CN207904400U - A kind of more size single-wafer electroplating clamps - Google Patents
A kind of more size single-wafer electroplating clamps Download PDFInfo
- Publication number
- CN207904400U CN207904400U CN201820054445.1U CN201820054445U CN207904400U CN 207904400 U CN207904400 U CN 207904400U CN 201820054445 U CN201820054445 U CN 201820054445U CN 207904400 U CN207904400 U CN 207904400U
- Authority
- CN
- China
- Prior art keywords
- bottom frame
- clamp plate
- upper ledge
- lower clamp
- hoop
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 17
- 235000005121 Sorbus torminalis Nutrition 0.000 claims description 3
- 244000152100 Sorbus torminalis Species 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a kind of more size single-wafer electroplating clamps,Including lower hoop,It is provided with the first bottom frame on the inside of the lower hoop,The side of first bottom frame is provided with the second bottom frame,The side of second bottom frame far from the first bottom frame is provided with third bottom frame,First bottom frame,Second bottom frame and third bottom frame are an integral structure with lower hoop,It is provided with the first lower clamp plate on the inside of first bottom frame,It is provided with the second lower clamp plate on the inside of second bottom frame,The utility model is provided with the first upper clamp plate and the first lower clamp plate,The first upper clamp plate and the first lower clamp plate being arranged form round geometrical clamp after engaging,And the groove by being opened up on clamping plate can prevent wafer from sliding,The clamping plate of the corresponding size of wafer selection according to different model is fixed,Realize the wafer of a fixture while compatible sizes,The electroplating clamp is simple in structure simultaneously,Simple operation,Good anti-vibration,The wafer of clamping will not shake.
Description
Technical field
The utility model belongs to technology of semiconductor chips field, and in particular to a kind of more size single-wafer electroplating clamps.
Background technology
Wafer refers to the silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer,
Various circuit component structures can be manufactured on silicon, and become the IC products for having specific electrical functionality, and plating is exactly
The process for plating the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is to make gold using electrolysis
Belong to or the technique of the surface of other materials product attachment layer of metal film prevents metal from aoxidizing to play, improves wearability, leads
Electrically, the effects that reflective, corrosion resistance and having improved aesthetic appearance.
But single-wafer electroplating clamp using effect currently on the market is bad, complicated, cumbersome, vibration resistance
It is poor, easily make wafer broken, fixed wafer model is single, and a fixture cannot be solid into property to the single-wafer of sizes
It is fixed, multiple single-wafers cannot be electroplated simultaneously.
Utility model content
The purpose of this utility model is to provide a kind of more size single-wafer electroplating clamps, to solve above-mentioned background technology
Middle proposition it is complicated, cumbersome, vibration resistance is poor, easily makes wafer broken, fixed wafer model is single, a fixture
The problem of single-wafer of sizes cannot being fixed into property, multiple single-wafers cannot be electroplated simultaneously.
To achieve the above object, the utility model provides the following technical solutions：A kind of more size single-wafer electroplating clamps,
Including lower hoop, it being provided with the first bottom frame on the inside of the lower hoop, the side of first bottom frame is provided with the second bottom frame, and described
Side of two bottom frames far from the first bottom frame is provided with third bottom frame, first bottom frame, the second bottom frame and third bottom frame and lower hoop
It is an integral structure, the first lower clamp plate is provided on the inside of first bottom frame, second is provided on the inside of second bottom frame
Lower clamp plate is provided with third lower clamp plate, the third lower clamp plate, the second lower clamp plate and first time folder on the inside of the third bottom frame
The bottom end of plate is both provided with lower fixed link, and the third lower clamp plate, the second lower clamp plate and the first lower clamp plate pass through lower fixed link
It is fixedly connected with third bottom frame, the second bottom frame and the first bottom frame, hoop, the inside of the upper hoop is provided with above the lower hoop
Be provided with the first upper ledge, the side of first upper ledge is provided with the second upper ledge, second upper ledge far from the first upper ledge one
Side is provided with third upper ledge, and the first upper clamp plate is provided on the inside of first upper ledge, is provided on the inside of second upper ledge
Second upper clamp plate is provided with third upper clamp plate, first upper clamp plate, the second upper clamp plate and third on the inside of the third upper ledge
The top of upper clamp plate is both provided with fixed link, and first upper clamp plate, the second upper clamp plate and third upper clamp plate are by upper solid
Fixed pole is fixedly connected with the first upper ledge, the second upper ledge and third upper ledge, and first upper clamp plate, the second upper clamp plate press from both sides in third
Fluted, first bottom frame, the second bottom frame and are opened up on plate, third lower clamp plate, the second lower clamp plate and the first lower clamp plate
Hinge is both provided on three bottom frames, first bottom frame, the second bottom frame and third bottom frame pass through hinge and the first upper ledge, second
Upper ledge and the rotation connection of third upper ledge, first bottom frame, the side of the second bottom frame and third bottom frame far from hinge are both provided with
Fixing buckle.
Preferably, first upper clamp plate is identical as the shape of the first lower clamp plate.
Preferably, it is opened up on first upper ledge, the second upper ledge and third upper ledge fluted.
Preferably, the lower hoop is hollow rectangular parallelepiped structure.
Preferably, it is provided with anti-skid chequer on the upper hoop.
Compared with prior art, the utility model has the beneficial effects that：
(1) the utility model is provided with the first upper clamp plate and the first lower clamp plate, the first upper clamp plate of setting and first time folder
Plate forms round geometrical clamp after engaging, and the groove by being opened up on clamping plate can prevent wafer from sliding, according to different model
The clamping plate of the corresponding size of wafer selection be fixed, realize the wafer of a fixture compatible sizes simultaneously, be somebody's turn to do simultaneously
Electroplating clamp is simple in structure, simple operation, good anti-vibration, and the wafer of clamping will not shake.
(2) the utility model is provided with the first upper ledge, the second upper ledge and third upper ledge, passes through the first upper ledge of setting, the
Two upper ledges and third upper ledge coordinate corresponding bottom frame again, enable the electroplating clamp that multiple single-wafers to be clamped simultaneously and carry out electricity
Plating, the plating quantity of single-wafer is greatly improved within the set time, is improved work efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the vertical view of the utility model；
Fig. 3 is the left view of the utility model；
Fig. 4 is the right view of the utility model；
Fig. 5 is the outside drawing of the first lower clamp plate of the utility model；
In figure：The first bottom frames of 1-, 2- hinges, the first upper ledges of 3-, hoop, the upper fixed links of 5-, the first upper clamp plates of 6-, 7- on 4-
Under two upper clamp plates, 8- thirds upper clamp plate, 9- thirds lower clamp plate, the second lower clamp plates of 10-, the first lower clamp plates of 11-, 12- under hoop, 13-
Fixed link, the second upper ledges of 14-, 15- thirds upper ledge, 16- thirds bottom frame, the second bottom frames of 17-, 18- fixing buckles, 19- grooves.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 5 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of more size single-wafer electroplating clamps, packet
Lower hoop 12 is included, the first bottom frame 1, the second bottom frame 17 and third bottom frame 16 are fixed as one formula mechanism by lower hoop 12, easy to remove, under
The inside of hoop 12 is provided with the first bottom frame 1, and the side of the first bottom frame 1 is provided with the second bottom frame 17, and the second bottom frame 17 is far from first
The side of bottom frame 1 is provided with third bottom frame 16, and the first bottom frame 1, the second bottom frame 17 and third bottom frame 16 are integral type with lower hoop 12
The inside of structure, the first bottom frame 1 is provided with the first lower clamp plate 11, and the inside of the second bottom frame 17 is provided with the second lower clamp plate 10, the
The inside of three bottom frames 16 is provided with third lower clamp plate 9, third lower clamp plate 9, the second lower clamp plate 10 and the first lower clamp plate 11 bottom end
It is both provided with lower fixed link 13, third lower clamp plate 9, the second lower clamp plate 10 and the first lower clamp plate 11 pass through lower fixed link 13 and
Three bottom frames 16, the second bottom frame 17 are fixedly connected with the first bottom frame 1, and the top of lower hoop 12 is provided with hoop 4, and the inside of upper hoop 4 is set
It is equipped with the first upper ledge 3, the side of the first upper ledge 3 is provided with the second upper ledge 14, and side of second upper ledge 14 far from the first upper ledge 3 is set
It is equipped with third upper ledge 15, the inside of the first upper ledge 3 is provided with the first upper clamp plate 6, and the first upper clamp plate 6 coordinates 11 groups of the first lower clamp plate
At complete clamping plate, the inside of the second upper ledge 14 is provided with the second upper clamp plate 7, and the inside of third upper ledge 15, which is provided in third, to press from both sides
Plate 8, the top of the first upper clamp plate 6, the second upper clamp plate 7 and third upper clamp plate 8 are both provided with fixed link 5, the first upper clamp plate 6,
Second upper clamp plate 7 and third upper clamp plate 8 are fixed by upper fixed link 5 and the first upper ledge 3, the second upper ledge 14 and third upper ledge 15
Connection, the first upper clamp plate 6, the second upper clamp plate 7, third upper clamp plate 8, third lower clamp plate 9, the second lower clamp plate 10 and the first lower clamp plate
Fluted 19 are opened up on 11, are both provided with hinge 2 on the first bottom frame 1, the second bottom frame 17 and third bottom frame 16, are passed through hinge 2
It is rotatablely connected, the first bottom frame 1, the second bottom frame 17 and third bottom frame 16 pass through hinge 2 and the first upper ledge 3, the second upper ledge
14 and third upper ledge 15 be rotatablely connected, the first bottom frame 1, the side of the second bottom frame 17 and third bottom frame 16 far from hinge 2 are respectively provided with
There is fixing buckle 18.
In order to enable the first upper clamp plate 6 and the first lower clamp plate 11 to form full-round structure, in the present embodiment, it is preferred that
First upper clamp plate 6 is identical as the shape of the first lower clamp plate 11.
For the ease of placing the fixing buckle 18 being arranged on the first upper ledge 3, the second upper ledge 14 and third upper ledge 15, the present embodiment
In, it is preferred that it is opened up on the first upper ledge 3, the second upper ledge 14 and third upper ledge 15 fluted.
In order to play the role of banding, in the present embodiment, it is preferred that lower hoop 12 is hollow rectangular parallelepiped structure.
For the ease of grasping, in the present embodiment, it is preferred that above bind round on 4 and be provided with anti-skid chequer.
The operation principle and process for using of the utility model：Under first bottom frame 1, the second bottom frame 17 and third bottom frame 16 pass through
Hoop 12 is fixed as a bottom frame entirety, and the first upper ledge 3, the second upper ledge 14 and third upper ledge 15 are fixed as by upper hoop 4 on one
Frame is whole, and upper ledge and bottom frame are rotatablely connected by hinge 2, and upper ledge is fixedly connected with bottom frame by fixing buckle 18, and when use opens
The clamping plate of upper ledge, the corresponding size of wafer selection according to different model is fixed, such as will match with the first lower clamp plate 11
Wafer, be placed into the groove 19 being arranged on the first lower clamp plate 11, be rotated further by upper ledge, pass through the first upper clamp plate 6 cooperation first
Lower clamp plate 11 forms complete clamping plate and single-wafer is fixed on fixture, while can decide whether to place different shaped as needed
Number wafer is electroplated together, and subsequent electroplating operations can be carried out after fixing wafer.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of more size single-wafer electroplating clamps, including lower hoop (12), it is characterised in that：It is set on the inside of the lower hoop (12)
It is equipped with the first bottom frame (1), the side of first bottom frame (1) is provided with the second bottom frame (17), and second bottom frame (17) is separate
The side of first bottom frame (1) is provided with third bottom frame (16), first bottom frame (1), the second bottom frame (17) and third bottom frame
(16) it is an integral structure with lower hoop (12), is provided with the first lower clamp plate (11) on the inside of first bottom frame (1), described second
It is provided with the second lower clamp plate (10) on the inside of bottom frame (17), third lower clamp plate (9) is provided on the inside of the third bottom frame (16),
The bottom end of the third lower clamp plate (9), the second lower clamp plate (10) and the first lower clamp plate (11) is both provided with lower fixed link (13), institute
Third lower clamp plate (9), the second lower clamp plate (10) and the first lower clamp plate (11) are stated by lower fixed link (13) and third bottom frame
(16), the second bottom frame (17) is fixedly connected with the first bottom frame (1), is provided with hoop (4) above the lower hoop (12), it is described on
It being provided with the first upper ledge (3) on the inside of hoop (4), the side of first upper ledge (3) is provided with the second upper ledge (14), and described second
Upper ledge (14) is provided with third upper ledge (15) far from the side of the first upper ledge (3), and the is provided on the inside of first upper ledge (3)
One upper clamp plate (6) is provided with the second upper clamp plate (7), the inside of the third upper ledge (15) on the inside of second upper ledge (14)
It is provided with third upper clamp plate (8), the top of first upper clamp plate (6), the second upper clamp plate (7) and third upper clamp plate (8) is all provided with
It is equipped with fixed link (5), first upper clamp plate (6), the second upper clamp plate (7) and third upper clamp plate (8) pass through upper fixed link
(5) it is fixedly connected with the first upper ledge (3), the second upper ledge (14) and third upper ledge (15), first upper clamp plate (6), on second
It is offered on clamping plate (7), third upper clamp plate (8), third lower clamp plate (9), the second lower clamp plate (10) and the first lower clamp plate (11)
Groove (19), is both provided with hinge (2) on first bottom frame (1), the second bottom frame (17) and third bottom frame (16), and described first
Bottom frame (1), the second bottom frame (17) and third bottom frame (16) pass through hinge (2) and the first upper ledge (3), the second upper ledge (14) and the
Three upper ledges (15) are rotatablely connected, and the one of the separate hinge (2) of first bottom frame (1), the second bottom frame (17) and third bottom frame (16)
Side is both provided with fixing buckle (18).
2. a kind of more size single-wafer electroplating clamps according to claim 1, it is characterised in that：First upper clamp plate
(6) identical as the shape of the first lower clamp plate (11).
3. a kind of more size single-wafer electroplating clamps according to claim 1, it is characterised in that：First upper ledge
(3), it is opened up on the second upper ledge (14) and third upper ledge (15) fluted.
4. a kind of more size single-wafer electroplating clamps according to claim 1, it is characterised in that：The lower hoop (12) is
Hollow rectangular parallelepiped structure.
5. a kind of more size single-wafer electroplating clamps according to claim 1, it is characterised in that：On the upper hoop (4)
It is provided with anti-skid chequer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820054445.1U CN207904400U (en) | 2018-01-13 | 2018-01-13 | A kind of more size single-wafer electroplating clamps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820054445.1U CN207904400U (en) | 2018-01-13 | 2018-01-13 | A kind of more size single-wafer electroplating clamps |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207904400U true CN207904400U (en) | 2018-09-25 |
Family
ID=63567364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820054445.1U Expired - Fee Related CN207904400U (en) | 2018-01-13 | 2018-01-13 | A kind of more size single-wafer electroplating clamps |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207904400U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109056018A (en) * | 2018-10-15 | 2018-12-21 | 安徽宏实自动化装备有限公司 | A kind of ultrasonic enhancing electroplanting device |
| CN111809223A (en) * | 2020-08-11 | 2020-10-23 | 硅密芯镀(海宁)半导体技术有限公司 | Wafer clamp, wafer moving mechanism comprising same and wafer electroplating equipment |
-
2018
- 2018-01-13 CN CN201820054445.1U patent/CN207904400U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109056018A (en) * | 2018-10-15 | 2018-12-21 | 安徽宏实自动化装备有限公司 | A kind of ultrasonic enhancing electroplanting device |
| CN109056018B (en) * | 2018-10-15 | 2020-05-12 | 安徽宏实自动化装备有限公司 | Ultrasonic wave reinforcing electroplating device |
| CN111809223A (en) * | 2020-08-11 | 2020-10-23 | 硅密芯镀(海宁)半导体技术有限公司 | Wafer clamp, wafer moving mechanism comprising same and wafer electroplating equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180925 |