CN201956324U - Cleaning equipment for semiconductor wafer - Google Patents
Cleaning equipment for semiconductor wafer Download PDFInfo
- Publication number
- CN201956324U CN201956324U CN2010206227957U CN201020622795U CN201956324U CN 201956324 U CN201956324 U CN 201956324U CN 2010206227957 U CN2010206227957 U CN 2010206227957U CN 201020622795 U CN201020622795 U CN 201020622795U CN 201956324 U CN201956324 U CN 201956324U
- Authority
- CN
- China
- Prior art keywords
- high low
- groove
- low flush
- cleaning equipment
- semiconductor crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses cleaning equipment for a semiconductor wafer. The cleaning equipment comprises n spray type pre-flushing grooves and high-low flushing grooves, wherein the spray type pre-flushing grooves and the high-low flushing grooves are arranged alternately and sequentially; and water inlet pipes are installed on the spray type pre-flushing grooves. The cleaning equipment for the semiconductor wafer simplifies the operation procedure and avoids water pollution; and the two high-low flushing grooves can rise and fall alternately by a lifting device to realize cyclic utilization of water, thereby saving the cost.
Description
Technical field
The utility model relates to a kind of cleaning equipment of semiconductor crystal wafer, and the bath of be used for semiconductor crystal wafer production process wet etching, removing photoresist belongs to the equipment in the wet etching operation.
Background technology
Existing wet corrosion technique mostly adopts artificial flushing, and the wafer that takes out from etching tank must be through just reaching preflush groove behind the overflow launder, during sour water takes place probably drips and be sprinkled upon in the groove; Four groove height quite and closely are arranged in together, and when the disk more than two batches was washed by water simultaneously, the water that overflows will pollute the groove on next door.
The utility model content
The utility model purpose is the cleaning equipment that a kind of semiconductor crystal wafer is provided at the defective that prior art exists.
The utility model adopts following technical scheme for achieving the above object:
The cleaning equipment of the utility model semiconductor crystal wafer comprises n fountain preflush groove and high low flush slot device, and fountain preflush groove and high low flush slot device are arranged alternately successively, and water inlet pipe also is set on the fountain preflush groove, and wherein n is the natural number greater than 2.
Described high low flush slot device is made of the first high low flush groove, the second high low flush groove and lowering or hoisting gear, the first high low flush groove, the second high low flush groove are arranged at the lowering or hoisting gear two ends respectively, and lowering or hoisting gear makes and keeps difference in height between first, second high low flush groove.
On the described first high low flush groove water inlet pipe is set also.
Described first, second high low flush trench bottom all is provided with gutter channel.
The utility model has been simplified work flow, but avoids water to pollute, the rise and fall that two high low flush grooves can replace by lowering or hoisting gear, and recycling water has been saved cost.
Description of drawings
Fig. 1: the utility model structure chart.
Embodiment
As shown in Figure 1, the cleaning equipment of semiconductor crystal wafer comprises n fountain preflush groove 5 and high low flush slot device, and fountain preflush groove 5 and high low flush slot device are arranged alternately successively, water inlet pipe 4 also is set on the fountain preflush groove 5, and wherein n is the natural number greater than 2.
Described high low flush slot device is made of first high low flush groove 1, the second high low flush groove 2 and lowering or hoisting gear 3, first high low flush groove 1, the second high low flush groove 2 is arranged at lowering or hoisting gear 3 two ends respectively, and lowering or hoisting gear 3 makes and keeps difference in height between first, second high low flush groove 1,2.
On the described first high low flush groove 1 water inlet pipe 4 is set also.
Described first, second high low flush groove 1,2 bottoms all are provided with gutter channel.
Claims (4)
1. the cleaning equipment of a semiconductor crystal wafer, it is characterized in that comprising n fountain preflush groove (5) and high low flush slot device, fountain preflush groove (5) and high low flush slot device are arranged alternately successively, water inlet pipe (4) also is set on the fountain preflush groove (5), and wherein n is the natural number greater than 2.
2. the cleaning equipment of semiconductor crystal wafer according to claim 1, it is characterized in that described high low flush slot device is made of the first high low flush groove (1), the second high low flush groove (2) and lowering or hoisting gear (3), the first high low flush groove (1), the second high low flush groove (2) are arranged at lowering or hoisting gear (3) two ends respectively, and lowering or hoisting gear (3) makes and keeps difference in height between first, second high low flush groove (1,2).
3. the cleaning equipment of semiconductor crystal wafer according to claim 2 is characterized in that on the described first high low flush groove (1) water inlet pipe (4) being set also.
4. the cleaning equipment of semiconductor crystal wafer according to claim 2 is characterized in that described first, second high low flush groove (1,2) bottom all is provided with gutter channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206227957U CN201956324U (en) | 2010-11-25 | 2010-11-25 | Cleaning equipment for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206227957U CN201956324U (en) | 2010-11-25 | 2010-11-25 | Cleaning equipment for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201956324U true CN201956324U (en) | 2011-08-31 |
Family
ID=44500426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206227957U Expired - Fee Related CN201956324U (en) | 2010-11-25 | 2010-11-25 | Cleaning equipment for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201956324U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110538837A (en) * | 2018-07-10 | 2019-12-06 | 蓝思科技（长沙）有限公司 | Glue removing and recycling process for assembly |
-
2010
- 2010-11-25 CN CN2010206227957U patent/CN201956324U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110538837A (en) * | 2018-07-10 | 2019-12-06 | 蓝思科技（长沙）有限公司 | Glue removing and recycling process for assembly |
| CN110538837B (en) * | 2018-07-10 | 2021-11-12 | 蓝思科技（长沙）有限公司 | Glue removing and recycling process for assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20141204 Granted publication date: 20110831 |
|
| RINS | Preservation of patent right or utility model and its discharge | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20150604 Granted publication date: 20110831 |
|
| RINS | Preservation of patent right or utility model and its discharge | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110831 Termination date: 20141125 |
|
| EXPY | Termination of patent right or utility model |