CN207834256U

CN207834256U - A kind of wafer descaling bath

Info

Publication number: CN207834256U
Application number: CN201721088110.3U
Authority: CN
Inventors: 周文华
Original assignee: Shanghai Qiang Hua Industrial Ltd By Share Ltd
Current assignee: Shanghai Qiang Hua Industrial Ltd By Share Ltd
Priority date: 2017-08-29
Filing date: 2017-08-29
Publication date: 2018-09-07
Anticipated expiration: 2027-08-29

Abstract

A kind of wafer descaling bath, there are one outer grooves for descaling bath tool, it is internally provided with inside groove in outer groove, spray tube is arranged in interior trench bottom, holder in inside groove is used to support quartzy supporting plate, for placing the cleaning gaily decorated basket on quartzy supporting plate, the cleaning gaily decorated basket is used to place the wafer for needing to clean, the madial wall and lateral wall of inside groove are equipped with thermocouple support, for installing thermocouple, the top of outer groove is the edge expanded outward, it is arranged with multiple support rods at the edge expanded, the bottom of outer groove is provided with waste pipe, the top edge of inside groove has multiple overflow launders, overflow launder is covered with entire inside groove top edge, for the excessive of acid solution, the overflow launder has the chamfering dropped.

Description

A kind of wafer descaling bath

Technical field

The utility model belongs to technical field of semiconductors, more particularly to a kind of wafer descaling bath.

Background technology

It is mentioned in the patent document of Publication No. CN1338771, it is " most frequent in the technique of integrated circuit package Step is exactly that chip is cleaned.The clean purpose of chip is miscellaneous in order to remove the organic compound being attached in wafer surface, metal The pollutants such as matter or particle.And influence of these pollutants for product subsequent process steps is very big.The pollution of metal impurities Can cause p-n electric leakage, reduction minority carrier lifetime, reduce grid oxic horizon breakdown voltage.The attachment of particle then can shadow Ring the authenticity of lithography process pattern transfer, or even cause circuit structure short-circuit ", it is seen that cleaning be for wafer manufacturing process and Its is important.But this document does not provide the design scheme of descaling bath in cleaning process.In existing disclosed file, close Lack ripe scheme in the structure of wafer descaling bath, particularly with how preventing acid solution from splashing, not simple and practicable method.

Utility model content

The utility model provides a kind of wafer descaling bath.

A kind of wafer descaling bath, there are one outer grooves for descaling bath tool, inside groove are internally provided in outer groove, including spray tube setting Trench bottom, the holder in inside groove are used to support quartzy supporting plate, and for placing the cleaning gaily decorated basket on quartzy supporting plate, the cleaning gaily decorated basket is for putting The wafer for needing to clean is set,

The madial wall and lateral wall of inside groove are equipped with thermocouple support, for installing thermocouple,

The top of outer groove is the edge expanded outward, multiple support rods is arranged at the edge expanded, in outer groove Bottom is provided with waste pipe,

There are multiple overflow launders, overflow launder to be covered with entire inside groove top edge for the top edge of inside groove, should for the excessive of acid solution Overflow launder has the chamfering dropped.

Chamfering possessed by the overflow launder of the wafer descaling bath of the utility model plays a part of to flow backwards, prevent for acid solution Acid solution is to splash in overflow, eliminates the security risk in production.

Description of the drawings

Detailed description below is read by reference to attached drawing, the utility model illustrative embodiments above-mentioned and other Objects, features and advantages will become prone to understand.In the accompanying drawings, show that this practicality is new by way of example rather than limitation Several embodiments of type, wherein：

Fig. 1 is the structural schematic diagram of the utility model.

Fig. 2 is the overflow launder enlarged diagram of existing descaling bath.

Fig. 3 is the overflow launder enlarged diagram of the utility model.

1 --- outer groove, 2 --- inside groove, 3 --- spray tube, 4 --- thermocouple support, 5 --- holder, 6 --- waste discharge Pipe, 7 --- support rod, 8 --- chamfering.

Specific implementation mode

It is the overflow launder enlarged diagram of the existing descaling bath before improving herein in Fig. 2.As shown in figs. 1 and 3, a kind of Wafer descaling bath, there are one outer grooves for descaling bath tool, are internally provided with inside groove in outer groove, spray tube is arranged in interior trench bottom, inside groove Interior holder is used to support quartzy supporting plate, needs to clean for placing for the placement cleaning gaily decorated basket, the cleaning gaily decorated basket on quartzy supporting plate Wafer.The madial wall and lateral wall of inside groove are equipped with thermocouple support, for installing thermocouple.The top of outer groove is to extending out The edge gone out is arranged with multiple support rods at the edge expanded, the bottom of outer groove is provided with waste pipe.The top of inside groove Edge has multiple overflow launders, and for the excessive of acid solution, which has the chamfering dropped.Play a part of to flow backwards for acid solution, Prevent acid solution overflow be splash.Overflow launder is covered with entire inside groove top edge.As shown in figure 3, being the crystalline substance of the utility model in Fig. 1 The overflow launder amplification signal A figures with chamfering of circle descaling bath.

It is worth noting that being created although foregoing teachings describe the utility model by reference to several specific implementation modes Spirit and principle, it should be appreciated that, it is not limited to the specific embodiments disclosed for the utility model, is drawn to various aspects Divide and does not also mean that the feature in these aspects cannot combine, it is this to divide the convenience merely to statement.The utility model purport Covering various modifications and equivalent arrangements included in spirit and scope of the appended claims.

Claims

1. a kind of wafer descaling bath, which is characterized in that there are one outer grooves for descaling bath tool, and inside groove is internally provided in outer groove, spray The holder that pipe is arranged in interior trench bottom, inside groove is used to support quartzy supporting plate, is used to place the cleaning gaily decorated basket, cleaning on quartzy supporting plate The gaily decorated basket is used to place the wafer for needing to clean,

The top of outer groove is the edge expanded outward, multiple support rods is arranged at the edge expanded, in the bottom of outer groove Waste pipe is provided with,

There are multiple overflow launders, overflow launder to be covered with entire inside groove top edge for the top edge of inside groove, be used for excessive, overflow of acid solution Slot has the chamfering dropped.

2. wafer descaling bath as described in claim 1, which is characterized in that the section of outer groove and inside groove is rendered as rectangle.