CN207966923U - The exhaust apparatus of wafer processing equipment - Google Patents
The exhaust apparatus of wafer processing equipment Download PDFInfo
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- CN207966923U CN207966923U CN201690001168.7U CN201690001168U CN207966923U CN 207966923 U CN207966923 U CN 207966923U CN 201690001168 U CN201690001168 U CN 201690001168U CN 207966923 U CN207966923 U CN 207966923U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Robotics (AREA)
Abstract
The utility model is related to a kind of exhaust apparatus of wafer processing equipment, the wafer which is formed in body interior for transferring wafer transfers robot, which is characterized in that the device includes：Blowing unit is located at the top of above-mentioned ontology and side direction generates wind downward；Side formula reservoir is mounted on the two sides of ontology, and the center direction toward above-mentioned wafer processing equipment sprays inert gas；And exhaust unit, it includes bottom plate, punched-plate, fumer and exhaust manifold, the bottom plate is equipped with the more than one exhaust channel of its downside installation fumer, the punched-plate is mounted on the top of above-mentioned exhaust channel, the fumer is mounted on the lower part of above-mentioned exhaust channel and is connected with exhaust manifold, which, which is equipped with, is connected to more than one fumer and the air exit of past outside drain air.According to the utility model, it is possible to provide the exhaust apparatus of the following wafer processing equipment：From the side formula reservoir mounted on ontology two sides to the center direction blown inert gas of wafer processing equipment, the blowing unit on top generates wind toward the downside direction of wafer processing equipment and can reduce wafer pollution to the greatest extent toward outside drain air by exhaust unit.
Description
Technical field
The utility model is related to a kind of exhaust apparatus of wafer processing equipment, in more detail, the wafer processing equipment
Center direction blown inert gas of the exhaust apparatus from the side formula reservoir mounted on ontology two sides to wafer processing equipment, upper
The blowing unit in portion toward wafer processing equipment downside direction generate wind and by exhaust unit toward outside drain air energy
Enough reduce wafer pollution to the greatest extent.
Background technology
The utility model is related to a kind of wafer processing equipments.
Various chambers (chamber) are typically provided in equipment for manufacturing semiconductor.
For example, for forming the processing chamber (process for having certain thickness film or injecting the objects such as particle in wafer
Chamber the transfer chamber), being transplanted on mounted on the periphery of above-mentioned processing chamber and wafer inside above-mentioned processing chamber
(transfer chamber), the load for forming pre- atmosphere with the atmosphere of processing chamber before transferring wafer by above-mentioned transfer chamber
Interlock cavities (load lock chamber) take care of wafer at a certain temperature in order to which remaining by-product after technique is removed
The various chambers of the side formula reservoir (sides storage) of certain time etc are all contained in semiconductor manufacturing facility.
To interconnect, wafer is carried out by transferring chamber in processing chamber the usually close installation of above-mentioned chamber in load interlock cavities
It handles and is transferred successively toward side formula reservoir.
On the other hand, wafer periphery can generate such as Br/Cl gases etc during carrying out semiconductor fabrication process
Various byproduct gas, these can allow wafer or chamber etc. to corrode and pollution as the gas of by-product, it is therefore necessary to be added clear
Except the process of above-mentioned byproduct gas.
Side formula reservoir is used in order to which the byproduct gas generated on wafer periphery is removed as previously mentioned.
At this point, front (side formula for allow wafer to enter of the inert gas of existing side formula reservoir in side formula reservoir
The evolution face of reservoir) to swim in FFU (Fan Filter Unit) and wafer processing equipment toward back side direction supplies
In the foreign matter inflow side formula reservoir of process gas and flue gas etc and generates particle (particle) in wafer and improve
Fraction defective, the various parts in wafer processing equipment can also be corroded by the foreign materials away of process gas and flue gas etc and therefore
Barrier.
Utility model content
Technical task
The utility model aims to solve the problem that problem as previously described, and the purpose of this utility model is to provide a kind of wafer processing and sets
Standby exhaust apparatus blows indifferent gas from the side formula reservoir mounted on ontology two sides to the center direction of wafer processing equipment
Body removes the foreign matter of process gas and flue gas etc in the formula reservoir of side, in the blowing unit mounted on body upper part toward wafer
The downside direction of processing equipment generates wind and is prevented in wafer processing equipment respectively toward outside drain air by exhaust unit
The corrosion of kind part and failure, exhaust unit are connected to the gas exhaust piping in factory and are prevented technique toward outside drain
The foreign matter of gas and flue gas etc leaks into factory.
The means to solve the problem
According to the feature of the utility model for realizing above-mentioned purpose, the utility model discloses the exhaust of wafer processing equipment
Device, the wafer which is formed in body interior for transferring wafer transfer robot, which includes：It send
Wind unit is located at the top of above-mentioned ontology and side direction generates wind downward；Side formula reservoir is mounted on the two sides of ontology,
Center direction toward above-mentioned wafer processing equipment sprays inert gas；And exhaust unit comprising bottom plate, punched-plate, fumer
And exhaust manifold, the bottom plate are equipped with the more than one exhaust channel of its downside installation fumer, which is mounted on above-mentioned
The top of exhaust channel, the fumer are mounted on the lower part of above-mentioned exhaust channel and are connected with exhaust manifold, the exhaust manifold
Equipped be connected to more than one fumer and toward the air exit of outside drain air.
Moreover, above-mentioned fumer includes the fumer hole of lower part and the fumer pipe that extends from above-mentioned fumer hole, it is above-mentioned
Exhaust manifold is equipped with ostium on top and is equipped with gas vent, above-mentioned exhaust with the inflow pipe and lower part extended from above-mentioned ostium
Case pipe is connect with above-mentioned inflow pipe.
Moreover, the contact surface between above-mentioned fumer and above-mentioned bottom plate is sealed by band, above-mentioned punched-plate and upper
The contact surface stated between bottom plate is sealed by band, the contact surface between above-mentioned bottom plate and main frame (main frame) by
Band is sealed.
The effect of utility model
According to the exhaust apparatus of foregoing the utility model wafer processing equipment, from the side mounted on ontology two sides
Formula reservoir to the center direction blown inert gas of wafer processing equipment remove side formula reservoir in process gas and flue gas it
The foreign matter of class generates wind toward the downside direction of wafer processing equipment in the blowing unit mounted on body upper part and passes through exhaust
Unit prevents the corrosion of various parts and failure in wafer processing equipment toward outside drain air, and exhaust unit is connected to factory
The interior gas exhaust piping and foreign matter that process gas and flue gas etc are prevented toward outside drain leaks into factory.
Description of the drawings
Fig. 1 is the diagrammatic illustration of the wafer processing equipment of the preferred embodiment in the utility model.
Fig. 2 is the side view of the wafer reservoir of the preferred embodiment in the utility model.
Fig. 3 and Fig. 4 is the stereogram of the wafer reservoir of the preferred embodiment in the utility model.
Fig. 5 is the exploded perspective view of the wafer reservoir and inert gas injection unit of the preferred embodiment in the utility model.
Fig. 6 is the exploded perspective view of the wafer reservoir and inert gas supply unit of the preferred embodiment in the utility model.
Fig. 7 is the stereogram of the side formula reservoir of the preferred embodiment in the utility model.
Fig. 8 is the wafer reservoir of the preferred embodiment in the utility model and the diagrammatic illustration of box.
Fig. 9 is the diagrammatic illustration of the box for instantiating the preferred embodiment in the utility model opened and closed.
Figure 10 is the diagrammatic illustration for the box for instantiating the preferred embodiment in the utility model.
Figure 11 is the exploded perspective view of the bottom plate of the preferred embodiment in the utility model.
Figure 12 and Figure 13 is that punched-plate and fumer are combined on the bottom plate for instantiate the preferred embodiment in the utility model
Diagrammatic illustration.
Figure 14 is the stereogram of the exhaust manifold of the preferred embodiment in the utility model.
Figure 15 is the diagrammatic illustration of the exhaust flowing for the wafer processing equipment for instantiating the preferred embodiment in the utility model.
Figure 16 is the diagrammatic illustration of the exhaust apparatus of the wafer processing equipment of the preferred embodiment in the utility model.
Specific implementation mode
The aftermentioned embodiment being described with reference to the accompanying drawings will be helpful to the advantages of being expressly understood that the utility model, feature and its
Implementation method.
But the utility model is not limited to following revealed embodiment, and the utility model can be by various different
Form realize that the present embodiment only contributes to the complete announcement of the utility model, main purpose is to the utility model institute
Has the scope that usually intellectual completely illustrates the utility model in category field, the scope of the utility model can only be wanted by right
Book is asked to define.In the whole instruction there is same pictorial symbolization person to represent same inscape.
It is detailed with reference to the figure and the embodiments of the present invention of the exhaust apparatus for illustrating wafer processing equipment
Illustrate the utility model.
Fig. 1 is the diagrammatic illustration of the wafer processing equipment of the preferred embodiment in the utility model.
Referring to Fig. 1, the exhaust apparatus of the utility model wafer processing equipment is related to a kind of wafer processing equipment (10), shape
Indifferent gas is blown at the front of the inert gas injection unit (200) in wafer reservoir (100) back side toward wafer reservoir (100)
Body simultaneously removes internal wafer reservoir (100) and the process gas on wafer (112) surface and the foreign matter of flue gas etc, is located at upside
Blowing unit (500) then side direction generates wind and makes the inert gas that is blown and wafer in wafer reservoir (100) down
The foreign matter of process gas and flue gas etc in processing equipment (10) is discharged into outside by the exhaust unit (400) of downside,
By exhaust unit (400) the various component corrosions in prevention wafer processing equipment (10) and event are able to toward outside drain air
Barrier.
Fig. 2 is the side view of the wafer reservoir of the preferred embodiment in the utility model, and Fig. 3 and Fig. 4 are that the utility model is excellent
It is the wafer reservoir and inert gas of the preferred embodiment in the utility model to select the stereogram of the wafer reservoir of embodiment, Fig. 5
The exploded perspective view of injection unit.
Please refer to Fig. 2 to Fig. 5, the side formula reservoir (20) of wafer processing equipment (10) include wafer reservoir (100) with
Inert gas injection unit (200).
Wafer reservoir (100) is formed with the wafer be isolated according to a determining deviation and can install wafer (112) and loads with putting
Plate (110), front open that multiple wafers (112) is allowed to be inserted into above-mentioned wafer loading shelf (110).
It is dashed forward according to a determining deviation in the inside both sides of above-mentioned wafer reservoir (100) with shelf (110) at this point, wafer is loaded
It forms multiple slots with going out and wafer (112) end is allowed to be inserted into.
Moreover, the back side forms the inert gas injection unit (200) of injection inert gas, top is then formd by transparent
The window (120) that material is formed.
Above-mentioned window (120) can allow the user of driving wafer processing equipment (10) to visually observe reservoir (100)
Internal state.
Inert gas injection unit (200) includes nozzle casing (210), nozzle plate (250) and conducting element (240).
Nozzle casing (210) forms more than one supply port (220) to allow inert gas supply pipe (230) to connect
It connects, the inert gas supply pipe (230) is then to the front supplying inert gas of above-mentioned wafer reservoir (100), the utility model
Embodiment instantiate to form the first supply port (222), the second supply port (224), third supply port (226) and the 4th
Supply port (228).
Nozzle plate (250) forms multiple spray-holes.
At this point, in order to remove the process gas and flue gas on wafer (112) surface that above-mentioned wafer reservoir (100) is loaded
Etc foreign matter, above-mentioned spray-hole, which is located between each multiple wafers (112) for being loaded and is loaded corresponding to above-mentioned wafer, to be used
It is formed to the spacing of shelf (110), it is preferable that as shown in figure 5, corresponding to as previously mentioned on the integral face of nozzle plate above-mentioned
Wafer forms spray-hole with loading the spacing with shelf (110) according to a determining deviation.
Conducting element (240) is located between said nozzle cover (210) and said nozzle plate (250) and the part at interval is given
With sealing, form the partition wall for dividing certain space in each above-mentioned supply port (port) (220), the utility model it is preferred
Embodiment marks off four respective certain spaces of supply port (220) and is divided into and is equivalent to the first supply port (222)
First inlet zone (242), is equivalent to third supply port at the second inlet zone (244) for being equivalent to the second supply port (224)
(226) third inlet zone (246) and the 4th inlet zone (248) for being equivalent to the 4th supply port (228).
At this point, above-mentioned supply port (220) is formed by four supply ports (220), it is preferred that above-mentioned inert gas
The side of supply pipe (230) connects first supply pipe (262), the other side of above-mentioned inert gas supply pipe (230) with a pipe
Then it is divided into four direction and is connected respectively to the first supply port (222), the second supply port (224), third supply port
(226) and the 4th supply port (228).
Inert gas supply pipe (230) is connected to above-mentioned first supply port (222), the second supply port (224), third
If supply port (226) and the 4th supply port (228) and supplying inert gas, inert gas can be in the first inlet zone
(242), each regions such as the second inlet zone (244), third inlet zone (246) and the 4th inlet zone (248) are spread, and are then passed through
The air blowing (blowing) of above-mentioned inert gas supply pipe (230) sprays indifferent gas from multiple spray-holes of said nozzle plate (250)
Body.
At this time, it is preferable that the thickness of above-mentioned conducting element (240) should be set as follows, also that is, can be from above-mentioned each supply
Port (220) supplying inert gas and allow inert gas in each region for being formed in above-mentioned conducting element (240) fully
It is diffused into the entire region, why be equipped with 4 supply ports (220) and is the reason of being divided into 4 inlet zones, is divided
At can more effectively allow inert gas to be spread in region when more than one and equably from multiple spray-holes spray.
At this point, the multiple spray-holes for being formed in said nozzle plate (250) are isolator formed uniformly according to a determining deviation mutually
In entire said nozzle plate (250) so as to between the two neighboring wafer (112) of the wafer (112) loaded space spray
Inert gas, therefore the surface for all wafers (112) that globality above-mentioned wafer reservoir (100) can be loaded and crystalline substance
The foreign matter of process gas and flue gas etc in first reservoir (100) is removed.
Moreover, inert gas removes after the foreign matter in wafer reservoir (100) by following process, also that is, from above-mentioned
The front of wafer reservoir (100) is gone out and is discharged toward the center direction of wafer processing equipment (10), then by being located at crystalline substance
Side direction generates the blowing unit (500) of wind and drives and move down and by wafer on the upside of first processing equipment (10) and down
The exhaust unit (400) of processing equipment (10) is externally discharged.
Fig. 6 is the exploded perspective view of the wafer reservoir and inert gas supply unit of the preferred embodiment in the utility model,
Fig. 7 is the stereogram of the side formula reservoir of the preferred embodiment in the utility model.
Fig. 6 and Fig. 7 are please referred to, above-mentioned wafer reservoir (100) is additionally provided with inert gas supply unit (260) in lower part.
Above-mentioned inert gas supply unit (260) forms first supply pipe (262) on top and then forms second in lower part
Supply pipe (264), above-mentioned first supply pipe (262) is with above-mentioned second supply pipe (264) in above-mentioned inert gas supply unit
(260) internal to be connected with each other, above-mentioned first supply pipe (262) then connects with above-mentioned inert gas supply pipe (230), further includes scratching
Property hose (280), above-mentioned flexible hose (280) above-mentioned second supply pipe (264) with supply above-mentioned wafer processing equipment (10)
The main supply pipe (270) of inert gas connected.
Above-mentioned flexible hose (280) will be described in detail later.
At this point, above-mentioned inert gas supply unit (260) can be to being supplied to the indifferent gas of above-mentioned wafer reservoir (100)
Supply, supply pressure of body etc. are controlled.
In more detail, the inside of above-mentioned inert gas supply unit (260) can also include with valve, actuator, amount
Rule etc. adjustment means so as to be directed to the inert gas that above-mentioned second supply pipe (264) is supplied supply and supply pressure into
Row is adjusted, and above-mentioned adjustment means can be applicable in general adjustment means easily, therefore not be described further here.
Fig. 8 is the wafer reservoir of the preferred embodiment in the utility model and the diagrammatic illustration of box, and Fig. 9 is to instantiate this practicality newly
The diagrammatic illustration of the box of type preferred embodiment opened and closed, Figure 10 are the illustrations for the box for instantiating the preferred embodiment in the utility model
Figure.
Fig. 8 to Figure 10 is please referred to, side formula reservoir (20) includes the box (300) for installing above-mentioned wafer reservoir (100), also
Including：Hinge-unit (310), the face portion side and above-mentioned wafer processing equipment (10) for being formed in above-mentioned box (300) are cut with scissors
Tie and allow above-mentioned wafer reservoir (100) face portion relative to above-mentioned wafer processing equipment (10) at open or closed state；
In conjunction with clamping piece (330), it is formed in the face portion other side of above-mentioned box (300), and be formed in above-mentioned wafer processing equipment
(10) combination protrusion, which is realized, to be combined or detaches.
Embodiment according to the present utility model, it is preferable that hinge-unit (310) is safely realized including three hinges
Opening and closing is formed in the combination protrusion (320) of above-mentioned wafer processing equipment (10) and is formed in the combination clamping of above-mentioned box (300)
Part (330) is combined with each other and is opened and closed.
At this point, if on-off action is repeated with clamping piece (330) in conjunction with protrusion (320) and combination, it may occur that
Change in location and cause above-mentioned wafer processing equipment (10) that mistake occurs, therefore it plays the function that position is fixed,
To which change in location not occur opening and closing is repeated.
Moreover, as previously mentioned, above-mentioned second supply pipe (264) and above-mentioned main supply pipe (270) are by above-mentioned flexible hose
(280) it connects, therefore, the utility model is designed as follows, need not also be released when that is, carrying out on-off action every time above-mentioned
The connection of second supply pipe (264) and above-mentioned main supply pipe (270).
At this time, it is preferable that above-mentioned flexible hose (280) is fabricated to the length of the on-off action corresponding to above-mentioned box (300)
Or has retractility.
Due to that can realize the opening and closing mode of the portal form, the wafer for needing continuously to manage is stored
Maintain providing convenience property in the inside of device (100).
Figure 11 is the exploded perspective view of the bottom plate of the preferred embodiment in the utility model, and Figure 12 and Figure 13 are to instantiate this practicality
The diagrammatic illustration of punched-plate and fumer is combined on the bottom plate of novel preferred embodiment, Figure 14 is the preferred embodiment in the utility model
Exhaust manifold stereogram.
Please refer to Fig.1 1 to Figure 14, the exhaust unit (400) of the utility model include punched-plate (480), bottom plate (410),
Exhaust channel (420), fumer pipe (440), flows into pipe (460), exhaust manifold (450), air exit at fumer (430)
(470)。
Above-mentioned bottom plate (410) includes more than one exhaust channel (420), the top installation of above-mentioned exhaust channel (420)
Punched-plate (480), the lower part installation fumer (430) of above-mentioned exhaust channel (420), the lower part of above-mentioned fumer (430) then shape
At fumer hole and equipped with the fumer pipe (440) extended from above-mentioned fumer hole.
Moreover, above-mentioned exhaust manifold (450) is equipped with the inflow pipe (460) extended from ostium on top, then set in lower part
Have the externally discharged air exit of the air of inflow (470).
Preferably, above-mentioned fumer pipe (440) is connected with each other with above-mentioned inflow pipe (460) and makes above-mentioned fumer
(430) it is connect with above-mentioned exhaust manifold (450).
At this point, main frame (main frame), the above-mentioned bottom plate of above-mentioned bottom plate (410) and above-mentioned wafer processing equipment (10)
(410) each contact surface is sealed with band with above-mentioned fumer (430) with above-mentioned punched-plate (480), above-mentioned bottom plate (410),
This is to prevent the foreign matter of process gas and flue gas etc from leaking into above-mentioned row when above-mentioned exhaust unit (400) is exhausted
Equipment other than gas unit (400).
Figure 15 is the diagrammatic illustration of the exhaust flowing for the wafer processing equipment for instantiating the preferred embodiment in the utility model.
Please refer to Fig.1 5, it is preferable that be mounted on first exhaust access lower part first row gas tank first row gas tank pipe and
The first of first exhaust manifold (451) flows into pipe (461) connection, is mounted on the second exhaust of second exhaust access (422) lower part
The second row gas tank pipe (442) of case (432) and the 4th of second exhaust manifold (452) the flows into pipe (464) connection, is mounted on third
The third fumer pipe (443) of the third fumer (433) of exhaust channel (423) lower part and the of second exhaust manifold (452)
Five flow into pipe (465) connection, are mounted on the 4th fumer pipe of the 4th fumer (434) of the 4th exhaust channel (424) lower part
(444) pipe (462) connection is flowed into the second of first exhaust manifold (451), is mounted on the of the 5th exhaust channel (425) lower part
5th fumer pipe (445) of five fumers (435) and the third of first exhaust manifold (451) flow into pipe (463) connection, installation
In the 6th fumer pipe (446) and second exhaust manifold of the 6th fumer (436) of the 6th exhaust channel (426) lower part
(452) the 6th flows into pipe (466) connection.
Moreover, being equipped with air exit in the downside of above-mentioned first exhaust manifold (451) and second exhaust manifold (452)
(470) and the fumer (430) more than said one the air flowed into is externally discharged.
At this time, it is preferable that each air exit (470) is connected to the gas exhaust piping of semiconductor factory and externally discharged,
It is prevented the foreign matter of process gas and flue gas etc and leaks into inside semiconductor factory by the way that the gas exhaust piping discharges.
Figure 16 is the diagrammatic illustration of the exhaust apparatus of the wafer processing equipment of the preferred embodiment in the utility model.
6 are please referred to Fig.1, can be confirmed that the inside of above-mentioned wafer processing equipment (10) is mounted with blowing unit (500), bottom plate
(410), the structure of exhaust manifold (450) and in order to allow the air exit of exhaust manifold (450) (470) to be connected to semiconductor work
The gas exhaust piping of factory and the outside for being exposed to above-mentioned wafer processing equipment (10).
The utility model can carry out various in the case of not changing the technological thought and essential feature of the utility model
Displacement, deformation and modification, this is obviously for the those skilled in the art of the utility model technical field.Cause
This, the embodiment being described above only is to be explained to the utility model rather than limit the utility model.Aforementioned detailed description
It cannot be used for limiting the utility model, the scope of the utility model should be defined by tbe claims.The utility model is really weighed
Sharp range should include all derived modifications of meaning, scope and its equivalent concept institute and deformation of claims.
The explanation of symbol
10：Wafer processing equipment 20：Side formula reservoir
100：Wafer reservoir 110：Wafer loading shelf
112：Wafer (wafer) 120：Window
200：Inert gas injection unit 210：Nozzle casing
220：Supply port 230：Inert gas supply pipe
240：Conducting element 242：First inlet zone
244：Second inlet zone 246：Third inlet zone
248：4th inlet zone 250：Nozzle plate
260：Inert gas injection unit 262：First supply pipe
264：Second supply pipe 270：Main supply pipe
280：Flexible hose 300：Box
310：Hinge-unit 320：In conjunction with protrusion
330：In conjunction with clamping piece 400：Exhaust unit
410：Bottom plate 420：Exhaust channel
430：Fumer 440：Fumer pipe
450：Exhaust manifold 460：Flow into pipe
470：Air exit 480：Punched-plate
500：Blowing unit
Claims (3)
1. a kind of exhaust apparatus of wafer processing equipment, the wafer processing equipment are formed in body interior for transferring wafer
Wafer transfers robot, which is characterized in that
The device includes：
Blowing unit is located at the top of above-mentioned ontology and side direction generates wind downward；
Side formula reservoir is mounted on the two sides of ontology, and the center direction toward above-mentioned wafer processing equipment sprays inert gas；And
Exhaust unit comprising bottom plate, punched-plate, fumer and exhaust manifold, the bottom plate are equipped with its downside installation fumer
More than one exhaust channel, the punched-plate are mounted on the top of above-mentioned exhaust channel, and the fumer is logical mounted on above-mentioned exhaust
It the lower part on road and is connected with exhaust manifold, which, which is equipped with, is connected to more than one fumer and empty toward outside drain
The air exit of gas.
2. the exhaust apparatus of wafer processing equipment according to claim 1, which is characterized in that
Above-mentioned fumer includes the fumer hole of lower part and the fumer pipe that extends from above-mentioned fumer hole,
Above-mentioned exhaust manifold is equipped with ostium on top and is equipped with gas vent with the inflow pipe and lower part extended from above-mentioned ostium,
Above-mentioned fumer pipe is connect with above-mentioned inflow pipe.
3. the exhaust apparatus of wafer processing equipment according to claim 1, which is characterized in that
Contact surface between above-mentioned fumer and above-mentioned bottom plate is sealed by band,
Contact surface between above-mentioned punched-plate and above-mentioned bottom plate is sealed by band,
Contact surface between above-mentioned bottom plate and main frame is sealed by band.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0136690 | 2015-09-25 | ||
| KR1020150136690A KR101758214B1 (en) | 2015-09-25 | 2015-09-25 | Exhaust device of wafer processing apparatus |
| PCT/KR2016/009823 WO2017052100A1 (en) | 2015-09-25 | 2016-09-02 | Exhaust device of wafer treating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207966923U true CN207966923U (en) | 2018-10-12 |
Family
ID=58386320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201690001168.7U Active CN207966923U (en) | 2015-09-25 | 2016-09-02 | The exhaust apparatus of wafer processing equipment |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101758214B1 (en) |
| CN (1) | CN207966923U (en) |
| WO (1) | WO2017052100A1 (en) |
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| US10566216B2 (en) * | 2017-06-09 | 2020-02-18 | Lam Research Corporation | Equipment front end module gas recirculation |
| WO2018236544A1 (en) * | 2017-06-23 | 2018-12-27 | Applied Materials, Inc. | Indexable side storage pod apparatus, heated side storage pod apparatus, systems, and methods |
| US10388547B2 (en) | 2017-06-23 | 2019-08-20 | Applied Materials, Inc. | Side storage pods, equipment front end modules, and methods for processing substrates |
| US11749537B2 (en) * | 2018-10-26 | 2023-09-05 | Applied Materials, Inc. | Side storage pods, equipment front end modules, and methods for operating equipment front end modules |
| US11189511B2 (en) * | 2018-10-26 | 2021-11-30 | Applied Materials, Inc. | Side storage pods, equipment front end modules, and methods for operating EFEMs |
| KR102283311B1 (en) * | 2019-01-07 | 2021-07-29 | 피코앤테라(주) | Wafer storage container |
| KR102217711B1 (en) * | 2019-07-09 | 2021-02-22 | 주식회사 에이케이테크 | Exhaust unit for side storage |
| KR102671424B1 (en) | 2022-01-18 | 2024-05-31 | 주식회사 저스템 | Exhaust apparatus for air flow stabilization in equipment front end module and semiconductor process device comprising the same |
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| KR19980025880U (en) * | 1996-11-06 | 1998-08-05 | 박병재 | Vehicle interior purifier |
| KR20040104040A (en) * | 2003-06-02 | 2004-12-10 | 주성엔지니어링(주) | Exhaust system of chemical vapor deposition apparatus |
| US7806143B2 (en) * | 2007-06-11 | 2010-10-05 | Lam Research Corporation | Flexible manifold for integrated gas system gas panels |
| US8460466B2 (en) * | 2010-08-02 | 2013-06-11 | Veeco Instruments Inc. | Exhaust for CVD reactor |
| KR102164544B1 (en) * | 2014-01-22 | 2020-10-12 | 삼성전자 주식회사 | semiconductor manufacturing apparatus including Wafer storage apparatus having gas charging units |
-
2015
- 2015-09-25 KR KR1020150136690A patent/KR101758214B1/en active IP Right Grant
-
2016
- 2016-09-02 WO PCT/KR2016/009823 patent/WO2017052100A1/en active Application Filing
- 2016-09-02 CN CN201690001168.7U patent/CN207966923U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170037294A (en) | 2017-04-04 |
| KR101758214B1 (en) | 2017-07-14 |
| WO2017052100A1 (en) | 2017-03-30 |
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