CN207876620U - A kind of silicon chip conveying mechanism - Google Patents
A kind of silicon chip conveying mechanism Download PDFInfo
- Publication number
- CN207876620U CN207876620U CN201820279191.3U CN201820279191U CN207876620U CN 207876620 U CN207876620 U CN 207876620U CN 201820279191 U CN201820279191 U CN 201820279191U CN 207876620 U CN207876620 U CN 207876620U
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- silicon chip
- magazine
- conveyer chain
- conveying mechanism
- sprocket
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Abstract
The utility model discloses a kind of silicon chip conveying mechanisms, including driving device, drive sprocket, driven sprocket and conveyer chain, the driving device drives the drive sprocket, the conveyer chain to be set on the drive sprocket and the driven sprocket, and the conveyer chain is equipped with magazine;The utility model is transmitted silicon chip by sprocket wheel and chain, and silicon chip is accommodated using magazine, silicon chip is positioned, compared with prior art, not only heavy burden ability is stronger for the utility model, and it is steady in transmit process to greatly improve silicon chip, prevents silicon chip from colliding with.
Description
Technical field
The utility model is related to solar cell and its Module Manufacture Technology field, especially a kind of silicon chip conveying mechanism.
Background technology
In the preparation process of efficient heterojunction solar battery, for silicon chip silkscreen process, corresponding silver paste
Drying and its solidification are to ensure the important link of silk-screen printing quality.
To ensure that silicon chip has good quality, while to improve production efficiency, usually by automatic during product
Line straight line conveys silicon chip.Existing curing apparatus generally uses the mode of movement of guipure to carry out silicon chip conveying, but mesh-belt conveying
The load-bearing of mode is limited, also not steady enough to the transmission of silicon chip.
Therefore, it is necessary to provide a kind of silicon chip conveying mechanism, the above problem is improved.
Utility model content
The purpose of this utility model is to provide a kind of silicon chip conveying mechanism, in the prior art using mesh-belt conveying to solve
Not steady enough and the limited deficiency of load-bearing problem, the silicon chip conveying mechanism of the utility model existing for mode can ensure silicon chip
It is balanced in transmit process to place, and ability of bearing a heavy burden is stronger.
To achieve the goals above, the utility model provides the following technical solution:
A kind of silicon chip conveying mechanism, including driving device, drive sprocket, driven sprocket and conveyer chain, the driving device
It drives the drive sprocket, the conveyer chain to be set on the drive sprocket and the driven sprocket, is set on the conveyer chain
There is magazine.
Preferably, the drive sprocket includes the first drive sprocket and the second drive sprocket disposed in parallel, described driven
Sprocket wheel includes the first driven sprocket and the second driven sprocket disposed in parallel, and the conveyer chain includes that the first conveyer chain and second pass
Chain, first conveyer chain is sent to be set on first drive sprocket and first driven sprocket, second conveyer chain
It is set on second drive sprocket and second driven sprocket.
Preferably, further include bearing, the bearing includes pedestal and supporting rack, and support frame as described above is set to the pedestal
On, the driving device is set on the pedestal, and the drive sprocket and the driven sprocket are respectively arranged on support frame as described above
Both ends.
Preferably, further include tension part, the tension part be set to the conveyer chain lower section, the tension part with
The conveyer chain engagement cooperation.
Preferably, belt drive unit is equipped between the driving device and the drive sprocket.
Preferably, deceleration mechanism is additionally provided between the driving device and the drive sprocket.
Preferably, the magazine is the cavity body structure of top end opening, and partition board is vertically equipped on the bottom surface of the magazine, described
Partition board is parallel with the side wall of the magazine, and the magazine is separated into several sub- cavitys by the partition board, and the silicon chip is accommodated in institute
It states in sub- cavity.
Preferably, the magazine includes two side walls disposed in parallel and is symmetrical arranged crossbeam between the side walls,
It is provided with multiple columns on the crossbeam, forms groove between the column, the silicon chip is placed in the groove.
Preferably, supporting plate is equipped between the conveyer chain and the magazine, the supporting plate is equipped with slot, on the magazine
Equipped with the mating connection for passing through the slot and the protrusion with the supporting plate with the matched protrusion of the slot, the magazine.
Preferably, magnetic limited block is additionally provided on the supporting plate, when the protrusion coordinates with the slot, the magazine
Bottom is contacted with the magnetic limited block.
The beneficial effects of the utility model are:
The utility model provides a kind of silicon chip conveying mechanism, including driving device, drive sprocket, driven sprocket and transmission
Chain, the driving device drive the drive sprocket, the conveyer chain to be set on the drive sprocket and the driven sprocket,
The conveyer chain is equipped with magazine;The utility model is transmitted silicon chip by sprocket wheel and chain, and accommodates silicon using magazine
Piece positions silicon chip, and compared with prior art, not only heavy burden ability is stronger for the utility model, but also can greatly improve silicon
Piece is steady in transmit process, prevents silicon chip from colliding with.
Description of the drawings
Fig. 1 is the integrally-built axonometric drawing of the silicon chip conveying mechanism of the utility model embodiment;
Fig. 2 is the partial structural diagram of the silicon chip conveying mechanism of the utility model embodiment;
Fig. 3 is the magazine of the utility model embodiment and the structural schematic diagram of supporting plate;
Fig. 4 is a kind of schematic diagram of structure of the magazine of the utility model embodiment;
Fig. 5 is the schematic diagram of another structure of the magazine of the utility model embodiment.
Reference sign:
1- driving devices, 2- drive sprockets, 3- driven sprockets, 4- conveyer chains, 5- magazines, 6- pedestals, 7- supporting racks, 8- skins
Belt driver, 9- decelerations mechanism, 10- supporting plates, 11- magnetism limited blocks.
Specific implementation mode
The embodiments described below with reference to the accompanying drawings are exemplary, is only used for explaining the utility model, and cannot solve
It is interpreted as limitations of the present invention.
As depicted in figs. 1 and 2, a kind of silicon chip conveying mechanism of the embodiments of the present invention offer, including driving device 1,
Drive sprocket 2, driven sprocket 3 and conveyer chain 4, the driving device 1 drive the drive sprocket 2, the conveyer chain 4 to be set in
On the drive sprocket 2 and the driven sprocket 3, the conveyer chain 4 is equipped with magazine 5.The driving device 1 is preferably arranged to
Can adjust output rotating speed servo motor, when silicon chip in transmit process, can be conveyed according to specified speed.The magazine
5 are preferably detachably connected with the conveyer chain 4, and the both sides of the conveyer chain 4 are equipped with manipulator, are responsible for silicon chip being placed on material
In box 5, and magazine 5 is disassembled on transmission chain 4 or by magazine 5 from conveyer chain 4, without manual operation, is protected
Demonstrate,prove yield rate.At the same time, the both sides of the conveyer chain 4 are equipped with displacement sensor, the magazine 5 detected by displacement sensor
Location information, the operation of control machinery hand.The magazine 5 be preferably arranged to it is multiple, and in the length direction of the conveyer chain 4
On be uniformly distributed, ensure silicon chip equilibrium on conveyer chain 4 prevent, heating, heat preservation and the cooling of silicon chip of being more convenient for.
The application method of the utility model is:Silicon chip is placed in magazine 5, silicon chip is reliably positioned, and will
Magazine 5 is mounted on conveyer chain 4, subsequent start-up driving device 1, is rotated driving drive sprocket 2 by driving device 1, then
Driven sprocket 3 is imparted power to by transmission chain 4, driven sprocket 3 is made to also begin to rotate, magazine 5 is simultaneously as transmission chain 4 is sent out
Raw displacement, realizes the transmission of silicon chip, after magazine 5 follows transmission chain 4 to be transmitted to setting position, magazine 5 is integrally taken with silicon chip
Under, or silicon chip removed;By aforesaid operations step it is found that the silicon chip conveying mechanism of the utility model, by sprocket wheel and
Chain is transmitted silicon chip, and accommodates silicon chip using magazine 5 and positioned to silicon chip, and compared with prior art, this practicality is new
Not only heavy burden ability is stronger for type, but also it is steady in transmit process to greatly improve silicon chip, prevents silicon chip from colliding with.
In order to further enhance the bearing capacity of conveyer chain 4 so that conveyer chain 4 is more steady to the transmission of silicon chip, described
Drive sprocket 2 includes the first drive sprocket disposed in parallel and the second drive sprocket, and the driven sprocket 3 includes disposed in parallel
First driven sprocket and the second driven sprocket, the conveyer chain 4 include the first conveyer chain and the second conveyer chain, first transmission
Chain is set on first drive sprocket and first driven sprocket, and second conveyer chain is set in described second actively
On sprocket wheel and second driven sprocket.Wherein, the first drive sprocket and the second drive sprocket are preferably provided at same root driving
On axis, which is driven by driving device 1, and the first driven sprocket and the second driven sprocket are preferably provided at same root driven shaft
On, to improve integrally-built compactedness, improve the utilization ratio of energy.It is of course also possible to by drive sprocket 2, driven sprocket 3
2 or more are set as with the quantity of conveyer chain 4, to obtain higher supporting effect.
Further, further include bearing, the bearing includes pedestal 6 and supporting rack 7, and support frame as described above 7 is set to the bottom
The top of seat 6, the driving device 1 are set on the pedestal 6, and the drive sprocket 2 and the driven sprocket 3 are respectively arranged on institute
State the both ends of supporting rack 7.As shown in Figure 1, the pedestal 6 and support frame as described above 7 are frame structure, by horizon bar and vertical bar
It being formed by connecting, driving device 1 is arranged on pedestal 6, and drive sprocket 2, driven sprocket 3 and conveyer chain 4 are arranged on supporting rack 7,
Drive sprocket 2 is arranged in supporting rack 7 close to one end of the driving device 1, and driven sprocket 3 is arranged far from the driving device
1 one end, drive sprocket 2 and driven sprocket 3 are arranged between the horizon bar of supporting rack 7.Certainly, driving device 1 can also be set
It sets on supporting rack 7, to shorten the path of power transmission.
On the basis of above structure, in order to realize the driving device 1 being mounted on pedestal 6 and be mounted on supporting rack 7
Drive sprocket 2 power transmit, between the driving device 1 and the drive sprocket 2 be equipped with belt drive unit 8.Belt
The driving pulley of transmission device 8 is connect with driving device 1, and driven pulley is preferably coaxially disposed with drive sprocket 2, and conveyer belt is arranged
On driving pulley and driven pulley, the power of driving device 1 is sent to drive sprocket 2.Certainly, in driving device 1 and master
Chain drive passing power can also be passed through between movable sprocket 2.
In addition, being additionally provided with deceleration mechanism 9 between the driving device 1 and the drive sprocket 2.It can by deceleration mechanism 9
To reduce the output speed of driving device 1, more to adapt to the transmission of silicon chip.The deceleration mechanism 9 is preferably retarder.
In order to improve transmission efficiency, it further preferably includes tensioned portion to prevent the absent-mindedness of conveyer chain 4, the utility model embodiment
Part, the tension part are set to the lower section of the conveyer chain 4, and the tension part engages cooperation with the conveyer chain 4.Described
Fine thread part may be used in tight component, may be set to be the tensioning wheel of such as sprocket wheel or roller, and tension part can be with
It realizes to the close or separate of conveyer chain 4, is being needed to passing for example, by the mechanism of cylinder either telescopic rod of hydraulic cylinder etc.
When chain 4 being sent to be tensioned, enables tension part close to conveyer chain 4 and coordinate with conveyer chain 4, off working state, you can withdraw tensioning
Component.Tension part is preferably provided at the centre position of 4 length direction of conveyer chain.Certainly, tension part, which can also be arranged, is passing
It send between chain 4.
As shown in figure 4, the magazine 5 is the cavity body structure of top end opening, be vertically equipped on the bottom surface of the magazine 5 every
Plate, the partition board is parallel with the side wall of the magazine 5, and the magazine 5 is separated into several sub- cavitys, the silicon chip by the partition board
It is accommodated in the sub- cavity.The partition board is preferably arranged to multiple, is arranged at equal intervals between the side wall of magazine 5, with point
It is separated out equal-sized sub- cavity, accommodates more silicon chips.Pre-selection is provided with cushion on the inner wall of the magazine 5, to place
Silicon chip vibrates in transmit process.
Magazine 5 or such structure:As shown in figure 5, the magazine 5 is the cavity body structure of both ends open, the material
The guide groove extended towards the opening direction is equipped in box 5, the horizontal interior wall in the magazine 5 is symmetrically arranged in the guide groove
On, the both ends of the silicon chip are overlapped in the guide groove.Guide groove in magazine 5 be preferably arranged to it is multiple, at equal intervals arrangement set
Set on the inner wall of magazine 5, and each guide groove is arranged in parallel, to improve the space availability ratio in magazine 5, it is convenient to silicon chip into
The technological operations such as the subsequent drying of row.Magazine 5 as shown in Figure 5, or the structure type for saving bottom plate or top plate, with
Simplify overall structure, reduces weight.The laterally disposed of multiple silicon chips may be implemented in the magazine 5 of such structure.
Further, magazine 5 can also be such structure:The magazine 5 is including two side walls disposed in parallel and symmetrically
Crossbeam between the side walls is set, multiple columns are provided on the crossbeam, forms groove, the silicon between the column
Piece is placed in the groove.The vertical placement of multiple silicon chips may be implemented in the magazine 5 of such structure.
Specifically, supporting plate 10 is equipped between the conveyer chain 4 and the magazine 5, the supporting plate 10 is equipped with slot, described
Magazine 5 is equipped with passes through the slot and the protrusion with the matched protrusion of the slot, the magazine 5 with the supporting plate 10
It is connected.2 rectangular slots are preferably provided on the supporting plate 10, the magazine 5 is equipped with 2 corresponding protrusions.
As shown in figure 3, magnetic limited block 11 is additionally provided on the supporting plate 10, and when the protrusion coordinates with the slot, institute
The bottom for stating magazine 5 is contacted with the magnetic limited block 11.The magazine 5 is preferably made of iron, cobalt or nickel, with it is described
Magnetic limited block 11 is attracting.It is connected at this point, magazine 5 is realized with supporting plate 10 except through the cooperation of slot and protrusion, moreover it is possible to pass through
Magnetic limited block 11 realizes its suction the connection with supporting plate 10, prevents magazine 5 from falling off from conveyer chain 4.
In order to ensure that the uniform force of magazine 5, the supporting plate 10 are stud plate, the magnetism limited block 11 is symmetrically set in
The both ends of the supporting plate 10.
The structure, feature and effect of the utility model are described in detail based on the embodiments shown in the drawings, with
Upper described is only the preferred embodiment of the utility model, but the utility model is to limit practical range shown in drawing, it is every according to
Change made by conception according to the utility model, or be revised as the equivalent embodiment of equivalent variations, still without departing from specification and figure
When showing covered spirit, it should be within the protection scope of the present utility model.
Claims (10)
1. a kind of silicon chip conveying mechanism, which is characterized in that including driving device (1), drive sprocket (2), driven sprocket (3) and pass
Send chain (4), the driving device (1) that the drive sprocket (2), the conveyer chain (4) is driven to be set in the drive sprocket (2)
On the driven sprocket (3), the conveyer chain (4) is equipped with magazine (5).
2. silicon chip conveying mechanism according to claim 1, which is characterized in that the drive sprocket (2) includes being arranged in parallel
The first drive sprocket and the second drive sprocket, the driven sprocket (3) includes the first driven sprocket disposed in parallel and second
Driven sprocket, the conveyer chain (4) include the first conveyer chain and the second conveyer chain, and first conveyer chain is set in described first
On drive sprocket and first driven sprocket, second conveyer chain be set in second drive sprocket and described second from
On movable sprocket.
3. silicon chip conveying mechanism according to claim 1, which is characterized in that further include bearing, the bearing includes pedestal
(6) it is set on the pedestal (6) with supporting rack (7), support frame as described above (7), the driving device (1) is set to the pedestal
(6) on, the drive sprocket (2) and the driven sprocket (3) are respectively arranged on the both ends of support frame as described above (7).
4. silicon chip conveying mechanism according to claim 1, which is characterized in that further include tension part, the tension part
Lower section set on the conveyer chain (4), the tension part engage cooperation with the conveyer chain (4).
5. silicon chip conveying mechanism according to claim 1, which is characterized in that the driving device (1) and the drive chain
Belt drive unit (8) is equipped between wheel (2).
6. silicon chip conveying mechanism according to claim 1, which is characterized in that the driving device (1) and the drive chain
It is additionally provided with deceleration mechanism (9) between wheel (2).
7. silicon chip conveying mechanism according to claim 1, which is characterized in that the magazine (5) is the cavity of top end opening
Structure is vertically equipped with partition board on the bottom surface of the magazine (5), and the partition board is parallel with the side wall of the magazine (5), the partition board
The magazine (5) is separated into several sub- cavitys, the silicon chip is accommodated in the sub- cavity.
8. silicon chip conveying mechanism according to claim 1, which is characterized in that the magazine (5) includes two disposed in parallel
Side wall and it is symmetrical arranged crossbeam between the side walls, is provided with multiple columns on the crossbeam, shape between the column
At groove, the silicon chip is placed in the groove.
9. the silicon chip conveying mechanism according to claim 7 or 8, which is characterized in that the conveyer chain (4) and the magazine
(5) supporting plate (10) is equipped between, the supporting plate (10) is equipped with slot, and the magazine (5) is equipped with matched with the slot
Protrusion, the mating connection that the magazine (5) passes through the slot and the protrusion with the supporting plate (10).
10. silicon chip conveying mechanism according to claim 9, which is characterized in that be additionally provided with magnetic limit on the supporting plate (10)
Position block (11), when the protrusion coordinates with the slot, the bottom of the magazine (5) is contacted with the magnetic limited block (11).
Priority Applications (1)
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CN201820279191.3U CN207876620U (en) | 2018-02-27 | 2018-02-27 | A kind of silicon chip conveying mechanism |
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CN201820279191.3U CN207876620U (en) | 2018-02-27 | 2018-02-27 | A kind of silicon chip conveying mechanism |
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CN207876620U true CN207876620U (en) | 2018-09-18 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111687633A (en) * | 2020-05-07 | 2020-09-22 | 山东泰展机电科技股份有限公司 | Transfer case assembly assembling and detecting system |
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2018
- 2018-02-27 CN CN201820279191.3U patent/CN207876620U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111687633A (en) * | 2020-05-07 | 2020-09-22 | 山东泰展机电科技股份有限公司 | Transfer case assembly assembling and detecting system |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210107 Address after: 101102 102-lq307, 1-3 / F, building 26, 17 huanke Middle Road, Jinqiao Science and technology industrial base, Tongzhou Park, Zhongguancun Science and Technology Park, Tongzhou District, Beijing Patentee after: Deyun Chuangxin (Beijing) Technology Co.,Ltd. Address before: 100176 Beijing Daxing District Beijing Economic and Technological Development Zone, No. 66 Building, No. 2 Jingyuan North Street, 7th Floor 805 Patentee before: Juntai innovation (Beijing) Technology Co.,Ltd. |
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TR01 | Transfer of patent right |