CN207938597U - A kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular - Google Patents
A kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular Download PDFInfo
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- CN207938597U CN207938597U CN201820230818.6U CN201820230818U CN207938597U CN 207938597 U CN207938597 U CN 207938597U CN 201820230818 U CN201820230818 U CN 201820230818U CN 207938597 U CN207938597 U CN 207938597U
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Abstract
The utility model provides a kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular, heat dissipation plane is divided into several slots by it, even if adjacent slot coolant liquid flows on the contrary, to ensure that coolant liquid entrance temperature is different in single slot, the entire face temperature that radiates is consistent substantially.It includes the indent liquid cooling slot of several parallel arrangements, is separated by partition between adjacent indent liquid cooling slot, corresponding first side plate, the second side plate are disposed on the length direction of all indent liquid cooling slots；Two adjacent indent liquid cooling slots：One of indent liquid cooling slot, which corresponds on first side plate, is provided with liquid inlet, corresponding to being provided with liquid outlet on second side plate, another indent liquid cooling slot, which corresponds on second side plate, is provided with liquid inlet, corresponding to being provided with liquid outlet on first side plate, all liquid inlets are connected to by the first external pipeline into liquid stream road, and all liquid outlets are connected to out liquid stream road by the second external pipeline.
Description
Technical field
The utility model is related to the technical field of cooling water channel structure, specially a kind of applicable plane thermal conductivity power semiconductor
The cooling water channel structure of module.
Background technology
Existing semi-conductor power module radiator coolant flows in radiator structure to be heated along journey, is caused close to stream
Road intake section good cooling results, it is poor close to runner exit part cooling effect.Long-term unbalanced heat dissipation is unfavorable for power and partly leads
The bulk life time of module.
Invention content
In view of the above-mentioned problems, the utility model provides a kind of cooling water channel being applicable in plane thermal conductivity power semiconductor modular
Heat dissipation plane is divided into several slots by structure, even if adjacent slot coolant liquid flow direction is on the contrary, to ensure that coolant liquid comes in and goes out in single slot
Mouth temperature is different, and the entire face temperature that radiates is consistent substantially, ensure that the bulk life time of power semiconductor modular.
A kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular, it is characterised in that：It includes several
The indent liquid cooling slot of parallel arrangement is separated by partition between adjacent indent liquid cooling slot, the length of all indent liquid cooling slots
Corresponding first side plate, the second side plate are disposed on direction；Two adjacent indent liquid cooling slots：One of indent liquid cooling
Slot, which corresponds on first side plate, is provided with liquid inlet, corresponding to being provided with liquid outlet on second side plate, another indent liquid
Cold trap, which corresponds on second side plate, is provided with liquid inlet, corresponding to liquid outlet is provided on first side plate, and all is described
Liquid inlet is connected to by the first external pipeline into liquid stream road, and all liquid outlets are connected to out liquid stream by the second external pipeline
Road, it is described enter liquid stream road on be provided with cooling liquid inlet connector, it is described go out liquid stream road on be provided with cooling liquid outlet connector.
It is further characterized by：
First side plate, the second side plate parallel arrangement, the indent liquid cooling slot is specially straight groove structure, all indents
Liquid cooling slot connects arrangement, composition rectangular configuration side by side；
The height and position of all liquid outlets is identical, it is described go out liquid stream road be specially c-type structure pipeline, it is described go out liquid stream
Two lateral lines in road connect the liquid outlet of corresponding position by second external pipeline respectively；
It is described go out liquid stream road middle part connect two lateral lines connecting tube on be provided with cooling liquid outlet connector；
The height and position of all liquid inlets is identical, it is described enter liquid stream road be specially c-type structure pipeline, it is described enter liquid stream
Two lateral lines in road connect the liquid inlet of corresponding position by first external pipeline respectively；
It is described enter liquid stream road middle part connect two lateral lines connecting tube on be provided with coolant inlet connector；
Preferably, the height of the liquid outlet is higher than the height of the liquid inlet, it is described go out liquid stream road be located at it is described enter liquid
The corresponding position of the surface of runner is arranged in parallel；
Preferably, the height of the liquid inlet is higher than the height of the liquid outlet, it is described enter liquid stream road be located at it is described go out liquid
The corresponding position of the surface of runner is arranged in parallel.
After the structure of the utility model, if heat dissipation plane is divided into the indent liquid cooling slot of parallel arrangement, same indent liquid
Coolant liquid is flowed into from one end of length direction in cold trap, the other end flows out, the coolant liquid influent mouth phase of all indent liquid cooling slots
Even, it is connected to the cooling liquid inlet connector of radiator；The liquid outlet of the coolant liquid of all indent liquid cooling slots is connected, and is connected to heat dissipation
The cooling liquid outlet connector of device；Even if adjacent slot coolant liquid flows on the contrary, to ensure that coolant liquid entrance temperature is not in single slot
Together, entirely heat dissipation face temperature is consistent substantially, ensure that the bulk life time of power semiconductor modular.
Description of the drawings
Fig. 1 is the three-dimensional figure structure schematic representation of the utility model；
Fig. 2 is the main view schematic diagram of specific embodiment of the utility model one；
Fig. 3 is that the A-A of Fig. 2 cuts open structural schematic diagram；
Fig. 4 is that the B-B of Fig. 2 cuts open structural schematic diagram；
Title in figure corresponding to serial number is as follows：
Indent liquid cooling slot 1, partition board 2, the first side plate 3, the second side plate 4, liquid inlet 5, liquid outlet 6, the first external pipeline 7,
Enter liquid stream road 8, the second external pipeline 9, go out liquid stream road 10, cooling liquid inlet connector 11, cooling liquid outlet connector 12.
Specific implementation mode
A kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular, is shown in Fig. 1：It includes several parallel cloth
The indent liquid cooling slot 1 set is separated between adjacent indent liquid cooling slot 1, the length side of all indent liquid cooling slots 1 by partition board 2
It is disposed with corresponding first side plate 3, the second side plate 4 upwards；Two adjacent indent liquid cooling slots：One of indent liquid cooling slot 1
Corresponding to liquid inlet 5 is provided on the 9th side plate 3, corresponding to being provided with liquid outlet 6 on the second side plate 4, another indent liquid cooling slot 3
Corresponding to liquid inlet 5 is provided on the second side plate 4, corresponding to liquid outlet 6 is provided on the first side plate 3, all liquid inlets 5 pass through
One external pipeline 7 is connected into liquid stream road 8, and all liquid outlets 6 are connected to out liquid stream road 10 by the second external pipeline 9, enter liquid stream
It is provided with cooling liquid inlet connector 11 on road 8, goes out on liquid stream road 10 to be provided with cooling liquid outlet connector 12.
First side plate 3, the second side plate 4 parallel arrangement, indent liquid cooling slot 1 are specially straight groove structure, all indent liquid coolings
Slot 1 connects arrangement, composition rectangular configuration side by side；
The height and position of all liquid outlets 6 is identical, goes out the pipeline that liquid stream road 10 is specially c-type structure, goes out liquid stream road 10
Two lateral lines respectively pass through the second external pipeline 9 connect corresponding position liquid outlet 6；
It is provided with cooling liquid outlet connector 12 in the connecting tube for two lateral lines of middle part connection for going out liquid stream road 10；
The height and position of all liquid inlets 5 is identical, enters the pipeline that liquid stream road 8 is specially c-type structure, enters liquid stream road 8
Two lateral lines connect the liquid inlet 5 of corresponding position by the first external pipeline 7 respectively；
Enter and is provided with coolant inlet connector 11 in the connecting tube of two lateral lines of middle part connection in liquid stream road 8；
Specific embodiment one is shown in that Fig. 1-Fig. 4, the height of liquid outlet 6 are higher than the height of liquid inlet 5, go out liquid stream road 10 and be located at
Enter the corresponding position parallel arrangement of the surface in liquid stream road 8 so that water-cooled effect is best.
Specific embodiment two, the height of liquid inlet 5 are higher than the height of liquid outlet 6, enter liquid stream road 8 and be located at liquid stream road 10
The corresponding position of surface is arranged in parallel.
Its operation principle is as follows：If heat dissipation plane is divided into the indent liquid cooling slot of parallel arrangement, cold in same indent liquid cooling slot
But liquid is flowed into from one end of length direction, the other end flows out, and the coolant liquid influent mouth of all indent liquid cooling slots is connected, and is connected to
The cooling liquid inlet connector of radiator；The liquid outlet of the coolant liquid of all indent liquid cooling slots is connected, and is connected to the cooling of radiator
Liquid outlet connection；Even if adjacent slot coolant liquid flow direction is on the contrary, to ensure that coolant liquid entrance temperature is different in single slot, entirely dissipates
Hot face temperature is consistent substantially, ensure that the bulk life time of power semiconductor modular.
Specific embodiment of the utility model is described in detail above, but content is only what the utility model was created
Preferred embodiment should not be construed as limiting the practical range of the utility model creation.All created according to the utility model is applied
All the changes and improvements made by range etc. should all still belong within this patent covering scope.
Claims (8)
1. a kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular, it is characterised in that：It includes that several are flat
The indent liquid cooling slot of row arrangement, is separated by partition between adjacent indent liquid cooling slot, the length side of all indent liquid cooling slots
It is disposed with corresponding first side plate, the second side plate upwards；Two adjacent indent liquid cooling slots：One of indent liquid cooling slot
Corresponding to liquid inlet is provided on first side plate, corresponding to being provided with liquid outlet on second side plate, another indent liquid cooling
Slot, which corresponds on second side plate, is provided with liquid inlet, corresponding to being provided with liquid outlet on first side plate, it is all it is described enter
Liquid mouth is connected to by the first external pipeline into liquid stream road, and all liquid outlets are connected to out liquid stream by the second external pipeline
Road, it is described enter liquid stream road on be provided with cooling liquid inlet connector, it is described go out liquid stream road on be provided with cooling liquid outlet connector.
2. a kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular as described in claim 1, feature exist
In：First side plate, the second side plate parallel arrangement, the indent liquid cooling slot is specially straight groove structure, all indent liquid coolings
Slot connects arrangement, composition rectangular configuration side by side.
3. a kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular as described in claim 1, feature exist
In：The height and position of all liquid outlets is identical, it is described go out liquid stream road be specially c-type structure pipeline, it is described go out liquid stream road
Two lateral lines connect the liquid outlet of corresponding position by second external pipeline respectively.
4. a kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular as claimed in claim 3, feature exist
In：It is described go out liquid stream road middle part connect two lateral lines connecting tube on be provided with cooling liquid outlet connector.
5. a kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular as claimed in claim 3, feature exist
In：The height and position of all liquid inlets is identical, it is described enter liquid stream road be specially c-type structure pipeline, it is described enter liquid stream road
Two lateral lines connect the liquid inlet of corresponding position by first external pipeline respectively.
6. a kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular as claimed in claim 5, feature exist
In：It is described enter liquid stream road middle part connect two lateral lines connecting tube on be provided with coolant inlet connector.
7. a kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular as claimed in claim 5, feature exist
In：The height of the liquid outlet is higher than the height of the liquid inlet, it is described go out liquid stream road be located at it is described enter liquid stream road surface
Corresponding position parallel arrangement.
8. a kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular as claimed in claim 5, feature exist
In：The height of the liquid inlet is higher than the height of the liquid outlet, it is described enter liquid stream road be located at it is described go out liquid stream road surface
Corresponding position parallel arrangement.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820230818.6U CN207938597U (en) | 2018-02-09 | 2018-02-09 | A kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular |
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| CN201820230818.6U CN207938597U (en) | 2018-02-09 | 2018-02-09 | A kind of cooling water channel structure being applicable in plane thermal conductivity power semiconductor modular |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172558A (en) * | 2018-02-09 | 2018-06-15 | 苏州绿控新能源科技有限公司 | A kind of cooling water channel structure for being applicable in plane thermal conductivity power semiconductor modular |
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2018
- 2018-02-09 CN CN201820230818.6U patent/CN207938597U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172558A (en) * | 2018-02-09 | 2018-06-15 | 苏州绿控新能源科技有限公司 | A kind of cooling water channel structure for being applicable in plane thermal conductivity power semiconductor modular |
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