CN207964073U - A kind of low-grade fever formula sound transducer - Google Patents
A kind of low-grade fever formula sound transducer Download PDFInfo
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- CN207964073U CN207964073U CN201820079512.5U CN201820079512U CN207964073U CN 207964073 U CN207964073 U CN 207964073U CN 201820079512 U CN201820079512 U CN 201820079512U CN 207964073 U CN207964073 U CN 207964073U
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Abstract
The utility model discloses a kind of low-grade fever formula sound transducers, including：Partiting thermal insulation substrat structure, heating unit and sensitive unit, the heating unit and the sensitive unit are adjacent and be respectively positioned on the partiting thermal insulation substrat structure；The heating unit is for providing local temperature field；The temperature change is converted to electric signal or optical signal by the sensitive unit for detecting Acoustic Wave Propagation temperature change caused by the local temperature field.Voice pickup effect can be effectively promoted using the utility model.
Description
Technical field
The utility model belongs to sound transducer technical field more particularly to a kind of low-grade fever formula sound transducer.
Background technology
Sound transducer is the energy converter that acoustic signals are converted into corresponding electric signal.Currently used sound transducer master
To include condenser type, moving-coil type sound transducer, be illustrated by taking condenser type as an example, change two bases of capacitor by acoustic pressure
The distance between plate changes capacitance, to realize detection sound wave, however it is limited come the sensitivity for detecting sound wave by mechanical deformation,
And the frequency response problem caused by Doppler effect, cause the pickup effect of existing sound transducer bad.
Utility model content
The utility model provides a kind of low-grade fever formula sound transducer, to solve the pickup effect of existing sound transducer not
Good problem.
To achieve the above object, the technical solution of the utility model is：
A kind of low-grade fever formula sound transducer, including：
Partiting thermal insulation substrat structure, heating unit and sensitive unit, the heating unit and the sensitive unit phase
It is adjacent and be respectively positioned on the partiting thermal insulation substrat structure；
The heating unit is for providing local temperature field；
The sensitive unit is for detecting Acoustic Wave Propagation temperature change caused by the local temperature field, by the temperature
Variation is converted to electric signal or optical signal.
Preferably, the sensitive unit is specifically used for described in the change detection according to any one or more following attribute
Temperature change：
The physical attribute of sensitive unit changes and device running parameter changes, wherein the physical attribute of sensitive unit
Variation include it is following any one or more：Spontaneous polarization variation, phase transformation, resistive, the change of device running parameter include：Work electricity
Pressure changes.
Preferably, the sensitive unit is filiform, sheet, column or netted；
The sensitive unit include it is following any one：Pyroelectricity material, vanadium oxide, conductor oxidate, silicon, silicon
The amorphous or polycrystalline composite materials of germanium, silicon germanium oxide, silicon carbide, when the sensitive unit is non-pyroelectricity material, institute
Stating low-grade fever formula sound transducer further includes：Several sensitive unit electrodes, are separately positioned on the different location of film the same face；
And/or
The pyroelectricity material include it is following any one：Kynoar, lithium tantalate, lead titanates, lead lanthanum titanate, zirconium titanium
Lead plumbate, calcium lead titanates, barium strontium titanate, tricalcium sulfate, the low-grade fever formula sound transducer further include：Several sensitive units
Electrode is separately positioned on the upper and lower surface of film；And/or
The device is PN junction, the p type island region of the PN junction and N-type region horizontal distribution or vertical distribution, the low-grade fever formula sound
Sound sensor further includes：Several sensitive unit electrodes, are separately positioned on p type island region and N-type region.
Preferably, the partiting thermal insulation substrat structure include it is following any one：Partiting thermal insulation substrate, heat shield liner bottom and absolutely
Edge structure, dielectric substrate and heat insulation structural or substrate and partiting thermal insulation structure.
Preferably, the partiting thermal insulation substrate include it is following any one：Polyimides, quartz, sapphire, Al2O3Pottery
Porcelain；
The insulation system includes the deielectric-coating positioned at substrate surface；
The heat insulation structural includes cavity, and the heating unit and the sensitive unit are located on the cavity；
The partiting thermal insulation structure includes：Positioned at the deielectric-coating of substrate surface and in the substrate and it is located at institute
The cavity under plasma membrane is given an account of, the heating unit and sensitive unit are located on the cavity and the deielectric-coating.
Preferably, the adjacent position and/or Bu Tong put down that the heating unit is generally aligned in the same plane with the sensitive unit
The adjacent position of the adjacent position in face, the Different Plane includes：By dielectric layer and/or cavity isolation or it is in contact.
Preferably, the sensitive unit position first touches sound wave compared to the heating unit position.
Preferably, the heating unit and the material of the sensitive unit differ.
Preferably, the mode of heating of the heating unit include it is following any one or more：Electrical heating, radiant heating,
Photic heating.
Low-grade fever formula sound transducer provided by the utility model is obtained by the thermal agitation during measurement sound transmission
The essential attribute of sound specifically uses sensitive unit to detect the difference variation of thermal agitation, to which direct detection is spoken
Wave information avoids and detects sound wave by way of mechanical deformation, and is not related to frequency response caused by Doppler effect and asks
Topic, therefore can effectively promote pickup effect.
Further, the utility model forms cavity structure in the substrate under the sensitive unit, in this way can be with
Signal interference caused by effectively avoiding interface from reflecting so that sound wave can continue to propagate downwards through detection zone, and due to heat
Sensing unit can be by the difference variation of detection thermal agitation, to which direct detection goes out the scalar sum Vector Message of sound, such as table
There are three the fundamental physical quantities for levying sound field：Scalar information acoustic pressure p, Vector Message Particle Vibration Velocity u, density variable quantity ρ,
And existing condenser type or moving-coil type sound transducer are only able to detect scalar information acoustic pressure p, in order to detect Vector Message, usually
Carry out voice pickup by sound pressure sensor array, but the structural volume of array is larger and complicated, cause cost compared with
It is high；And scalar information acoustic pressure p, the inspection of Vector Message Particle Vibration Velocity u can be realized by simple structure in the utility model
It surveys, and then effectively promotes pickup effect.
Description of the drawings
It, below will be to needed in the embodiment in order to illustrate more clearly of the technical solution that the utility model is implemented
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the utility model, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is a kind of cross section structure schematic diagram of the low-grade fever formula sound transducer provided according to the utility model embodiment；
Fig. 2 to Fig. 4 is the low-grade fever formula sound transducer provided according to the utility model embodiment first to the third water
Divide the schematic top plan view of cloth equally；
Fig. 5 to Fig. 7 is that the 4th to the 6th kind of the low-grade fever formula sound transducer provided according to the utility model embodiment hangs down
The cross section structure schematic diagram being directly distributed；
Fig. 8 is second of cross section structure signal of the low-grade fever formula sound transducer provided according to the utility model embodiment
Figure；
Fig. 9 is the flow of the first preparation method of the low-grade fever formula sound transducer provided according to the utility model embodiment
Figure；
Figure 10 is the stream of second of preparation method of the low-grade fever formula sound transducer provided according to the utility model embodiment
Cheng Tu.
Specific implementation mode
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, below in conjunction with the accompanying drawings to this
The specific implementation mode of utility model is described in detail.
Many details are elaborated in the following description in order to fully understand the utility model, but this practicality is new
Type can also be implemented using other different from other manner described here, and those skilled in the art can be without prejudice to this reality
With doing similar popularization in the case of novel intension, therefore the utility model is not limited by following public specific embodiment.
Secondly, the utility model combination schematic diagram is described in detail, when the utility model embodiment is described in detail, for ease of
Illustrate, indicates that the sectional view of device architecture can disobey general proportion and make partial enlargement, and the schematic diagram is example,
This should not limit the range of the utility model protection.In addition, three-dimensional space that should be comprising length, width and depth in actual fabrication
Between size." on " etc. similar description include being in contact or discontiguous situation.
The prior art is typically to cause mechanical deformation come sound detecting sensor by the acoustic pressure of sound wave, for example, capacitance
Formula sound transducer：Change caused capacitance change by distance between detecting the capacitance caused by sound wave come sound detecting, moving-coil
Formula sound transducer substantially carrys out sound detecting also with mechanical deformation, however, detecting the spirit of sound wave by mechanical deformation
Sensitivity is limited, and the frequency response problem caused by Doppler effect, causes the pickup effect of existing sound transducer not
It is good.
Low-grade fever formula sound transducer provided by the utility model, the part that heating unit is formed by detecting Acoustic Wave Propagation
Temperature change caused by temperature field, carrys out sound detecting, and avoiding problems the existing sensitivity that sound wave is detected by mechanical deformation
It is limited, and the frequency response problem caused by Doppler effect, it can effectively promote pickup effect.
Further, there are three the fundamental physical quantities for characterizing sound field：Scalar information acoustic pressure p, Vector Message particle vibration speed
Spend u, density variable quantity ρ.Since sound wave is the propagation of medium particle vibration, so Vector Message Particle Vibration Velocity u is
It is most suitable for the physical quantity of description sound wave.Currently used condenser type, moving-coil type sound transducer etc. mainly measure scalar information
Acoustic pressure p, for the sound field information for obtaining enough, the perception sound of high-fidelity, it is also necessary to the Vector Message of sound.Mostly use sound at present
Pressure sensor array realizes the acquisition of the Vector Message of sound.And the overall dimensions of microphone array will be bigger, structure
It is complex.To solve the above-mentioned problems, the utility model corresponds to the position setting cavity of sensitive unit on substrate so that
Sound wave can enter across sensitive unit in cavity, anti-without sending sound wave in place of sensitive unit and substrate contact
It penetrates, causes the defect for being not easy to detect Vector Message so that the utility model can utilize single low-grade fever formula sound transducer simultaneously
The variation for detecting scalar information acoustic pressure p and Vector Message Particle Vibration Velocity u, can effectively promote pickup effect in this way.
The technical solution of the utility model and technique effect in order to better understand, below with reference to flow chart and specifically
Embodiment is described in detail, as shown in Figure 1, being the low-grade fever formula sound transducer provided according to the utility model embodiment
The first cross section structure schematic diagram.
In the present embodiment, a kind of low-grade fever formula sound transducer may include：Partiting thermal insulation substrat structure, heating unit
And sensitive unit, the heating unit and the sensitive unit it is adjacent and be respectively positioned on the partiting thermal insulation substrat structure it
On；The heating unit is for providing local temperature field；The sensitive unit is for detecting Acoustic Wave Propagation to the part temperature
Temperature change caused by spending field, electric signal or optical signal are converted to by the temperature change.
The sound transducer can pass through MEMS (Micro-Electro-Mechanical System, MEMS)
Technology is realized, and arrayed configurations may be implemented, it is of course also possible to use other technologies manufacture the sound transducer.
The essential attribute of sound is obtained especially by the thermal agitation during measurement sound transmission.Heat-sensitive material is used to detect
The difference variation of thermal agitation, by the structure of reasonable design, to which direct detection goes out the scalar or scalar sum vector letter of sound
Breath.Since the basic physical property of heat-sensitive material can vary with temperature and generate the changes such as polarization charge, phase transformation variation, resistance
Change, so its responsive bandwidth can be very wide, very high, anti-interference is understood in sensitivity can be very high.Such as thermistor material, main component
For various conductor oxidates, resistivity is as temperature change is respectively with negative temperature coefficient (NTC) and positive temperature coefficient (PTC)
Variation.Vanadium oxide material, as crystal-phase transformation phenomenon can occur for temperature change, by the phase transition of reversible semiconductor to metal,
Its resistivity is caused to produce transition variation.Its electricity of the amorphous such as non-crystalline silicon, SiGe, SiGeO and SiC and polycrystalline composite materials
Resistance rate is changed with temperature change with positive temperature coefficient.Its output voltage of silicon PN junction is declined with temperature with negative temperature coefficient.Heat is released
Electric material such as PVDF (Kynoar), LiTaO3、PbTiO3, PLT, PZT, PCT, BST, TGS etc., since spontaneous polarization can be with
Temperature change can form surface charge on two surface of material.The operating voltage or work of detection sensitive unit can be passed through in this way
Make the change of electric current to detect sound wave.
Wherein, partiting thermal insulation substrat structure can be made of substrate, heat insulation structural and/or insulation system etc., for example, described
Partiting thermal insulation substrat structure include it is following any one：Partiting thermal insulation substrate, heat shield liner bottom and insulation system, dielectric substrate and every
Heat structure or substrate and partiting thermal insulation structure.Specifically, partiting thermal insulation substrate can be organic polymer substrate, inorganic matter
Substrate etc., including but not limited to it is following any one or more：Polyimides, quartz, sapphire, Al2O3Ceramics, such as quartz and
Sapphire laminated substrate etc., does not limit herein.When using heat shield liner bottom, in order to avoid heating unit and/or thermo-responsive
It leaks electricity between unit and substrate, insulation system can be formed on the heat shield liner bottom, the material at heat shield liner bottom can be same
Partiting thermal insulation substrate can also be heat-insulated but on-insulated substrate, for example, the organic matter of the filler with thermally conductive, electrically non-conductive
Manufactured substrate, will not enumerate herein, and insulation system includes but not limited to：Dielectric film, cavity etc..Dielectric substrate can be with
With partiting thermal insulation substrate, it can also be insulating heat-conductive substrate, then form heat insulation structural, such as thermal conductivity on insulating heat-conductive substrate
Low film, cavity etc., do not limit herein.Further, it is also possible to using common substrate and partiting thermal insulation structure come realize every
Then the effect of thermal insulation forms deielectric-coating and/or cavity on a semiconductor substrate for example, using common semiconductor substrate
Structure etc. realizes partiting thermal insulation substrat structure.The semiconductor substrate can be Si substrates, Ge substrates, SiGe substrate etc.,
In other embodiment, the semiconductor substrate can also be the substrate for including other elements semiconductor or compound semiconductor, example
Such as GaAs, InP or SiC can also be laminated construction, such as Si/SiGe etc.；The semiconductor substrate can also be insulator
Semiconductor substrate thereon, such as SOI substrate, GOI substrates, SGOI substrates etc..In addition, the substrate can also be Sapphire Substrate,
The oxide crystals such as quartz substrate substrate and glass substrate etc., or can also be polymer substrate, no longer enumerated here.It needs
It is noted that a basic role of above-mentioned various substrates is to provide mechanical support for heating unit and sensitive unit.
Preferably, above-mentioned insulation system includes the deielectric-coating positioned at substrate surface；The heat insulation structural includes cavity, described
Heating unit and the sensitive unit are located on the cavity；The partiting thermal insulation structure includes：Positioned at substrate surface
Deielectric-coating and the cavity in the substrate and under the deielectric-coating, the heating unit and sensitive unit
On the cavity and the deielectric-coating.Wherein, above-mentioned deielectric-coating includes but not limited to：SiNx、SiO2、Poly Si、a-
Si、BPSG、TiO2, SiNO etc..
The mode of heating of the heating unit include it is following any one or more：Electrical heating, radiant heating, it is photic plus
Thermal and magnetic field heating etc. is convenient for the mode of heating for generating local temperature field to be applicable in, it is preferred to use electrical heating side in the prior art
Formula.It needs to power to realize electrical heating to heating unit by electrode when electrical heating, the material of the heating unit includes but unlimited
In：The materials such as Pt, polysilicon, W, Ni can specifically be produced specifically by the related MEMS technology such as photoetching, etching, stripping
Structure, such as filiform, sheet, column.Electrode can be the various metals film such as Au, Al, Ag, Pt, Cu, mostly use sputtering or
Evaporation technology makes, and may then pass through semiconductor technology and prepares specific shape.It should be noted that the choosing of electrode material
Taking can choose by experiment or according to theory, for example, choosing the low material of specific contact resistivity as electrode, in addition, in order to drop
The bulk resistor of low contact resistance or electrode can also be optimized by techniques such as thermal annealings.The effect of heating unit is to carry
For local temperature field, when using Electric heating, accordingly, it is desirable to prepare electrode to heating unit in order to electrified regulation.This
Outside, which can also be carries out light heating to generate local temperature field, herein no longer using laser etc. to heating unit
It enumerates.
The sensitive unit is specifically used for temperature described in the change detection according to any one or more following attribute and becomes
Change：The physical attribute of sensitive unit changes and device running parameter changes；Wherein, the physical attribute variation of sensitive unit
Including it is following any one or more：Spontaneous polarization variation, phase transformation, resistive, the change of device running parameter include：Operating voltage changes
Become, open threshold value changes, operating current changes etc..Certainly, it in order to draw the voice signal detected, needs to described thermo-responsive
Electrode is arranged in unit, for example, providing constant voltage to an electrode, detects the change of the voltage and or current of another electrode output
Change；For pyroelectric phenomena, the charge generated can be drawn by electrode；For device, the positive and negative anodes of device can be given to distinguish
Electrode is set, the variation of operating voltage is then detected.Further, it is also possible to export the sound letter detected in the form of optical signal
Breath, for example, the electric signal of output is converted to optical signal by electrical to optical converter, this will not be detailed here.
Preferably, the sensitive unit is filiform, sheet, column or netted.The heating unit and described thermo-responsive
The adjacent position of the adjacent position of adjacent position and/or Different Plane that unit is generally aligned in the same plane, the Different Plane includes：
By dielectric layer and/or cavity isolation or it is in contact.That is sensitive unit and heating unit can be there are many arrangement sides
Formula.The sensitive unit can be located at the arbitrary one side or the multi-lateral of the heating unit, for example, upside, downside, left side, the right side
Side, upper left side, upper right side, lower left side, lower right side etc., do not limit herein, are according to the utility model as shown in Figures 2 to 4
Embodiment provide low-grade fever formula sound transducer first to the third horizontal distribution schematic top plan view；Such as Fig. 5 to Fig. 7 institutes
Show, is the section knot of the 4th to the 6th kind of vertical distribution of the low-grade fever formula sound transducer provided according to the utility model embodiment
Structure schematic diagram.Preferably, sensitive unit and heating unit allow sensitive unit preferential contact to sound wave on spatial position, this
Sample can obtain better Effect on Detecting.
The sensitive unit include it is following any one or more：Pyroelectricity material, vanadium oxide, conductor oxidate,
The amorphous or polycrystalline composite materials of silicon, SiGe, silicon germanium oxide (SiGeO), silicon carbide, when the sensitive unit is non-thermal releases
When electric material, such as vanadium oxide, the low-grade fever formula sound transducer further include：Several sensitive unit electrodes, are separately positioned on
The different location of film the same face；And/or the pyroelectricity material include it is following any one or more：Kynoar, tantalum
Sour lithium, lead titanates, lead lanthanum titanate (PLT), lead zirconate titanate, calcium lead titanates (PCT), barium strontium titanate, tricalcium sulfate (TGS),
The low-grade fever formula sound transducer further includes：Several sensitive unit electrodes, are separately positioned on the upper and lower surface of film；And/or
The device is PN junction, the P types area of the PN junction and N-type region horizontal distribution or vertical distribution, the low-grade fever formula sound transducer
Further include：Several sensitive unit electrodes, are separately positioned on p type island region and N-type region.It can be arranged one on one sound transducer
Or multiple heating units, one or more sensitive units, the attribute of each sensitive unit detection can be identical or different, example
Such as, a sensitive unit detects the temperature change according to spontaneous polarization, described in a sensitive unit is detected according to resistive
Temperature change, a sensitive unit detect described temperature change etc. according to the operating voltage of PN junction, and certainly, each is thermo-responsive
The quantity of unit is not limited to one, will not enumerate herein.The PN junction can form level by modes such as ion implantings
The structure of distribution can also form the structure of vertical distribution by way of epitaxial growth, no longer enumerated here.Sensitive unit
Material can be realized by techniques such as sputtering, evaporation, oxidation, chemical vapor deposition CVD, ion implanting, collosol and gels, temperature-sensitive
Feeling cell electrode includes but not limited to：Au, Al, Ag, Pt, Cu etc., the material that equally specific contact resistivity can be selected small, for
Phase transformation, resistive class sensitive unit, sensitive unit electrode can be located at the same face of sensitive unit, such as upper surface is same
The same side of side or lower surface；For spontaneous polarization class sensitive unit, sensitive unit electrode can be located at thermo-responsive list
The opposite two sides of member, such as it is located at the upper and lower surface of sensitive unit；For PN junction class sensitive unit, thermo-responsive list
First electrode can be located at the p-type area and n-type area of PN junction.
It should be noted that it is preferred that the heating unit and the material of the sensitive unit differ, it in this way can spirit
Respective separately adjustable control living, to realize best Effect on Detecting.
Low-grade fever formula sound transducer provided by the utility model is obtained by the thermal agitation during measurement sound transmission
The essential attribute of sound specifically uses sensitive unit to detect the difference variation of thermal agitation, to which direct detection is spoken
Wave information avoids and detects sound wave by way of mechanical deformation, and is not related to frequency response caused by Doppler effect and asks
Topic, therefore can effectively promote pickup effect.
Further, in order to by simple structure to realize scalar information acoustic pressure p and Vector Message Particle Vibration Velocity u
Detection, and then pickup effect is effectively promoted, as shown in figure 8, being the low-grade fever formula sound provided according to the utility model embodiment
Second of cross section structure schematic diagram of sensor.The utility model forms cavity knot in the substrate under the sensitive unit
Structure, in this way it is possible to prevente effectively from signal interference caused by interface is reflected so that sound wave can penetrate detection zone downwards after resuming
It broadcasts, and since sensitive unit can be by the difference variation of detection thermal agitation, to which direct detection goes out the scalar sum arrow of sound
Information is measured, such as scalar information acoustic pressure p, Vector Message Particle Vibration Velocity u, to realize existing sound transducer matrix ability
Collected sound vector information.
Correspondingly, the utility model additionally provides the preparation method of low-grade fever formula sound transducer, is basis as shown in Fig. 9
The flow chart of the first preparation method of the low-grade fever formula sound transducer that the utility model embodiment provides.
In the present embodiment, which includes the following steps：
Step S01, provides substrate, and the substrate is partiting thermal insulation substrat structure.
Wherein, select silicon chip as substrate, carrying out LPCVD methods in silicon chip upper surface deposits SiNxDielectric film, as whole
The support construction of body.
Step S02 forms heating unit and sensitive unit over the substrate.
In the present embodiment, it forms heating unit over the substrate and sensitive unit includes：In the first medium
Thermal resistance structure and heating electrode are formed on film, and sensitive unit and sensitive unit electricity are formed on substrate surface
Pole.It specifically, can be in SiNxThe evaporation of Pt metallic films is carried out above dielectric film, and passes through photoetching, etching and/or stripping
From etc. techniques formed heating structure.SiNxThe sputtering that electrode A l under pyroelectricity material is carried out above film, then carries out pyroelectricity
The spin coating and polarization of material PVDF (Kynoar) then carries out the sputtering of top electrode Al.So far, the making of sensitive unit
It has completed.Patterned electric heating film, which is produced, by photoetching, etching technics forms sensitive unit.
Further, after the substrate surface forms heating electrode, the method further includes：In the heating electrode
On formed second medium film；And/or sacrificial layer is formed on the heating electrode, heat is formed on the sacrificial layer
After sensing unit, the sacrificial layer under the sensitive unit is removed, to form cavity.
In another embodiment, as shown in Figure 10, it is to be passed according to the low-grade fever formula sound that the utility model embodiment provides
The flow chart of second of preparation method of sensor, in order to formed can sound detecting signal Vector Message when, the method may be used also
To further comprise：
Step S03 forms mask in the substrate back；
After forming heating unit and sensitive unit, the preparation method further includes：
Step S04, performs etching, and removes the unprotected substrate of the mask, with formed be located at the sensitive unit it
Under cavity.
Specifically, by the SiN of silicon chip back sidexDielectric film forms window by photoetching, etching technics, and with patterned
SiNxDielectric film is mask, and silicon substrate is corroded or etched away.Cavity structure can be thus formed, is believed with sound detecting
Number Vector Message.
In another embodiment, silicon chip can be selected as substrate, SiO is deposited on silicon chip by PECVD2It is thin
Film, support construction as a whole.By PECVD in SiO2The upper surface formation polysilicon membrane of film, and use photoetching,
Etching technics prepares heating structure.The thermo-responsive film of vanadium oxide is sputtered on heating structure, and passes through photoetching, etching technics shape
At sensitive unit.Then the making of Au electrodes is carried out in the upper surface of sensitive unit.Using pecvd process silicon chip the back of the body
Face makes layer of sinxFilm, and etch figure.Silicon substrate is corroded or etched using the figure as mask, is formed outstanding
Empty or engraved structure.So far, low-grade fever formula sound transducer completes.
In yet another embodiment, it selects silicon chip as substrate, SiO is carried out on silicon chip by pecvd process2Medium is thin
The making of film, support construction as a whole.It can be by PECVD in SiO2The upper surface of film forms polysilicon membrane,
And chemical wet etching goes out heating structure.P-type and N-type ion implanting are carried out in polysilicon membrane, are formed PN junction and are become to detect temperature
Change, and Al electrodes are sputtered in corresponding position, signal is drawn.By pecvd process layer of sin is grown at the back side of silicon chipxIt is thin
Film, and etch figure.Using the figure as the corrosion of mask progress silicon substrate, either etching forms hanging or engraved structure.
So far, low-grade fever formula sound transducer completes.
In other embodiments, it selects quartz plate as substrate, is deposited respectively by LPCVD methods on quartz plate two sides
SiNxDielectric film, support construction as a whole.Then in the SiN of upper surfacexThe steaming of Ni metallic films is carried out on dielectric film
Hair, and heating unit is formed by photoetching, stripping technology, thicker heating then can also be further formed by electroplating technology
Unit can provide higher thermal power in this way to bear higher current or voltage.PI is carried out in the upper surface of heating unit
(polyimides) spin coating is simultaneously lithographically formed support column figure.The deposition of non-crystalline silicon is then carried out, and chemical wet etching goes out non-crystalline silicon figure
Shape.Using patterned non-crystalline silicon as mask, PI is subjected to sacrificial layer processing with oxygen plasma, forms hanging bridge like amorphous silicon-sensitive
Structure.And heating unit：Ni structures vacantly separate below non-crystalline silicon, and with non-crystalline silicon.So far, low-grade fever formula sound transducer
It completes.
In the preparation method of low-grade fever formula sound transducer provided by the utility model, what can be simple and efficient prepares low-grade fever
Formula sound transducer is promoted convenient for industry.
The above descriptions are merely preferred embodiments of the present invention, not makees in any form to the utility model
Limitation.
Although the utility model has been disclosed in the preferred embodiments as above, it is not limited to the utility model.It is any
Those skilled in the art, in the case where not departing from technical solutions of the utility model ambit, all using the disclosure above
Methods and technical content makes many possible changes and modifications to technical solutions of the utility model, or is revised as equivalent variations
Equivalent embodiment.Therefore, every content without departing from technical solutions of the utility model, according to the technical essence of the utility model pair
Any simple modifications, equivalents, and modifications made for any of the above embodiments still fall within technical solutions of the utility model protection
In range.
Claims (9)
1. a kind of low-grade fever formula sound transducer, which is characterized in that including：
Partiting thermal insulation substrat structure, heating unit and sensitive unit, the heating unit and the sensitive unit it is adjacent and
It is respectively positioned on the partiting thermal insulation substrat structure；
The heating unit is for providing local temperature field；
The sensitive unit is for detecting Acoustic Wave Propagation temperature change caused by the local temperature field, by the temperature change
Be converted to electric signal or optical signal.
2. low-grade fever formula sound transducer according to claim 1, which is characterized in that the sensitive unit is specifically used for root
Temperature change described in the change detection of any one or more lower attribute according to this：
The physical attribute of sensitive unit changes and device running parameter changes, wherein the physical attribute of sensitive unit changes
Including it is following any one or more：Spontaneous polarization variation, phase transformation, resistive, the change of device running parameter include：Operating voltage changes
Become.
3. low-grade fever formula sound transducer according to claim 2, which is characterized in that
The sensitive unit is filiform, sheet, column or netted；
The sensitive unit include it is following any one：Pyroelectricity material, vanadium oxide, conductor oxidate, silicon, SiGe, silicon
The amorphous or polycrystalline composite materials of chromium oxide, silicon carbide, when the sensitive unit is non-pyroelectricity material, the low-grade fever
Formula sound transducer further includes：Several sensitive unit electrodes, are separately positioned on the different location of film the same face；And/or
The pyroelectricity material include it is following any one：Kynoar, lithium tantalate, lead titanates, lead lanthanum titanate, zirconium metatitanic acid
Lead, calcium lead titanates, barium strontium titanate, tricalcium sulfate, the low-grade fever formula sound transducer further include：Several sensitive unit electricity
Pole is separately positioned on the upper and lower surface of film；And/or
The device is PN junction, the p type island region of the PN junction and N-type region horizontal distribution or vertical distribution, and the low-grade fever formula sound passes
Sensor further includes：Several sensitive unit electrodes, are separately positioned on p type island region and N-type region.
4. low-grade fever formula sound transducer according to claim 1, which is characterized in that the partiting thermal insulation substrat structure includes
Below any one：Partiting thermal insulation substrate, heat shield liner bottom and insulation system, dielectric substrate and heat insulation structural or substrate and heat-insulated
Insulation system.
5. low-grade fever formula sound transducer according to claim 4, which is characterized in that
The partiting thermal insulation substrate include it is following any one：Polyimides, quartz, sapphire, Al2O3Ceramics；
The insulation system includes the deielectric-coating positioned at substrate surface；
The heat insulation structural includes cavity, and the heating unit and the sensitive unit are located on the cavity；
The partiting thermal insulation structure includes：Positioned at the deielectric-coating of substrate surface and in the substrate and positioned at being given an account of
Cavity under plasma membrane, the heating unit and sensitive unit are located on the cavity and the deielectric-coating.
6. low-grade fever formula sound transducer according to claim 1, which is characterized in that the heating unit and described thermo-responsive
The adjacent position of the adjacent position of adjacent position and/or Different Plane that unit is generally aligned in the same plane, the Different Plane includes：
By dielectric layer and/or cavity isolation or it is in contact.
7. low-grade fever formula sound transducer according to claim 6, which is characterized in that sensitive unit position phase
Sound wave is first touched compared with the heating unit position.
8. low-grade fever formula sound transducer according to claim 1, which is characterized in that the heating unit and described thermo-responsive
The material of unit differs.
9. low-grade fever formula sound transducer according to claim 1, which is characterized in that the mode of heating packet of the heating unit
Include it is following any one or more：Electrical heating, radiant heating, photic heating.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108180984A (en) * | 2018-01-18 | 2018-06-19 | 北京北方高业科技有限公司 | A kind of low-grade fever formula sound transducer and preparation method thereof |
| WO2023093471A1 (en) * | 2021-11-24 | 2023-06-01 | 华为技术有限公司 | Fluid detection apparatus, microphone, and electronic device |
-
2018
- 2018-01-18 CN CN201820079512.5U patent/CN207964073U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108180984A (en) * | 2018-01-18 | 2018-06-19 | 北京北方高业科技有限公司 | A kind of low-grade fever formula sound transducer and preparation method thereof |
| WO2023093471A1 (en) * | 2021-11-24 | 2023-06-01 | 华为技术有限公司 | Fluid detection apparatus, microphone, and electronic device |
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