CN207854264U - The processing unit (plant) of optical recognized point in flexible circuit board - Google Patents
The processing unit (plant) of optical recognized point in flexible circuit board Download PDFInfo
- Publication number
- CN207854264U CN207854264U CN201820005140.1U CN201820005140U CN207854264U CN 207854264 U CN207854264 U CN 207854264U CN 201820005140 U CN201820005140 U CN 201820005140U CN 207854264 U CN207854264 U CN 207854264U
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- CN
- China
- Prior art keywords
- welding
- tin
- leakage
- screen
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The processing unit (plant) of optical recognized point in a kind of flexible circuit board；Pad including chip mounter, for welding and leakage tin steel-screen；The leakage tin steel-screen is arranged in the top of the pad, and the pad is equipped with the golden face of rectangular welding；The leakage tin steel-screen is equipped with leakage tin opening；The leakage tin opening corresponds to the golden face of the rectangular welding also squarely；This rectangular leakage tin opening is equipped with a block to extend internally in week inwardly；So that being blocked on the golden face of welding, place is naked to leak out the welding gold face consistent with the block shape, forms the optical recognized point of contraposition.The utility model leaks the design of tin inner side block by leaking on tin steel-screen so that welding has the exposed section not covered by tin cream to form contraposition optical recognized point on golden face；Identify precision height, welding quality stable；The performance for not influencing product, nor affects on product appearance, has the advantages that tolerance can be eliminated and improves product yield.
Description
Technical field
The utility model belongs to the technical field of printed wiring board, be related to optical recognized point in a kind of flexible circuit board plus
Tooling is set.
Background technology
Flexible circuit board（FPC）Have the characteristics that Distribution density is high, light-weight, thickness is thin, is mainly used in mobile phone, notes
Many products such as this computer, PDA, digital camera.Surface mounting technology (SMT) process of flexible circuit board includes mainly that tin cream prints
Three basic links such as brush, attachment and Reflow Soldering.Paste solder printing refers to that tin cream is passed through the mould printing of predetermined pattern to circuit
On the weld pad of plate；Patch is accurately to be installed to surface-assembled component on the fixed position of flexible circuit board；Reflow Soldering refers to
Tin cream is dissolved to realize that machinery is connect with electric appliance between electronic component pin and circuit board welding pad.
In these links, to paste solder printing figure, patch has point-device requirement, once paste solder printing figure,
Patch location is not accurate enough, will lead to the bad connection between electronic component pin and flexible circuit board weld pad, causes product
It scraps or needs to carry out reworked processing.
In general, patch can substantially be divided into manual patch and automatic post-chip, and the process of manual patch is typically to use tweezer
Sub-folder chip, and chip is directed at pad, and being cooled down again by thawing scolding tin makes soldering tin binds that chip is fixed, manual patch
Disadvantage includes that human cost is high, patch precision is low low with working efficiency etc. etc..Therefore, in addition to certain special stations must use hand
Outside dynamic patch, manual patch increasingly fades out production.Automatic placement machine is mostly used greatly in current production.Automatic chip mounting is usual
It is by the way that after CCD para-position, suction nozzle absorption chip simultaneously determines chip position according to the alignment situation of CCD, then by Reflow Soldering core
Piece is fixed.But the automatic chip mounting device of the prior art has a problem that, the optical point for contraposition is located at FPC elements
Except frame on, CCD first incudes the optical point except FPC elements, the welding position of repositioning, the outline die of such design
There is the process accumulated in tolerance, be easy to cause the bad consequence of chip centering effect to the tolerance of Product jointing component,
There is deviation during the welding process, influences the yield of product.In addition, CCD can only identify the normalized optical point of FPC it is such as round or
It is rectangular；When no optical point on FPC with regard to SMT chip mounter None- identifieds.Optical recognized point is produced and do not had for single PCS,
Ask patch precision that can not then accomplish within 0.5mm.SMT None- identifieds may result in SMT patch device patch deviations, precision
It is unable to reach requirement.
Therefore, how to solve the above problems, be the content to be studied of those skilled in the art.
Invention content
To overcome above-mentioned deficiency in the prior art, the utility model aim is to provide optics in a kind of flexible circuit board
The processing unit (plant) of identification point.
In order to achieve the above objects and other related objects, optical recognized point in a kind of flexible circuit board of the utility model offer
Processing unit (plant)；Pad including chip mounter, for welding and leakage tin steel-screen；The leakage tin steel-screen is arranged in the upper of the pad
Side, the pad are equipped with the golden face of rectangular welding；The leakage tin steel-screen is equipped with leakage tin opening；Described in the leakage tin opening is corresponding
The golden face of rectangular welding also squarely；This rectangular leakage tin opening is equipped with a block to extend internally in week inwardly；Make
The naked leakage in the place welding gold face consistent with the block shape that be blocked on golden face must be welded, the optical recognized point of contraposition is formed.
In above-mentioned technical proposal, related content is explained as follows：
1, in said program, the block is located at the corner of the leakage tin opening, triangular in shape.
2, in said program, the block is located at the edge of the leakage tin opening, is rectangle, square or arc-shaped.
3, in said program, the chip mounter is SMT chip mounters.
Utility model works principle：It first passes through and the solder pad size on FPC elements is calculated, then leakage tin steel
Online leakage tin aperture position carries out artificial offset 0.15mm, is carried out at the same time unilateral reduction leakage tin amount, in order to ensure that tin amount is enough,
Steel mesh is carried out to other directions again and extends out three times 0.05mm of processing, starts to leak tin operation；Then the welding for covering pad because of block
The triangle that the right-angle side of tin cream is formed is not paved on golden face, by the identification adjustment to chip mounter, passes through the CCD on chip mounter
The color of identification, tin cream is dark color, and exposed welding gold face is golden yellow, then welds golden face exposed section and form contraposition optical identification
Point, correspondence changes optical recognized point, then by the adjustment to furnace temperature, is paved with, is welded to pad after so that its tin cream is melted.
Since above-mentioned technical proposal is used, the utility model this have the advantage that compared with prior art：
The utility model in the case of no optical point, leaks tin notch in traditional FPC elements by leaking on tin steel-screen
The design of interior side block blocks so that welding has the exposed section not covered by tin cream on golden face, which forms contraposition optical identification
Point.Identify precision height, welding quality stable；The performance for not influencing product, nor affects on product appearance, and having can eliminate
The advantages of tolerance and raising product yield.
Description of the drawings
Fig. 1 is the schematic diagram that the utility model leaks tin steel-screen, welds golden face；
Fig. 2 is the schematic diagram of the utility model optical recognized point.
Specific implementation mode
Illustrate that the embodiment of the utility model, those skilled in the art can be by these by particular specific embodiment below
Content disclosed by specification understands other advantages and effect of the utility model easily.
It please refers to Fig.1.It should be clear that structure, ratio, size etc. depicted in this specification institute accompanying drawings, only coordinating
The revealed content of specification, so that those skilled in the art understands and reads, being not limited to the utility model can be real
The qualifications applied, therefore do not have technical essential meaning, the tune of the modification of any structure, the change of proportionate relationship or size
It is whole, in the case where not influencing the effect of the utility model can be generated and the purpose that can reach, should all still fall in the utility model institute
The technology contents of announcement obtain in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", "left", "right",
The term of " centre " and " one " etc. is merely convenient to being illustrated for narration, rather than to limit the enforceable range of the utility model,
Its relativeness is altered or modified, in the case where changing technology contents without essence, when being also considered as the enforceable scope of the utility model.
As depicted in figs. 1 and 2, in a kind of flexible circuit board optical recognized point processing unit (plant)；Including chip mounter（In figure not
It shows）, for welding pad 1 and leakage tin steel-screen 2；The leakage tin steel-screen 2 is arranged in the top of the pad 1, the pad 1
It is equipped with rectangular welding gold face 3；The leakage tin steel-screen 2 is equipped with leakage tin opening 4；The leakage tin opening 4 corresponds to the rectangular weldering
Connect the also squarely of golden face 3；This rectangular leakage tin opening 4 is equipped with a block 5 to extend internally in week inwardly；So that weldering
The naked leakage in the place that is blocked on the golden face 3 welding gold face consistent with 5 shape of the block is connect, the optical recognized point 6 of contraposition is formed.
The block 5 is located at the corner of the leakage tin opening 4, triangular in shape.
The block 5 is located at the edge of the leakage tin opening 4, is rectangle, square or arc-shaped（It is not shown in figure）.
The chip mounter is SMT chip mounters.
When work, on FPC elements 7, chip（It is not shown in figure）It is welded at pad 1, first passes through on FPC elements 7
1 size of pad is calculated, then 4 positions of leakage tin opening on leakage tin steel-screen 2 are carried out artificial offset 0.15mm, is carried out at the same time list
Reduction leakage tin amount in side in order to ensure that tin amount is enough, then carries out leakage tin steel-screen 2 to other directions and extends out three times 0.05mm of processing, opens
Begin to leak tin operation；Then the triangle for the right-angle side formation for not being paved with tin cream on the golden face of welding for covering pad 1 because of block 5, lead to
The identification adjustment to chip mounter is crossed, is identified by the CCD on chip mounter, the color of tin cream is dark color, and exposed welding gold face is
Golden yellow then welds golden face exposed section and forms contraposition optical recognized point, corresponds to the optical recognized point, and the CCD on chip mounter passes through
Induction is located at the optical recognized point on the golden face of welding, and the position of positioning FPC internal pads makes it then by the adjustment to furnace temperature
Tin cream is paved with pad after melting, is welded.Optical recognized point after the completion of welding is covered by chip, is not influenced outside product
It sees, tolerance can be eliminated and improves product yield.Will not be under pressure because of FPC element materials and heat effect generate deformation and
So that optical recognized point and the pad of FPC elements is generated displacement, meets requirement of the allowance control within 0.05mm, improve product
Yield and reliability.
The utility model in the case of no optical point, leaks tin notch in traditional FPC elements by leaking on tin steel-screen
The design of interior side block blocks so that welding has the exposed section not covered by tin cream on golden face, which forms contraposition optical identification
Point.Identify precision height, welding quality stable；The performance for not influencing product, nor affects on product appearance, and having can eliminate
The advantages of tolerance and raising product yield.
The above embodiments are only illustrative of the principle and efficacy of the utility model, new not for this practicality is limited
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications completed under refreshing and technological thought or change, should be covered by the claim of the utility model.
Claims (4)
1. the processing unit (plant) of optical recognized point in a kind of flexible circuit board；It is characterized in that：Weldering including chip mounter, for welding
Disk and leakage tin steel-screen；The leakage tin steel-screen is arranged in the top of the pad, and the pad is equipped with the golden face of rectangular welding；It is described
It leaks tin steel-screen and is equipped with leakage tin opening；The leakage tin opening corresponds to the golden face of the rectangular welding also squarely；This is rectangular described
The week for leaking tin opening is equipped with a block to extend internally inwardly；So that be blocked on the golden face of the welding naked leakage in place and the gear
Block-shaped consistent welding gold face, forms the optical recognized point of contraposition.
2. the processing unit (plant) of optical recognized point in flexible circuit board according to claim 1, it is characterised in that：The block
It is triangular in shape positioned at the corner of the leakage tin opening.
3. the processing unit (plant) of optical recognized point in flexible circuit board according to claim 1, it is characterised in that：The block
Positioned at the edge of the leakage tin opening, it is rectangle, square or arc-shaped.
4. the processing unit (plant) of optical recognized point in flexible circuit board according to claim 1, it is characterised in that：The patch
Machine is SMT chip mounters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820005140.1U CN207854264U (en) | 2018-01-03 | 2018-01-03 | The processing unit (plant) of optical recognized point in flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820005140.1U CN207854264U (en) | 2018-01-03 | 2018-01-03 | The processing unit (plant) of optical recognized point in flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207854264U true CN207854264U (en) | 2018-09-11 |
Family
ID=63416863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820005140.1U Expired - Fee Related CN207854264U (en) | 2018-01-03 | 2018-01-03 | The processing unit (plant) of optical recognized point in flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207854264U (en) |
-
2018
- 2018-01-03 CN CN201820005140.1U patent/CN207854264U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191217 Address after: 215000 Building 5, No.199, Jinfeng Road, high tech Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Shiwei Electronic Technology Co.,Ltd. Address before: 215000 Jiangsu city of Suzhou province Wuzhong District Mudu Golden Bridge Development East Building B1 Patentee before: SUZHOU SHIWEI ELECTRONIC Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180911 Termination date: 20220103 |