CN207884993U - High temperature resistant composite silicone band for pcb board impregnation - Google Patents
High temperature resistant composite silicone band for pcb board impregnation Download PDFInfo
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- CN207884993U CN207884993U CN201721860668.9U CN201721860668U CN207884993U CN 207884993 U CN207884993 U CN 207884993U CN 201721860668 U CN201721860668 U CN 201721860668U CN 207884993 U CN207884993 U CN 207884993U
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- pcb board
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Abstract
The utility model discloses a kind of high temperature resistant composite silicone band for pcb board impregnation, includes silica gel base, antiseepage antireflective coating layer, adhering agent layer, release layer, high-temperature-resistant layer, thermal insulation layer and anti-puncture layer；The antiseepage antireflective coating layer is covered in the bottom surface of silica gel base, the adhering agent layer is coated in the bottom surface of antiseepage antireflective coating layer, the release layer is covered in the bottom surface of adhering agent layer, the high-temperature-resistant layer is covered on the surface of silica gel base, the thermal insulation layer is covered on the surface of high-temperature-resistant layer, which is covered on the surface of thermal insulation layer.By being equipped with antiseepage antireflective coating layer, adhering agent layer, release layer, high-temperature-resistant layer, thermal insulation layer and anti-puncture layer; so that this product is reasonable in design; have the functions such as impermeable, high temperature resistant, heat-insulated and anti-puncture; heat-resisting quantity is more preferable; insulating properties is more preferably; it can play a very good protection to pcb board, the whole performance of product is more preferable, meets the needs used.
Description
Technical field
The utility model is related to silicone band field technologies, refer in particular to a kind of high temperature resistant composite for pcb board impregnation
Silicone band.
Background technology
It in the making production process of pcb board, needs to carry out impregnation process, in this process, to block the plating on pcb board
Layer gold（That is golden finger）With prevent electroplate liquid immerse and pollution, it is often necessary to using silicone band on pcb board Gold plated Layer carry out
Protection.
Currently, more single applied to the silica gel band structure during pcb board impregnation, heat-resisting quantity is insufficient, and insulating properties is not
It is good, it cannot play a very good protection.Therefore, it is necessary to be improved to current silicone band.
Utility model content
In view of this, the utility model is in view of the existing deficiencies of the prior art, main purpose is to provide a kind of for PCB
The high temperature resistant composite silicone band of plate impregnation, can effectively solve that existing silicone band heat-resisting quantity is insufficient, insulating properties is bad leads
The problem of cause cannot play a very good protection.
To achieve the above object, the utility model is using following technical solution：
A kind of high temperature resistant composite silicone band for pcb board impregnation includes silica gel base, antiseepage antireflective coating layer, adhesion
Oxidant layer, release layer, high-temperature-resistant layer, thermal insulation layer and anti-puncture layer；The antiseepage antireflective coating layer is covered in the bottom surface of silica gel base, this is viscous
The bottom surface that oxidant layer is coated in antiseepage antireflective coating layer, which is covered in the bottom surface of adhering agent layer, which is covered in silicon
On the surface of matrix layer, which is covered on the surface of high-temperature-resistant layer, which is covered on the surface of thermal insulation layer.
As a preferred embodiment, the thickness of the silica gel base is 30-35 μm.
As a preferred embodiment, the adhering agent layer is silicone material.
As a preferred embodiment, the anti-surface for piercing through layer is covered with dyed layer.
As a preferred embodiment, the surface of the dyed layer is covered with antistatic layer.
The utility model has clear advantage and advantageous effect compared with prior art, specifically, by above-mentioned technology
Known to scheme：
By being equipped with antiseepage antireflective coating layer, adhering agent layer, release layer, high-temperature-resistant layer, thermal insulation layer and anti-puncture layer so that
This product is reasonable in design, has the functions such as impermeable, high temperature resistant, heat-insulated and anti-puncture, heat-resisting quantity is more preferable, and insulating properties is more
It is good, it can play a very good protection to pcb board, the whole performance of product is more preferable, meets the needs used.
More clearly to illustrate the structure feature and effect of the utility model, come below in conjunction with the accompanying drawings with specific embodiment pair
The utility model is described in detail.
Description of the drawings
Fig. 1 is the sectional view of the preferred embodiment of the utility model.
Description of drawing identification：
11, silica gel base 12, antiseepage antireflective coating layer
13, adhering agent layer 14, release layer
15, high-temperature-resistant layer 16, thermal insulation layer
17, anti-puncture layer 18, dyed layer
19, antistatic layer.
Specific implementation mode
It please refers to shown in Fig. 1, that show the concrete structures of the preferred embodiment of the utility model, include silica gel base
Layer 11, antiseepage antireflective coating layer 12, adhering agent layer 13, release layer 14, high-temperature-resistant layer 15, thermal insulation layer 16 and anti-puncture layer 17.
The thickness of the silica gel base 11 is 30-35 μm；The antiseepage antireflective coating layer 12 is covered in the bottom surface of silica gel base 11, prevents
The thickness of permeation coating 12 is 15-20 μm, for realizing impermeable effect；The adhering agent layer 13 is coated in antiseepage antireflective coating layer
12 bottom surface, in the present embodiment, the adhering agent layer 13 are silicone material, are used for, and sticker Nian Jie with outside
The thickness of layer 13 is 14-18 μm；The release layer 14 is covered in the bottom surface of adhering agent layer 13, and release layer 14 is PET materials, thickness
It is 15-16 μm.
The high-temperature-resistant layer 15 is covered on the surface of silica gel base 11, and the high-temperature-resistant layer 15 is for realizing heat safe mesh
, and the thickness of high-temperature-resistant layer 15 is 20-22 μm；The thermal insulation layer 16 is covered on the surface of high-temperature-resistant layer 15, thermal insulation layer 16
Thickness be 18-22 μm, good heat-blocking action can be played；The anti-puncture layer 17 is covered on the surface of thermal insulation layer 16,
For realizing puncture-proof effect, thickness is 22-26 μm.
And the anti-surface for piercing through layer 17 is covered with dyed layer 18, dyed layer 18 is green, and dyed layer 18 is thickness
It is 15-18 μm；In addition, the surface of the dyed layer 18 is covered with antistatic layer 19, antistatic layer 19 is for realizing anlistatig
Purpose, thickness are 16-18 μm.
When making, silica gel base 11 is first molded, then, antiseepage antireflective coating layer 12 is pasted in silica gel base 11, then,
The bottom surface of antiseepage antireflective coating layer 12 coats sticker and forms adhering agent layer 13, then, release layer 14 is covered in adhering agent layer 13
Bottom surface then paste high-temperature-resistant layer 15 on the surface of silica gel base 11, then paste thermal insulation layer on the surface of high-temperature-resistant layer 15
16, then, anti-puncture layer 17 is pasted on the surface of thermal insulation layer 16, then, pastes dyed layer 18 on the anti-surface for piercing through layer 17, most
Afterwards, antistatic layer 19 is pasted on the surface of dyed layer 18.In use, release layer 14 is removed, then by adhering agent layer 13 and PCB
The surface of plate is bonded and covers the Gold plated Layer of pcb board.
The design focal point of the utility model is：By being equipped with antiseepage antireflective coating layer, adhering agent layer, release layer, resistance to height
Warm layer, thermal insulation layer and anti-puncture layer so that this product is reasonable in design, has impermeable, high temperature resistant, heat-insulated and anti-puncture etc.
Function, heat-resisting quantity is more preferable, and insulating properties more preferably, can play a very good protection to pcb board, the whole performance of product
More preferably, meet the needs used.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model
Any restrictions, therefore any trickle amendment made by the above technical examples according to the technical essence of the present invention, equivalent change
Change and modify, is still within the scope of the technical solutions of the present invention.
Claims (5)
1. a kind of high temperature resistant composite silicone band for pcb board impregnation, it is characterised in that：Include silica gel base, impermeable
Coating, adhering agent layer, release layer, high-temperature-resistant layer, thermal insulation layer and anti-puncture layer；The antiseepage antireflective coating layer is covered in silica gel base
Bottom surface, the adhering agent layer are coated in the bottom surface of antiseepage antireflective coating layer, which is covered in the bottom surface of adhering agent layer, the high-temperature-resistant layer
It is covered on the surface of silica gel base, which is covered on the surface of high-temperature-resistant layer, which is covered in thermal insulation layer
Surface on.
2. the high temperature resistant composite silicone band according to claim 1 for pcb board impregnation, it is characterised in that：The silicon
The thickness of matrix layer is 30-35 μm.
3. the high temperature resistant composite silicone band according to claim 1 for pcb board impregnation, it is characterised in that：It is described viscous
It is silicone material oxidant layer.
4. the high temperature resistant composite silicone band according to claim 1 for pcb board impregnation, it is characterised in that：It is described anti-
The surface for piercing through layer is covered with dyed layer.
5. the high temperature resistant composite silicone band according to claim 4 for pcb board impregnation, it is characterised in that：Described
The surface of chromatograph is covered with antistatic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721860668.9U CN207884993U (en) | 2017-12-27 | 2017-12-27 | High temperature resistant composite silicone band for pcb board impregnation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721860668.9U CN207884993U (en) | 2017-12-27 | 2017-12-27 | High temperature resistant composite silicone band for pcb board impregnation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207884993U true CN207884993U (en) | 2018-09-18 |
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ID=63503514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721860668.9U Active CN207884993U (en) | 2017-12-27 | 2017-12-27 | High temperature resistant composite silicone band for pcb board impregnation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207884993U (en) |
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2017
- 2017-12-27 CN CN201721860668.9U patent/CN207884993U/en active Active
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