CN207938006U - Ultra-thin fingerprint recognition device for smart mobile phone - Google Patents
Ultra-thin fingerprint recognition device for smart mobile phone Download PDFInfo
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- CN207938006U CN207938006U CN201720982970.5U CN201720982970U CN207938006U CN 207938006 U CN207938006 U CN 207938006U CN 201720982970 U CN201720982970 U CN 201720982970U CN 207938006 U CN207938006 U CN 207938006U
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Abstract
The utility model discloses a kind of ultra-thin waterproof fingerprint recognition module, including cover board, TSV encapsulation fingerprints chip, basic ring and flexible PCB, the basic ring bottom has a convex edge to extend internally, in the TSV encapsulation fingerprint chip insertion basic ring and its lower surface edge is connected with convex edge, described flexible PCB one end is chip interconnecting piece, the other end is connector mounting portion, and the chip interconnecting piece bonding of the middle section and flexible PCB of TSV encapsulation fingerprint chips lower surface connects；Bending part, middle interconnecting piece are disposed between chip interconnecting piece and connector mounting portion, between chip interconnecting piece and middle interconnecting piece, the thickness of the TSV encapsulation fingerprint chip is 0.2 ~ 0.4mm for the bending part.Ultra-thin fingerprint recognition device of the utility model for smart mobile phone breaks through conventional fingerprint module metal ring structure, reduces metal ring thickness and length and width size, and is conducive to fully reduce fingerprint modular volume to interiors of products space utilization.
Description
Technical field
The utility model is related to a kind of fingerprint modules, belong to technical field of semiconductor encapsulation.
Background technology
Since fingerprint has the characteristics such as unchangeable property, uniqueness, by identifying that fingerprint can accurately and reliably be known
Other user identity.Fingerprint recognition module is exactly to use fingerprint identification technology, fingerprint image that is convenient, rapidly obtaining user, into
And to device that the identity of user is identified.But existing fingerprint recognition module all compare it is partially thick, for mobile phone volume with account for
For screen than there is very big problem, the electronic products such as mobile phone/laptop thickness can be more and more thinner, and screen accounts for screen than requiring increasingly
Greatly, future market has increasing need for smaller, thinner fingerprint recognition module.
Invention content
The utility model aim is to provide a kind of ultra-thin fingerprint recognition device for smart mobile phone, this is used for smart mobile phone
Ultra-thin fingerprint recognition device break through conventional fingerprint module metal ring structure, reduce metal ring thickness and length and width ruler
It is very little, and be conducive to fully reduce fingerprint modular volume to interiors of products space utilization.
In order to achieve the above objectives, the technical solution adopted in the utility model is：A kind of ultra-thin waterproof fingerprint recognition module, packet
Including cover board, TSV encapsulation fingerprints chip, basic ring and flexible PCB, the basic ring bottom has a convex edge to extend internally,
In the TSV encapsulation fingerprint chip insertion basic ring and its lower surface edge is connected with convex edge, the flexible PCB
One end is chip interconnecting piece, and the other end is connector mounting portion, the middle section of TSV encapsulation fingerprint chip lower surface with it is soft
Property circuit board chip interconnecting piece bonding connection；It is disposed with bending between chip interconnecting piece and connector mounting portion
Portion, middle interconnecting piece, between chip interconnecting piece and middle interconnecting piece, the TSV encapsulates fingerprint chip for the bending part
Thickness is 0.2 ~ 0.4mm；
Capacitor element, resistance device and inductance component are installed, an epoxy glue adhesion coating is covered on the middle interconnecting piece
The capacitor element, resistance device and inductance component surface and positioned at capacitor element, resistance device and inductance component periphery
Flexible PCB region.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in said program, the basic ring shape is round, rectangular, oval or track type.
2. in said program, the chip interconnecting piece edge of the flexible PCB has one side glue-line.
3. in said program, it is located at and states region both sides between middle interconnecting piece and connector mounting portion and be provided with indent
Hole.
4. in said program, there is gap slot, this gap slot to encapsulate fingerprint chip with TSV for the end of the convex edge
Between pass through seal glue bond.
Since above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
1. the utility model is used for the ultra-thin fingerprint recognition device of smart mobile phone, chip is encapsulated using TSV, and volume is apparent
Reduce, thickness is optimized to 0.3mm by 0.7mm before, and module thickness is optimized to 0.7mm by 1mm, and basic ring bottom is inside with one
The convex edge of extension, the TSV encapsulation fingerprint chip insertion basic ring is interior and its lower surface edge is connected with convex edge,
Break through conventional fingerprint module metal ring structure, reduce metal ring thickness and length and width size, TSV encapsulate fingerprint chip with
Basic ring and flexible PCB binding force are more secured, can meet the ultra-thin of electronic products such as future market mobile phone/laptop and set
Meter demand；Secondly, bending part, middle interconnecting piece, institute are disposed between chip interconnecting piece and connector mounting portion
State bending part has certain flexure region between chip interconnecting piece and middle interconnecting piece, is conducive to fully to interiors of products
Space utilization reduces fingerprint modular volume.
2. the utility model is used for the ultra-thin fingerprint recognition device of smart mobile phone, capacitance is installed on in-between interconnecting piece
Device, resistance device and inductance component, an epoxy glue adhesion coating are covered in the capacitor element, resistance device and inductance component surface
And positioned at capacitor element, the flexible PCB region of resistance device and inductance component periphery, be conducive to reinforce capacitor element, electricity
Device and inductance component and flexible PCB bonding strength are hindered, so that device is not easy to fall off, device and sky has also been isolated
The contact of gas, it is electrically bad caused by preventing humidity from aoxidizing；Secondly, the end of convex edge has gap slot, this gap slot
By sealing glue bond between TSV encapsulation fingerprint chips, overflowing between TSV encapsulation fingerprint chips and basic ring is effectively prevented
Glue maintains the flatness of TSV encapsulation fingerprint chips, improves the water resistance of module.
Description of the drawings
Attached drawing 1 is the ultra-thin fingerprint recognition device structural schematic diagram that the utility model is used for smart mobile phone；
Attached drawing 2 is the ultra-thin fingerprint recognition device partial structural diagram of the utility model one；
Attached drawing 3 is the ultra-thin fingerprint recognition device partial structural diagram of the utility model two.
In the figures above：1, cover board；2, TSV encapsulates fingerprint chip；3, basic ring；4, flexible PCB；41, chip connects
Portion；42, connector mounting portion；43, middle interconnecting piece；44, bending part；5, convex edge；61, capacitor element；62, resistor
Part；63, inductance component；7, epoxy glue adhesion coating；8, side glue-line；9, concave hole；10, gap slot；11, fluid sealant.
Specific implementation mode
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of ultra-thin waterproof fingerprint recognition module, it is characterised in that：Fingerprint chip is encapsulated including cover board 1, TSV
2, there is a convex edge 5 to extend internally, the TSV to encapsulate fingerprint core for basic ring 3 and flexible PCB 4,3 bottom of the basic ring
Piece 2 is embedded in basic ring 3 and its lower surface edge is connected with convex edge 5, and 4 one end of the flexible PCB connects for chip
Portion 41, the other end are connector mounting portion 42, the middle section and flexible PCB 4 of 2 lower surface of TSV encapsulation fingerprints chip
Chip interconnecting piece 41 bonding connection；It is disposed with bending part between chip interconnecting piece 41 and connector mounting portion 42
44, middle interconnecting piece 43, between chip interconnecting piece 41 and middle interconnecting piece 43, the TSV encapsulation refers to the bending part 44
The thickness of line chip 2 is 0.25mm；
Capacitor element 61, resistance device 62 and inductance component 63, a Wear Characteristics of Epoxy Adhesive are installed on the middle interconnecting piece 43
Layer 7 is covered in the capacitor element 61, resistance device 62 and 63 surface of inductance component and positioned at capacitor element 61, resistance device
62 and 63 periphery of inductance component 4 region of flexible PCB.
3 shape of above-mentioned basic ring is circle, and 41 edge of chip interconnecting piece of above-mentioned flexible PCB 4 has one side glue-line 8.
The end of above-mentioned convex edge 5 has gap slot 10, by close between this gap slot and TSV encapsulation fingerprints chip 2
Sealing 11 bonds.
On be set forth in region both sides between middle interconnecting piece 43 and connector mounting portion 42 and be provided with concave hole 9.
Embodiment 2：A kind of ultra-thin waterproof fingerprint recognition module, it is characterised in that：Fingerprint chip is encapsulated including cover board 1, TSV
2, there is a convex edge 5 to extend internally, the TSV to encapsulate fingerprint core for basic ring 3 and flexible PCB 4,3 bottom of the basic ring
Piece 2 is embedded in basic ring 3 and its lower surface edge is connected with convex edge 5, and 4 one end of the flexible PCB connects for chip
Portion 41, the other end are connector mounting portion 42, the middle section and flexible PCB 4 of 2 lower surface of TSV encapsulation fingerprints chip
Chip interconnecting piece 41 bonding connection；It is disposed with bending part between chip interconnecting piece 41 and connector mounting portion 42
44, middle interconnecting piece 43, between chip interconnecting piece 41 and middle interconnecting piece 43, the TSV encapsulation refers to the bending part 44
The thickness of line chip 2 is 0.3mm；
Capacitor element 61, resistance device 62 and inductance component 63, a Wear Characteristics of Epoxy Adhesive are installed on the middle interconnecting piece 43
Layer 7 is covered in the capacitor element 61, resistance device 62 and 63 surface of inductance component and positioned at capacitor element 61, resistance device
62 and 63 periphery of inductance component 4 region of flexible PCB.
3 shape of above-mentioned basic ring is ellipse, and 41 edge of chip interconnecting piece of above-mentioned flexible PCB 4 has one side glue-line 8.
The end of above-mentioned convex edge 5 has gap slot 10, by close between this gap slot and TSV encapsulation fingerprints chip 2
Sealing 11 bonds.
When using above-mentioned ultra-thin fingerprint recognition device for smart mobile phone, chip is encapsulated using TSV, and volume obviously subtracts
Small, thickness is optimized to 0.3mm by 0.7mm before, and module thickness is optimized to 0.7mm by 1mm, and basic ring bottom has one inwardly to prolong
The convex edge stretched, TSV is encapsulated in fingerprint chip insertion basic ring and its lower surface edge is connected with convex edge, breaks through and passes
Unite fingerprint module metal ring structure, reduce metal ring thickness and length and width size, TSV encapsulate fingerprint chip and basic ring and
Flexible PCB binding force is more secured, can meet the ultrathin design demand of the electronic products such as future market mobile phone/laptop；
Secondly, bending part, middle interconnecting piece, the bending part are disposed between chip interconnecting piece and connector mounting portion
There is certain flexure region between chip interconnecting piece and middle interconnecting piece, be conducive to fully to interiors of products space profit
With reduction fingerprint modular volume；Again, be conducive to reinforce capacitor element, resistance device and inductance component and flexible PCB
Contact of the device with air has also been isolated so that device is not easy to fall off in bonding strength, prevents electricity caused by moist aoxidize
Property is bad.
Above-described embodiment is only the technical concepts and features for illustrating the utility model, and its object is to allow be familiar with technique
Personage can understand the content of the utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
It is all according to equivalent change or modification made by the spirit of the present invention essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (5)
1. a kind of ultra-thin fingerprint recognition device for smart mobile phone, it is characterised in that：Including cover board（1）, TSV encapsulate fingerprint core
Piece（2）, basic ring（3）And flexible PCB（4）, the basic ring（3）Bottom has a convex edge to extend internally（5）, described
TSV encapsulates fingerprint chip（2）Embedded basic ring（3）Interior and its lower surface edge and convex edge（5）It connects, the flexible electrical
Road plate（4）One end is chip interconnecting piece（41）, the other end is connector mounting portion（42）, the TSV encapsulation fingerprint chip（2）Under
The middle section and flexible PCB on surface（4）Chip interconnecting piece（41）Bonding connection；Positioned at chip interconnecting piece（41）And even
Connect device mounting portion（42）Between be disposed with bending part（44）, middle interconnecting piece（43）, the bending part（44）Positioned at chip
Interconnecting piece（41）And middle interconnecting piece（43）Between, the TSV encapsulates fingerprint chip（2）Thickness be 0.2 ~ 0.4mm；
The middle interconnecting piece（43）On capacitor element is installed（61）, resistance device（62）And inductance component（63）, an epoxy
Adhesive layer（7）It is covered in the capacitor element（61）, resistance device（62）And inductance component（63）Surface and be located at capacitor
Part（61）, resistance device（62）And inductance component（63）The flexible PCB on periphery（4）Region.
2. the ultra-thin fingerprint recognition device according to claim 1 for smart mobile phone, it is characterised in that：The inward flange
Portion（5）End have gap slot（10）, this gap slot and TSV encapsulate fingerprint chip（2）Between pass through fluid sealant（11）Bonding.
3. the ultra-thin fingerprint recognition device according to claim 1 for smart mobile phone, it is characterised in that：The basic ring
（3）Shape is round, rectangular, oval or track type.
4. the ultra-thin fingerprint recognition device according to claim 1 for smart mobile phone, it is characterised in that：The flexible electrical
Road plate（4）Chip interconnecting piece（41）Edge has one side glue-line（8）.
5. the ultra-thin fingerprint recognition device according to claim 1 for smart mobile phone, it is characterised in that：It is located in stating
Between interconnecting piece（43）With connector mounting portion（42）Between region both sides be provided with concave hole（9）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720982970.5U CN207938006U (en) | 2017-08-08 | 2017-08-08 | Ultra-thin fingerprint recognition device for smart mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720982970.5U CN207938006U (en) | 2017-08-08 | 2017-08-08 | Ultra-thin fingerprint recognition device for smart mobile phone |
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| Publication Number | Publication Date |
|---|---|
| CN207938006U true CN207938006U (en) | 2018-10-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720982970.5U Active CN207938006U (en) | 2017-08-08 | 2017-08-08 | Ultra-thin fingerprint recognition device for smart mobile phone |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110210388A (en) * | 2019-05-31 | 2019-09-06 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
-
2017
- 2017-08-08 CN CN201720982970.5U patent/CN207938006U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110210388A (en) * | 2019-05-31 | 2019-09-06 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
| CN110210388B (en) * | 2019-05-31 | 2021-03-09 | 维沃移动通信有限公司 | Fingerprint module and mobile terminal |
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