reflect it to the third filter through the first reflective sheet; the third filter The light sheet is located between the first filter and the first lens;

The third lens is located between the second filter and the optical fiber adapter, and the third lens is used for condensing the light that enters the optical fiber adapter through the second filter.
The optical module according to claim 1, wherein:

It also includes a second reflector, and the light transmitted through the optical fiber adapter is reflected into the second reflector through the second filter, and then reflected to the second receiver through the second reflector.
The optical module according to claim 4, wherein:

The propagation direction of the light from the optical fiber adapter forms an angle of less than 45° with the light incident surface of the second filter.
3. The optical module according to claim 3, further comprising an isolator, the isolator being located between the first filter and the third filter.
The optical module according to claim 3, further comprising a semiconductor cooler and a conductive substrate, the semiconductor cooler is located in the optical component housing, the first lens, the second lens and the The conductive substrate is located on the semiconductor refrigerator;

The first laser chip and the second laser chip are located on the surface of the conductive substrate.
The optical module according to any one of claims 1 to 7, wherein the first receiver and the second receiver are located on the same side or opposite sides of the optical component housing.
The optical module according to any one of claims 1 to 7, wherein the first receiver and the second receiver are located in the optical component housing.
The optical module according to any one of claims 1 to 7, further comprising a displacement prism, and the displacement prism is used to adjust the height of the light emitted by the emitter.